CN115876010A - Loop heat pipe formed by combination - Google Patents

Loop heat pipe formed by combination Download PDF

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Publication number
CN115876010A
CN115876010A CN202210267340.5A CN202210267340A CN115876010A CN 115876010 A CN115876010 A CN 115876010A CN 202210267340 A CN202210267340 A CN 202210267340A CN 115876010 A CN115876010 A CN 115876010A
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plate
lower plate
evaporator
upper plate
liquid phase
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CN115876010B (en
Inventor
郭春生
李华杰
刘淼
杨珺博
候蕊
马军
薛丽红
李蒸
韩卓晟
逯晓康
杨沛东
刘百川
于永升
姜鲲
周晓雨
周志龙
黑吉芳
李宝瑞
李可
年显勃
张元坤
李文涵
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Shandong University
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Shandong University
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Abstract

The invention relates to a loop heat pipe formed by combination, which comprises an upper plate, a middle plate and a lower plate, wherein the upper plate and the lower plate are of an integrated structure, the upper plate comprises an evaporator upper plate, a condenser upper plate, an upper plate vapor phase pipeline and an upper plate liquid phase pipeline, the lower plate comprises an evaporator lower plate, a condenser lower plate, a lower plate vapor phase pipeline and a lower plate liquid phase pipeline, the middle plate is the middle plate of an evaporator, the lower part of the middle plate comprises a liquid phase inlet, a liquid storage tank, a micro-channel and a liquid phase channel middle plate, the upper part of the middle plate comprises a steam channel and a gas buffer cavity, and the upper plate, the middle plate and the lower plate are arranged together to form a complete loop heat pipe. The invention provides a loop heat pipe with a new structure, wherein an evaporator lower plate, a condenser lower plate, a vapor-phase pipeline lower plate and a liquid-phase pipeline lower plate are integrally designed, the bottom surfaces of the evaporator lower plate, the condenser lower plate, the vapor-phase pipeline lower plate and the liquid-phase pipeline lower plate are on the same plane and are designed on the same plate, the integration effect is good, and the processing difficulty is reduced; the evaporator upper plate, the condenser upper plate, the vapor phase pipeline upper plate and the liquid phase pipeline upper plate are designed in an integrated mode, the four ground surfaces are on the same plane and are designed on the same plate, the integration effect is good, and the processing difficulty is reduced.

Description

Loop heat pipe formed by combination
Technical Field
The invention relates to a heat pipe technology, in particular to a loop heat pipe formed by combination, and belongs to the field of F28D15/02 heat pipes.
Background
The heat pipe technology is from America, has the history of nearly 60 years, fully utilizes the heat conduction principle of two-phase working medium flow, and has the advantages of small heat resistance, excellent heat transfer performance, high heat dissipation efficiency and the like.
The loop heat pipe is a high-efficiency two-phase heat transfer device, has the characteristics of high heat transfer performance, long-distance heat transfer, excellent temperature control characteristic, random bending of a pipeline, convenient installation and the like, and has incomparable advantages compared with other heat transfer devices, so the loop heat pipe has very wide application prospect in various fields.
The loop heat pipe mainly comprises an evaporation section, a condensation section, a liquid storage device, a steam pipeline and a liquid pipeline (an adiabatic end). The whole circulation process is as follows: the liquid absorbs heat outside the evaporation section, the outer surface of the capillary core in the evaporation section is evaporated, the generated steam flows to the condensation section from the steam pipeline, the heat is released to the heat sink in the condensation section, meanwhile, the steam is condensed into liquid, and finally, the liquid flows into the liquid storage device through the liquid pipeline, and the liquid working medium in the liquid storage device maintains the supply of the capillary core in the evaporation section.
Most of the existing loop heat pipes do not adopt an integrated manufacturing technology, the integration effect is poor, the processing difficulty is increased, and the existing heat pipes have strong heat dissipation noise and unsatisfactory effect.
The invention provides a novel loop heat pipe, which is provided by improving the structure and parameters of a traditional micro-channel flat-plate loop heat pipe evaporator; the evaporator upper plate, the condenser upper plate, the vapor phase pipeline upper plate and the liquid phase pipeline upper plate are designed in an integrated mode, the bottom surfaces of the evaporator upper plate, the condenser upper plate, the vapor phase pipeline upper plate and the liquid phase pipeline upper plate are on the same plane and are designed on the same plate, the integration effect is good, and the processing difficulty is reduced. The U-shaped manifold structure is additionally arranged, and through the design, the heat flux density and the heat dissipation efficiency of the loop heat pipe are effectively improved; in addition, the streamline flow guide module consisting of the fishbone-shaped microchannel fins and the fusiform fin array effectively increases the heat exchange area between the evaporator and the heat source, the metal capillary core provides driving force and improves the heat dissipation efficiency, and efficient and accurate heat dissipation of the heat source is realized.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art. The loop heat pipe provided by the invention has the advantages of good integration effect, low processing difficulty, high heat exchange efficiency and no energy consumption.
The technical scheme of the invention is as follows: a loop heat pipe formed by combination comprises an upper plate, a middle plate and a lower plate, wherein the upper plate and the lower plate are of an integrated structure, the upper plate comprises an evaporator upper plate, a condenser upper plate, an upper plate vapor phase pipeline and an upper plate liquid phase pipeline, the lower plate comprises an evaporator lower plate, a condenser lower plate, a lower plate vapor phase pipeline and a lower plate liquid phase pipeline, the middle plate is the middle plate of the evaporator, a liquid phase inlet, a liquid storage tank, a micro-channel and a liquid phase channel are formed below the middle plate, a steam channel and a gas buffer cavity are formed above the middle plate, the upper plate, the middle plate and the lower plate are installed together to form a complete loop heat pipe, the condenser upper plate and the condenser lower plate form a condenser, the evaporator upper plate, the middle plate and the evaporator lower plate form an evaporator, the upper plate vapor phase pipeline and the lower plate vapor phase pipeline form a vapor phase pipeline, and the upper plate liquid phase pipeline and the lower plate form a liquid phase pipeline; liquid absorbs heat in the evaporator, enters the gas buffer cavity through the steam channel, then enters the vapor phase pipeline, enters the condenser through the vapor phase pipeline for condensation, and the condensed liquid enters the liquid phase pipeline, enters the liquid storage tank through the liquid phase inlet, then enters the liquid phase channel, passes through the micro-channel from the liquid phase channel, and is heated to form steam entering the steam channel.
Preferably, the microchannel comprises fishbone-shaped microchannel fins, the fins are divided into two rows inclined towards one side of the fluid flowing direction, a liquid phase channel is arranged in the middle of the two rows, and the two rows are symmetrically distributed along the liquid phase channel.
Preferably, the fishbone-shaped microchannel fins comprise a plurality of sets, and the liquid phase channel is formed between the plurality of sets of fins.
Preferably, the liquid storage tank is of an upper and lower through structure, and the gas buffer cavity is not of an upper and lower through structure.
Preferably, the lower plate of the evaporator is provided with an array of fins arranged in a shuttle configuration.
Preferably, an anti-reverse inserting opening is arranged at a position corresponding to the gas buffering cavity of the upper plate of the evaporator.
Preferably, the ratio of the radius of the vapor phase pipeline to the radius of the liquid phase pipeline is 1.5.
Preferably, the filling port is located in the liquid phase line.
Preferably, the reservoir and the gas buffer chamber are circular arcs.
Preferably, the fishbone-shaped microchannel fins form a certain included angle with the horizontal plane, and capillary cores are filled between the fishbone-shaped microchannel fins.
Compared with the prior art, the invention has the following advantages:
(1) The lower plate of the evaporator, the lower plate of the condenser, the lower plate of the vapor-phase pipeline and the lower plate of the liquid-phase pipeline adopt an integrated design, the bottom surfaces of the evaporator, the condenser and the lower plate of the vapor-phase pipeline are on the same plane and are designed on the same plate, the integration effect is good, and the processing difficulty is reduced; the evaporator upper plate, the condenser upper plate, the vapor phase pipeline upper plate and the liquid phase pipeline upper plate are designed in an integrated mode, the bottom surfaces of the evaporator upper plate, the condenser upper plate, the vapor phase pipeline upper plate and the liquid phase pipeline upper plate are on the same plane and are designed on the same plate, the integration effect is good, and the processing difficulty is reduced.
(2) The evaporator adopts a manifold design, a full U-shaped loop is changed into a half U-shaped loop structure, and a gas flow path is optimized; compared with the traditional loop heat pipe, the capillary path length and the flow velocity of the liquid phase working medium are reduced, the heat exchange time of liquid flowing through the micro-channel is prolonged, the heat exchange effect and the heat exchange efficiency are improved, in addition, the flow resistance of the liquid phase working medium is reduced by the semi-U-shaped loop manifold structure, and the heat transfer effect is improved.
(3) Designing and processing a high-aspect-ratio micro channel array. The capillary force of the micro channel to the liquid-phase working medium is greatly improved to provide more driving force for the circulation of the working medium in the pipe, so that the liquid-phase working medium can realize self-circulation without energy input in a complex loop heat pipe, the capillary core is designed into a parallelogram, a triangle or a trapezoid, the cavity area of the fishbone-shaped micro-channel fin is utilized to the maximum extent, and the heat exchange capacity is improved.
(4) The integration hypoplastron is provided with the cavity that holds fishbone form microchannel fin, personally submits certain contained angle with the level, has promoted the quantity and the area of capillary core, has promoted heat transfer area, promotes heat exchange efficiency.
(5) The streamlined flow guide module that the integration hypoplastron set up fusiformis fin array and constitute improves the heat exchange area of liquid phase working medium, and the diffusion of liquid phase working medium is more even with being heated, and streamlined design can effectively reduce the flow resistance that the fin brought for the liquid phase working medium.
(6) And metal powder is injected by cold pressing, the capillary core and the middle plate of the evaporator are integrally designed, the capillary core and the manifold bottom plate are combined into a whole by adopting a sintering method, and the heat exchange efficiency is increased while the capillary force is increased and the driving force is provided by adopting a porous structure.
(7) The condenser part adopts a staggered micro-channel design, and a vapor phase working medium to be cooled is more uniformly diffused to the whole cooling cavity, so that the condensation efficiency is improved, and the vapor phase in a cycle can be converted into a liquid phase.
(8) The two condensers are connected in parallel, so that the condensing efficiency is improved, the flow resistance of a vapor phase working medium and a liquid phase working medium is reduced, and the upper limit of the heat dissipation heat flow density of the loop heat pipe is improved.
(9) The condenser is internally provided with a plurality of groups of fusiform fins, so that the heat conduction area is increased, the heat dissipation efficiency is improved, and the flow resistance of a vapor phase working medium is reduced.
(10) The circular arc serial liquid storage tank reduces the flow resistance of the heat-conducting working medium, and timely replenishes liquid to fully soak the capillary core, thereby ensuring no dry burning phenomenon and ensuring constant heat dissipation efficiency.
(11) The circular arc-shaped gas buffer cavity reduces the flow resistance of a vapor phase working medium, plays a role in buffering when the phase of the heat conduction working medium is changed from a liquid state to a gaseous state, and avoids the influence of overhigh vapor phase pressure on the phase change process.
(12) The pipe diameters of the gas pipeline and the liquid pipeline are different, and the volume ratio is about 2:1, space is provided for phase change of the heat-conducting working medium to gas, so that the circulation of the working medium is smoother.
(13) The bottom side of the integrated lower plate is carved with an identification reticle at the position of the evaporation cavity, so that a user can conveniently position a heat source.
(14) The edge of integration upper plate, integration hypoplastron, evaporimeter medium plate has designed 2 slope trapezium structures, is convenient for carry on V type location and sealed, is aided with vacuum brazing at last, is favorable to the position welding seam that integration upper plate, integration hypoplastron and evaporimeter medium plate contacted closely, realizes good leakproofness.
(15) The integrated upper plate and the integrated lower plate are provided with grooves, and the evaporator middle plate at the corresponding position is provided with a protrusion, so that the direction error during the installation of the evaporator middle plate can be avoided.
Drawings
FIG. 1 is an exploded view of a loop heat pipe according to the present invention;
FIG. 2 is a schematic front view of the integrated upper plate of the present invention;
FIG. 3 is a schematic reverse side view of the integrated upper plate of the present invention;
FIG. 4 is a schematic front view of a middle plate in an evaporator of the present invention;
FIG. 5 is a schematic view of the opposite side of a plate in an evaporator of the present invention;
FIG. 6 is a partial schematic view of a mid-plate in an evaporator of the present invention;
FIG. 7 is a schematic front view of an integrated lower plate of the present invention;
fig. 8 is a reverse schematic view of an integrated lower plate of the present invention.
In FIG. 1, 1-1 is an upper plate, 1-2 is a middle plate, and 1-3 is a lower plate;
in the figure 2-3, 1-1-1 is an evaporator upper plate, 1-1-2 is a condenser upper plate, 1-1-3 is an upper plate vapor phase pipeline, 1-1-4 is an upper plate liquid phase pipeline, 1-1-5 is a filling port, 1-1-6 is an anti-reverse bayonet, 1-1-7 is a 2-degree inclined trapezoidal structure;
in fig. 4-5, 1-2-1 is a liquid phase inlet, 1-2-2 is a liquid storage tank, 1-2-3 is a 2-degree inclined trapezoidal structure, 1-2-4 is a fishbone-shaped microchannel, 1-2-5 is an anti-insertion reverse bayonet, 1-2-6 is a liquid phase channel, 1-2-7 is a steam channel, and 1-2-8 is a gas buffer cavity;
in FIG. 6, 1-2-9 is a triangular microchannel, 1-2-10 is a parallelogram microchannel, and 1-2-11 is a trapezoidal microchannel;
in fig. 7-8, 1-3-1 is a lower plate of an evaporator, 1-3-2 is a liquid phase pipeline of the lower plate, 1-3-3 is a vapor phase pipeline of the lower plate, 1-3-4 is a lower plate of a condenser, 1-3-5 is a streamline flow guide module, 1-3-6 is an anti-insertion reverse bayonet, 1-3-7 is a smooth transition structure, 1-3-8 is a marking line of an evaporation cavity position, 1-3-9 is a fusiform fin, and 1-3-10 is a staggered micro-channel structure; 1-3-11 is the upper step edge of the lower plate of the condenser.
Detailed Description
The technical solution in the embodiment of the present invention will be described in addition with the accompanying drawings in the embodiment of the present invention.
Fig. 1-7 disclose a loop heat pipe. As shown in fig. 1, a loop heat pipe formed by combination comprises an upper plate 1-1, a middle plate 1-2 and a lower plate 1-3, wherein the upper plate 1-1 and the lower plate 1-3 are of an integrated structure. As shown in FIG. 2, the upper plate 1-1 includes an evaporator upper plate 1-1-1, a condenser upper plate 1-1-2, an upper plate vapor phase pipeline 1-1-3, and an upper plate liquid phase pipeline 1-1-4. As shown in fig. 7, the lower plate 1-3 includes an evaporator lower plate 1-3-1, a condenser lower plate 1-3-4, a lower plate vapor phase line 1-3-3, and a lower plate liquid phase line 1-3-2. The middle plate 1-2 is a middle plate of an evaporator, as shown in fig. 4-5, the lower part of the middle plate 1-2 comprises a liquid phase inlet 1-2-1, a liquid storage tank 1-2-2, a micro-channel 1-2-4 and a liquid phase channel 1-2-6, the upper part of the middle plate comprises a steam channel 1-2-7 and a gas buffer cavity 1-2-8, the upper plate 1-1, the middle plate 1-2 and the lower plate 1-3 are mounted together to form a complete loop heat pipe, wherein the upper plate of the condenser and the lower plate of the condenser form a condenser, the upper plate of the evaporator, the middle plate and the lower plate of the evaporator form an evaporator, the vapor phase pipeline of the upper plate and the vapor phase pipeline of the lower plate form a vapor phase pipeline, and the liquid phase pipeline of the upper plate and the liquid phase pipeline of the lower plate form a liquid phase pipeline; the liquid absorbs heat in the evaporator, enters the gas buffer cavity through the steam channel 1-2-7, then enters the vapor phase pipeline, enters the condenser through the vapor phase pipeline for condensation, the condensed liquid enters the liquid phase pipeline, enters the liquid storage tank through the liquid phase inlet, then enters the liquid phase channel, passes through the micro-channel from the liquid phase channel, and is heated to form steam entering the steam channel.
Preferably, the upper plate 1-1 and the lower plate 1-2 are integrally manufactured.
The lower plate of the evaporator, the lower plate of the condenser, the lower plate of the vapor-phase pipeline and the lower plate of the liquid-phase pipeline adopt an integrated design, the bottom surfaces of the evaporator, the condenser and the lower plate of the vapor-phase pipeline are on the same plane and are designed on the same plate, the integration effect is good, and the processing difficulty is reduced; the evaporator upper plate, the condenser upper plate, the vapor phase pipeline upper plate and the liquid phase pipeline upper plate are designed in an integrated mode, the bottom surfaces of the evaporator upper plate, the condenser upper plate, the vapor phase pipeline upper plate and the liquid phase pipeline upper plate are on the same plane and are designed on the same plate, the integration effect is good, and the processing difficulty is reduced.
Preferably, as shown in fig. 1, the number of the condensers is two, and each condenser is provided with a separate vapor-phase line and a separate liquid-phase line connected to an evaporator which is arranged between the two condensers. The evaporator is provided with separate inlet and outlet manifolds connecting the vapor and liquid phase lines of each condenser.
The evaporator adopts a manifold design, and a full U-shaped loop is changed into a half U-shaped loop structure, so that a gas flow path is optimized; compared with the traditional loop heat pipe, the capillary path length and the flow velocity of the liquid phase working medium are reduced, the heat exchange time of liquid flowing through the micro-channel is prolonged, the heat exchange effect and the heat exchange efficiency are improved, in addition, the flow resistance of the liquid phase working medium is reduced by the semi-U-shaped loop manifold structure, and the heat transfer effect is improved.
Preferably, as shown in fig. 5 and 6, the microchannel comprises fishbone-shaped microchannel fins, and microchannels are formed between adjacent fishbone-shaped microchannel fins; the fins are divided into two rows inclined towards one side of the fluid flowing direction, a liquid phase channel is arranged between the two rows, and the two rows are symmetrically distributed along the liquid phase channel.
According to the invention, the integrated lower plate is provided with the cavity for accommodating the fishbone-shaped microchannel fins, and a certain included angle is formed between the cavity and the horizontal plane, so that the number and the area of the capillary cores are increased, the heat exchange area is increased, and the heat exchange efficiency is improved.
As shown in fig. 4-5, the fishbone-shaped microchannel fins include multiple sets with liquid phase channels formed between the sets of fins. The fishbone-shaped fin structure adopts a fishbone-type microchannel staggered with a horizontal plane inclination angle of 20 degrees. The fishbone-shaped micro-channel 1-2-4 is correspondingly matched with the steam channel 1-2-7, and the fishbone-shaped fin structure adopts the fishbone-shaped micro-channel which is staggered with the inclination angle of 20 degrees with the horizontal plane, so that the capillary cores are arranged in an equidistant array, the heat dissipation area is effectively increased, the space is saved, and the heat exchange performance is improved.
Preferably, the fishbone-shaped microchannel fins form a certain included angle with the horizontal plane, and capillary cores are filled between the fishbone-shaped microchannel fins. The staggered fishbone-type micro-channels are matched with the capillary cores, the trapezoidal micro-channels are filled at one side of the liquid storage tank, the triangular capillary cores are filled at the side of the gas buffer cavity, and the trapezoidal capillary cores are filled at the middle part. As shown in fig. 6, 1-2-9 is a triangular micro-channel, 1-2-10 is a parallelogram micro-channel, 1-2-11 is a trapezoid micro-channel, and the triangular capillary wick, the parallelogram capillary wick and the trapezoid capillary wick are respectively filled with the triangular micro-channel, the parallelogram capillary wick and the trapezoid capillary wick, and the rib plate is formed by interference fit with the capillary wick. The capillary core with various shapes effectively increases the heat exchange area and improves the heat exchange efficiency.
The invention designs and processes the high aspect ratio micro channel array, preferably the aspect ratio is 4.5-5.5, and more preferably 5. The capillary force of the micro channel to the liquid-phase working medium is greatly improved to provide more driving force for the circulation of the working medium in the pipe, so that the liquid-phase working medium can realize self-circulation without energy input in a complex loop heat pipe, the capillary core is designed into a parallelogram, a triangle and a trapezoid, the cavity area of the fishbone-shaped micro-channel fin is utilized to the maximum extent, and the heat exchange capacity is improved.
According to the invention, metal powder is injected by cold pressing, the capillary core and the middle plate of the evaporator are integrally designed, the capillary core and the bottom plate of the middle plate are combined into a whole by adopting a sintering method, and the porous structure increases the capillary force, provides a driving force and simultaneously increases the heat exchange efficiency.
Preferably, as shown in fig. 7, the lower plate of the evaporator is provided with a fin array 1-3-9, and the fin array 1-3-9 is arranged in a shuttle structure. The novel spindle-shaped fin is arranged, so that fluid can flow along the fin, the capillary cores are further fully soaked, and the evaporation efficiency is improved.
As shown in fig. 7, the fin arrays are multiple, and two adjacent fin arrays are connected end to end. Preferably, each fin array is divided into a plurality of layers, each array including a central fin and a plurality of layers of peripheral fins surrounding the central fin, each layer of fins being in a shuttle configuration. By arranging the multiple layers, the fluid can flow in the multiple layers sufficiently to exchange heat.
The fin arrays form a group, the head of the first shuttle-shaped structure of each group is opposite to the fluid direction of the liquid (facing to the fluid flow direction), the tail of the first shuttle-shaped structure is connected with the head of the second shuttle-shaped structure, and the like, so that a group is formed. Through the arrangement of the multiple layers, the fluid can fully flow in the multiple layers for heat exchange, and the flow channel of the fluid continuously flows along the shuttle shape and changes in volume frequently along with the flow, so that the heat exchange efficiency is further improved.
Preferably, the head and tail of the shuttle are both sharp.
Preferably, the tip angle of the head part of the shuttle structure is smaller than that of the tail part. Isomorphic above structure can make the fluid at first along the slow diffusion of shuttle shape, avoids the low characteristic of heat transfer effect that quick diffusion brought, promotes going on of heat transfer, promotes fluidic guide simultaneously, makes it further cooperate with preceding capillary structure, has improved evaporation efficiency.
Preferably, the central fins of each set are connected in the same line as the direction of fluid flow.
Preferably, the plurality of sets of fin arrays are arranged in parallel.
Preferably, the fin array is disposed at corresponding positions between the plurality of sets of fins.
Streamline flow guide modules 1-3-5 composed of fusiform fin arrays are arranged on the upper surface of the lower plate of the evaporator, and three groups of symmetrically distributed fins are macroscopically distributed in a fusiform manner to play a flow guide role, so that the capillary cores are further fully infiltrated, and the evaporation efficiency is improved.
The upper surface of the lower plate of the condenser is provided with array shuttle-shaped fins 1-3-9 similar to the evaporator, the flow resistance of liquid and gas is reduced, and the ratio of the width of the fins to the distance is 1: and 2, the flow resistance is further reduced, the heat exchange area is increased under the same condition, and the heat exchange efficiency of the condenser is effectively improved. The joint of the condenser lower plate and the vapor phase and liquid phase pipelines adopts a staggered micro-channel structure 1-3-10, so that the vapor phase entering the condenser is uniformly diffused to each micro-channel.
Preferably, the condenser is provided with fins, and the fins are in a shuttle structure. The shuttle-shaped structure is arranged to increase the heat conduction area, improve the heat dissipation efficiency and reduce the flow resistance of the vapor phase working medium.
The streamline flow guide module 1-3-5 formed by the fusiform fin array is matched with the fishbone-shaped fin structure in position to form the evaporator with a novel structure, so that a liquid channel and a steam channel which are matched with each other are further formed, and the heat exchange efficiency of the evaporator can be further improved.
The condenser part adopts a staggered micro-channel design, and a vapor phase working medium to be cooled is more uniformly diffused to the whole cooling cavity, so that the condensation efficiency is improved, and the vapor phase in a cycle can be converted into a liquid phase.
Preferably, the staggered-fork structure means that the inlet and the outlet of the condenser both adopt V-shaped structures, and compared with a condenser with a rectangular cavity, the heat exchange efficiency with the wall surface is improved on the premise of not reducing the flow speed.
After simulation calculation, the fact that the fusiform structure is matched with the V-shaped inlet structure and the V-shaped outlet structure is found, and under the condition that the pressure drop is almost unchanged compared with the common microchannel fin, the transient temperature uniformity improving effect is obvious.
Preferably, the fins are elastic parts, the heat conductor can be flushed when fluid flows through the elastic parts, and the fins can swing in a pulsating mode, so that descaling is promoted, turbulence is caused by vibration, and heat transfer can be enhanced.
Preferably, the elasticity of the fins is first reduced and then increased along the direction of fluid flow in the condenser section (from the inlet to the outlet of the condenser section). Because along with research discovery, along with steam gets into the condenser, because the volume increases suddenly, pressure diminishes, make the part liquid that the part carried also constantly form the gas, thereby make the impact increase, be difficult to the scale deposit, consequently, it begins to reduce gradually to set up elasticity, along with follow-up heat transfer condensation, the easier scale deposit of fluid, and along the fluid flow direction scale deposit degree more and more serious, consequently through setting up elasticity degree constantly increase, has reached further scale removal and has strengthened the heat transfer purpose, reduce big elastic heat conductor, reduce cost. Through the arrangement, heat exchange and descaling can be further and rapidly realized, and meanwhile, the cost can be saved, so that the best effect and the lowest cost are achieved.
It is further preferred that the heat conducting body has a decreasing magnitude of elasticity and subsequently an increasing magnitude of elasticity in the direction of fluid flow in the condenser section (from the inlet to the outlet of the condenser section). The change is found according to research, accords with the scaling rule, and can further reduce the cost, improve the heat exchange efficiency and reduce the scaling. So that the best results and lowest costs are achieved.
It is further preferred that the location of least flexibility of the fins is one fifth between the inlet and the outlet of the evaporator, close to the inlet.
Preferably, the liquid storage tank 1-2-2 is of an upper and lower through structure, and the gas buffer cavity 1-2-8 is not of an upper and lower through structure. Through so setting up can reduce the reservoir and be connected with gaseous buffer chamber, reduce liquid inflow gaseous buffer chamber.
Preferably, an anti-reverse inserting opening is arranged at a position corresponding to the gas buffering cavity of the upper plate of the evaporator.
Preferably, the ratio of the radius of the vapor phase pipeline to the radius of the liquid phase pipeline is 1.5.
Preferably, the filling port is located in the liquid phase line.
Preferably, the reservoir and the gas buffer chamber are circular arcs.
The manifold type evaporator loop heat pipe is characterized in that an integrated upper plate, an evaporator middle plate and an integrated lower plate are connected with a vacuum brazing mode through splicing. The vacuum brazing is favorable for the tight welding seam of the contact position of the integrated upper plate, the integrated lower plate and the middle plate of the evaporator, realizes good sealing performance, obviously improves the corrosion resistance of the product, has no environmental pollution in the processing process, lower production cost, higher yield and clean working surface. The splicing structure utilizes the anti-mounting reverse bayonet to realize splicing connection of the integrated upper plate, the evaporator middle plate and the integrated lower plate, so that the sealing performance of a workpiece is better.
The invention takes metal as raw materials of each part and can be manufactured and matched by precision machining. The capillary core in the evaporator is also made of metal materials and is manufactured by a vacuum heating furnace through a sintering method.
The integrated upper plate is integrally formed by the evaporator upper plate, the condenser upper plate, the upper plate vapor phase pipeline and the upper plate liquid phase pipeline on the same plane, and finish machining is facilitated.
Preferably, the manifold type evaporator loop heat pipe adopts a structural design that one evaporator is connected with two condensers in parallel, so that the condensation area is increased, the condensation rate is increased, and the heat exchange efficiency is improved.
Preferably, as shown in fig. 2, the integrated upper plate 1-1 includes an evaporator upper plate, a condenser upper plate, an upper plate vapor phase line, and an upper plate liquid phase line.
The evaporator upper plate comprises a gas buffer cavity, wherein the gas buffer cavity is correspondingly matched with a cavity of the integrated lower plate provided with the micro-channel, the integrated upper plate vapor phase pipeline 1-1-3 is corresponding to the integrated lower plate vapor phase pipeline, and the upper plate liquid phase pipeline 1-1-4 is matched with the integrated lower plate liquid phase pipeline, so that a complete manifold type evaporator loop heat pipe structure is formed.
Preferably, the liquid phase pipeline 1-1-4 on the upper plate of the evaporator is not communicated with the gas buffer cavity. The non-communicated area is tightly attached to the micro-channel of the lower plate part of the evaporator, so that steam generated in the gas buffer cavity can always flow out of the vapor phase pipeline and cannot flow back, and the capillary pressure balance in the evaporator is not damaged after the device is started.
Preferably, the gas buffering cavity of the upper plate of the evaporator is provided with anti-reverse insertion ports 1-1-6, so that the installation direction can be conveniently judged.
Preferably, as shown in fig. 2, the ratio of the radius of the upper plate vapor phase pipeline 1-1-3 to the radius of the upper plate liquid phase pipeline 1-1-4 is 1.5.
Preferably, as shown in fig. 2, the filling ports 1-1-5 are all located on the liquid phase pipeline section, so that the sealing performance is good, no air leakage hidden trouble exists, and the filling is facilitated.
Preferably, the stepped edge is arranged at the packaging position, so that the sealing performance is guaranteed. As shown in FIG. 2, 2-degree chamfered edge design is adopted at the packaging part 1-1-7, and the V-shaped automatic centering is beneficial to packaging.
Preferably, as shown in fig. 4-5, the plate 1-2 in the evaporator comprises a liquid phase inlet 1-2-1, a liquid storage tank 1-2-2, a fishbone-shaped micro-channel 1-2-4, an anti-insertion and anti-reverse-bayonet 1-2-5, a liquid phase channel 1-2-6, a steam channel 1-2-7 and a gas buffer cavity 1-2-8, wherein the staggered fishbone-shaped fin structure is correspondingly matched with the capillary core.
Preferably, as shown in fig. 4, the interior of the liquid storage tank 1-2-2 is designed to be a smooth circular arc-shaped liquid storage cavity, which has a buffer effect on the heat dissipation working medium, reduces the flow resistance of the liquid, and has a flow guiding effect at the same time, so that the heat dissipation working medium can flow into the evaporation tank conveniently. The heat dissipation working medium enters the liquid storage tank through the liquid phase pipeline, and then enters the fishbone-shaped microchannel through the liquid phase pipeline. The reservoir is connected with two diameter liquid phase inlet pipelines and three liquid phase outlet pipelines, preferably, the liquid phase inlet pipelines and the outlet pipelines have different diameters, the number of the outlet pipelines is more than that of the inlet pipelines, and the diameter of the outlet pipelines is smaller than that of the inlet pipelines. The liquid phase pipelines on the two sides are designed to be variable-diameter, the flow speed of the heat dissipation working medium is controlled, the buffering function is realized, the vaporization degree of the heat dissipation working medium in the evaporator is further controlled, and the heat exchange efficiency is improved.
Preferably, the liquid storage tank is connected with two liquid phase inlet pipelines with the diameter of 2mm and three liquid phase outlet pipelines with the diameter of 1 mm.
Preferably, the inner structures of the middle plate of the evaporator adopt 2mm, 1mm and 0.5mm round guide corners according to positions, so that the manufacturing process is simplified, and the manufacturing cost is reduced.
Preferably, as shown in fig. 4, the anti-reverse-bayonet 1-2-5 structure prevents the middle plate of the evaporator from being inserted reversely, and corresponds to the integrated upper plate and the integrated lower plate anti-reverse bayonet, so as to facilitate the positioning of the middle plate of the evaporator.
Preferably, as shown in fig. 4, the steam channel 1-2-7 is connected with the gas buffer cavity 1-2-8, the gas buffer cavity is used for buffering heat dissipation working media, the round angle design in the gas buffer cavity reduces resistance, and the heat dissipation working media are guided to enter the gas buffer cavity. The steam channel on the upper layer of the middle plate of the evaporator is designed in a hollow mode, part of the capillary core is shielded, part of the capillary core is exposed, and the working medium is heated and rises during circulation to form a manifold structure, so that a heat transfer path is optimized, and the heat dissipation efficiency is improved.
Preferably, when the integrated upper plate, the middle plate of the evaporator and the integrated lower plate are packaged, the stepped edge is adopted, and the sealing performance is favorably ensured. As shown in fig. 4, the sealing position 1-2-3 of the middle plate of the evaporator adopts a 2-degree chamfered edge design and a V-shaped automatic centering design, which is beneficial to positioning the middle plate of the evaporator, and is matched with the integrated upper plate and the integrated lower plate to facilitate sealing.
As shown in fig. 6, the staggered fishbone microchannel is matched with the capillary wick, 1-2-9 is a triangular microchannel, 1-2-10 is a parallelogram microchannel, 1-2-11 is a trapezoidal microchannel, the triangular capillary wick, the parallelogram capillary wick and the trapezoidal capillary wick are respectively filled with the staggered fishbone microchannel, and the rib plate is formed by interference fit with the capillary wick. The capillary core with various shapes effectively increases the heat exchange area and improves the heat exchange efficiency.
As shown in fig. 7, the integrated lower plate includes an evaporator lower plate 1-3-1, a lower plate liquid phase pipeline 1-3-2, a condenser lower plate 1-3-4, and a lower plate vapor phase pipeline 1-3-3.
Streamline diversion modules 1-3-5 composed of shuttle-shaped fin arrays are arranged on the upper surface of the lower plate of the evaporator, and three groups of symmetrically distributed fins are macroscopically distributed in a shuttle shape to play a diversion role, so that the capillary cores are further fully infiltrated, and the evaporation efficiency is improved.
Preferably, the inner wall of the lower plate of the evaporator is provided with anti-reverse insertion ports 1-3-6, and the side wall of the lower plate is inclined by 2 degrees in the vertical direction so as to be correctly matched with other parts and ensure air tightness. Preferably, the lower plate of the evaporator and the vapor phase pipeline have different axial heights, and the joint of the lower plate and the vapor phase pipeline adopts a smooth transition structure 1-3-7.
Preferably, the lower surface of the lower plate of the evaporator is engraved with 0.1mm of mark scribed lines 1-3-8 of the position of the evaporation cavity, and meanwhile, the roughness of the lower bottom surface is small, so that the lower bottom surface is favorable for positioning and matching with the position of a heat source and is in full contact with the heat source to reduce the thermal resistance.
The upper surface of the lower plate of the condenser is arrayed with 1-3-9 fusiform fins, so that the flow resistance of liquid and gas is reduced, and the width-to-space ratio of the fins is 1: and 2, the flow resistance is further reduced, the heat exchange area is increased under the same condition, and the heat exchange efficiency of the condenser is effectively improved. The joint of the condenser lower plate and the vapor phase and liquid phase pipelines adopts a staggered micro-channel structure 1-3-10, so that the vapor phase entering the condenser is uniformly diffused to each micro-channel.
Preferably, the 2mm round angle design is adopted at 1-3-11 of the upper step edge of the lower plate of the condenser, so that the air tightness of the equipment can be ensured, and the matching with the upper plate of the condenser is facilitated.
The above embodiments are only for illustrating the technical idea and features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the content of the present invention and implement the present invention, and not to limit the protection scope of the present invention by this means. All equivalent changes and modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.

Claims (10)

1. A loop heat pipe formed by combination comprises an upper plate, a middle plate and a lower plate, wherein the upper plate and the lower plate are of an integrated structure, the upper plate comprises an evaporator upper plate, a condenser upper plate, an upper plate vapor phase pipeline and an upper plate liquid phase pipeline, the lower plate comprises an evaporator lower plate, a condenser lower plate, a lower plate vapor phase pipeline and a lower plate liquid phase pipeline, the middle plate is the middle plate of the evaporator, a liquid phase inlet, a liquid storage tank, a micro-channel and a liquid phase channel are formed below the middle plate, a steam channel and a gas buffer cavity are formed above the middle plate, the upper plate, the middle plate and the lower plate are installed together to form a complete loop heat pipe, the condenser upper plate and the condenser lower plate form a condenser, the evaporator upper plate, the middle plate and the evaporator lower plate form an evaporator, the upper plate vapor phase pipeline and the lower plate vapor phase pipeline form a vapor phase pipeline, and the upper plate liquid phase pipeline and the lower plate form a liquid phase pipeline; the liquid absorbs heat in the evaporator, enters the gas buffer cavity through the steam channel, then enters the vapor phase pipeline, enters the condenser through the vapor phase pipeline for condensation, and the condensed liquid enters the liquid phase pipeline, enters the liquid storage tank through the liquid phase inlet, then enters the liquid phase channel, passes through the micro-channel from the liquid phase channel, and is heated to form steam entering the steam channel.
2. A loop heat pipe as claimed in claim 1, wherein the microchannel comprises fishbone microchannel fins, said fins being divided into two rows inclined to one side of the direction of fluid flow, the middle of the two rows being the liquid phase channel, said two rows being symmetrically distributed along the liquid phase channel.
3. A loop heat pipe as set forth in claim 1, wherein the fishbone microchannel fins comprise a plurality of sets, the liquid phase channel being formed between the plurality of sets of fins.
4. A loop heat pipe as claimed in claim 1 wherein the reservoir is of an upper and lower pass-through configuration and the gas buffer chamber is not of an upper and lower pass-through configuration.
5. A loop heat pipe as claimed in claim 1 wherein the evaporator lower plate is provided with an array of fins arranged in a shuttle configuration.
6. A loop heat pipe as claimed in claim 1, wherein an anti-reverse-insertion opening is provided at a position corresponding to the gas buffer chamber of the evaporator upper plate.
7. A loop heat pipe as claimed in claim 1 wherein the ratio of the radius of the vapor phase conduit to the radius of the liquid phase conduit is 1.5.
8. A loop heat pipe as set forth in claim 1 wherein the fill port is located in the liquid phase line.
9. A loop heat pipe as claimed in claim 1 wherein the reservoir and the gas buffer chamber are circular arcs.
10. A loop heat pipe as claimed in claim 2, wherein the ribs of the fishbone-shaped microchannel are at an angle to the horizontal plane, and the capillaries are filled between the ribs of the fishbone-shaped microchannel.
CN202210267340.5A 2022-03-18 2022-03-18 Loop heat pipe formed by combination Active CN115876010B (en)

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CN212695142U (en) * 2020-09-28 2021-03-12 董潇潇 Microchannel heat sink with interrupted inclined rib structure
CN113163683A (en) * 2021-04-02 2021-07-23 西安易朴通讯技术有限公司 Liquid cooling heat dissipation equipment, cabinet and system
CN113983843A (en) * 2021-03-01 2022-01-28 苏州圣荣元电子科技有限公司 Thin plate type loop heat pipe

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015183880A (en) * 2014-03-20 2015-10-22 富士通株式会社 Loop type heat pipe, its process of manufacture, and electronic apparatus
CN104406440A (en) * 2014-11-06 2015-03-11 江苏大学 Silicon-based miniature loop heat pipe cooler
CN107677152A (en) * 2017-09-19 2018-02-09 电子科技大学 A kind of Micro-channel Liquid-cooling Cold Plate
CN107702574A (en) * 2017-09-25 2018-02-16 华中科技大学 A kind of longitudinal liquid-supply evaporator
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