CN116007417B - A shuttle array fin evaporator and loop heat pipe thereof - Google Patents

Abstract

The present invention relates to a shuttle array fin evaporator, which comprises an evaporator lower plate, the evaporator lower plate is provided with a fin array, and the fin array is arranged in a shuttle structure. The present invention is provided with a new shuttle structure fin, which can make the fluid flow along the fin, further make the capillary wick fully infiltrated, and improve the evaporation efficiency.

Description

A shuttle array fin evaporator and loop heat pipe thereof

Technical Field

The invention relates to a heat pipe technology, in particular to a shuttle array fin evaporator and a loop heat pipe thereof, belonging to the heat pipe field of F28D15/02.

Background technique

Heat pipe technology originated in the United States and has a history of nearly 60 years. It makes full use of the heat conduction principle of two-phase working fluid flow and has the advantages of small thermal resistance, excellent heat transfer performance and high heat dissipation efficiency.

The loop heat pipe is a high-efficiency two-phase heat transfer device with high heat transfer performance, long-distance heat transmission, excellent temperature control characteristics, and the pipe can be bent arbitrarily and is easy to install. Due to its incomparable advantages over many other heat transfer devices, the loop heat pipe has a very broad application prospect in many fields.

The loop heat pipe mainly includes the evaporation section, condensation section, liquid reservoir, steam pipeline and liquid pipeline (insulated end). The whole cycle process is as follows: the liquid absorbs the heat outside the evaporation section, evaporates on the outer surface of the capillary wick in the evaporation section, and the generated steam flows from the steam pipeline to the condensation section, releases heat to the heat sink in the condensation section, and at the same time, the steam condenses into liquid, and finally flows into the liquid reservoir through the liquid pipeline. The liquid working medium in the liquid reservoir maintains the supply to the capillary wick in the evaporation section.

Most of the existing loop heat pipes do not use integrated manufacturing technology, the integration effect is poor, the processing difficulty is increased, and the existing heat pipes have strong heat dissipation noise and unsatisfactory effect.

The present invention provides a new type of loop heat pipe. By improving the structure and parameters of the traditional microchannel flat loop heat pipe evaporator, a new structure loop heat pipe is proposed. The evaporator lower plate, condenser lower plate, vapor phase pipeline lower plate, and liquid phase pipeline lower plate adopt an integrated design. The bottom surfaces of the four are in the same plane and designed on the same plate, with good integration effect and reduced processing difficulty. The evaporator upper plate, condenser upper plate, vapor phase pipeline upper plate, and liquid phase pipeline upper plate adopt an integrated design. The bottom surfaces of the four are in the same plane and designed on the same plate, with good integration effect and reduced processing difficulty. In addition, a U-shaped manifold structure is newly added. Through such a design, the heat flux density and heat dissipation efficiency of the loop heat pipe are effectively improved. In addition, the present invention uses a streamlined flow guide module composed of fishbone-shaped microchannel fins and shuttle-shaped fin arrays to effectively increase the heat exchange area between the evaporator and the heat source. The metal capillary core provides driving force and improves the heat dissipation efficiency, thereby realizing efficient and precise heat dissipation of the heat source.

The present invention also improves the fin structure of the prior art and provides a new shuttle-shaped fin structure.

Summary of the invention

The present invention aims to solve at least one of the technical problems existing in the prior art or related art. The present invention provides a loop heat pipe with good integration effect, reduced processing difficulty, high heat exchange efficiency and no energy consumption.

The technical solution of the present invention is as follows: a shuttle array fin evaporator, the evaporator comprises an evaporator upper plate, a middle plate and an evaporator lower plate, the evaporator lower plate is provided with a fin array, and the fin array is arranged in a shuttle structure.

Preferably, there are multiple fin arrays, and two adjacent fin arrays are connected end to end.

Preferably, each fin array is divided into multiple layers, each array includes a central fin and multiple layers of peripheral fins surrounding the central fin, and each layer of fins is a shuttle-shaped structure.

Preferably, a plurality of fin arrays form a group, the head of the first shuttle-shaped structure of each group is opposite to the flow direction of the liquid, the tail of the first shuttle-shaped structure is connected to the head of the second shuttle-shaped structure, and so on, thereby forming a group.

Preferably, the head and tail of the shuttle-shaped structure are both pointed.

Preferably, the tip angle of the head of the shuttle-shaped structure is smaller than the tip angle of the tail.

Preferably, the connecting line of each group of central fins is in the same direction as the fluid flow direction.

Preferably, multiple groups of fin arrays are arranged in parallel.

A loop heat pipe formed by combination includes an upper plate, a middle plate and a lower plate, wherein the upper plate includes an evaporator upper plate, a condenser upper plate, an upper plate vapor phase pipeline and an upper plate liquid phase pipeline, and the lower plate includes an evaporator lower plate, a condenser lower plate, a lower plate vapor phase pipeline and a lower plate liquid phase pipeline, and the middle plate is the middle plate of the evaporator, and the lower side of the middle plate includes a liquid phase inlet, a liquid storage tank, a microchannel, and a liquid phase channel, and the upper side of the middle plate includes a steam channel and a gas buffer chamber, and the upper plate, the middle plate and the lower plate are installed together to form a complete loop heat pipe, wherein the condenser upper plate and the condenser lower plate form a condenser, the evaporator upper plate, the middle plate and the evaporator lower plate form an evaporator, the upper plate vapor phase pipeline and the lower plate vapor phase pipeline form a vapor phase pipeline, and the upper plate liquid phase pipeline and the lower plate liquid phase pipeline form a liquid phase pipeline; the evaporator is the evaporator described above.

Preferably, a microchannel is arranged in the middle plate of the evaporator, and the microchannel includes fishbone-shaped microchannel fins, and fishbone-shaped microchannels are formed between adjacent fishbone-shaped microchannel fins; the fins are divided into two rows inclined to one side of the fluid flow direction, and the middle of the two rows is a liquid phase channel, and the two rows are symmetrically distributed along the liquid phase channel; the fin array is arranged at corresponding positions between multiple groups of fins.

The fins are elastic components, through which the fluid can flush the heat conductor when it flows. The fins will oscillate in a pulsating manner, thereby promoting descaling. The vibration causes a turbulent flow effect, which can also enhance heat transfer.

Preferably, along the flow direction of the fluid in the condensation section (from the inlet to the outlet of the condensation section), the elasticity of the fin decreases first and then increases.

Compared with the prior art, the present invention has the following advantages:

(1) The integrated lower plate is provided with a streamlined flow guide module composed of a shuttle-shaped fin array, which increases the heat exchange area of the liquid phase working medium, makes the diffusion and heating of the liquid phase working medium more uniform, and the streamlined design can effectively reduce the flow resistance caused by the fins to the liquid phase working medium.

(2) The evaporator adopts a manifold design, which transforms the full U-shaped loop into a semi-U-shaped loop structure to optimize the gas flow path. Compared with the traditional loop heat pipe, it reduces the capillary path length and the flow rate of the liquid working fluid, increases the heat exchange time of the liquid flowing through the microchannel, and improves the heat exchange effect and efficiency. In addition, the semi-U-shaped loop manifold structure reduces the flow resistance of the liquid working fluid and improves the heat transfer effect.

(3) Design and process high aspect ratio micro-channel arrays. The capillary force of the micro-channels on the liquid working fluid is greatly improved to provide more driving force for the working fluid circulation in the tube, so that the liquid working fluid can achieve self-circulation without energy input in the complex loop heat pipe. The capillary core shape is designed to be parallelogram, triangle, or trapezoidal to maximize the use of the cavity area of the fishbone-shaped microchannel fins and improve the heat exchange capacity.

(4) The evaporator lower plate, condenser lower plate, vapor phase pipeline lower plate, and liquid phase pipeline lower plate adopt an integrated design. The bottom surfaces of the four are in the same plane and are designed on the same plate, which has a good integration effect and reduces the difficulty of processing; the evaporator upper plate, condenser upper plate, vapor phase pipeline upper plate, and liquid phase pipeline upper plate adopt an integrated design. The bottom surfaces of the four are in the same plane and are designed on the same plate, which has a good integration effect and reduces the difficulty of processing.

(5) The integrated lower plate is provided with a cavity for accommodating the herringbone-shaped microchannel fins, which is at a certain angle to the horizontal plane, thereby increasing the number and area of the capillary cores, increasing the heat exchange area, and improving the heat exchange efficiency.

(6) Cold-pressed metal powder is injected, and the capillary wick and the evaporator middle plate are designed as an integrated whole. The capillary wick and the manifold bottom plate are combined into one by sintering. The porous structure increases the capillary force, provides driving force, and increases the heat transfer efficiency.

(7) The condenser part adopts a staggered microchannel design, which allows the vapor phase to be cooled to be more evenly diffused throughout the cooling chamber, improving the condensation efficiency and ensuring that the vapor phase can be converted into the liquid phase within one cycle.

(8) Connecting two condensers in parallel is beneficial to improving the condensation efficiency, reducing the flow resistance of the vapor phase and liquid phase, and increasing the upper limit of the heat flux density of the loop heat pipe.

(9) Multiple groups of shuttle-shaped fins are arranged in the condenser to increase the heat conduction area, improve the heat dissipation efficiency, and reduce the flow resistance of the vapor phase working fluid.

(10) The arc-shaped series liquid storage tank reduces the flow resistance of the heat-conducting medium, replenishes the liquid in time to fully soak the capillary wick, ensures no dry burning, and ensures constant heat dissipation efficiency.

(11) The arc-shaped gas buffer chamber reduces the flow resistance of the vapor phase working fluid and plays a buffering role when the heat transfer working fluid changes from liquid to gas, thus preventing the vapor phase pressure from being too high and affecting the phase change process.

(12) The diameters of the gas pipeline and the liquid pipeline are different, and the volume ratio is about 2:1, which provides space for the heat transfer medium to change into gas, making the circulation of the medium smoother.

(13) The bottom side of the integrated lower plate is engraved with marking lines indicating the position of the evaporation chamber, making it easier for users to locate the heat source.

(14) The edges of the integrated upper plate, the integrated lower plate, and the evaporator middle plate are designed with a 2° inclined trapezoidal structure to facilitate V-shaped positioning and sealing. Finally, vacuum brazing is used to tighten the welding gap at the contact point between the integrated upper plate, the integrated lower plate, and the evaporator middle plate, thereby achieving good sealing.

(15) Grooves are designed on the integrated upper plate and the integrated lower plate, and protrusions are designed on the corresponding positions of the evaporator middle plate, which helps to avoid the wrong direction when installing the evaporator middle plate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is an exploded view of a loop heat pipe of the present invention;

FIG2 is a front schematic diagram of the integrated upper plate of the present invention;

FIG3 is a schematic diagram of the reverse side of the integrated upper plate of the present invention;

FIG4 is a front schematic diagram of the evaporator middle plate of the present invention;

FIG5 is a schematic diagram of the reverse side of the middle plate of the evaporator of the present invention;

FIG6 is a partial schematic diagram of a middle plate of an evaporator of the present invention;

FIG7 is a front schematic diagram of the integrated lower plate of the present invention;

FIG. 8 is a schematic diagram of the reverse side of the integrated lower plate of the present invention.

In Figure 1, 1-1 is an upper plate, 1-2 is a middle plate, and 1-3 is a lower plate;

In Figure 2-3, 1-1-1 is the evaporator upper plate, 1-1-2 is the condenser upper plate, 1-1-3 is the upper plate vapor phase pipeline, 1-1-4 is the upper plate liquid phase pipeline, 1-1-5 is the filling port, 1-1-6 is the anti-reverse insertion port, and 1-1-7 is a 2° inclined trapezoidal structure;

In FIG4-5, 1-2-1 is a liquid phase inlet, 1-2-2 is a liquid storage tank, 1-2-3 is a 2° inclined trapezoidal structure, 1-2-4 is a herringbone-shaped microchannel, 1-2-5 is an anti-reverse insertion bayonet, 1-2-6 is a liquid phase channel, 1-2-7 is a steam channel, and 1-2-8 is a gas buffer chamber;

In Figure 6, 1-2-9 is a triangular microfluidic channel, 1-2-10 is a parallelogram microfluidic channel, and 1-2-11 is a trapezoidal microfluidic channel;

In Figure 7-8, 1-3-1 is the lower plate of the evaporator, 1-3-2 is the liquid phase pipeline of the lower plate, 1-3-3 is the vapor phase pipeline of the lower plate, 1-3-4 is the lower plate of the condenser, 1-3-5 is the streamlined guide module, 1-3-6 is the anti-reverse insertion bayonet, 1-3-7 is the smooth transition structure, 1-3-8 is the marking line of the evaporation chamber position, 1-3-9 is the shuttle fin, 1-3-10 is the staggered microchannel structure; 1-3-11 is the stepped edge on the lower plate of the condenser.

Detailed ways

The technical solutions in the embodiments of the present invention will be supplemented below with reference to the accompanying drawings in the embodiments of the present invention.

FIG1-7 discloses a loop heat pipe. As shown in FIG1, a loop heat pipe formed by a combination includes an upper plate 1-1, a middle plate 1-2 and a lower plate 1-3, and the upper plate 1-1 and the lower plate 1-3 are an integrated structure. As shown in FIG2, the upper plate 1-1 includes an evaporator upper plate 1-1-1, a condenser upper plate 1-1-2, an upper plate vapor phase pipeline 1-1-3 and an upper plate liquid phase pipeline 1-1-4. As shown in FIG7, the lower plate 1-3 includes an evaporator lower plate 1-3-1, a condenser lower plate 1-3-4, a lower plate vapor phase pipeline 1-3-3 and a lower plate liquid phase pipeline 1-3-2. The middle plate 1-2 is the middle plate of the evaporator. As shown in FIG4-5, the bottom of the middle plate 1-2 includes a liquid phase inlet 1-2-1, a liquid storage tank 1-2-2, a microchannel 1-2-4, and a liquid phase channel 1-2-6. The top of the middle plate includes a steam channel 1-2-7 and a gas buffer chamber 1-2-8. The upper plate 1-1, the middle plate 1-2 and the lower plate 1-3 are installed together to form a complete loop heat pipe, wherein the condenser upper plate and the condenser lower plate form a condenser, and the evaporator upper plate, the middle plate and the evaporator lower plate form a condenser. The lower plate of the evaporator forms an evaporator, the upper plate vapor phase pipeline and the lower plate vapor phase pipeline form a vapor phase pipeline, and the upper plate liquid phase pipeline and the lower plate liquid phase pipeline form a liquid phase pipeline; the liquid absorbs heat in the evaporator, enters the gas buffer chamber through the steam channel 1-2-7, and then enters the vapor phase pipeline, and enters the condenser through the vapor phase pipeline for condensation. The condensed liquid enters the liquid phase pipeline, enters the liquid storage tank through the liquid phase inlet, and then enters the liquid phase channel, passes through the microchannel from the liquid phase channel, is heated to form steam, and enters the steam channel.

Preferably, the upper plate 1-1 and the lower plate 1-2 are manufactured in one piece.

The evaporator lower plate, condenser lower plate, vapor phase pipeline lower plate and liquid phase pipeline lower plate adopt an integrated design. The bottom surfaces of the four are in the same plane and are designed on the same plate, which has a good integration effect and reduces the processing difficulty. The evaporator upper plate, condenser upper plate, vapor phase pipeline upper plate and liquid phase pipeline upper plate adopt an integrated design. The bottom surfaces of the four are in the same plane and are designed on the same plate, which has a good integration effect and reduces the processing difficulty.

Preferably, as shown in Fig. 1, there are two condensers, each condenser is provided with a separate vapor phase pipeline and a liquid phase pipeline connected to the evaporator, and the evaporator is arranged between the two condensers. The evaporator is provided with a separate inlet manifold and an outlet manifold connecting the vapor phase pipeline and the liquid phase pipeline of each condenser.

The evaporator of the present invention adopts a manifold design, which transforms the full U-shaped loop into a semi-U-shaped loop structure to optimize the gas flow path; compared with the traditional loop heat pipe, it reduces the capillary path length and the flow rate of the liquid working fluid, increases the heat exchange time of the liquid flowing through the microchannel, and improves the heat exchange effect and heat exchange efficiency. In addition, the semi-U-shaped loop manifold structure reduces the flow resistance of the liquid working fluid and improves the heat transfer effect.

Preferably, as shown in Figures 5 and 6, the microchannel includes fishbone-shaped microchannel fins, and microchannels are formed between adjacent fishbone-shaped microchannel fins; the fins are divided into two rows inclined to one side of the fluid flow direction, and the middle of the two rows is a liquid phase channel, and the two rows are symmetrically distributed along the liquid phase channel.

The present invention provides a cavity for accommodating fishbone-shaped microchannel fins on the integrated lower plate, which forms a certain angle with the horizontal plane, thereby increasing the number and area of the capillary cores, increasing the heat exchange area, and improving the heat exchange efficiency.

As shown in Figures 4-5, the fishbone-shaped microchannel fins include multiple groups, and the liquid phase channels are formed between the multiple groups of fins. The fishbone-shaped fin structure adopts a staggered fishbone microchannel with an inclination angle of 20° to the horizontal plane. The fishbone-shaped microchannel 1-2-4 of the present invention is matched with the steam channel 1-2-7, and the fishbone-shaped fin structure adopts a staggered fishbone microchannel with an inclination angle of 20° to the horizontal plane, so that the capillary cores are arranged in an equidistant array, effectively increasing the heat dissipation area, saving space, and improving the heat exchange performance.

Preferably, the fishbone-shaped microchannel fins are at a certain angle to the horizontal plane, and the capillary wicks are filled between the fishbone-shaped microchannel fins. The staggered fishbone microchannels and the capillary wicks cooperate with each other, and the trapezoidal microchannels are filled on one side of the liquid storage tank, the triangular capillary wicks are filled on the side of the gas buffer chamber, and the trapezoidal capillary wicks are filled in the middle part. As shown in Figure 6, 1-2-9 is a triangular microchannel, 1-2-10 is a parallelogram microchannel, and 1-2-11 is a trapezoidal microchannel, which are filled with triangular capillary wicks, parallelogram capillary wicks, and trapezoidal capillary wicks respectively, and the ribs and the capillary wicks are formed by interference fit. Capillary wicks of various shapes effectively increase the heat exchange area and improve the heat exchange efficiency.

The present invention designs and processes a micro-channel array with a high aspect ratio, preferably with an aspect ratio of 4.5-5.5, and more preferably 5. The capillary force of the micro-channel on the liquid phase working medium is greatly improved to provide more driving force for the working medium circulation in the tube, so that the liquid phase working medium can realize self-circulation without energy input in a complex loop heat pipe. The capillary core shape is designed to be parallelogram, triangle, trapezoid, and maximize the use of the cavity area of the fishbone-shaped microchannel fins to improve the heat exchange capacity.

The present invention injects metal powder by cold pressing, integrates the capillary core and the evaporator middle plate, and adopts a sintering method to integrate the capillary core and the middle plate bottom plate. The porous structure increases the capillary force, provides driving force, and increases the heat exchange efficiency.

Preferably, as shown in Fig. 7, the evaporator lower plate is provided with a fin array 1-3-9, and the fin array 1-3-9 is arranged in a shuttle-shaped structure. The present invention provides a new shuttle-shaped fin structure, which can make the fluid flow along the fin, further fully wet the capillary wick, and improve the evaporation efficiency.

As shown in FIG7 , there are multiple fin arrays, and two adjacent fin arrays are connected end to end. Preferably, each fin array is divided into multiple layers, each array includes a central fin and multiple layers of peripheral fins surrounding the central fin, and each layer of fins is a shuttle-shaped structure. By setting multiple layers, the fluid can fully flow and exchange heat therein.

Multiple fin arrays form a group, and the head of the first shuttle-shaped structure of each group is opposite to the fluid direction of the liquid (facing the fluid flow direction), and the tail of the first shuttle-shaped structure is connected to the head of the second shuttle-shaped structure, and so on, thereby forming a group. By setting up multiple layers, the fluid can fully flow and exchange heat in it, and the flow channel of the fluid frequently flows and changes in volume along the shuttle shape as it flows, further improving the heat exchange efficiency.

Preferably, the head and tail of the shuttle-shaped structure are both pointed.

Preferably, the tip angle of the head of the shuttle structure is smaller than the tip angle of the tail. The above structure can make the fluid diffuse slowly along the shuttle shape first, avoiding the low heat exchange effect caused by rapid diffusion, promoting heat exchange, and at the same time promoting the guidance of the fluid, so that it further cooperates with the capillary structure in front, thereby improving the evaporation efficiency. Preferably, the connection line of each group of central fins is the same as the flow direction of the fluid.

Preferably, multiple groups of fin arrays are arranged in parallel.

Preferably, the fin arrays are arranged at corresponding positions between the multiple groups of fins.

The upper surface of the lower plate of the evaporator is provided with a streamlined flow guide module 1-3-5 composed of a shuttle-shaped fin array. The three groups of symmetrically distributed fins also play a flow guide role in the shuttle-shaped distribution on a macro scale, further fully infiltrating the capillary wick and improving the evaporation efficiency.

The upper surface of the lower plate of the condenser is arrayed with shuttle-shaped fins 1-3-9 similar to those of the evaporator, which reduces the flow resistance of liquid and gas. The ratio of fin width to spacing is 1:2, which further reduces the flow resistance and increases the heat exchange area under the same conditions, effectively improving the heat exchange efficiency of the condenser. The connection between the lower plate of the condenser and the vapor phase and liquid phase pipelines adopts a staggered microchannel structure 1-3-10 to make the vapor phase entering the condenser evenly diffuse to each microchannel.

Preferably, the condenser is provided with fins, and the fins are of a shuttle-shaped structure. The shuttle-shaped structure is provided to increase the heat conduction area, improve the heat dissipation efficiency, and reduce the flow resistance of the vapor phase working medium.

The present invention presents an evaporator of a novel structure by coordinating the positions of the streamlined flow guide module 1-3-5 composed of a shuttle-shaped fin array with the fishbone-shaped fin structure, further forming liquid channels and steam channels that cooperate with each other, which can further improve the heat exchange efficiency of the evaporator.

The condenser part adopts a staggered microchannel design, so that the vapor phase working fluid to be cooled is more evenly diffused throughout the entire cooling chamber, improving the condensation efficiency and ensuring that the vapor phase can be converted into the liquid phase within one cycle.

Preferably, the staggered structure means that both the condenser inlet and the condenser outlet adopt a V-shaped structure, which increases the heat exchange efficiency with the wall without reducing the flow rate compared to the rectangular cavity condenser.

Through simulation calculations, it was found that by combining the shuttle structure with the inlet and outlet V-shaped structures, under the same flow rate, compared with the ordinary microchannel fins, the pressure drop remains almost unchanged, and the transient temperature uniformity is significantly improved.

Preferably, the fins are elastic components, through which the fluid can flush the heat conductor when it flows, and the fins will oscillate in a pulsating manner, thereby promoting descaling, and the vibration causes turbulence, which can also enhance heat transfer.

Preferably, along the flow direction of the fluid in the condensation section (from the inlet to the outlet of the condensation section), the elasticity of the fins first decreases and then increases. Because as research has found, as the steam enters the condenser, the pressure decreases due to the sudden increase in volume, so that part of the liquid carried also continuously forms vapor, which increases the impact and is not easy to scale. Therefore, the elasticity is set to gradually decrease. With the subsequent heat exchange and condensation, the fluid is more prone to scale accumulation, and the degree of scaling along the flow direction of the fluid is getting more and more serious. Therefore, by setting the elasticity to increase continuously, the purpose of further descaling and strengthening heat transfer has been achieved, reducing the high-elasticity heat conductor and reducing costs. Through the above-mentioned settings, heat exchange and descaling can be further quickly achieved, while saving costs, so that the best effect and lowest cost are achieved.

It is further preferred that along the fluid flow direction in the condensation section (from the inlet to the outlet of the condensation section), the elasticity of the heat conductor decreases gradually, and then increases continuously. The above changes are also based on research findings, in line with the law of scaling, and can further reduce costs, improve heat exchange efficiency, and reduce scaling, so as to achieve the best effect and the lowest cost.

Further preferably, the position where the fin has the least elasticity is at one fifth of the distance between the inlet and the outlet of the evaporator, close to the inlet.

Preferably, the liquid storage tank 1-2-2 is a through structure at the top and bottom, and the gas buffer chamber 1-2-8 is not a through structure at the top and bottom. This arrangement can reduce the connection between the liquid storage tank and the gas buffer chamber, and reduce the flow of liquid into the gas buffer chamber.

Preferably, an anti-reverse insertion slot is provided at a position corresponding to the gas buffer cavity of the upper plate of the evaporator.

Preferably, the radius ratio of the vapor phase pipeline to the liquid phase pipeline is 1.5:1.

Preferably, the filling port is located in the liquid phase pipeline.

Preferably, the liquid storage tank and the gas buffer chamber are arc-shaped.

The manifold evaporator loop heat pipe, wherein the integrated upper plate, the evaporator middle plate, and the integrated lower plate are connected by splicing and vacuum brazing. Vacuum brazing is conducive to the tight welding gaps at the contact positions of the integrated upper plate, the integrated lower plate, and the evaporator middle plate, achieving good sealing. In addition, the corrosion resistance of the product is significantly improved, the processing process is environmentally pollution-free, the production cost is low, the yield rate is high, and the working surface is clean. The splicing structure uses an anti-reverse mounting bayonet to realize the splicing connection of the integrated upper plate, the evaporator middle plate, and the integrated lower plate, so that the sealing performance of the workpiece is better.

The present invention uses metal as the raw material of each part, which can be made and matched through precision machining. The capillary core in the evaporator is also made of metal material and is made by sintering in a vacuum heating furnace.

The integrated upper plate integrates the evaporator upper plate, the condenser upper plate, the upper plate vapor phase pipeline, and the upper plate liquid phase pipeline into an integrated form on the same plane, which is conducive to fine processing.

Preferably, the manifold evaporator loop heat pipe adopts a structural design of one evaporator in parallel with two condensers, which increases the condensation area, increases the condensation rate, and improves the heat exchange efficiency.

Preferably, as shown in FIG. 2 , the integrated upper plate 1 - 1 includes an evaporator upper plate, a condenser upper plate, an upper plate vapor phase pipeline and an upper plate liquid phase pipeline.

The evaporator upper plate includes a gas buffer chamber, wherein the gas buffer chamber corresponds to a chamber of a microchannel provided on an integrated lower plate, the integrated upper plate vapor phase pipeline 1-1-3 corresponds to the integrated lower plate vapor phase pipeline, and the upper plate liquid phase pipeline 1-1-4 cooperates with the integrated lower plate liquid phase pipeline, thereby forming a complete manifold evaporator loop heat pipe structure.

Preferably, the liquid phase pipeline 1-1-4 of the upper plate of the evaporator is not connected to the gas buffer chamber. The unconnected area is closely fitted with the microchannel of the lower plate of the evaporator to ensure that the steam generated in the gas buffer chamber always flows out from the vapor phase pipeline without backflow, and ensure that the capillary pressure balance in the evaporator is not destroyed after the device is started.

Preferably, the gas buffer cavity of the upper plate of the evaporator is provided with an anti-reverse insertion slot 1-1-6 to facilitate determination of the installation direction.

Preferably, as shown in FIG. 2 , the radius ratio of the upper plate vapor phase pipeline 1-1-3 to the upper plate liquid phase pipeline 1-1-4 is 1.5:1. This ratio is advantageous in controlling the fluid flow rate and improving the phase change efficiency.

Preferably, as shown in FIG. 2 , the filling ports 1 - 1 - 5 are all located in the liquid phase pipe section, with good sealing performance, no risk of air leakage, and are conducive to filling.

As a preferred embodiment, a stepped edge is provided at the encapsulation to ensure sealing. As shown in FIG2 , the encapsulation 1-1-7 adopts a 2° chamfered edge design and a V-shaped automatic centering, which is beneficial to encapsulation.

Preferably, as shown in Figures 4-5, the evaporator middle plate 1-2 includes a liquid phase inlet 1-2-1, a liquid storage tank 1-2-2, a herringbone microchannel 1-2-4, an anti-reverse insertion latch 1-2-5, a liquid phase channel 1-2-6, a steam channel 1-2-7, and a gas buffer chamber 1-2-8, wherein the staggered herringbone fin structure corresponds to the capillary wick.

Preferably, as shown in FIG4 , the interior of the liquid storage tank 1-2-2 is designed as a smooth arc-shaped liquid storage cavity, which has a buffering effect on the heat dissipation medium, reduces the resistance to liquid flow, and at the same time plays a guiding role, so as to facilitate the heat dissipation medium to flow into the evaporation tank. The heat dissipation medium enters the liquid storage tank through the liquid phase pipeline, and then enters the fishbone-shaped microchannel through the liquid phase pipeline. The liquid storage tank is connected to two diameter liquid phase inlet pipelines and three liquid phase outlet pipelines. Preferably, the diameters of the liquid phase inlet pipeline and the outlet pipeline are different, the number of outlet pipelines is more than the inlet pipeline, and the diameter is smaller than the inlet pipeline. The liquid phase pipelines on both sides are designed with variable diameters to control the flow rate of the heat dissipation medium and realize the buffering function, thereby controlling the vaporization degree of the heat dissipation medium in the evaporator and improving the heat exchange efficiency.

Preferably, the liquid storage tank is connected to two 2 mm diameter liquid phase inlet pipelines and three 1 mm diameter liquid phase outlet pipelines.

Preferably, the internal structure of the evaporator middle plate adopts 2mm, 1mm, and 0.5mm rounded corners according to the position, which simplifies the manufacturing process and reduces the manufacturing cost.

Preferably, as shown in FIG. 4 , the anti-reverse insertion bayonet 1-2-5 structure prevents the evaporator middle plate from being inserted reversely, and corresponds to the anti-reverse installation bayonet of the integrated upper plate and the integrated lower plate, so as to facilitate the positioning of the evaporator middle plate.

As a preferred embodiment, as shown in FIG4 , the steam channel 1-2-7 is connected to the gas buffer chamber 1-2-8, and the gas buffer chamber is used to buffer the heat dissipation medium. The gas buffer chamber has a rounded corner design to reduce resistance and guide the heat dissipation medium into the gas buffer chamber. The steam channel on the upper plate of the evaporator adopts a hollow design, with part of the capillary core shielded and part of the capillary core exposed. When the medium circulates, it is heated and rises, forming a manifold structure, optimizing the heat transfer path, and improving the heat dissipation efficiency.

As a preferred method, when the integrated upper plate, the evaporator middle plate and the integrated lower plate are packaged, a stepped edge is used to ensure sealing. As shown in FIG4 , the evaporator middle plate packaging 1-2-3 adopts a 2° chamfering design and a V-shaped automatic centering design, which is conducive to the positioning of the evaporator middle plate, and cooperates with the integrated upper plate and the integrated lower plate to facilitate packaging.

As shown in Figure 6, the staggered herringbone microchannels and the capillary cores cooperate with each other. 1-2-9 is a triangular microchannel, 1-2-10 is a parallelogram microchannel, and 1-2-11 is a trapezoidal microchannel, which are filled with triangular capillary cores, parallelogram capillary cores, and trapezoidal capillary cores respectively. The ribs and capillary cores are formed by interference fit. Capillary cores of various shapes effectively increase the heat exchange area and improve the heat exchange efficiency.

As shown in FIG. 7 , the integrated lower plate includes an evaporator lower plate 1 - 3 - 1 , a lower plate liquid phase pipeline 1 - 3 - 2 , a condenser lower plate 1 - 3 - 4 and a lower plate vapor phase pipeline 1 - 3 - 3 .

The upper surface of the lower plate of the evaporator is provided with a streamlined flow guide module 1-3-5 composed of a shuttle-shaped fin array. The three groups of symmetrically distributed fins also play a flow guide role in the shuttle-shaped distribution on a macro scale, further fully infiltrating the capillary wick and improving the evaporation efficiency.

Preferably, the inner wall of the lower plate of the evaporator is provided with an anti-reverse insertion slot 1-3-6, and the side wall is inclined 2° in the vertical direction to properly cooperate with other components while ensuring air tightness. Preferably, the lower plate of the evaporator and the axial center of the vapor phase pipeline are at different heights, and a smooth transition structure 1-3-7 is adopted at the joint.

Preferably, the lower surface of the lower plate of the evaporator is engraved with 0.1 mm marking lines 1-3-8 for the position of the evaporation chamber, and the roughness of the lower bottom surface is relatively small, which is conducive to positioning and matching with the heat source position and sufficient contact to reduce thermal resistance.

The upper surface of the lower plate of the condenser is arrayed with shuttle fins 1-3-9 to reduce the flow resistance of liquid and gas. The ratio of fin width to spacing is 1:2, which further reduces the flow resistance and increases the heat exchange area under the same conditions, effectively improving the heat exchange efficiency of the condenser. The connection between the lower plate of the condenser and the vapor phase and liquid phase pipelines adopts a staggered microchannel structure 1-3-10 to make the vapor phase entering the condenser evenly diffuse to each microchannel.

Preferably, the stepped edge 1-3-11 on the lower plate of the condenser adopts a 2mm rounded corner design, which can not only ensure the air tightness of the equipment, but also facilitate the cooperation with the upper plate of the condenser.

The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims (5)

1. A shuttle array fin evaporator, the evaporator comprises an evaporator upper plate, a middle plate and an evaporator lower plate, the evaporator lower plate is provided with a fin array, the fin array is arranged in a shuttle structure; there are multiple fin arrays, and two adjacent fin arrays are connected end to end; multiple fin arrays form a group, the head of the first shuttle structure of each group is opposite to the fluid direction of the liquid, the tail of the first shuttle structure is connected to the head of the second shuttle structure, and so on, so as to form a group; the head and tail of the shuttle structure are both pointed; the angle of the tip of the head of the shuttle structure is smaller than the angle of the tip of the tail; each fin array is divided into multiple layers, each array includes a central fin and a plurality of peripheral fins surrounding the central fin, and each layer of fins is a shuttle structure. 2. The evaporator as claimed in claim 1, characterized in that the connecting line of each group of central fins is in the same direction as the fluid flow direction. 3. The evaporator as claimed in claim 1, characterized in that a plurality of fin arrays are arranged in parallel. 4. A combined loop heat pipe, comprising an upper plate, a middle plate and a lower plate, wherein the upper plate comprises an evaporator upper plate, a condenser upper plate, an upper plate vapor phase pipeline and an upper plate liquid phase pipeline, the lower plate comprises an evaporator lower plate, a condenser lower plate, a lower plate vapor phase pipeline and a lower plate liquid phase pipeline, the middle plate is the middle plate of the evaporator, the lower side of the middle plate comprises a liquid phase inlet, a liquid storage tank, a microchannel, and a liquid phase channel, the upper side of the middle plate comprises a steam channel and a gas buffer chamber, the upper plate, the middle plate and the lower plate are installed together to form a complete loop heat pipe, wherein the condenser upper plate and the condenser lower plate form a condenser, the evaporator upper plate, the middle plate and the evaporator lower plate form an evaporator, the upper plate vapor phase pipeline and the lower plate vapor phase pipeline form a vapor phase pipeline, and the upper plate liquid phase pipeline and the lower plate liquid phase pipeline form a liquid phase pipeline; the evaporator is the evaporator described in any one of claims 1 to 3. 5. The loop heat pipe according to claim 4 is characterized in that a microchannel is arranged in the middle plate of the evaporator, the microchannel includes fishbone-shaped microchannel fins, and fishbone-shaped microchannels are formed between adjacent fishbone-shaped microchannel fins; the fins are divided into two rows inclined to one side of the fluid flow direction, the middle of the two rows is a liquid phase channel, and the two rows are symmetrically distributed along the liquid phase channel; the fin array is arranged at corresponding positions between multiple groups of fins.