CN113380737A - Y-shaped immersed capillary micro-channel enhanced heat dissipation structure and manufacturing method thereof - Google Patents
Y-shaped immersed capillary micro-channel enhanced heat dissipation structure and manufacturing method thereof Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
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- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
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Abstract
The invention discloses a Y-shaped immersed capillary micro-channel enhanced heat dissipation structure and a manufacturing method thereof. The invention can further improve the working efficiency of boiling heat exchange under complex working conditions, is expected to break through the bottleneck of high heat flux density heat dissipation of electronic components, and meets the increasing heat dissipation requirements of the electronic components.
Description
Technical Field
The invention belongs to a high heat flow density boiling enhanced heat exchange technology, relates to a high-efficiency cooling technology suitable for a high heat flow density microelectronic device, and particularly relates to a Y-shaped immersed capillary micro-channel enhanced heat dissipation structure and a manufacturing method thereof.
Background
With the increasing processing precision of new generation electronic components represented by high-power integrated 5G chips, the smaller feature size increases the heat flux density on the chip surface, and heat dissipation has become the technical bottleneck of electronic technology development. According to investigation, high-temperature thermal failure becomes the most main reason that the microelectronic device cannot work normally, so that the thermal management effect of the chip directly influences the reliability of the electronic component. Boiling heat exchange is used as an efficient phase-change heat dissipation technology, and internal energy of a high-temperature wall surface can be transferred in modes of convection, vaporization and the like, so that the boiling heat exchange is widely applied to the field of cooling of electronic devices and achieves remarkable effect.
The traditional boiling heat dissipation structure has the problems of poor surface wettability, easy mixing of gas and liquid phases, less gasification core number on the boiling wall surface and the like, and has two important indexes: neither the convective Heat Transfer Coefficient (HTC) nor the critical heat flux density (CHF) meet current requirements.
Disclosure of Invention
The invention aims to provide a Y-shaped immersed capillary micro-channel enhanced heat dissipation structure and a manufacturing method thereof, and aims to solve the problems of insufficient liquid supplementing capacity, gas-liquid channel mixing, difficult bubble separation and the like in the cooling technology of high heat flow density electronic devices by using the conventional enhanced surface structure.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a heat radiation structure is reinforceed to Y font submergence formula capillary microchannel, includes the heat dissipation copper base plate, is the array arrangement on the heat dissipation copper base plate and has a plurality of Y font microcolumns, along horizontal direction, forms main microchannel between two adjacent Y font microcolumns, along longitudinal direction, forms the side microchannel between two adjacent Y font microcolumns, main microchannel with the side microchannel is perpendicular, the Y font microcolumn includes integrated into one piece's cube base and the plough cutting fin that is located cube base top, along horizontal direction, forms the even fluid infusion slit of width between the plough cutting fin of two adjacent Y font microcolumns, the even capillary imbibition layer of one deck is adhered to the bottom surface and the side of main microchannel.
Further, the total height h of the Y-shaped immersed capillary micro-channel enhanced heat dissipation structure1Is 5 mm.
Further, the length and width dimensions l of the heat dissipation copper substrate1×w110mm by 10 mm.
Further, the main microchannel width l2Is 1.2 mm.
Further, the thickness h of the bottom surface of the capillary liquid absorption layer3200-300 μm, side thickness l4Is 150-200 μm.
Further, the width w of the side micro-channel2Is 500 μm.
Further, the total height h of the Y-shaped microcolumn21.2mm, width l of the cubic base3And 400 μm.
Furthermore, the included angle theta between the plough cutting fins of the same Y-shaped microcolumn1At 90 DEG, the width w of each plowing fin3And a height h4Respectively 850 μm and 400 μm.
A manufacturing method of a Y-shaped immersed capillary micro-channel enhanced heat dissipation structure comprises the following steps:
the first step is as follows: carrying out linear cutting on the upper surface of the heat dissipation copper substrate to process a main micro-channel;
the second step is that: adhering a layer of shielding glue to the upper surface of the processed main microchannel, cleaning and deoiling other surfaces, then carrying out acid leaching, after rust removal and micro corrosion, extending the surface into a prepared electrophoretic paint containing a large amount of copper particles with the particle size of 70 microns, connecting a power supply with a workpiece, then electrifying, uniformly and flatly paving the micron-sized copper particles on the surface of the main microchannel under the action of an electric field, and controlling the operation time within two minutes;
the third step: carrying out surface cleaning after each electrophoresis layer, sequentially replacing electrophoresis paints containing copper particles with the particle sizes of 100 micrometers and 130 micrometers, repeating the electrophoresis process of the second step until three compact copper particle electrophoresis layers are processed on the surface of the main microchannel, finally forming a millimeter-scale capillary liquid absorption layer, and dissolving the residual shielding glue attached to the upper surface;
the fourth step: processing a side micro-channel on the side surface of the electrophoretic heat dissipation copper substrate, and cleaning and polishing the surface of the obtained side micro-channel;
the fifth step: carrying out annealing heat treatment of air cooling after heat preservation at the temperature of 280-320 ℃ on the workpiece obtained after the fourth step;
and a sixth step: and (3) performing up-and-down extrusion movement by using a coulter with a sharp corner on the bottom surface, uniformly opening the square microcolumn with the capillary liquid absorption layer wrapped on the side surface obtained after the fifth step, and finally forming the Y-shaped capillary micro-channel reinforced chip boiling heat exchange structure.
Further, the method also comprises a seventh step of: and cleaning the finished product obtained in the sixth step, and soaking the cleaned finished product in a hydrogen peroxide solution with the volume concentration of 30% for 1 hour.
Compared with the prior art, the invention has the following beneficial technical effects:
the invention provides a Y-shaped capillary immersed micro-channel enhanced boiling heat exchange structure, the special micro-channel shape design makes heat difficult to transfer to the topmost end of a Y-shaped micro-column, phase change bubble interference does not exist near a liquid supplementing slit, cooling liquid can more efficiently flow into the liquid supplementing, and the cooling liquid can be deeply developed towards a main micro-channel under the driving of wall surface capillary force, so that the liquid supplementing in the direction parallel to the outer surface of the main micro-channel is more stable and sufficient. In addition, the capillary liquid absorption layer on the surface of the Y-shaped microcolumn enables bubbles generated by phase change to be difficult to stay in the microchannel, simultaneously inhibits the combination of bubbles in the horizontal direction, and inhibits the generation of a wall surface gas film, thereby remarkably improving the critical heat flow density (CHF); the capillary liquid absorption layer obviously increases the number of nucleation sites on the heat exchange wall surface and the effective heat exchange area of the wall surface, so that the cooling liquid reaches the nucleation boiling phase change initial point (ONB) in advance under a small supercooling degree, the improvement of the phase change evaporation efficiency between three phase lines of a thin liquid film under high heat flow is promoted, and the convective Heat Transfer Coefficient (HTC) of the chip during boiling heat exchange is improved.
Furthermore, because steam is very sensitive to the pressure resistance change of the flow channel when overflowing, the Y-shaped microcolumn is designed into the characteristics that the wall surface of the main microchannel is rough and has large flow resistance and the wall surface of the side microchannel has small smooth flow resistance, the steam can quickly overflow from the smooth side microchannel after phase change, two probe pins extending out of the top surface of the Y-shaped microcolumn formed after plowing and cutting can obviously increase the flow resistance near the liquid supplementing slit, liquid insensitive to the resistance of the flow channel can be continuously supplemented from the liquid supplementing slit source, and the efficient phase change state that the gas-liquid channels respectively perform the respective channels and are separated from each other can be realized. In addition, the relative distance of the adjacent fluid infusion slits is lengthened by the plough cutting fins, so that the horizontal combination and expansion of phase-change steam at the bottom of the capillary liquid absorption layer are prevented, the condition that a steam film obstructs the infusion of liquid in the heat dissipation device is prevented, and the efficient and stable heat dissipation requirement of electronic components such as chips under high critical heat flux density can be met.
Further, the capillary liquid absorption layers located at the side and bottom of the Y-shaped microcolumn serve to increase the number of boiling nucleation sites, buffer the cooling liquid and stably supply it to the phase change region. Through the processing of multilayer solution electrophoresis technology, make the first electrophoretic deposition of the spherical copper particle of tiny particle form the thin layer on main microchannel surface, change the electrophoretic solution many times after afterwards, make main microchannel surface from inside to outside deposit the copper particle of multilayer particle diameter crescent, make the liquid in the capillary imbibition layer the capillary force that receives constantly increase from outside to inside, cooling liquid is more abundant with the contact of Y font microcolumn side.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
FIG. 1 is a schematic diagram of the three-dimensional structure of the enhanced boiling heat exchange structure of the Y-shaped capillary micro-channel of the present invention;
FIG. 2 is a front view of an enhanced boiling heat exchange structure of the Y-shaped capillary micro-channels of the present invention;
fig. 3 is a side view of the enhanced boiling heat exchange structure of the Y-shaped capillary micro-channel of the present invention.
Fig. 4 is a top view of the enhanced boiling heat exchange structure of the Y-shaped capillary micro-channel of the present invention.
Wherein, 1, a heat dissipation copper substrate; 2. a capillary liquid absorption layer; 3. y-shaped microcolumns; 4. a main microchannel; 5. a side microchannel; 6. plowing and cutting ribs; 7. and (6) a liquid supplementing slit.
Detailed Description
Embodiments of the invention are described in further detail below:
the invention provides a Y-shaped capillary immersed micro-channel enhanced boiling heat exchange structure and a manufacturing method thereof, on one hand, a capillary liquid absorbing layer 2 can obviously increase a vaporization core, and meanwhile, a main micro-channel 4 and a side micro-channel 5 which are formed by designing a Y-shaped micro-column 3 can realize local flow resistance control, so that bubbles are easier to separate from the side micro-channel 5 with small resistance, and the bubble separation frequency in the vertical direction is obviously increased, thereby improving the convection heat exchange coefficient; on the other hand, the Y-shaped microcolumn 3 can inhibit the formation of a gas film in the horizontal direction, meanwhile, the capillary liquid absorption layer contains a fine liquid supplementing channel, so that liquid can be supplemented to the bottom of the main microchannel 4 in a high heat flow area in time in a capillary pumping mode, the wettability and the liquid supplementing capacity of the heat dissipation device under high heat flow density are improved, local hot spots and dry spots generated after the liquid is supplemented in time are avoided, and the heat transfer deterioration of the high heat flow area is prevented; in addition, the steam after phase change overflows from the side micro-channel 5 with smooth wall surface and small flow resistance, cooling liquid is supplemented from the liquid supplementing slit 7 at the top ends of the two adjacent Y-shaped micro-columns 3, so that the relative separation of the gas-liquid channels is effectively formed, and the critical heat flow density of the heat dissipation device is effectively improved finally.
Specifically, referring to fig. 1, a schematic three-dimensional structure diagram, a Y-shaped capillary micro-channel enhanced boiling heat dissipation structure includes a heat dissipation copper substrate 1, a capillary liquid absorption layer 2 and a plurality of Y-shaped micro-pillars 3. Two sides of the Y-shaped microcolumn 3 are respectively provided with a main micro-channel 4 and a side micro-channel 5, the upper part of the plow cutting fin 6 is formed by extruding a special coulter with a sharp corner at the lower part, and a liquid supplementing slit 7 with a regular path is formed between the plow cutting fins 6 extending outwards. The capillary liquid absorption layer 2 is positioned in the main microchannel 4 between the Y-shaped microcolumns 3, plays roles of capillary liquid pumping to a high-temperature wall surface, liquid storage and transportation, boiling nucleation site increasing and the like, obviously improves the convective Heat Transfer Coefficient (HTC) of the wall surface of the Y-shaped microcolumn 3, and enables the heat dissipation structure to have excellent heat transfer stability and temperature uniformity.
As shown in fig. 2 and 3, the total height h of the Y-shaped capillary micro-channel enhanced boiling heat exchange structure15mm, length and width dimensions l of the heat-dissipating copper substrate 11×w110mm by 10 mm. Main microchannel 4 Width l21.2mm, a layer of uniform capillary liquid absorbing layer 2 is attached to the side surface and the bottom surface of the capillary liquid absorbing layer 2, and the thickness h of the bottom surface of the capillary liquid absorbing layer 23200-300 μm, side thickness l4Is 150-200 μm. Side microchannels 5 function to timely vent floor vapor, width w2Is 500 μm. Total height h of Y-shaped microcolumn 321.2mm, and a root width of l3400 μm, and the included angle theta between the plough-cutting fins 6 on the same microcolumn1Is 90 degrees, and the width w of each plowing and cutting fin 63And a height h4Respectively 850 μm and 400 μm.
The technical solutions of the present invention are described below clearly and completely with reference to the following embodiments, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Based on the principle of enhanced heat exchange of increasing wall surface wettability and liquid supplementing capacity and separating liquid inlet and gas escape flow channels, the invention prevents bubbles from being combined into a film in the horizontal direction by processing a special micro-channel shape and a capillary layer, improves the separation frequency of the bubbles in the vertical direction, and increases high heatThe liquid supplementing capacity under the flow realizes the relative separation of gas-liquid channels, thereby improving the convective Heat Transfer Coefficient (HTC) and the critical heat flux density (CHF), and having great development potential in the immersion type cooling application in a tiny space. The components mainly comprise a square heat dissipation copper substrate 1 with a length l1And width w1Both are 10mm, and the top surface of the heat dissipation copper substrate 1 is provided with a capillary liquid absorption layer 2 and Y-shaped microcolumns 3 which are manufactured by processes of linear cutting, electrophoresis, plowing and the like. The capillary liquid absorbing layer 2 is wrapped at the width l2The bottom surface and the side surface of the main micro-channel 4 with the diameter of 1.2mm obviously improve the number and the wettability of boiling nucleation sites on the wall surface and promote the convection heat exchange and the evaporation of the fluid-solid surface. When the cooling liquid is fed into the microchannel from the upper liquid feeding slit 7, the cooling liquid is stored in the narrow pores formed by sintering and bonding of the copper powder under the action of the capillary pump drive, continuously and stably spreads downwards along the capillary liquid absorption layer 2, and finally is transported to the thickness h3200-.
The plowing fins 6 will effectively change the local pressure resistance distribution due to the sensitivity to pressure drop obstruction when gas escapes. When the boiling phase change of the heating wall surface is severe, most steam can overflow from the smooth and narrow side micro-channel 5, so that the speed of the steam bubbles separating from the wall surface is improved, and the conditions of liquid supplementing capacity reduction, local hot point temperature fluctuation abnormity and the like caused by mutual interference of gas-liquid flow are prevented. In addition, the multilayer multi-particle-size copper particle electrophoresis process from inside to outside ensures that the capillary force of the capillary liquid absorption layer 2 is stable under long-time work, and the inter-particle connection strength is reliable and is not easy to fall off; on the other hand, the capillary transport capacity of liquid from outside to inside is enhanced, and the resistance of vapor overflowing from inside to outside is reduced.
The post-treatment process of the Y-shaped capillary microchannel enhanced boiling heat exchange structure, which comprises annealing heat treatment, hydrogen peroxide solution soaking and the like, improves the strength, the processing performance and the wall surface hydrophilicity of the heat dissipation device, can further ensure the stable working capacity during high-heat-flow work, and the rough wall surface at the rear part of the processing ensures that bubbles are difficult to gather when being violently generated and form an air film covering the surface of the whole microchannel.
The novel structure of the invention has the advantages of excellent boiling heat dissipation capability, mature theoretical model, low manufacturing cost, good development prospect and application capability, is expected to realize high heat flux density heat dissipation, and can be applied to the immersion type cooling solution of high-integration-level electronic components.
The manufacturing method of the boiling heat exchange structure of the Y-shaped capillary micro-channel reinforced chip comprises the following steps:
the first step is as follows: and (4) performing linear cutting on the upper surface of the heat-dissipation copper substrate 1 to form a wider main micro-channel 4.
The second step is that: adhering a layer of thin shielding glue on the upper surface of the processed main micro-channel 4, cleaning other surfaces, removing oil, performing acid leaching, removing rust, performing micro-corrosion, extending the surface into a prepared electrophoretic paint containing a large amount of micron-sized copper particles, connecting a power supply and a workpiece, applying current, uniformly and flatly paving the copper particles on the outer surface of the main micro-channel 4 under the action of an electric field, and controlling the operation time within two minutes to form a capillary liquid absorption layer 2.
The third step: and cleaning the surface of each electrophoretic layer, replacing the electrophoretic paint with larger particle size and repeating the electrophoresis process of the second step until three compact copper particle electrophoretic layers are processed on the surface of the main microchannel 4, and dissolving the residual shielding adhesive attached to the upper surface.
The fourth step: the side micro channel 5 is machined on the side surface after electrophoresis by a CNC machine tool, and the surface of the resulting side micro channel 5 is cleaned and polished.
The fifth step: and (3) carrying out annealing heat treatment of air cooling after the workpiece is subjected to heat preservation at the temperature of 280-320 ℃ so as to release internal residual stress and improve the surface hardness so as to improve the cold working performance of the brass.
And a sixth step: and (3) a coulter with a sharp angle of 90 degrees at the bottom surface is used for up-and-down extrusion movement, the square microcolumn containing the capillary liquid absorption layer 2 is uniformly pressed in half and half, and finally the Y-shaped capillary micro-channel reinforced chip boiling heat exchange structure is formed.
The seventh step: the finished product is cleaned and then soaked in a hydrogen peroxide solution with the concentration of 30% for 1 hour to improve the wettability of the capillary liquid absorption layer 2.
According to the invention, the compact capillary liquid absorption layer 2 is uniformly paved on the surface of the main microchannel in an electrophoresis mode, so that the heat exchange area is effectively expanded, the number of boiling nucleation sites on the wall surface is obviously increased, the fluid-solid coupling heat transfer effect can be improved in a capillary pumping mode, and local hot spots and dry spots of a heat dissipation structure are prevented, thereby being beneficial to increasing the convective Heat Transfer Coefficient (HTC) of the wall surface of the boiling heat dissipation structure; the outward extending fins are cut by the plow, the exhaust and liquid supplementing flow passages are relatively separated by changing the flow resistance of local fluid by utilizing the density difference of gas and liquid phases and the difference of the flow resistance sensitivity of the gas and liquid phases to the flow passage resistance during flowing, the overflow frequency of steam bubbles is increased, the phenomenon that steam is gathered in the micro-channel and extends in the horizontal direction to form a film and interfere the liquid supplementation is avoided, and the critical heat flow density (CHF) of the wall surface of the boiling heat dissipation structure is increased.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A Y-shaped immersed capillary micro-channel enhanced heat dissipation structure is characterized by comprising a heat dissipation copper substrate (1), a plurality of Y-shaped micro-columns (3) are arranged on the heat dissipation copper substrate (1) in an array manner, a main micro-channel (4) is formed between two adjacent Y-shaped micro-columns (3) along the transverse direction, a side micro-channel (5) is formed between two adjacent Y-shaped micro-columns (3) along the longitudinal direction, the main micro-channel (4) is vertical to the side micro-channel (5), the Y-shaped micro-column (3) comprises an integrally formed cubic base and plough cutting fins (6) positioned above the cubic base, along the transverse direction, a liquid supplementing slit (7) with uniform width is formed between the plough cutting fins (6) of two adjacent Y-shaped micro-columns (3), and a uniform capillary liquid absorbing layer (2) is attached to the bottom surface and the side surface of the main microchannel (4).
2. The structure of claim 1, wherein the overall height h of the structure is greater than the overall height of the structure1Is 5 mm.
3. The structure for enhancing heat dissipation of Y-shaped immersed capillary micro-channel as claimed in claim 1, wherein the length and width dimensions l of the heat dissipation copper substrate (1)1×w110mm by 10 mm.
4. The structure for enhancing heat dissipation of capillary micro-channels in Y-shape according to claim 1, wherein the width I of the main micro-channel (4) is larger than that of the main micro-channel2Is 1.2 mm.
5. The Y-shaped immersed capillary micro-channel enhanced heat dissipation structure as recited in claim 1, wherein the thickness h of the bottom surface of the capillary liquid absorption layer (2)3200-300 μm, side thickness l4Is 150-200 μm.
6. The structure for enhanced heat dissipation of Y-shaped immersed capillary micro-channel as claimed in claim 1, wherein the width w of the side micro-channel (5)2Is 500 μm.
7. The structure for enhancing heat dissipation of Y-shaped immersed capillary micro-channel as claimed in claim 1, wherein the total height h of the Y-shaped micro-column (3) is21.2mm, width l of the cubic base3And 400 μm.
8. The structure for enhancing the heat dissipation of a Y-shaped immersed capillary microchannel as claimed in claim 1, wherein the included angle θ between the plough cutting fins (6) of the same Y-shaped microcolumn (3)1Is 90 degrees, the width w of each plowing rib (6)3And a height h4Respectively 850 μm and 400 μm.
9. A method for manufacturing a Y-shaped immersed capillary microchannel enhanced heat dissipation structure as recited in any one of claims 1 to 8, comprising the steps of:
the first step is as follows: the main micro-channel (4) is processed on the upper surface of the heat dissipation copper substrate (1) in a wire cutting mode;
the second step is that: adhering a layer of shielding glue to the upper surface of the processed main microchannel (4), cleaning and deoiling other surfaces, then carrying out acid leaching, after derusting and micro-corrosion, extending the surface into a prepared electrophoretic paint containing a large amount of copper particles with the particle size of 70 microns, connecting a power supply with a workpiece, then electrifying, uniformly and flatly paving the micron-sized copper particles on the surface of the main microchannel (4) under the action of an electric field, and controlling the operation time within two minutes;
the third step: carrying out surface cleaning after each electrophoresis layer, sequentially replacing electrophoresis paints containing copper particles with the particle sizes of 100 micrometers and 130 micrometers, and repeating the electrophoresis process of the second step until three compact copper particle electrophoresis layers are processed on the surface of the main microchannel (4), finally forming a millimeter-scale capillary liquid absorption layer (2), and dissolving residual shielding glue attached to the upper surface;
the fourth step: processing a side micro-channel (5) on the side surface of the electrophoretic heat dissipation copper substrate (1), and cleaning and polishing the surface of the obtained side micro-channel (5);
the fifth step: carrying out annealing heat treatment of air cooling after heat preservation at the temperature of 280-320 ℃ on the workpiece obtained after the fourth step;
and a sixth step: and (3) performing up-and-down extrusion movement by using a coulter with a sharp corner on the bottom surface, uniformly opening the square microcolumn with the capillary liquid absorption layer (2) wrapped on the side surface obtained after the fifth step, and finally forming the Y-shaped capillary micro-channel reinforced chip boiling heat exchange structure.
10. The method for manufacturing the enhanced heat dissipation structure of the Y-shaped immersed capillary micro-channel as claimed in claim 9, further comprising a seventh step of: and cleaning the finished product obtained in the sixth step, and soaking the cleaned finished product in a hydrogen peroxide solution with the volume concentration of 30% for 1 hour.
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