200841159 九、發明說明： ’【發明所屬之技術領域】 • 本發明涉及一種散熱裝置，尤係指一種用於電子元件 上之散熱裝置。 【先前技術】 隨著資訊技術之飛速發展，電腦中央處理器之運算速 度越來越快，其產生之熱量也越來越多，而過多熱量若無 •法及時排出，將嚴重影響中央處理器運行時之穩定性。為 此，業界通常在中央處理器頂面裝設一散熱裝置，以協助 排除熱量。 習知散熱裝置組合，往往包括一散熱體，該散熱體包 括一散熱底座及形成於該底座上之散熱鰭片，由於該底座 係實體金屬，容易導致散熱不均勻，熱量集中在中央處理 器之發熱帶處且散熱速度慢，從而影響整體散熱效果。 $ 針對上述問題，業界可採用增加熱管之方法，如中國 專利公告第2612068Y號中揭露一散熱裝置，該散熱裝置包 括一散熱體及至少一熱管，該散熱體具有一基座，該基座 上形成有複數散熱鰭片，這些散熱鰭片之頂端還形成有一 平板，上述熱管之一端容置在該基座中，另一端容置於該 基板中。該散熱裝置通過熱管將基座之熱量轉移，但是中 央處理器之熱量還是通過基板傳至熱管及散熱鰭片，實體 金屬之基座影響了整個散熱裝置散熱速度。並且，由於基 座具有一定之厚度，無形中增加了整個散熱裝置之體積， 6 200841159 降低了散熱裝置之在不同系統中之適應性。 •【發明内容】 .本發明旨在提供—種散熱快、體積小之散熱裝置。 一種散熱裝置，用於對一電子元 熱趙片及至少二好，料熱管包括讀段及=2= 熱鰭片之放熱段，該等吸熱段呈平板狀^共面設置，= ^面用以與電子元件直接接觸，其上表面與該等散熱讀片 焊接。 曰 本發明散熱裝置將該等扁平熱管用作散熱裝置之底座 而與私子7〇件接觸，既使散熱裝置之傳熱性能提高，又未 顯著增加製造成本，，時使整個散熱裝置之體積減少，更 有效之利用系統空間。 【實施方式】 請參閱圖1至圖4,本發明散熱裝置1〇〇安裝於一電路 肇板（圖未示）上，用以對該電路板上之電子元件（圖未示），如 中央處理器進行散熱。該散熱裝置1〇〇包括一散熱鰭片組 2〇及連接該散熱鰭片組20與中央處理器之複數熱管1Q， 該散熱裝置100還包括二扣具50,該等扣具5〇焊接於散熱 鰭片組20底部兩側以將散熱裝置1QQ固定於電路板上。 熱官10均呈U形。每一熱管10包括一水平之吸熱段 12、一平行于該吸熱段12之放熱段14及一連接該吸熱段 12與放熱段14之連接段13。其中，該等吸熱段12壓成扁 平後相互並排且共同形成一上表面120與下表面125。各熱 7 200841159 管10之吸熱段12相互緊密接觸，以用作一平板狀之基座， .使其與中央處理器之上表面接觸以及與散熱籍片組之底 .面焊接。熱官1G之放熱段14處於同_平面且彼此相隔， 其用以穿設於散熱鰭片組2〇中。 散熱鰭片組20由複數單一散熱鰭片21相互平行間隔 卡扣形成，每一散熱鰭片21為大致呈！^形設置之金屬片， 且該等散熱縛片21垂直於該等熱管1〇之吸熱段12及放敎 #段14。散熱縛片組20底面中部形成一凸出部221，該凸出 部221兩側對稱形成二容置空間以收容二扣具％。每一散 熱鰭片21底部均設有同向彎折之折緣22〇，，豆中各折 緣225組成之平面與熱管1〇之吸熱段12之上表面12〇焊 接，處於折緣225兩側之折緣22〇所組成之平面與二扣具 5〇焊接。每—散熱_片21兩侧靠近頂部分別形成-折緣 25。該等折緣25、220及225共同將散熱續片㈣隔枢同 距離以形成散熱通風道。每一散熱鰭片21上均勻間隔設有 •四孔210,散熱籍片組2〇上之孔21〇共同組成四通道（圖未 標）以收容熱管10之放熱段14。 母扣具5〇包括一焊接於散熱鰭片組2〇之折緣22〇 上之定位板52及從定位板52兩端呈—定角度向外延伸之 扣合板54。每-扣合板54上設有一通孔（圖未標），方便螺 釘或鉚釘60等穿過從而將該散熱裝置1〇〇固定到電路板 上。 私 使用時，將該散熱裝置⑽之底面即熱管1()之吸熱段 12組成之基座直接與中央處理器接觸，該中央處理器產生 200841159 之熱篁由與其接觸之熱f 1〇之吸熱段12下表φ i25吸收； .這些熱管1G之吸熱段12吸收之熱量一部分直接傳遞至 與吸熱段12直接接觸之散熱籍片組2G之底部；另一部分 貝！ k過,、、、s 1G之連接段13及放熱段14將吸 敎 量傳遞至傳遞至散熱鳍片組2G之中央部分；最後，這此傳 ，至餘f片組2〇之熱量從散熱籍片組加散發至线 中，攸而戸、現對中央處理器之散熱。 孰^發日狀熱㈣之吸熱段12經壓錢面積增大，與散 組20焊接後直接與巾央處S|§接觸，與習 ^去了與中央處理器接觸之基座，其取代了基座，= 片組20接觸從㈣速吸熱及傳遞熱量。並且 議之體積因省去基座而具有了更大之適應性，能 在更多之系統中靈活安裝。 此 ^上所述’本發明符合發料财件，爰依 =*惟，以上所述者僅為本發明之較佳實施例，舉1 A悉本案技藝之人士’在爰依本發明精神所 ：凡 或變化，皆應涵蓋於以下之中請專利範圍内。…）錦 【圖式簡單說明】 圖1係本發明散熱裝置之立體分解圖。 圖2係圖1散熱裝置倒置之立體分解圖。 圖3係圖1散熱裝置之組合圖。 圖4係圖2散熱裝置之組合圖。 【主要元件符號說明】 9 200841159 散熱裝置 100 熱管 10 吸熱段 12 上表面 120 下表面 125 連接段 13 放熱段 14 散熱鰭片組 20 散熱鰭片 21 孔 210 折緣 220 、 225 、 25 凸出部 221 扣具 50 定位板 52 扣合板 54 鉚釘 60200841159 IX. INSTRUCTIONS: 'Technical field to which the invention pertains>> The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for an electronic component. [Prior Art] With the rapid development of information technology, the computer central processing unit is running faster and faster, and the heat generated by it is increasing. If too much heat is discharged in time, it will seriously affect the central processing unit. Stability at runtime. For this reason, the industry usually installs a heat sink on the top surface of the central processor to help remove heat. The conventional heat sink assembly often includes a heat dissipating body, and the heat dissipating body includes a heat dissipating base and heat dissipating fins formed on the base. Since the base is solid metal, the heat dissipation is uneven, and the heat is concentrated in the central processing unit. The heat is in the tropic zone and the heat dissipation rate is slow, which affects the overall heat dissipation effect. For the above problem, the industry may adopt a method of adding a heat pipe. For example, a heat sink is disclosed in the Chinese Patent Publication No. 2612068Y. The heat sink includes a heat sink and at least one heat pipe. The heat sink has a base on the base. A plurality of heat dissipating fins are formed. The top ends of the heat dissipating fins are further formed with a flat plate. One end of the heat pipe is received in the base, and the other end is received in the substrate. The heat sink transfers the heat of the susceptor through the heat pipe, but the heat of the central processor is transmitted to the heat pipe and the heat sink fin through the substrate, and the base of the solid metal affects the heat dissipation speed of the entire heat sink. Moreover, since the base has a certain thickness, the volume of the entire heat sink is invisibly increased, and 6 200841159 reduces the adaptability of the heat sink in different systems. • [Summary of the Invention] The present invention aims to provide a heat sink that is fast in heat dissipation and small in size. The utility model relates to a heat dissipating device, which is used for pairing an electron element and at least two, the heat pipe comprises a reading section and a heat release section of the =2= hot fin, and the heat absorbing sections are arranged in a flat shape and are coplanar, and the surface is used for the surface. In direct contact with the electronic component, the upper surface thereof is soldered to the heat dissipation reading sheets. The heat dissipating device of the present invention uses the flat heat pipe as a base of the heat dissipating device to be in contact with the private element, so that the heat transfer performance of the heat dissipating device is improved without significantly increasing the manufacturing cost, and the volume of the entire heat dissipating device is made. Reduce and use system space more efficiently. [Embodiment] Referring to FIG. 1 to FIG. 4, the heat dissipating device 1 of the present invention is mounted on a circuit board (not shown) for electronic components (not shown) on the board, such as the center. The processor dissipates heat. The heat dissipating device 1 includes a heat dissipating fin set 2 and a plurality of heat pipes 1Q connecting the heat dissipating fin set 20 and the central processing unit. The heat dissipating device 100 further includes two fastening devices 50. The bottom sides of the heat dissipation fin group 20 are fixed on the circuit board with the heat sink 1QQ. The hot officials 10 are all U-shaped. Each heat pipe 10 includes a horizontal heat absorbing section 12, a heat releasing section 14 parallel to the heat absorbing section 12, and a connecting section 13 connecting the heat absorbing section 12 and the heat releasing section 14. Wherein, the heat absorbing sections 12 are pressed flat and then side by side and together form an upper surface 120 and a lower surface 125. Each heat 7 200841159 The heat absorbing section 12 of the tube 10 is in close contact with each other to serve as a flat base, which is brought into contact with the upper surface of the central processing unit and welded to the bottom surface of the heat radiating film set. The exothermic sections 14 of the thermal officer 1G are in the same plane and are spaced apart from each other, and are used to pass through the fin group 2〇. The heat dissipation fin group 20 is formed by a plurality of single heat dissipation fins 21 being spaced apart from each other in parallel, and each of the heat dissipation fins 21 is substantially present! The metal sheets are disposed in a shape, and the heat dissipating tabs 21 are perpendicular to the heat absorption section 12 and the detent section 14 of the heat pipes 1 . A bulging portion 221 is formed in the middle of the bottom surface of the heat-dissipating die set 20, and the two accommodating spaces are symmetrically formed on both sides of the protruding portion 221 to accommodate the two fasteners. The bottom of each of the heat dissipation fins 21 is provided with a flange 22 of the same direction of bending, and the plane formed by each of the flanges 225 of the bean is welded to the upper surface 12 of the heat absorption section 12 of the heat pipe 1 at the flange 225 The plane formed by the side flange 22 is welded to the two fasteners 5〇. Each of the heat-dissipating sheets 21 is formed with a folded edge 25 on both sides of the top. The flanges 25, 220 and 225 collectively displace the heat sink (4) at the same distance to form a heat dissipation vent. Each of the heat dissipating fins 21 is evenly spaced and provided with four holes 210, and the holes 21 of the heat radiating chip group 2 are collectively formed into four channels (not shown) to accommodate the heat releasing portion 14 of the heat pipe 10. The female fastener 5 includes a positioning plate 52 welded to the flange 22 of the heat dissipation fin group 2, and a fastening plate 54 extending outward from the two ends of the positioning plate 52. Each of the fastening plates 54 is provided with a through hole (not shown) for facilitating the passage of screws or rivets 60 to fix the heat sink 1 to the circuit board. In private use, the bottom surface of the heat sink (10), which is the heat absorption section 12 of the heat pipe 1 (), is directly in contact with the central processor, and the central processor generates the heat of the heat of the heat of the heat of the heat of the heat of the heat Section 12 below table φ i25 absorption; . The heat absorbed by the heat absorption section 12 of these heat pipes 1G is directly transmitted to the bottom of the heat radiation group 2G which is in direct contact with the heat absorption section 12; another part is! The connection section 13 and the heat release section 14 of the k, , , and s 1G transfer the suction amount to the central portion of the heat dissipation fin group 2G; finally, this is transmitted to the heat of the remaining fin group 2 The film group is added to the line, and the heat is discharged from the central processor.吸 ^ 发日型热 (4) The heat absorption section 12 increased the area of the pressure, and after welding with the loose group 20, it directly contacts the S|§ of the towel, and replaces the base with the central processor, which replaces it. The pedestal, = chip set 20 contacts the heat from the (four) speed and transfers heat. And the size of the discussion is more adaptable due to the elimination of the pedestal, and it can be flexibly installed in more systems. The invention is in accordance with the invention, and the above is only a preferred embodiment of the present invention, and the person skilled in the art of the present invention is in the spirit of the present invention. : Where or change, it should be covered in the following patents. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat sink of the present invention. 2 is an exploded perspective view of the heat sink of FIG. 1 inverted. Figure 3 is a combination diagram of the heat sink of Figure 1. Figure 4 is a combination diagram of the heat sink of Figure 2. [Main component symbol description] 9 200841159 Heat sink 100 Heat pipe 10 Heat absorbing section 12 Upper surface 120 Lower surface 125 Connection section 13 Heat release section 14 Heat sink fin set 20 Heat sink fin 21 Hole 210 Folding edge 220, 225, 25 Projection part 221 Buckle 50 positioning plate 52 fastening plate 54 rivet 60