TWI576227B - Heat dissipation base and method of manufacturing same - Google Patents

Description

Heat sink base and manufacturing method thereof

A heat dissipation base and a manufacturing method thereof, in particular, a heat dissipation base capable of saving manufacturing cost and greatly reducing the overall weight of the heat dissipation base, and a manufacturing method thereof.

With the faster computing speed of current electronic devices, the heat generated by the internal electronic components generates relatively high heat, so the heat dissipating components are required to dissipate heat for the electronic components, but some of the heat dissipating components are disposed on the electronic components. The central part of the device is protected by the casing of the electronic device, so that the heat generated by the device is easily collected in the casing of the electronic device and cannot be diffused and dissipated, and the heat conduction element is transmitted as a heat conduction element by utilizing the characteristics of the heat source at the distal end of the heat pipe. Heat is transferred to the outside of the electronics housing for heat dissipation.

However, in the current application of the prior art, the heat pipe system cannot directly combine with the electronic component. When the heat pipe is used as the heat transfer component, it is still necessary to contact the heat source through at least one susceptor or combine with the heat source, so that the heat pipe can be firmly combined. The heat generated by the heat source is transmitted on the heat source, and the base of the prior art is mainly made of a metal material having a heat conductive property such as aluminum material and copper material, and then a hole or a groove is formed through the base. The trough is combined with the heat pipe to transfer heat in a tight fit, inlay, glue, or weld.

Although the base of the metal material has the advantages of better heat conduction and rapid mass production, the material cost is high, and the weight is heavy, so it is inconvenient to carry and transport.

Therefore, the prior art has the following disadvantages: 1. The cost is high; 2. The weight is heavier; 3. Inconvenient to carry.

Accordingly, in order to solve the above disadvantages of the prior art, the present invention provides a heat dissipation base that reduces the overall weight.

A secondary object of the present invention is to provide a method of manufacturing a heat dissipation base that can reduce production costs.

In order to achieve the above object, the present invention provides a heat dissipation base comprising: a heat conducting component, a body; the heat conductive component has a first side and a second side; the body has a groove and a first a first side portion and a second side portion, the groove portion communicates with the first and second side portions, the heat conducting element is embedded in the first side portion of the body, and the second side surface of the heat conducting element corresponds to the groove portion The system is made of a polymer material, and the heat-conducting element is molded in an integrated manner with the system.

In order to achieve the above object, the present invention provides a method for manufacturing a heat dissipation base, comprising the steps of: providing a heat conduction element and at least one heat pipe; forming a base body on a circumference side of the heat conduction element; fixing the heat pipe to the foregoing One side of the heat conducting element.

The heat dissipation base and the manufacturing method thereof of the invention can not only reduce the weight of the heat dissipation base, but also greatly reduce the production cost; therefore, the invention has the following advantages: 1. lightening the weight; 2. reducing the production cost.

The above object of the present invention and its structural and functional characteristics will be based on the drawings The preferred embodiment of the formula is illustrated.

1 and 2 are a perspective exploded view and a combination diagram of a first embodiment of the heat dissipation base of the present invention. As shown in the figure, the heat dissipation base 1 of the present invention comprises: a heat conducting component 11 and a body 12 The heat conducting component 11 has a first side surface 111 and a second side surface 112. The body 12 has a groove portion 121 and a first side portion 122 and a second side portion 123. The groove portion 121 communicates with the first portion. The first and second side portions 122 and 123 are disposed on the first side portion 122 of the body 12, and the second side 112 of the heat conducting member 11 corresponds to the groove portion 121. The body 12 is high. The molecular material is formed, and the heat conducting element 11 and the body 12 are integrally molded.

The material of the heat conducting element 11 is made of a copper material, an aluminum material, a stainless steel material, a graphite material, and a heat conductive alloy material. The present embodiment is described by a copper material, but is not limited thereto.

Please refer to FIGS. 3 and 4 , which are perspective exploded and combined views of the second embodiment of the heat dissipation base of the present invention. As shown in the figure, the embodiment has the same structure as that of the first embodiment, and therefore will not be used here. Further, the difference between the embodiment and the first embodiment is that the groove portion 121 further has an open side 1211 and a bottom side 1212, and the second side portion 123 and the open side 1211 are disposed at the boundary. There is at least one arm portion 13 which spans the open side 1211. The arm portion 13 can press a heat pipe 2 to make the heat pipe 2 and the heat conducting member 11 closer. Fixed bonding.

Referring to FIG. 5, it is a perspective view of a third embodiment of the heat dissipation base of the present invention. As shown in the figure, the embodiment is identical to the structure of the first embodiment, and therefore will not be described again, but the implementation is not described herein. The difference between the example and the foregoing first embodiment is that the groove portion 121 further has an open side 1211 and a bottom side 1212 and a fixing component 14 . The fixing member 14 is not integrally formed with the body 12, and the fixing member 14 is disposed above the open side 1211 of the groove portion 121, and the fixing member 14 is capable of applying pressure to the radial direction of the heat pipe 2. The heat pipe 2 is fixed to the body 12 and the heat conducting element 11 and the degree of tight coupling between the heat pipe 2 and the heat conducting element 11 is further enhanced.

Please refer to FIG. 6 , which is a cross-sectional view of a fourth embodiment of the heat dissipation base of the present invention. As shown in the figure, the embodiment is identical to the structure of the first embodiment, and therefore will not be described herein again. The difference from the first embodiment is that the groove portion 121 further has a heat pipe 2, and the heat pipe 2 is disposed on the groove portion 121. The heat pipe 2 has a flat shape on at least one side and the heat conducting member 11 The second side 112 is attached, and the heat pipe 2 and the heat conducting element 11 have a heat conducting medium 3 therebetween.

Please refer to FIG. 7 , which is a perspective view of a fifth embodiment of the heat dissipation base of the present invention. As shown in the figure, the embodiment is identical to the structure of the first embodiment, and therefore will not be described herein again, but the implementation is not described herein. The difference between the example and the first embodiment is that the body 12 further has a third side portion 124 and a fourth side portion 125. The third and fourth side portions 124 and 125 are respectively connected to the at least one fixing component 4 . .

Referring to FIG. 8 , it is a cross-sectional view of a sixth embodiment of the heat dissipation base of the present invention. As shown in the figure, the embodiment is identical to the structure of the first embodiment, and therefore will not be described herein again, but the implementation is not described herein. The difference from the first embodiment is that the heat conducting component 11 further has a joint portion 113. The joint portion 113 is disposed on the circumferential side of the heat conducting component 11. The joint portion 113 can be rough and concave. , hook shape, wavy shape and zigzag shape can be used to strengthen the design of the solid body 12 and the heat conducting element 11 to be firmly combined.

FIG. 9 is a perspective exploded view of a seventh embodiment of the heat dissipation base of the present invention. As shown in the figure, the embodiment has the same structure as that of the first embodiment. The second embodiment 112 of the heat conducting element 11 has at least one recess 1123, and the heat pipe 2 is received in the recess 1123. .

Please refer to FIG. 10 , which is a flow chart of the manufacturing method of the heat dissipation base of the present invention, and refer to FIG. 1 to FIG. 9 together. As shown in the figure, the manufacturing method of the heat dissipation base of the present invention comprises the following steps: S1 Providing a heat conducting component and at least one heat pipe; preparing a heat conducting component 11 and at least one heat pipe 2, wherein the heat conducting component 11 is a material having better heat conducting properties, such as copper material and aluminum material, wherein the material is made of copper. It is better.

S2: forming a body of the base on the circumference of the heat-conducting element; the body 12 having a base formed on the circumference of the heat-conducting element 11 by injection molding has a groove portion 121, and the heat-conducting element 11 is partially embedded It is disposed on the side of the body 12 of the base and corresponds to the groove portion 121. The body 12 of the base is made of plastic material. Further, as shown in Fig. 5, the fixing member 14 spans over the groove portion, or as shown in Figs. 3 and 4, the arm portion 13 straddles the open side 1211 of the groove portion 121.

S3: Fixing the heat pipe to the side of the heat conducting element.

The heat pipe 2 side is correspondingly attached to one side of the heat conducting element 11 and mechanically combined to fix the two. The machining may be any one of tight fitting, inlaying, gluing and welding.

1‧‧‧heating base

11‧‧‧thermal element

111‧‧‧ first side

112‧‧‧ second side

113‧‧‧Combination Department

12‧‧‧Ontology

121‧‧‧Slots

1211‧‧‧ open side

1212‧‧‧ bottom side

1123‧‧‧ recess

122‧‧‧First side

123‧‧‧ second side

124‧‧‧ third side

125‧‧‧ fourth side

13‧‧‧ Arms

14‧‧‧Fixed components

2‧‧‧heat pipe

3‧‧‧ Thermal medium

4‧‧‧Fixed parts

1 is a perspective exploded view of a first embodiment of a heat dissipation base of the present invention; FIG. 2 is a perspective view of a first embodiment of the heat dissipation base of the present invention; An exploded perspective view of two embodiments; 4 is a perspective view of a second embodiment of the heat dissipation base of the present invention; FIG. 5 is a perspective view of a third embodiment of the heat dissipation base of the present invention; and FIG. 6 is a fourth embodiment of the heat dissipation base of the present invention. FIG. 7 is a perspective view showing a fifth embodiment of the heat dissipation base of the present invention; FIG. 8 is a cross-sectional view showing a sixth embodiment of the heat dissipation base of the present invention; and FIG. 9 is a seventh embodiment of the heat dissipation base of the present invention. 3 is an exploded perspective view of the embodiment; FIG. 10 is a flow chart showing the steps of the method for manufacturing the heat dissipation base of the present invention.

1‧‧‧heating base

11‧‧‧thermal element

111‧‧‧ first side

112‧‧‧ second side

12‧‧‧Ontology

121‧‧‧Slots

122‧‧‧First side

123‧‧‧ second side

Claims (8)

A heat dissipation base includes: a heat conducting component having a first side and a second side, wherein the heat conducting component further has a joint portion disposed on a circumference side of the heat conducting component, wherein the joint portion is a rough surface, a concave-convex shape, a hook shape, a wave shape, and a zigzag shape; a body having a groove portion and a first side portion and a second side portion, the groove portion connecting the first and second side portions, The heat conducting component is embedded in the first side of the body, and the second side of the heat conducting component corresponds to the groove. The system is made of a polymer material, and the heat conducting component is integrally formed with the body. The fixing portion is used for reinforcing the body and the heat conducting member to be firmly coupled; a heat pipe is disposed in the groove portion, the heat pipe is at least one side flat and is attached to the second side of the heat conducting component; and a fixing component, the fixing component is The body is not integrally formed, and the fixing component is disposed above the open side of the groove portion, so that the fixing component fixes the heat pipe and further strengthens the tight coupling between the heat pipe and the heat conducting component. The heat dissipation base according to claim 1, wherein the heat conductive element is made of copper or aluminum or stainless steel or graphite. The heat dissipation base of claim 1, wherein the heat pipe and the heat conductive element have a heat conducting medium. The heat sink base of claim 1, wherein the body further has a third side portion and a fourth side portion, and the third and fourth side portions are respectively connected to the at least one fixing member. The heat sink base of claim 1, wherein the second side of the heat conducting element has at least one recess. A method for manufacturing a heat dissipation base includes the steps of: providing a heat conducting component and at least one heat pipe and a fixing component; forming a base portion on the circumferential side of the heat conducting component, and having a groove portion, and the fixing component and the body The non-integrally formed structure, and the fixing component is disposed above the open side of the groove portion, the heat conducting component portion is partially embedded on one side of the base body and corresponds to the groove portion, and the base body is a plastic The heat pipe is disposed on one side of the heat conducting component and fixed by the fixing component, and further strengthens the tight coupling between the heat pipe and the heat conducting component. The method for manufacturing a heat dissipation base according to claim 6, wherein the step of fixing the heat pipe to the heat conduction element side is mechanically processed. The method of manufacturing the heat dissipation base according to claim 7, wherein the machining may be any of tight fitting, inlaying, gluing, or welding.