JPH0698646B2 - Molding method for metal plate embedded case - Google Patents

Molding method for metal plate embedded case

Info

Publication number
JPH0698646B2
JPH0698646B2 JP60294001A JP29400185A JPH0698646B2 JP H0698646 B2 JPH0698646 B2 JP H0698646B2 JP 60294001 A JP60294001 A JP 60294001A JP 29400185 A JP29400185 A JP 29400185A JP H0698646 B2 JPH0698646 B2 JP H0698646B2
Authority
JP
Japan
Prior art keywords
metal plate
case
molding
embedded
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60294001A
Other languages
Japanese (ja)
Other versions
JPS62152824A (en
Inventor
喜將 杉山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP60294001A priority Critical patent/JPH0698646B2/en
Publication of JPS62152824A publication Critical patent/JPS62152824A/en
Publication of JPH0698646B2 publication Critical patent/JPH0698646B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/12Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B29C33/16Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall using magnetic means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065Positioning or centering articles in the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065Positioning or centering articles in the mould
    • B29C2045/14147Positioning or centering articles in the mould using pins or needles penetrating through the insert
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は、合成樹脂からなるケース体に少なくとも一
面が露出する金属板をその周囲を前記ケース体内に埋込
んで設けた金属板埋設ケースの成形方法に関するもので
ある。
Description: TECHNICAL FIELD The present invention relates to molding of a metal plate-embedded case in which a metal plate, at least one surface of which is exposed in a case body made of synthetic resin, is embedded by surrounding the metal plate in the case body. It is about the method.

〔発明の技術的背景〕[Technical background of the invention]

一般に電卓と呼ばれている小型電子式計算機等の小型電
子機器は、上部ケースと下部ケースとからなる合成樹脂
製の機器ケース内に、LSIチップ等の電子部品を取付け
た配線基板や液晶表示パネル等を配置した構造となって
いる。
A small electronic device such as a small electronic calculator generally called a calculator is a wiring board or liquid crystal display panel in which electronic parts such as LSI chips are mounted in a device case made of synthetic resin consisting of an upper case and a lower case. It has a structure in which etc. are arranged.

ところで、この種の小型電子機器では、そのケースに、
機器内蔵部品のうち厚い部品の配置位置に対応させて開
口部または凹入部を設け、この開口部または凹入部に厚
い部分の一部を収容することによって機器の薄型化をは
かっているが、合成樹脂製のケースに開口部や凹入部を
設けると、その部分の強度が弱くなるために、ケースに
開口部や凹入部を設ける場合には、この開口部や、凹入
部を設けた薄肉部分に、金属板をその周囲を前記ケース
体内に埋込んで一体的に設けてこの部分を補強すること
が必要となる。
By the way, in this type of small electronic device,
A device is made thinner by providing an opening or a recess corresponding to the position of the thick part of the device built-in part and accommodating part of the thick part in this opening or recess. If an opening or recess is provided in the resin case, the strength of that part will be weakened.Therefore, when providing the opening or recess in the case, make sure that the opening or recess is thin. It is necessary to embed a metal plate around its periphery in the case body and integrally provide it to reinforce this portion.

第5図、第7図および第9図は、開口部または凹入部に
この部分を補強する金属板を設けた金属板埋設ケースを
示したもので、ここでは電子機器の下部ケースを示して
いる。第5図に示すケースは、合成樹脂製のケース体1
の底面に開口部を設けるとともにこの開口部にステンレ
ス板等の金属板2を一体的に設けたものであり、このケ
ースは従来次のようにして成形されている。
FIGS. 5, 7, and 9 show a metal plate-embedded case in which a metal plate that reinforces this portion is provided in the opening or recess, and here, the lower case of the electronic device is shown. . The case shown in FIG. 5 is a case body 1 made of synthetic resin.
An opening is formed on the bottom surface of the metal plate, and a metal plate 2 such as a stainless plate is integrally formed on this opening. This case is conventionally formed as follows.

すなわち第4図は、第5図に示したケースの成形方法を
示したもので、図中10a,10bは前記ケース体1を成形す
る一対の成形金型であり、一方の金型例えばケース体1
の内面を成形する金型10aには金属板2を位置決めする
位置決めピン11aが金型内に突設され、他方の金型10bに
は前記位置決めピン11aに対する逃げ穴11bが設けられて
いる。また両方の金型10a,10bには、前記位置決めピン1
1aにより金型内に位置決め装着された金属板を挟持固定
する固定ピン12a,12bが金属板2の周縁部に沿わせて互
いに対向するように設けられている。この固定ピン12a,
12bのうち、位置決めピン11aを有する一方の金型10a側
の固定ピン12a,12aは金型10aに固定されており、他方の
金型10b側の固定ピン12b,12bはこの金型10b内に出没可
能に設けられて図示しない押しばねにより金型10b内に
突出する方向に押圧されている。
That is, FIG. 4 shows a molding method of the case shown in FIG. 5, and 10a and 10b in the drawing are a pair of molding dies for molding the case body 1, and one of the dies, for example, the case body. 1
A positioning pin 11a for positioning the metal plate 2 is projectingly provided in the mold 10a for molding the inner surface of the mold, and an escape hole 11b for the positioning pin 11a is provided in the other mold 10b. Further, the positioning pin 1 is provided on both the molds 10a and 10b.
Fixing pins 12a and 12b for sandwiching and fixing the metal plate positioned and mounted in the mold by 1a are provided along the peripheral edge of the metal plate 2 so as to face each other. This fixing pin 12a,
Of the 12b, the fixing pins 12a, 12a on the side of one die 10a having the positioning pin 11a are fixed to the die 10a, and the fixing pins 12b, 12b on the side of the other die 10b are in this die 10b. A push spring (not shown) is provided so as to be retractable, and is pressed in a direction projecting into the mold 10b.

このケースの成形方法は、金型10a,10b内に金属板2を
装着してケース体1の成形樹脂を射出することにより、
金属板2の周囲を内部に埋込んだケース体1を成形する
もので、金型10a,10bを開いた状態で金属板2をその位
置決め孔3(第5図参照)を金型10aの位置決めピン11a
に嵌込んで一方の金型10a内に位置決め装着し、この状
態で金型10a,10bを閉じると、ばね力で押圧されている
他方の金型10bの固定ピン12b,12bが金属板2に接して一
方の金型10aの固定ピン12a,12aとの間に金属板2を挟持
固定する(この固定ピン12b,12bは金型10a,10bを閉じる
のにともなって金属板2を押圧固定した状態を保ちなが
らばね力に抗して後退する)から、金型10a,10bを完全
に閉じた状態で金型10a,10b内にケース体1の成形樹脂
を射出すれば、第5図に示したケースを成形することが
できる。なお、このようにして成形されたケースのケー
ス体1には、前記固定ピン12a,12bの跡a,bが第5図に示
すように残るために、ケース外面に、他方の金型10bの
固定ピン12b,12bの跡b,bと、金属板2の位置決め孔3が
見えるが、このピン跡b,bと位置決め孔3は、ケース外
面にアルミニウム等の金属シートや樹脂シートからなる
外装シート(図示せず)を接着することによって覆い隠
すことができる。
This case is formed by mounting the metal plate 2 in the molds 10a and 10b and injecting the molding resin for the case body 1,
A case body 1 in which the periphery of a metal plate 2 is embedded is formed. The metal plate 2 is positioned in the positioning hole 3 (see FIG. 5) of the mold 10a with the molds 10a and 10b open. Pin 11a
Then, the molds 10a and 10b are fitted and positioned in one mold 10a, and when the molds 10a and 10b are closed in this state, the fixing pins 12b and 12b of the other mold 10b pressed by the spring force are attached to the metal plate 2. The metal plate 2 is sandwiched and fixed between the fixing pins 12a and 12a of one of the molds 10a (the fixing pins 12b and 12b press and fix the metal plate 2 as the molds 10a and 10b are closed). 5) If the molding resin of the case body 1 is injected into the molds 10a, 10b with the molds 10a, 10b completely closed, as shown in FIG. The case can be molded. In addition, since the marks a and b of the fixing pins 12a and 12b remain on the case body 1 of the case molded in this way as shown in FIG. The marks b, b of the fixing pins 12b, 12b and the positioning hole 3 of the metal plate 2 are visible. The pin marks b, b and the positioning hole 3 are exterior sheets made of a metal sheet such as aluminum or a resin sheet on the outer surface of the case. It can be obscured by gluing (not shown).

また、第7図および第9図に示したケースは、合成樹脂
製のケース体1の内底面に凹入部を設けるとともにこの
凹入部を形成した薄肉部分のケース外面(第7図のケー
ス)またはケース内面(第9図のケース)にステンレス
板等の金属板2をその周囲をケース体1に埋込んで一体
的に設けたものであり、第7図に示したケースは第6図
に示すような成形金型10a,10bにより成形され、第9図
に示したケースは第8図に示すような成形金型10a,10b
により成形されている。なお、第6図および第8図に示
した成形金型10a,10bは、ケース体1の凹入部を成形す
る部分の型形状が異なるだけでその他の構造は第4図に
示したものと同じであるし、またケースの成形も上記と
同様にして行なわれているから、その説明は図に同符号
を付して省略する。
Further, the case shown in FIGS. 7 and 9 is provided with a recessed portion on the inner bottom surface of the synthetic resin case body 1 and the outer surface (the case of FIG. 7) of the thin portion where the recessed portion is formed or A metal plate 2 such as a stainless steel plate is integrally provided by embedding a metal plate 2 such as a stainless steel plate in the case body 1 on the inner surface of the case (case of FIG. 9). The case shown in FIG. 7 is shown in FIG. Molded by such molding dies 10a, 10b, and the case shown in FIG. 9 is the molding dies 10a, 10b as shown in FIG.
It is molded by. The molding dies 10a and 10b shown in FIG. 6 and FIG. 8 are the same as those shown in FIG. 4 except that the mold shape of the portion for molding the recessed portion of the case body 1 is different. Since the case is molded in the same manner as described above, the description thereof will be omitted by giving the same reference numerals to the drawings.

〔背景技術の問題点〕[Problems of background technology]

しかしながら、上記従来の金属板埋設ケースの成形方法
では、一方の金型10a内に位置決めピン11aにより位置決
めして装着した金属板2を、両方の金型10a,10bに設け
た位置決めピン12a,12bによって挟持固定するようにし
ているために、両方の金型10a,10bに互いに対向するよ
うに設けなければならず、そのために金型10a,10bの製
作が面倒でコスト高となるし、また、成形されたケース
のケース体1に固定ピン12a,12bの跡a,bが孔状に残って
しまうという問題もあった。
However, in the above-described conventional method for molding a metal plate embedded case, the metal plate 2 positioned and mounted by the positioning pin 11a in one mold 10a is provided with the positioning pins 12a, 12b provided in both molds 10a, 10b. Since it is clamped and fixed by both, it must be provided on both molds 10a, 10b so as to face each other, which makes the manufacturing of the molds 10a, 10b cumbersome and costly, and also There is also a problem that marks a and b of the fixing pins 12a and 12b remain in the shape of holes in the case body 1 of the molded case.

〔発明の目的〕[Object of the Invention]

この発明は上記のような実情にかんがみてなされたもの
であって、その目的とするところは、成形型に金属板を
固定する固定ピンを設ける必要をなくして成形型の製作
の簡易化およびコストダウンをはかるとともに、成形さ
れたケースのケース体に固定ピンの跡が残るという問題
もなくし、しかも一方の成形型内に装着した金属板を、
型合せ時や成形樹脂の射出時に浮上ったり傾いたりしな
いように確実に固定して、所定の位置に正しい姿勢で金
属板を埋設したケースを成形することができる金属板埋
設ケースの成形方法を提供することにある。
The present invention has been made in view of the above circumstances, and an object thereof is to simplify the manufacturing of the molding die and to reduce the cost by eliminating the need to provide a fixing pin for fixing the metal plate to the molding die. Along with the down, there is no problem that the fixing pin remains on the case body of the molded case, and the metal plate mounted in one molding die,
A method for forming a metal plate-embedded case that can be firmly fixed so that it does not float or tilt during mold matching or injection of molding resin, and that can form a case in which a metal plate is embedded in a prescribed position in the correct posture. To provide.

〔発明の概要〕[Outline of Invention]

すなわち、この発明は、一対の成形型の一方に、その型
面と面一に埋込み固定されて金属板の両側部の側縁近く
をそれぞれそのほぼ全長にわたって吸着する一対の金属
板吸着磁石と、前記型面から突出して前記金属板に設け
られている位置決め部に嵌入する位置決めピンとを設け
ておき、この一方の成形型内に、前記金属板をその位置
決め部を前記位置決めピンに嵌込んで位置決め装着する
とともにこの金属板を前記磁石に吸着させて固定し、こ
の状態で前記一対の成形型を合せて前記ケース体に成形
樹脂を射出することにより、金属板埋設ケースを成形す
るようにしたものである。
That is, the present invention includes a pair of metal plate attraction magnets, which are embedded and fixed flush with the mold surface in one of the pair of molding dies and attract the side edges of both sides of the metal plate over substantially the entire length thereof, respectively. Positioning pins that project from the mold surface and are fitted into the positioning portions provided on the metal plate are provided, and the metal plate is positioned in the one molding die by fitting the positioning portions to the positioning pins. A metal plate-embedded case is formed by attaching the metal plate to the magnet and fixing the metal plate and injecting a molding resin into the case body in this state. Is.

つまり、この発明は、成形型内に装着した金属板を固定
ピンによらずに磁石の吸着で固定するようにしたもので
あり、この発明によれば、成形型に金属板を固定する固
定ピンを設ける必要はないから、成形型の製作の簡易化
およびコストダウンをはかることができるとともに、成
形されたケースのケース体に固定ピンの跡が残るという
従来の成形方法の問題もなくすことができる。しかも、
この発明では、一方の成形型内への金属板の装着および
固定を、この金属板に設けられている位置決め部を成形
型の型面から突出している位置決めピンに嵌込んで位置
決めし、この金属板を上記磁石に吸着させるだけの極く
簡単な作業で容易に作業性がよく行なうことができる。
That is, according to the present invention, the metal plate mounted in the forming die is fixed by the attraction of the magnet instead of using the fixing pin. According to the present invention, the fixing pin for fixing the metal plate to the forming die is used. Since it is not necessary to provide the mold, it is possible to simplify the manufacturing of the molding die and reduce the cost, and it is also possible to eliminate the problem of the conventional molding method that the mark of the fixing pin remains on the case body of the molded case. . Moreover,
According to the present invention, the metal plate is mounted and fixed in one of the molding dies by positioning the positioning portion provided on the metal plate by fitting it into the positioning pin protruding from the mold surface of the molding die. The workability can be easily improved by a very simple work of adsorbing the plate to the magnet.

また、この発明は、成形型内に装着した金属板を固定ピ
ンに代えて磁石によって吸着固定するようにしたもので
あるが、装着した金属板は、この金属板の両側部の側縁
近くをそれぞれそのほぼ全長にわたって吸着する一対の
磁石によって浮上りや傾きを生ずることなく固定される
し、その横ずれも位置決めピンによって阻止されるた
め、型合せ時や成形樹脂の射出時に金属板の位置ずれや
姿勢変化を生じることはなく、また、一対の磁石を成形
型にその型面と面一に埋込み固定し、これら磁石で金属
板の両側部の側縁近くをそれぞれそのほぼ全長にわたっ
て吸着固定するようにしているために、金属板の側縁部
が成形樹脂の射出圧力によって変形することもないか
ら、所定の位置に正しい姿勢で金属板を埋設したケース
を成形することができる。
Further, according to the present invention, the metal plate mounted in the molding die is attracted and fixed by a magnet instead of the fixing pin, but the mounted metal plate is placed near the side edges on both sides of the metal plate. A pair of magnets that attract each other over almost its entire length are fixed without rising or tilting, and lateral displacement is also blocked by the positioning pins, so the position and orientation of the metal plate during mold matching and injection of molding resin There is no change, and a pair of magnets are embedded and fixed in the molding die so that they are flush with the die surface, and these magnets are attracted and fixed near the side edges of both sides of the metal plate over substantially their entire length. Since the side edge of the metal plate is not deformed by the injection pressure of the molding resin, it is possible to mold the case in which the metal plate is embedded in the correct position at the predetermined position. .

〔発明の実施例〕Example of Invention

以下、この発明の一実施例を図面を参照して説明する。
第1図は金属板埋設ケースの成形方法を示しており、ま
た第2図および第3図は成形された金属板埋設ケースを
示している。
An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 shows a method for molding a metal plate-embedded case, and FIGS. 2 and 3 show a molded metal plate-embedded case.

まず、成形された金属板埋設ケースについて説明する
と、このケースは小型電子機器の下部ケースとして使用
されるもので、第2図および第3図において1は合成樹
脂からなるケース体である。このケース体1は、その底
面の一側部に、機器内に配置される配線基板や液晶表示
パネル等の下部を収容する横長の開口部を設けたもの
で、この開口部は、その下端側に一体的に設けた金属板
2で塞がれている。この金属板2は、鉄、ニッケル等の
強磁性金属からなっており、この金属板2はその周囲を
ケース体1に埋込んでケース体1と一体化されている。
また、3,3は前記金属板2の露出部分に設けられている
位置決め孔である。この位置決め孔3,3は、ケースの成
形時に成形金型内にこの金属板2を位置決め装着するの
に利用されたもので、この位置決め孔3,3は、ケース体
1の裏面にそのほぼ全面にわたって形成した凹入面1aに
外装シート(図示せず)を接着することによって金属板
2とともに覆い隠されるようになっている。
First, a molded metal plate burying case will be described. This case is used as a lower case of a small electronic device, and in FIGS. 2 and 3, reference numeral 1 is a case body made of synthetic resin. The case body 1 is provided with a laterally long opening for accommodating a lower portion of a wiring board, a liquid crystal display panel, or the like arranged in a device, on one side of a bottom surface thereof. It is closed by a metal plate 2 which is integrally provided on the. The metal plate 2 is made of a ferromagnetic metal such as iron or nickel, and the metal plate 2 is integrated with the case body 1 by embedding the periphery thereof in the case body 1.
Further, 3 and 3 are positioning holes provided in the exposed portion of the metal plate 2. The positioning holes 3 and 3 are used for positioning and mounting the metal plate 2 in the molding die during molding of the case. The positioning holes 3 and 3 are formed on the back surface of the case body 1 almost entirely. An exterior sheet (not shown) is adhered to the recessed surface 1a formed over it so as to be covered with the metal plate 2.

次に前記金属板埋設ケースの成形方法を説明すると、第
1図(a),(b)において、10a,10bは前記ケース体
1を成形する一対の成形金型であり、一方の金型例えば
ケース体1の内面を成形する金型10aにはその所定位置
に装着される金属板2の装着位置を決める位置決めピン
11aが金型内に突設され、他方の金型10bには前記位置決
めピン11aに対する逃げ穴11bが設けられている。また、
13,13は位置決めピン11aを設けた一方の金型10aに、金
属板2の装着位置を対応させて設けられた永久磁石であ
り、この磁石13,13は、その表面が金型10aの型面と面一
になるようにして金型10aに埋込み固定されている。こ
の磁石13,13は、金型10a内に前記位置決めピン11aによ
り位置決めして装着される金属板2を吸着固定するもの
で、この磁石13,13は、これに吸着した金属板2の側縁
部が、成形樹脂の射出時にその圧力で変形しないように
するために、できるだけ金属板2の側縁近くを吸着する
位置に設けられており、またこの磁石13,13は、金属板
2の両側部をそのほぼ全長にわたって強く吸着するよう
に、金属板装着位置の両側部にその長さ方向に沿わせて
設けられている。なお、この磁石13,13は、横長のもの
としてもよいし、また多数個の磁石を金属板装着位置の
両側部にその長さ方向に沿わせて適当間隔で配設しても
よい。
Next, a method of molding the metal plate-embedded case will be described. In FIGS. 1A and 1B, 10a and 10b are a pair of molding dies for molding the case body 1. A positioning pin that determines the mounting position of the metal plate 2 that is mounted at a predetermined position on the mold 10a that molds the inner surface of the case body 1.
11a is provided so as to project into the mold, and the other mold 10b is provided with an escape hole 11b for the positioning pin 11a. Also,
Numerals 13 and 13 are permanent magnets provided corresponding to the mounting position of the metal plate 2 on one die 10a provided with the positioning pin 11a, and the surfaces of the magnets 13 and 13 are the dies of the die 10a. It is embedded and fixed in the mold 10a so as to be flush with the surface. The magnets 13 and 13 are for adsorbing and fixing the metal plate 2 which is positioned and mounted in the mold 10a by the positioning pins 11a. The magnets 13 and 13 are side edges of the metal plate 2 adsorbed to the magnets 13 and 13. In order to prevent the molding resin from being deformed by the pressure when the molding resin is injected, it is provided at a position where it is attracted as close as possible to the side edge of the metal plate 2, and the magnets 13, 13 are provided on both sides of the metal plate 2. The portions are provided along both sides of the metal plate mounting position along the length direction so as to strongly adsorb the portion over substantially the entire length. The magnets 13, 13 may be horizontally long, or a large number of magnets may be arranged on both sides of the metal plate mounting position along the length direction at appropriate intervals.

このケースの成形方法は、第1図(a)に示すように金
型10a,10bを開いた状態で、金属板2をその位置決め孔
3を位置決めピン11aに嵌込んで一方の金型10a内に位置
決め装着するとともに、この金属板2を磁石13,13に吸
着させて金型10a内に固定し、この状態で金型10a,10bを
第1図(b)に示すように閉じて金型10a,10b内に成形
樹脂を射出してケース体1を成形するもので、これによ
り第2図および第3図に示した金属板埋設ケースが成形
される。
As shown in FIG. 1 (a), the molding method of this case is such that the metal plate 2 is inserted into the positioning pin 11a through its positioning hole 3 with the molds 10a and 10b open. And the metal plate 2 is attracted to the magnets 13 and 13 and fixed in the mold 10a. In this state, the molds 10a and 10b are closed as shown in FIG. 1 (b). Molding resin is injected into 10a and 10b to mold the case body 1, whereby the metal plate-embedded case shown in FIGS. 2 and 3 is molded.

しかして、この成形方法では、上記のように、成形金型
内に装着した金属板2を固定ピンによらずに一方の金型
10aに設けた磁石13,13の吸着で固定するようにしている
から、成形金型10a,10bに金属板2を固定する固定ピン
を設ける必要はない。したがって、この成形方法によれ
ば、成形金型10a,10bの製作の簡易化およびコストダウ
ンをはかることができるし、また、成形されたケースの
ケース体1に固定ピンの跡が残るという従来の成形方法
の問題もなくすことができる。しかも、この成形方法で
は、一方の金型10a内への金属板2の装着および固定
を、金属板2に設けられている位置決め孔3を金型10a
の型面から突出している位置決めピン11aに嵌込んで位
置決めし、この金属板2を上記磁石に吸着させるだけの
極く簡単な作業で容易に作業性よく行なうことができ
る。
Thus, in this molding method, as described above, the metal plate 2 mounted in the molding die is not used for the fixing pin and the metal plate 2 for one die is used.
Since the magnets 13, 13 provided on 10a are fixed by attraction, it is not necessary to provide the molding dies 10a, 10b with fixing pins for fixing the metal plate 2. Therefore, according to this molding method, the manufacturing of the molding dies 10a, 10b can be simplified and the cost can be reduced, and the mark of the fixing pin remains on the case body 1 of the molded case. The problem of the molding method can be eliminated. Moreover, in this molding method, the metal plate 2 is mounted and fixed in one mold 10a by positioning the positioning hole 3 provided in the metal plate 2 in the mold 10a.
The positioning pin 11a protruding from the die surface is used for positioning, and the metal plate 2 can be easily attracted to the magnet by a very simple operation with good workability.

また、この成形方法は、金型10a内に装着した金属板2
を固定ピンに代えて磁石によって吸着固定するようにし
たものであるが、装着した金属板2は、この金属板2の
両側部の側縁近くをそれぞれそのほぼ全長にわたって吸
着する一対の磁石13,13によって浮上りや傾きを生ずる
ことなく固定されるし、その横ずれも位置決めピン11a
によって阻止されるため、型合せ時や成形樹脂の射出時
に金属板2の位置ずれや姿勢変化を生じることはなく、
また、一対の磁石13,13を金型10aにその型面と面一に埋
込み固定し、これら磁石13,13で金属板2の両側部の側
縁近くをそれぞれそのほぼ全長にわたって吸着固定する
ようにしているため、金属板2の側縁部が成形樹脂の射
出圧力によって変形することもないから、所定の位置に
正しい姿勢で金属板2を埋設したケースを成形すること
ができる。
In addition, this molding method uses the metal plate 2 mounted in the mold 10a.
In place of the fixing pins, magnets are attracted and fixed by a magnet. The mounted metal plate 2 has a pair of magnets 13, which attract near the side edges of both sides of the metal plate 2 over substantially the entire length thereof. It is fixed by 13 without rising or tilting, and its lateral displacement is also determined by the positioning pin 11a.
Since it is prevented by the above, there is no displacement of the metal plate 2 and no change in posture at the time of mold matching or injection of molding resin.
Further, a pair of magnets 13 and 13 are embedded and fixed in the die 10a so as to be flush with the die surface, and the magnets 13 and 13 attract and fix near the side edges of both sides of the metal plate 2 over substantially the entire length thereof. Therefore, since the side edge portion of the metal plate 2 is not deformed by the injection pressure of the molding resin, it is possible to mold the case in which the metal plate 2 is embedded at a predetermined position in the correct posture.

なお、上記実施例では、金属板2をその両面が露出する
状態で埋設したケースの成形について説明したが、この
発明は、第6図または第8図に示したような金属板2の
一面が露出する金属板埋設ケースの成形にも適用できる
ことはもちろんである。
In addition, in the above-mentioned embodiment, the molding of the case in which the metal plate 2 is embedded so that both surfaces thereof are exposed has been described. However, in the present invention, one surface of the metal plate 2 as shown in FIG. 6 or FIG. Of course, it can also be applied to the molding of an exposed metal plate embedded case.

〔発明の効果〕〔The invention's effect〕

この発明は、成形型内に装着した金属板を固定ピンによ
らずに磁石の吸着で固定するようにしたものであるか
ら、この発明によれば、成形型に金属板を固定する固定
ピンを設ける必要はなく、したがって、成形型の製作の
簡易化およびコストダウンをはかることができるととも
に、成形されたケースのケース体に固定ピンの跡が残る
という従来の成形方法の問題もなくすことができる。し
かも、この発明では、一方の成形型内への金属板の装着
および固定を、この金属板に設けられている位置決め部
を成形型の型面から突出している位置決めピンに嵌込ん
で位置決めし、この金属板を上記磁石に吸着させるだけ
の極く簡単な作業で容易に作業性よく行なうことができ
る。
According to the present invention, the metal plate mounted in the forming die is fixed by the attraction of the magnet instead of using the fixing pin. Therefore, according to the present invention, the fixing pin for fixing the metal plate to the forming die is provided. Therefore, it is not necessary to provide the mold, so that the manufacturing of the molding die can be simplified and the cost can be reduced, and the problem of the conventional molding method that the mark of the fixing pin remains on the case body of the molded case can be eliminated. . Moreover, in the present invention, the mounting and fixing of the metal plate in one of the molding dies is performed by positioning the positioning portion provided on the metal plate by fitting it into the positioning pins protruding from the mold surface of the molding die. It is possible to perform the workability easily with a very simple work of adsorbing the metal plate to the magnet.

また、この発明は、成形型内に装着した金属板を固定ピ
ンに代えて磁石によって吸着固定するようにしたもので
あるが、装着した金属板は、この金属板の両側部の側縁
近くをそれぞれそのほぼ全長にわたって吸着する一対の
磁石によって浮上りや傾きを生ずることなく固定される
し、その横ずれも位置決めピンによって阻止されるた
め、型合せ時や成形樹脂の射出時に金属板の位置ずれや
姿勢変化を生じることはなく、また、一対の磁石を成形
型にその型面と面一に埋込み固定し、これら磁石で金属
板の両側部の側縁近くをそれぞれそのほぼ全長にわたっ
て吸着固定するようにしているために、金属板の側縁部
が成形樹脂の射出圧力によって変形することもないか
ら、所定の位置に正しい姿勢で金属板を埋設したケース
を成形することができる。
Further, according to the present invention, the metal plate mounted in the molding die is attracted and fixed by a magnet instead of the fixing pin, but the mounted metal plate is placed near the side edges on both sides of the metal plate. A pair of magnets that attract each other over almost its entire length are fixed without rising or tilting, and lateral displacement is also blocked by the positioning pins, so the position and orientation of the metal plate during mold matching and injection of molding resin There is no change, and a pair of magnets are embedded and fixed in the molding die so that they are flush with the die surface, and these magnets are attracted and fixed near the side edges of both sides of the metal plate over substantially their entire length. Since the side edge of the metal plate is not deformed by the injection pressure of the molding resin, it is possible to mold the case in which the metal plate is embedded in the correct position at the predetermined position. .

【図面の簡単な説明】[Brief description of drawings]

第1図はこの発明の一実施例を示す型開き状態と型閉じ
状態の断面図、第2図および第3図は成形された金属板
埋設ケースの斜視図および断面図、第4図および第5
図、第6図および第7図、第8図および第9図はそれぞ
れ従来の成形方法を示す型閉じ状態の断面図および成形
された金属板埋設ケースの断面図である。 1……ケース体、2……金属板、3……位置決め孔、10
a,10b……成形金型、11a……位置決めピン、13……磁
石。
FIG. 1 is a sectional view showing an embodiment of the present invention in a mold open state and a mold closed state, FIGS. 2 and 3 are perspective views and sectional views of a molded metal plate burying case, FIG. 4 and FIG. 5
FIG. 6, FIG. 6 and FIG. 7, FIG. 8 and FIG. 9 are a cross-sectional view of a conventional molding method in a mold closed state and a cross-sectional view of a molded metal plate embedded case, respectively. 1 ... Case body, 2 ... Metal plate, 3 ... Positioning hole, 10
a, 10b …… Molding die, 11a …… Positioning pin, 13 …… Magnet.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】合成樹脂からなるケース体に、少なくとも
一面が露出する金属板をその周囲を前記ケース体内に埋
込んで設けた金属板埋設ケースを形成する方法であっ
て、 一対の成形型の一方に、その型面と面一に埋込み固定さ
れて前記金属板の両側部の側縁近くをそれぞれそのほぼ
全長にわたって吸着する一対の金属板吸着磁石と、前記
型面から突出して前記金属板に設けられている位置決め
部に嵌入する位置決めピンとを設けておき、この一方の
成形型内に、前記金属板をその位置決め部を前記位置決
めピンに嵌込んで位置決め装着するとともにこの金属板
を前記磁石に吸着させて固定し、この状態で前記一対の
成形型を合せて前記ケース体に成形樹脂を射出すること
を特徴とする金属板埋設ケースの成形方法。
1. A method for forming a metal plate-embedded case in which a metal plate having at least one exposed surface is embedded in the case body made of synthetic resin, the periphery of the metal plate being embedded in the case body. On the other hand, a pair of metal plate attracting magnets that are embedded and fixed flush with the mold surface and attract near the side edges of both sides of the metal plate over substantially their entire lengths respectively, and a pair of metal plate attracting magnets protruding from the mold surface to the metal plate. A positioning pin to be fitted into the provided positioning portion is provided, and the metal plate is fitted into the molding die of one of the molds by fitting the positioning portion into the positioning pin and positioning the metal plate on the magnet. A method for molding a metal plate-embedded case, comprising adsorbing and fixing, and in this state, the pair of molding dies are combined and a molding resin is injected into the case body.
JP60294001A 1985-12-27 1985-12-27 Molding method for metal plate embedded case Expired - Lifetime JPH0698646B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60294001A JPH0698646B2 (en) 1985-12-27 1985-12-27 Molding method for metal plate embedded case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60294001A JPH0698646B2 (en) 1985-12-27 1985-12-27 Molding method for metal plate embedded case

Publications (2)

Publication Number Publication Date
JPS62152824A JPS62152824A (en) 1987-07-07
JPH0698646B2 true JPH0698646B2 (en) 1994-12-07

Family

ID=17801957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60294001A Expired - Lifetime JPH0698646B2 (en) 1985-12-27 1985-12-27 Molding method for metal plate embedded case

Country Status (1)

Country Link
JP (1) JPH0698646B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576227B (en) * 2012-01-16 2017-04-01 奇鋐科技股份有限公司 Heat dissipation base and method of manufacturing same

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03110114A (en) * 1989-09-25 1991-05-10 Hitachi Ltd Method and device for manufacturing molded form with unified resin part and metallic part
JPH042605U (en) * 1990-04-24 1992-01-10
IT1399942B1 (en) * 2010-05-11 2013-05-09 Masiero MOLD FOR THE MANUFACTURE OF PRODUCTS WITH MOLDED INSERTS
JP2013211612A (en) * 2012-03-30 2013-10-10 Nippon Seiki Co Ltd Remote control device and manufacturing method of the same
CN105751425A (en) * 2014-12-19 2016-07-13 上海英济电子塑胶有限公司 Mini-type iron piece automatic buried molding mechanism and molding method thereof
JP6479544B2 (en) * 2015-04-10 2019-03-06 Nok株式会社 Manufacturing method of gasket
FR3099078B1 (en) * 2019-07-23 2021-06-25 Faurecia Interieur Ind Metal foil molding assembly and associated method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51103025A (en) * 1975-03-07 1976-09-11 Mitsubishi Motors Corp Fukugozaino seikeihoho oyobi seikeizairyo
JPS5335964U (en) * 1976-09-01 1978-03-29
JPS57128528A (en) * 1981-02-04 1982-08-10 Yamanashi Seiki Kk Insert molding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576227B (en) * 2012-01-16 2017-04-01 奇鋐科技股份有限公司 Heat dissipation base and method of manufacturing same

Also Published As

Publication number Publication date
JPS62152824A (en) 1987-07-07

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