JPH0755029Y2 - Electronic device wiring structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a structure for processing wiring extending from a substrate of an electronic device housed in a housing such as a differential pressure or pressure transmitter.

[Conventional technology]

Conventionally, a substrate is housed in a housing for differential pressure, pressure transmission, etc., as shown in FIG.

A bracket for protecting the substrate and holding the substrate is provided on one side peripheral surface of the substrate.

Then, the wiring extending from the circuit element on the substrate is held midway so as not to be pinched and broken when the lid is assembled.

Specifically, as shown in FIG. 2, a resin fastener for holding the wiring extending from the circuit element is fitted in a part of the bracket, and the wiring is passed through the fastener.

[Problems to be solved by the device]

However, the conventional wiring processing structure requires a step of fitting the fastener into the bracket, which is disadvantageous in terms of cost and assembly time.

Further, a method in which the bracket is made of resin and the fastener is integrally molded with the bracket is also conceivable, but it is difficult in terms of molding technology because the shape of the fastener itself is complicated.

Further, a structure in which a bracket is provided with a notch as shown in FIG. 3 is conceivable, but the wiring holding ability was not sufficient.

[Means for Solving the Problems]

In order to achieve the above object, the present invention is provided on the side surface of the bracket,
An L-shaped projection is formed on one of the horizontal surfaces with its opening surface aligned with the horizontal surface, and a rectangular projection is formed on the other surface with one surface thereof aligned with the horizontal surface.
The L-shaped protrusion and the rectangular protrusion are formed so as to have the same protrusion amount as that of the die protrusion, and the L-shaped protrusion and the rectangular protrusion are positioned slightly separated from the wiring thickness in the horizontal plane direction.

[Action]

By adopting the configuration of the present invention, the structure can be formed by integral molding and the wiring is hard to come off.

〔Example〕

 Hereinafter, the present invention will be described based on an embodiment shown in the drawings.

FIG. 4 is a perspective view showing an embodiment of an electronic device wiring structure according to the present invention.

In this figure, reference numeral 1 denotes a substrate body, and a bracket 2 is fixedly provided around one surface of the substrate body.

A rectangular projection 3 is integrally formed with the bracket 2 on a part of the outer peripheral surface of the bracket 2, and the rectangular projection 3 and the L-shaped projection 4 are formed.
The wiring 6 extending from the circuit element 5 fixed on the substrate body 1 is hooked and held in the gap.

[Effect of device]

With the above configuration, not only the wiring can be easily inserted between the L-shaped projection and the rectangular projection and hooked, but also the wiring can be held without causing excessive bending, and various wirings can be used. Wiring with the same thickness can be attached, and the protrusions will not be damaged.

Further, when molding the bracket, the life of the mold is not shortened, and the wiring holding portion can be integrally molded, so that the cost can be reduced.

In addition, the assembling time can be shortened, and the mold can be manufactured with a simple and inexpensive structure that is divided into two parts.

[Brief description of drawings]

FIG. 1 is a diagram showing a conventional example of the differential pressure and pressure transmitter of the present invention, FIG. 2 is a detailed explanatory diagram of FIG. 1, FIG. 3 is a diagram showing another conventional example, and FIG. It is a perspective view which shows a device. 1 ... Board body, 2 ... Bracket, 3 ... Rectangular projection, 4 ... L-shaped projection, 5 ... Circuit element, 6 ... Wiring

Claims (1)

[Scope of utility model registration request] 1. A L-shaped projection having one end fixed to one side surface of a bracket covering one side of a printed circuit board, and one surface on the same horizontal plane as the free end surface of the other end of the L-shaped projection. A protrusion having the same protrusion amount as the protrusion from the side surface of the bracket is formed integrally with the rectangular protrusion formed on the side opposite to the fixed end of the L-shaped protrusion, and the L-shaped protrusion and the rectangular protrusion are arranged in the horizontal plane direction. An electronic device wiring structure, characterized in that the wiring holding portion is arranged slightly apart from the thickness of the wiring, and the wiring holding portion is constituted by a space surrounded by the bracket and the L-shaped projection and one surface of the rectangular projection.