US20130118718A1 - Heat pipe assembly - Google Patents
Heat pipe assembly Download PDFInfo
- Publication number
- US20130118718A1 US20130118718A1 US13/314,196 US201113314196A US2013118718A1 US 20130118718 A1 US20130118718 A1 US 20130118718A1 US 201113314196 A US201113314196 A US 201113314196A US 2013118718 A1 US2013118718 A1 US 2013118718A1
- Authority
- US
- United States
- Prior art keywords
- heat
- conducting member
- heat pipe
- pipe
- heat conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
Definitions
- the present disclosure relates to cooling components and, particularly, to a heat pipe assembly.
- Heat pipes are widely used for cooling electronic products because of their high heat transfer efficiency. If hot and cold sources are too far apart from each other, the resulting heat pipe may not be very efficient, because heat transfer efficiency has an inverse relationship with length, meaning longer heat pipes are less efficient in heat dissipation.
- the FIGURE is an isometric view of an exemplary embodiment of a heat pipe assembly, an electronic component, and two heat sinks.
- an exemplary embodiment of a heat pipe assembly is connected between an electronic component 100 which can generate heat and a heat sink 200 .
- the electronic component 100 is a semiconductor chip with a heat sink 101 disposed on the semiconductor chip.
- An engagement slot is defined in a bottom of the heat sink 101 .
- the heat pipe assembly includes a first heat pipe 10 , a second heat pipe 20 , and a heat conducting member 30 .
- the heat conducting member 30 is a substantially rectangular block made of copper or copper alloy.
- a first slot 31 and a second slot 32 are defined in a top of the heat conducting member 30 , respectively extending through opposite sides of the heat conducting member 30 .
- a first end of the first heat pipe 10 is connected to the electronic component 10 .
- the first end of the first heat pipe 10 is engaged in the engagement slot the heat sink 101 , and sandwiched between the heat sink 101 and the electronic component 100 .
- a second end of the first heat pipe 10 is engaged in the first slot 31 , and secured to the heat conducting member 30 by welding.
- a first end of the second heat pipe 20 is connected to the heat sink 200 .
- a second end of the second heat pipe 20 is engaged in the second slot 32 , and secured to the heat conducting member 30 by welding.
- the heat generated by the electronic component 100 is transferred to the heat conducting member 30 through the heat sink 101 and the first heat pipe 10 .
- the heat absorbed by the heat conducting member 30 is further transferred to the heat sink 200 through the second heat pipe 20 .
- each of the heat pipes 10 and 20 can have an efficient length. Therefore, the heat pipes 10 and 20 can satisfy heat transfer requirements.
Abstract
A heat pipe assembly used to transfer heat generated by an electronic component to a heat sink includes a first heat pipe, a second heat pipe, and a heat conducting member. A first end of the first heat pipe is connected to the electronic component. A second end of the first heat pipe is connected to the heat conducting member by welding. A first end of the second heat pipe is connected to the second heat sink. A second end of the second heat pipe is connected to the heat conducting member by welding.
Description
- 1. Technical Field
- The present disclosure relates to cooling components and, particularly, to a heat pipe assembly.
- 2. Description of Related Art
- Heat pipes are widely used for cooling electronic products because of their high heat transfer efficiency. If hot and cold sources are too far apart from each other, the resulting heat pipe may not be very efficient, because heat transfer efficiency has an inverse relationship with length, meaning longer heat pipes are less efficient in heat dissipation.
- Many aspects of the present embodiments can be better understood with reference to the following drawing. The components in the drawing are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments.
- The FIGURE is an isometric view of an exemplary embodiment of a heat pipe assembly, an electronic component, and two heat sinks.
- The disclosure, including the accompanying drawings, is illustrated by way of examples and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
- Referring to the FIGURE, an exemplary embodiment of a heat pipe assembly is connected between an
electronic component 100 which can generate heat and aheat sink 200. In one embodiment, theelectronic component 100 is a semiconductor chip with aheat sink 101 disposed on the semiconductor chip. An engagement slot is defined in a bottom of theheat sink 101. The heat pipe assembly includes afirst heat pipe 10, asecond heat pipe 20, and aheat conducting member 30. - The
heat conducting member 30 is a substantially rectangular block made of copper or copper alloy. Afirst slot 31 and asecond slot 32 are defined in a top of theheat conducting member 30, respectively extending through opposite sides of theheat conducting member 30. - A first end of the
first heat pipe 10 is connected to theelectronic component 10. In one embodiment, the first end of thefirst heat pipe 10 is engaged in the engagement slot theheat sink 101, and sandwiched between theheat sink 101 and theelectronic component 100. A second end of thefirst heat pipe 10 is engaged in thefirst slot 31, and secured to theheat conducting member 30 by welding. - A first end of the
second heat pipe 20 is connected to theheat sink 200. A second end of thesecond heat pipe 20 is engaged in thesecond slot 32, and secured to theheat conducting member 30 by welding. - In use, the heat generated by the
electronic component 100 is transferred to theheat conducting member 30 through theheat sink 101 and thefirst heat pipe 10. The heat absorbed by theheat conducting member 30 is further transferred to theheat sink 200 through thesecond heat pipe 20. - Since the first and
second heat pipes heat conducting member 30, each of theheat pipes heat pipes - It is to be understood, however, that even though numerous characteristics and advantages of the embodiment have been set forth in the foregoing description, together with details of the structure and function of the embodiment, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (8)
1. A heat pipe assembly for heat transferring from an electronic component to a heat sink apart from the electronic component, the heat pipe assembly comprising:
a heat conducting member;
a first heat pipe comprising a first end to be connected to the electronic component, and a second end fixed to the heat conducting member; and
a second heat pipe comprising a first end connected to the heat sink, and a second end fixed to the heat conducting member.
2. The heat pipe assembly of claim 1 , wherein the heat conducting member is a substantially rectangular block defining a first slot receiving the second end of the first heat pipe, and a second slot receiving the second end of the second heat pipe.
3. The heat pipe assembly of claim 2 , wherein the heat conducting member is made of copper or copper alloy.
4. The heat pipe assembly of claim 3 , wherein the second ends of the first and second heat pipes are fixed to the heat conducting member by welding.
5. A heat dissipation assembly, comprising:
a first heat sink attached on a heat-generating component;
a heat conducting member;
a first heat pipe comprising a first end connected to the first heat sink, and a second end fixed to the heat conducting member;
a second heat sink apart from the first heat sink; and
a second heat pipe comprising a first end connected to the second heat sink, and a second end fixed to the heat conducting member.
6. The heat dissipation assembly of claim 5 , wherein the heat conducting member is a substantially rectangular block defining a first slot receiving the second end of the first heat pipe, and a second slot receiving the second end of the second heat pipe.
7. The heat dissipation assembly of claim 6 , wherein the heat conducting member is made of copper or copper alloy.
8. The heat dissipation assembly of claim 6 , wherein the second ends of the first and second heat pipes are fixed to the heat conducting member by welding.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100141333 | 2011-11-11 | ||
TW100141333A TW201319503A (en) | 2011-11-11 | 2011-11-11 | Heat pipe assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130118718A1 true US20130118718A1 (en) | 2013-05-16 |
Family
ID=48279507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/314,196 Abandoned US20130118718A1 (en) | 2011-11-11 | 2011-12-08 | Heat pipe assembly |
Country Status (2)
Country | Link |
---|---|
US (1) | US20130118718A1 (en) |
TW (1) | TW201319503A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150296661A1 (en) * | 2012-12-30 | 2015-10-15 | General Electric Company | Heat sink apparatus and method for power semiconductor device module |
US20230232590A1 (en) * | 2022-01-14 | 2023-07-20 | Dell Products L.P. | Heating or cooling apparatus-integrated heat sink for a computing device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5822187A (en) * | 1996-10-25 | 1998-10-13 | Thermal Corp. | Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices |
-
2011
- 2011-11-11 TW TW100141333A patent/TW201319503A/en unknown
- 2011-12-08 US US13/314,196 patent/US20130118718A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5822187A (en) * | 1996-10-25 | 1998-10-13 | Thermal Corp. | Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150296661A1 (en) * | 2012-12-30 | 2015-10-15 | General Electric Company | Heat sink apparatus and method for power semiconductor device module |
US9730365B2 (en) * | 2012-12-30 | 2017-08-08 | General Electric Company | Heat sink apparatus and method for power semiconductor device module |
US20230232590A1 (en) * | 2022-01-14 | 2023-07-20 | Dell Products L.P. | Heating or cooling apparatus-integrated heat sink for a computing device |
US11925003B2 (en) * | 2022-01-14 | 2024-03-05 | Dell Products L.P. | Heating or cooling apparatus-integrated heat sink for a computing device |
Also Published As
Publication number | Publication date |
---|---|
TW201319503A (en) | 2013-05-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHANG, YAO-TING;REEL/FRAME:027349/0082 Effective date: 20111201 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |