TWM358348U - Assembly-type heat-dissipating device - Google Patents

Assembly-type heat-dissipating device Download PDF

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Publication number
TWM358348U
TWM358348U TW98202488U TW98202488U TWM358348U TW M358348 U TWM358348 U TW M358348U TW 98202488 U TW98202488 U TW 98202488U TW 98202488 U TW98202488 U TW 98202488U TW M358348 U TWM358348 U TW M358348U
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Taiwan
Prior art keywords
heat
heat sink
rti
base
fixing
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TW98202488U
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Chinese (zh)
Inventor
Jin-Zong Huang
Original Assignee
Chase Shine Technology Co Ltd
Jin-Zong Huang
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Application filed by Chase Shine Technology Co Ltd, Jin-Zong Huang filed Critical Chase Shine Technology Co Ltd
Priority to TW98202488U priority Critical patent/TWM358348U/en
Publication of TWM358348U publication Critical patent/TWM358348U/en

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

M358348 五、新型說明: 【新型所屬之技術領域】 尤指便 本案係一種用於電子元 件的散哉裝t 於快速及穩固組裝的組合式 ’、、、 八政熱骏置構造 【先前技術】 按,隨著人們對電腦的啦 -* ^ Λ 而衣日漸增加,除一般 文㈢作業外,舉凡數位影像處 # £ a T ^ 处理、播放音樂及影片, 至疋工業繪圖或遊戲等, 級,Φ日<«向A 相姆於周邊設備的升 級,電細内部的中樞-中央處理 卜 产,姓认祕# 為也必須加快運算速 良好的散熱裝置。 …作下,也要有設計 孰η戶t吊見的散熱裝置多為強制氣冷,並俜將散 熱風扇與散熱塊結合後,由 ,、係將政 效果好的金Μ u肪 於放熱塊本身即為導熱 負,例如:銅或鋁等,i底而将斑 中央處理器頂邱άΑ议也 /、底面係,、 貝4的發熱面相接觸,且在 設有複數個散埶 放…、塊頂面 熱鰭片後,禮:' 央處理器的熱量傳導至散 力強制Μ勒以熱塊上的散熱風屬所吹出之風 及ΐ:=量。然’此種散熱塊有1成形式, 片,每一而多片式散熱塊係由複數片散熱鰭 月…、鰭片的端緣設有相對扣部, 合後再扣合士 精相互宜 成一體,並於組接面上設有 由導埶堍盥屯 β等熱塊,再 …/、中央處理器接觸導熱,但是,| κ % # 鰭片的製产:r , 早片散熱 便而容易增加製造成本,且組裂上也 4 M358348 相當不方便,必須同時兼顧組I後的平整性及 時的穩固性。 故本創作人遂利用包覆於散熱片外部的外 與套接支撐散熱片的熱導管’結合成—體的組 散熱裝置的新型結構,利用多點支撐及固定 式’俾解決上述缺失。 【新型内容】 本創作之一目的,旨在提.供 ^ . 曰你促供—種組合式黄 置,俾增加組裝的便利性。 本創作之次一目的,旨在接& 曰牧致供—種组合y 裝置’俾降低製造成本。 本創作之再一目的,旨在括糾 J曰仕徒供—種組合# 裝置’俾提昇散熱效率。 為達上述目的,本創作之組合式散熱裝售 要係包括—底座、複數個熱導管、複數個散杳 一外罩;*中,該底座係設有複數個平行排歹, 槽’该熱導管底部係垂直設於 土且°又乂履座的凹槽内, 一熱導管呈相互平行;該散孰 < … 月又,、、、片S又有稷數個制 穿孔、缺口部及至少—蜾 ^螺孔,每一散熱片係侈 設於熱導管上,而藉由折板 1似彤成平行豐合的幵j 該外罩係呈L字形,置#古 于〜”垂直端緣各設有一倒截 且頂部的端緣係設有至少〜 固定孔。 組裝時,每^一散孰Η # …片依序穿設於熱導管德 使用 罩, 合式 等方 熱裴 散熱 散熱 ,主 片及 的凹 使每 板、 序穿 式, 部, ,再 5M358348 V. New description: [New technical field] Especially in this case, a combination of electronic components for bulk assembly and quick and stable assembly, ',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Press, as people's computer-*^ Λ Λ 日 日 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , * , , , , * * * * * * , Φ Day < «A phase upgrade to the A phase of the peripheral equipment, the central part of the electric-fine internal processing, the surname of the secret # is also necessary to speed up the heat sink with good computing speed. ...Because, there must be a design that the heat sinks that the 户 户 t 吊 吊 吊 多 多 多 多 多 多 多 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制 强制It is itself a negative thermal conductivity, such as: copper or aluminum, etc., and the bottom of the central processor, the bottom surface system, and the heating surface of the shell 4 are in contact with each other, and there are a plurality of dimming devices... After the hot fins on the top of the block, the ceremony: 'The heat transfer from the central processor to the force of force to force the mules to blow out the wind and the heat from the heat block on the heat block: = quantity. However, the heat-dissipating block has a form of 10%, and each of the multi-chip heat-dissipating blocks is composed of a plurality of heat-dissipating fins. The end edges of the fins are provided with opposite buckles, and then the buckles are suitable for each other. Integral, and a thermal block consisting of a guide 埶堍盥屯β on the junction surface, and then.../, the central processor is in contact with heat conduction, however, | κ % # fin production: r, early heat dissipation It is easy to increase the manufacturing cost, and the group split is also very inconvenient, and it is necessary to take into consideration the flatness and timely stability after the group I. Therefore, the present creator uses a new structure of a heat dissipating device that is combined with a heat pipe that is attached to the outside of the heat sink and is sleeved to support the heat sink, and uses the multi-point support and the fixed type to solve the above-mentioned lack. [New content] One of the purposes of this creation is to provide a .. 曰 促 促 促 — 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 组合 组合 组合 组合The second purpose of this creation is to reduce the manufacturing cost by connecting & Another purpose of this creation is to improve the heat dissipation efficiency of the device. In order to achieve the above purposes, the combined heat-dissipating and packaging of the present invention includes a base, a plurality of heat pipes, and a plurality of heat-dissipating covers; wherein the base is provided with a plurality of parallel drains, the groove The bottom portion is vertically disposed in the groove of the soil and is also in the position of the crawler seat, and a heat pipe is parallel to each other; the heat sink < ... month, and, and the sheet S have a plurality of perforations, notches, and at least - 蜾^ screw hole, each heat sink is extravagant on the heat pipe, and the flap 1 is like a parallel feng j. The cover is L-shaped, and the frame is set to be "ancient to the vertical edge". There is a reversed and top end edge provided with at least a fixing hole. When assembling, each piece of the 孰Η ... ... ... 依 依 依 依 ... ... ... ... ... ... ... ... ... ... ... ... ... ... 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热And concave, each plate, sequenced, part, and then 5

,故 M358348 利用外I — & 匕覆蓋設於疊合的散熱片一側及其 使倒鉤部扣合於每-散熱片的缺口部内,項面’ 部係蓋合於最上方的散熱片,並以螺桿:卜罩項 固定孔,八 °卜軍的 刀別螺設於每一散熱月的螺孔内, 扣合及螺作 /、夕點 且 螺杯固定的方式,可有效固定每一散熱片。 乍之政熱片經結構間化後’係利用較簡單的 、 式,而製得折板、穿孔、缺口部及至少一螺 'σ ,且組裝時也相當簡便,故也可降低製造、 多且. 、管 功效;再者,本創作利用熱導管玎快 傳導熱量,並將熱量分散至每一散熱片,且由外 側面所没置的散熱風扇,將熱量由侧面吹出 更大的散熱面積’所以散熱效率也會相對提高 【實施方式】 為使貴審查委員能清楚了解本創作之内容,僅 以下列§兒明搭配圖式,敬請參閱。 α月參閱第1、2圖所示,本創作之較佳實施例, 係包括下列結構: —底座1 〇,其上方設有複數個平行排列的凹槽 11,且底座1〇的平面上設有一上蓋該上蓋12 並設有複數個平行排列的開溝1 21 ;另該底座1 〇的 下方並設有一固定座i 3,供以固設於主機板上,其 係呈Η字形,該固定座1 3係由底座1 〇的四個角落’ 各斜向外延伸設有一固定片131,且固定片131上 M358348 設有至少—固定孔132。 /數個熱導管2°,係呈U字形,其内部係設有 適虽料熱液體,透過導熱液體的熱對流而快速傳 導熱量的效果’該熱導f 2 〇的底部係埋設於前述底 座1 °的凹槽11 Μ ’並藉由焊接材料填補其間的空 用、.f隙被完全填補後,而可提高熱導管2 〇之 相互熱傳導作用’進而提昇散熱的效能,底幻。的 頂面並由前述上蓋12加以包覆’其中央的熱導管 20直立向上,而兩侧的熱導管2〇分別向二側傾斜 設置,而每一熱導管2〇可平均向外分布(如第2圖 所示’係形成有六根向上直立的熱 &乙口 j ’底座 1 〇的底面經磨平後,可使熱導管2〇的 - J°卩外露, 便於直接貼附於中央處理器的發熱面。 複數個散熱片3 〇,其平面部設有 '丁應月1J述熱導 管20的穿孔31以及至少一螺孔32,I ^ π ~穿孔31 的周圍係凸設有一向上的環擋牆3 11,廿# 亚於散熱片 3 0的對稱端緣各設有一向上的折板3 3, 而黄文靜4片 3 0係依序穿設於向上直立的熱導管2 〇,w ρ '' 乂形成平行 疊合的型式’藉由折板3 3頂高而使每—Λ ^ 政熱片30 平行疊合時產生一設定間距;另該散熱片3 〇 的二側 緣係分設有一缺口部3 4。 一外罩40,如第3圖所示’其係呈丨全 L子'形,該 外罩40的侧面係設有對應散熱風扇50的風孔4ι Λ 安裝孔42,供以安裝散熱風扇,且外罩4〇側 M358348 對稱垂直端緣向内各設有—折板43,且於折板43 的端緣設有—倒鉤部431,而外罩4〇頂部的端緣係 對應前述散熱片30的螺孔32設有至少一固定孔 44’故固定孔44及螺孔32内可供穿螺設一螺桿45; 另該外罩40頂部的平面區域對應前述熱導管20設 有複數個穿孔4 6。 再如第1、2、4、5圖所示,本創作進行安裝時, 係將每一散熱片30依序穿設於熱導管後,藉由 散熱片30端緣的折板33,可使散熱片3〇成為平行 豐合的型式,復利用外罩40包覆蓋設於疊合的散熱 片30 —侧及其頂面,使倒鉤部43丨扣合於每一散熱 片30的缺口部34内,而外罩4〇頂部係蓋合於最上 方的散熱片30,再以螺桿45穿過外罩40的固定孔 44 ’而分別螺設於每一散熱片的螺孔32内,使 得散熱片30完全被固定,藉由多點扣合及螺桿45 固定的方式,同時搭配熱導管20的支撐,而可有效 支撐固定每一散熱片30。再者,本創作之散熱片3〇 係經結構簡化後,可藉由簡單的製造方式,例如. 沖壓工法’而快速製得折板3 3、穿孔31、缺口邻 34及至少—螺孔32等結構,且組裝時也相當簡便, 不需另外經過扣合及公差配合的手續,故可降低製 造、組裝成本;使用時’係將底座10的底面貼附於 中央處理器的發熱面’利用熱導管20内的導熱液# 之熱對流,快速將熱量分散至每一片平行的散熱片 8 M358348 ύ υ ’取傻冉甶外罩 z 〜唧面所設置的散熱風扇 將熱量由側面吹出,由^A ’ 田於本創作之熱導管2〇與 片30會有最佳的傳導 月文戒 、&度,以及較大的散熱面積 所以散熱效率也會大中,丄 領 八1^地提高,供中央處理器j私 運作。 吊 如上所述,如第1〜c 5圖所示,本創作在實施 將具有下列優點: 、時 1 ·本創作之散熱# q η / …、 3〇係依序牙設於熱導管 上而开乂成$合型式’復利用外罩4 0的包产 盍5又’以及螺桿45的螺設’使散熱片30的Therefore, the M358348 is covered by the outer I- & 匕 cover on the side of the stacked heat sink and the hook portion is fastened in the notch portion of each heat sink, and the front surface of the cover is attached to the uppermost heat sink. And the screw: the cover cover fixing hole, the knives of the eight-degree squad are set in the screw holes of each heat-dissipating month, and the fastening and screwing/, the eve and the screw cup are fixed, which can effectively fix each A heat sink. After the inter-structured heat film of the 乍 政 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Moreover, the effect of the tube; in addition, the creation uses the heat pipe to conduct heat quickly, and disperses the heat to each heat sink, and the heat-dissipating fan that is not placed on the outer side blows heat from the side to a larger heat-dissipating area. 'Therefore, the heat dissipation efficiency will be relatively improved. [Embodiment] In order for your review board to clearly understand the content of this creation, please refer to the following §. Referring to Figures 1 and 2, the preferred embodiment of the present invention comprises the following structure: - a base 1 〇 having a plurality of parallel-arranged grooves 11 disposed thereon, and a plane of the base 1 〇 The upper cover 12 is provided with a plurality of parallelly arranged trenches 1 21; and a fixed seat i 3 is disposed under the base 1 for fixing to the motherboard, which is in a U shape, and the fixing is fixed. The seat 13 is provided with a fixing piece 131 extending obliquely outward from the four corners of the base 1 ,, and the M358348 of the fixing piece 131 is provided with at least a fixing hole 132. / A number of heat pipes are 2° in a U-shape, and the inside is provided with a heat medium that conducts heat through the heat convection of the heat transfer liquid. The bottom of the heat guide f 2 埋 is embedded in the base. The 1 ° groove 11 Μ 'and fill the space between them by the welding material, the .f gap is completely filled, and the heat conduction effect of the heat pipe 2 ' can be improved', thereby improving the heat dissipation performance. The top surface is covered by the aforementioned upper cover 12', the central heat pipe 20 is erected upward, and the heat pipes 2 两侧 on both sides are respectively inclined to the two sides, and each heat pipe 2 〇 can be evenly distributed outward (such as Figure 2 shows the formation of six upright heats. The bottom surface of the base 1 〇 is smoothed, so that the heat pipe 2 〇 - J ° 卩 can be exposed, so that it can be directly attached to the central processing. The heat radiating surface of the device has a plurality of fins 3 〇, and the flat portion thereof is provided with a perforation 31 of the heat pipe 20 of the Ding Yingyue 1J and at least one screw hole 32, and an I ^ π ~ perforation 31 is convexly provided with an upward direction The ring-shaped retaining wall 3 11, 廿# is provided with an upward flap 3 3 at the symmetrical end edges of the fins 30, and the Huang Wenjing 4 sheets 30 are sequentially passed through the upwardly standing heat pipe 2 〇, w ρ '' 乂 form a parallel superimposed pattern 'by the top of the flap 3 3 so that each Λ 政 热 热 平行 平行 平行 平行 平行 产生 产生 产生 产生 产生 产生 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行A notch portion 34 is provided. A cover 40, as shown in Fig. 3, is in the form of a full L-sub-shape, and the side of the outer cover 40 is provided with a corresponding The air hole 4 Λ of the hot fan 50 is mounted with a hole 42 for mounting a heat dissipating fan, and the symmetrical vertical end edge of the outer side of the outer cover 4 is provided with a folding plate 43 and is provided at the end edge of the folding plate 43. The hook portion 431, and the end edge of the top of the outer cover 4 is provided with at least one fixing hole 44' corresponding to the screw hole 32 of the heat sink 30. Therefore, a screw 45 can be screwed into the fixing hole 44 and the screw hole 32; The planar area at the top of the outer cover 40 is provided with a plurality of perforations 46 corresponding to the heat pipe 20. As shown in the first, second, fourth, and fifth figures, each of the heat sinks 30 is sequentially disposed when the creation is performed. After the heat pipe, the fins 33 can be made into a parallel type by the folded plate 33 at the edge of the heat sink 30, and the cover 40 is covered on the side of the stacked heat sink 30 and its top surface. The barb portion 43 is fastened into the notch portion 34 of each of the fins 30, and the top of the cover 4 is closed to the uppermost fin 30, and then the screw 45 is passed through the fixing hole 44' of the cover 40. The screws are respectively screwed into the screw holes 32 of each heat sink, so that the heat sink 30 is completely fixed, and is fixed by a multi-point fastening and a screw 45. The method is matched with the support of the heat pipe 20, and can effectively support and fix each heat sink 30. Moreover, the heat sink 3 of the present invention can be simplified by a simple manufacturing method, for example, a stamping method. The structure of the folding plate 3 3 , the through hole 31 , the notch adjacent 34 and at least the screw hole 32 is quickly obtained, and the assembly is also quite simple, and the procedure of the fastening and the tolerance matching is not required, so the manufacturing and assembly costs can be reduced. In use, the bottom surface of the base 10 is attached to the heat generating surface of the central processing unit. The heat convection in the heat pipe 20 is utilized to rapidly dissipate heat to each parallel heat sink 8 M358348 ύ 取The fan of the silly cover z ~ 唧 所 将 将 将 将 将 将 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The larger the heat dissipation area, the heat dissipation efficiency will also be large, and the collar will be improved for the central processor j to operate privately. As mentioned above, as shown in Figures 1 to 5, the creation of the present invention will have the following advantages: 1. Time 1 · The heat dissipation of the creation # q η / ..., 3〇 is placed on the heat pipe.乂 乂 $ 合 合 合 合 复 复 复 复 复 复 复 复 复 复 复 4 4 4 4 4 4 4 4 以及 以及 以及 以及 以及 以及 以及

一端緣被緊密的固中 甘丁 / Z ]U疋,其不但組裝相當方 便,而可大幅提昇組裝品質。 2. 再者纟於本創作係設有熱導管20、平行叠 口的政熱片30 ’以及設置於側面的散熱風曷 5〇 ’而有最佳的傳導速度’及較大的散熱面 積,故可大幅提高散熱效率。 3. 而本創作之底幻"設有不同的固定座13, 以搭配使用於各種不同型式的中央處理器, 而此夠更加廣泛地被運用。 唯’以上所述者’僅為本創作之較佳實施例而 广/並非用以限定本創作實施之範圍,其他如:底 ::材貝、熱導官的數量、散熱片的形狀,或是外 此笙形狀等轉變方式’亦皆在本案的範疇之中;故 ’、’、、、白此技藝所作出等效或輕易的變化者,在不 9 M358348 脫離本創作之精神與範圍下所作之均等 飾,皆應涵蓋於本創作之專利範圍内。 綜上所述,本創作之組合式散熱裝置 專利之創作性,及對產業的利用價值;申 專利法之規定,向 鈞局提起新型專利之 化與修 係具有 人爰依 請。The one end edge is tightly solided in the gantin / Z ]U 疋, which is not only easy to assemble, but also greatly improves the assembly quality. 2. In addition, this creation department is equipped with a heat pipe 20, a parallel stack of political heat sheets 30 'and a heat-dissipating windshield 5' disposed on the side to have an optimum conduction speed' and a large heat-dissipating area. Therefore, the heat dissipation efficiency can be greatly improved. 3. The bottom of this creation has a different fixed seat 13 for use with a variety of different types of central processing units, which is more widely used. The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention, such as: bottom: number of materials, number of thermal guides, shape of the heat sink, or It is also in the scope of this case that the transformation of the shape of the ' ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; 故 故 故 故 故 故 故 故 故 故 等效 等效 等效 等效 等效 等效 等效 等效 等效 等效 等效 等效 等效The equivalents made shall be covered by the scope of this creation. In summary, the creation of the combined heat sink device patent, and the value of the use of the industry; the application of the patent law, the introduction of new patents and revisions to the bureau has people to rely on.

10 M358348 【圖式簡單說明】 第1圖,為本創作較佳實施例的立體分解圖。 第2圖,為本創作較佳實施例的立體組合圊。 第3圖,為本創作較佳實施例外罩的立體構造圖。 第4圖,為本創作較佳實施例組合使用時的示意圖 (一)。 第5圖,為本創作較佳實施例組合使用時的示意圖 (一)。 第5圖,為本創作較七 (二)。 • 【主要元件符號說明】 10 底座 11 凹槽 12 上蓋 121 開溝 13 固定座 131 固定片 # 132 固定孔 20 熱導管 30 散熱片 31 穿孔 311 環擋牆 32 螺孔 33 折板 34 缺口部 11 M35834810 M358348 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a preferred embodiment of the present invention. Fig. 2 is a perspective view of a preferred embodiment of the present invention. Figure 3 is a perspective view of the preferred embodiment of the present invention. Figure 4 is a schematic view (1) of the preferred embodiment of the present invention when used in combination. Figure 5 is a schematic view (1) of the preferred embodiment of the present invention when used in combination. Figure 5 is a comparison of the creation of the seventh (2). • [Main component symbol description] 10 Base 11 Groove 12 Upper cover 121 Ditch 13 Mounting seat 131 Fixing plate # 132 Fixing hole 20 Heat pipe 30 Heat sink 31 Perforation 311 Ring retaining wall 32 Screw hole 33 Folding plate 34 Notch 11 M358348

40 外罩 41 風孔 42 安裝子L 43 折板 431 倒鉤部 44 固定·? L 45 螺桿 46 穿孔 50 散熱風扇40 Cover 41 Air hole 42 Mounting L 43 Folding plate 431 Barbs 44 Fixing · L 45 Screw 46 Perforation 50 Cooling fan

1212

Claims (1)

M358348 六、申請專利範圍: 1 · 一種組合式散熱裝置,係包括: 一底座,其上方設有複數個平行排列的凹 槽; 複數個設於該底座凹槽内的熱導管,其利用 焊接材料填補於該熱導管與該凹槽間的空隙,以 作為固定之用且可提昇散熱效能; 複數個穿設於該熱導管上的散熱片,中央的 平面部設有穿孔及至少一螺孔’且二對稱的側緣 分別設有一折板,鄰近折板的一側又設有—缺口 部,使散熱片穿設於熱導管後,可形成平行疊合 的型式,藉折板可使每一散熱片間產生.一設定間 距; 一包覆蓋設於該散熱片外部的外罩,其侧面 係設有對應散熱風扇的風孔及安裝孔,該外罩侧 面的對稱垂直端緣設有一倒鉤部,使該倒鉤部扣 合於該散熱片的缺口部;另該外罩頂部的端緣設 有至少一固定孔,以將一螺桿依序穿設於該固定 孔及該散熱片的螺孔内,完成組裝。 2. 如申請專利範圍第1項所述之組合式散熱裝置’ 其中’該底座的平面上設有一上蓋,該上蓋並設 有複數個平行排列的開溝。 3. 如申請專利範圍第1項所述之組合式散熱裝置’ 其中,該底座的下方設有一固定座,供固設於主 13 M358348 機板上。 4. 如申請專利範圍第3項所述之組合式散熱裝置, •其中,該底座係呈Η字形,且由該底座的四個角 落各斜向外延伸設有一固定片,該固定片上並設 有至少一固定孔。 5. 如申請專利範圍第1項所述之組合式散熱裝置, 其中,該熱導管係呈U字形,且内部設有導熱液 ' 體。 φ- 6.如申請專利範圍第1項所述之組合式散熱裝置, 其中,該散熱片上每一穿孔的周圍係凸設有一環 擋牆。 7. 如申請專利範圍第1項所述之組合式散熱裝置, 其中,該外罩係呈L字形,且頂部的平面區域對 應該熱導管設有複數個穿孔。 8. 如申請專利範圍第1項所述之組合式散熱裝置, 其中,該外罩側面的對稱垂直端緣向内各延伸設 0 有一折板,該折板的端緣並設有一倒鉤部。 14M358348 VI. Scope of Application: 1 · A combined heat sink includes: a base having a plurality of parallel arranged grooves thereon; a plurality of heat pipes disposed in the grooves of the base, using welding materials Filling a gap between the heat pipe and the groove for fixing and improving heat dissipation performance; a plurality of fins penetrating the heat pipe, the central flat portion is provided with a perforation and at least one screw hole The two symmetrical side edges are respectively provided with a folding plate, and one side of the folding plate is further provided with a notch portion, so that the heat dissipating fins are disposed behind the heat pipe, and the parallel laminated type can be formed, and the folding plate can be used for each A set of spacing is formed between the heat sinks; a cover covers the outer cover disposed on the outer side of the heat sink, and a wind hole and a mounting hole corresponding to the heat dissipation fan are disposed on a side surface thereof, and a symmetrical vertical end edge of the side surface of the outer cover is provided with a barb portion The barb portion is fastened to the notch portion of the heat sink; and the end edge of the top portion of the outer cover is provided with at least one fixing hole for sequentially inserting a screw into the fixing hole and the screw hole of the heat sink. Complete group Installed. 2. The combined heat sink according to claim 1, wherein the base is provided with an upper cover, and the upper cover is provided with a plurality of parallel-arranged grooves. 3. The combined heat sink according to claim 1, wherein a fixing seat is disposed under the base for fixing on the main 13 M358348 board. 4. The combined heat sink according to claim 3, wherein the base is in a U-shape, and a fixing piece is arranged obliquely outward from each of the four corners of the base, and the fixing piece is arranged There is at least one fixing hole. 5. The combined heat sink according to claim 1, wherein the heat pipe is U-shaped and has a heat transfer liquid inside. </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; 7. The combined heat sink according to claim 1, wherein the cover is L-shaped, and the planar area of the top portion is provided with a plurality of perforations corresponding to the heat pipe. 8. The combined heat sink of claim 1, wherein the symmetrical vertical end of the side of the outer cover extends inwardly with a flap, and the end edge of the flap is provided with a barb. 14
TW98202488U 2009-02-20 2009-02-20 Assembly-type heat-dissipating device TWM358348U (en)

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