TWM288090U - High-density heat-dissipating fin module with heat pipe - Google Patents

Description

M288090, Creation Instructions (1) [New Technology Area] This creation is about a heat pipe type high-density fin heat sink, especially I 4 cooker double heat sink and fins arranged in a staggered heat pipe type high density fin Heat sink. [Prior Art] According to the rapid upgrade of the computer industry, many high-precision electronic components have been developed. These electronic components are enhanced with the technical level, and their speed is not enhanced, the speed of operation is accelerated, and the heat is accompanied. Significantly improved, in order to maintain the electronic components to continue operating at their permitted temperature, how to speed up and effectively dissipate heat has become one of the most urgent issues that R&D personnel need to solve today. q. The common heat sink is the aluminum extruded heat sink shown in the first figure, and the riveted heat sink 2a shown in the second figure. The two types of political heat g§la, 2a, because the fins 1〇a, 2〇a are limited by the process, the fins 10a, 2〇a must maintain a certain distance between the fins, and thus can not The total number of fins l〇a, 20a is increased under the same heat dissipation volume, so that the heat dissipation area is limited. Alternatively, as shown in the second figure, there may be a heat dissipation using a two-layer stack, which includes a heat pipe, and two heat sinks 31a, 32a, respectively, through the two ends of the heat officer 3_〇& The heat dissipating bodies 31a and 32a are connected to each other so that the heat dissipating bodies 31a and 32a can be placed above and below each other. However, the two-layer stacked heat sink 3a passes through the two heat dissipating bodies 31a and 32a. Each of the heat dissipation fins 310a, 32Aa increases the heat dissipation area, but since the overall height of the heat dissipation body 3a is relatively increased after stacking, the application is extremely large.

M288090 Creation Instructions (2) Limitations. In addition, the structural hot bodies 31a and 32a in the docking are undoubtedly a special and effective enthusiasm to change [the new type of heat dissipation area of the film, and the solution is less than one fin. #,,, and The relative positions are tied to each other, and the device created by the above-mentioned [implementing the above-mentioned contents in the above-mentioned research] is stacked to achieve the heat-dissipating tube, and the hot end and the first heat radiator 31a are The stability on the 32a is insufficient, and the support is heavy on the material. </ br /> This creator is a combination of the use of the theory, the lack of the original creation. The heat dissipation is only based on the heat and the heat of the steel. Finally, the fins 310a and 320a are used as the two heat pipes 3 0 a. The above-mentioned lack is a reasonable design and the main purpose is to make At the same time, the structure is unstable. The purpose of the above is that the heat sink can also effectively fix the problem. The present invention includes a first cooling surface of the first and second pedestal heat sinks on the surface, and the heat pipe. The heat transfer is connected to the first interlaced stack for the purpose of production. Mode] The two bases are set on the heat sink.距 After the distance, the adjacent docking provides an increase in the reduction of the dispersion. Providing a heating body, a heat receiving end comprising a plurality of fins; wherein, the number of tubular high-density fins or the entire volume of the heat sink, and the first and second by the first The second heat dissipation reduces heat dissipation and the like, and the overall high stability of the structure is not a heat pipe second heat dissipation base, and is composed of the fins of the second heat sink body and the foot of the cooling end, and the high density body and the And erecting the heat pipe with separate heat sinks, and the fins are placed without a test.

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In order to make your review board more technical, please refer to the following for the reference only to provide reference and description restrictions. Learn more about the features of this creation and the detailed description and drawings of the creation, but not for the creation of this creation.

Lane 12 and second runner 22. The second heat sink 2 is located above the first heat sink i, and the second heat sink 2 is placed upside down in a normal normal use state, that is, the second fins 21 of the second heat sink 2 are extended downward. For the second, please refer to the fourth and fifth figures, which are respectively the first embodiment and the three-dimensional combination diagram. The present invention proposes a heat sink device for heat sinking, the heat dissipating device includes a first heat sink body 2 and at least one heat pipe (Heat ριρ〇3; wherein, the first, the first heat body 1, 2 are It can be a common aluminum extruded radiator or a riveted heat sink (as shown in the sixth and seventh figures), and the first and second heat radiating bodies 1 and 2 can be extruded by the same mold. And the first and second heat dissipating bodies 1 and 2 respectively comprise a base 1〇, 2〇, and a plurality of fins η and 21 which are erected on the surfaces of the corresponding bases 10 and 20, and each of the first and second fins The first and second heat dissipating bodies 1 and 2 are further disposed at the upper side of each of the second fins 21, and the first and second heat dissipating bodies 1 and 2 are further arranged. The surface of the pedestal 1 〇 and 2 呈 is 180 degrees in the normal vector system. The heat pipes 3 can have a curved shape of a "c" shape, and both have a heated end 30 and a cooling end 31, and each The heated end of the heat pipe 3 and the cooling end 31 extend relative to each other to form a connecting portion 3 2, thereby constituting the heat pipe 3. The heat receiving end 3 of each heat pipe 3 〇 and the cooling end 31 are respectively associated with the first

Page 7 M288090 IV. Creation Description (4) The two pedestals 1 0 and 20 are used for heat transfer connection; in the embodiment of the present application, they are on the side of the first and second pedestals 10, 20 The perforations 13 and 23 penetrating into the interior are respectively provided, and the number of the perforations 13 and 23 on the first and second bases 1 and 2 is determined by the number of the heat pipes 3 to be matched, and the heat pipes 3 are provided. The heated end 3〇 penetrates into each of the perforations 13 of the first base 10, and the cooling ends 31 of the heat pipes 3 penetrate into the respective perforations 23 of the second base 20. Accordingly, the heat source (such as the CPU) can be located below the base 1 of the first heat sink 1, so that the heat absorbed by the base 10 of the first heat sink 1 to the heat source can pass through the heat pipes. After the heat receiving end 30 of 3 is transmitted to the cooling end 31 via the connecting portion 32, the cooling end 31 of each heat pipe 3 is dissipated by the second heat radiating body 2. Please refer to the sixth figure, the main part of the creation is that the fins of the first heat sink 1 are arranged in the flow path between the second fins 21 on the second heat sink 2 respectively. At the same time, each of the second fins 2 1 on the second heat sink 2 is also disposed in the flow channel 12 between the first fins ii on the first heat sink 1 . In this way, the fins 11 and 21 of the first and second heat dissipating bodies 2 are arranged in a staggered manner, thereby reducing the overall height of the heat dissipating device, and the first and second heat sinks 1 and 2 need not consider the docking due to the stacking. Problems such as insufficient structural stability. In addition, if the number of the heat pipes 3 is plural, the heat receiving end 3 of each heat pipe 3 is disposed on the first base 10, and is arranged in a side by side arrangement, and the cooling end 31 of each heat pipe 3 is on the second base 2 On the 〇, it is placed horizontally. In this way, the heat receiving ends 30 of the heat pipes 3 can be concentrated on the heat generating source, so that the heat generated by the heat generating source can be transmitted to the cooling end 31 through the heat pipes 3, and the cooling ends 31 of the heat pipes 3 are spaced apart. The second pedestal 2 is on the raft, which is beneficial to the heat dispersion

Page 8 M288090 Creation Instructions (5) Cooling. Furthermore, for example, the first and second heat dissipating bodies 1, 21 may be provided for the heat dissipation and circulation of the two fins 1 1 and 2 1 of copper, Ming, etc. In addition, as the first and second pedestals 10, 2 0 &gt;Consistent; and in the two pedestals 10, 20, and 7 are shown in Fig. 2, the riveting thermal conductivity is also good, and in the creation of the heat sink, the good material has a perforation as shown in the first direction of the first direction. 1 3 The above-mentioned first perforation 1 3 is indeed a right to propose a novelty law. However, the content of this article is limited. As mentioned above, to the expected and progressive application, the above-mentioned creation is equivalent to Chen Ming. The purpose of this creation is 'completely, please check it out and only for the scope of this profit, the structure changes, in this creation, the 23-way system example, the 23 trend is not enough' and the settlement of the new patent is granted to the case. The best for the purpose of the work, the same applies to all

In the second embodiment, the first fin 11 is made 'and in each of the first, the first 12 and the second flow path 2 2 in the third embodiment, the first and the fins 11 and 21 are arranged as a six. As shown in the figure, the first creation of the new creation products with the fins 11 and 21 is lacking in knowledge, and because of the application requirements, the patents are used to protect the creator's trip. And the schema is included in the scope of this creation

M288090 Schematic description of the drawing [Simplified description of the drawing] The first figure is a flat view of the squeezing type actuator. The second figure is a plan view of a conventional riveted heat sink. The third figure is a plan view of a conventional two-layer heat sink. The fourth figure is a schematic diagram of the physical decomposition of the first embodiment of the present invention. The fifth figure is a combination of the first and the actual embodiments of the present invention. The sixth drawing is a cross-sectional view of the first embodiment of the present invention. The seventh figure is the second creation: a flat cross-sectional view of the embodiment. • The eighth figure is a combination of the verticals of the J L embodiment. (Component representative symbol) &lt; Conventional &gt; Heat sink 1 a Fin 10a Heat sink 2 a Fin 20a, diffuser 3a Tube 30a Heat sink 3l· a Dispersing fin 310a Heat sink 32. a Heat sink fin Slice 320a &lt;this creation&gt;

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Claims (1)

M288090 L. Patent application scope: A tubular high-density fin heat sink comprising: r * ..., a body having a first base and a plurality of first rotors disposed on the first base table The second heat sink further has a second base and a plurality of second at least helium tubes disposed on the surface of the second base, and the right side is formed by a 'the bottom and the cooling end is a heat The end and the cooling end, and the heated end thereof, wherein the second base is connected to the second base, and the two bases are thermally connected; and the second heat dissipation system is located at a position above the first heat sink. The system is staggered. The heat pipe type high-density scales mentioned in item 1 of the heat dissipation range 3, such as the Ming type extruded radiator. Heat sink, J: Heat pipe type high density fins as described in 1 item, such as &quot;LCt riveted heat sink. Density fin heat sink, A = 热, 2 or 3 of the heat pipe type. The second heat dissipation system of the younger brother is an aluminum extruded heat sink. 5. If the application is patented, the density fins are heat-dissipating, and the heat pipe type described in the second or second item is high. /, 苐 a heat dissipation system is a riveted heat sink 6 , as claimed in the patent 簕囹坌, = heat sink, wherein the heat pipe type high density fins described in the first to the first. /, ^ The surface of the base of the first and second bases is 180 heat-dissipating in the normal vector system, wherein the heat pipe type high-density fins mentioned in item 1 are placed on the sides of the two bases. Its interior Page 12 M288090 V. Patent application scope • Perforation, and the heat pipe is cold 8. If the heat sink is used, 9, such as the heat sink, it forms a connection. 1 〇 如 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请The receiving end penetrates into the perforation of the first base, and the second base is in the perforation. The heat pipe type high density fin described in the item is a curved shape of the "[" shape. The heat pipe type high-density fin has a hot end and a cooling end extending relative to each other, wherein the heat pipe is concentrated on the water, the base is on the base, and the heat pipe type high density seat is separated on the surface. The first heat sink has a first heat sink formed by the first first heat sink, and has a second plurality The number is a plurality of parallel-arranged fin heat-dissipating pedestals, and each channel; two pedestals, a structure, and a flow channel; and at least one heat pipe having a heated end and a cold and cooling end Wherein, in each of the second flow channels, the first flow channel 1 2 is in the second portion as the first first fin. The application for the patent system is divided into fins, and the pedestal is heat-disposed in a heat pipe type high-density fin number, and each of the heat pipes, and each of the heat pipes. The device includes: a first fin disposed between the first base and a second fin disposed at the end of the second fin and connected by a heated end; each of the second fins Heat pipe type high density fins as described in each of the first fins 1 M288090 V. Patent application scope. The chip heat dissipation device, wherein the first heat dissipation system is an aluminum extrusion type heat sink. 1 . The heat pipe type high density fin-sheet heat dissipation device according to claim 1, wherein the first heat dissipation system is a riveted heat sink. 14. The heat pipe type high density fin heat sink according to claim 1, wherein the second heat dissipation system is an aluminum extruded heat sink. 15. The heat pipe type high density fin heat sink according to claim 1, wherein the second heat dissipation system is a riveted p heat sink. The heat pipe type high density fin heat sink according to claim 11, wherein the first and second pedestal surfaces are 180 degrees in a normal vector system. The heat pipe type high-density fin heat dissipating device of claim 1, wherein the first and second base sides are respectively provided with perforations penetrating into the inner side thereof, and the heat receiving end of the heat pipe is provided. The through hole of the first base is penetrated, and the cooling end of the heat pipe penetrates into the through hole of the second base. The heat pipe type high density fin heat sink according to claim 11, wherein the heat pipe has a curved shape of a "c" shape. The heat pipe type high density fin heat sink of claim 1, wherein the heat pipe extends relatively between the heated end and the cooling end to form a joint. 20. The heat pipe type high density fin heat sink according to claim 11, wherein the number of the heat pipes is plural, and each of the heat pipes Page 14 M288090 V. The heat-receiving end of the patent application scope is arranged in parallel on the first base, and the cooling ends of the heat pipes are horizontally spaced on the second base. I Page 15