TWM250224U - Successive-layer type heat dissipation apparatus - Google Patents

Description

M250224

V. Creation Description (1) [Technical Field of Creation] This creation is related to the design of gradational heat sink structure, especially a heat sink structure design that should be used in the computer's central processing unit (CPU) or other chips. The combination of multiple layers of heat sinks and heat pipes can achieve sufficient and rapid heat dissipation. [Previous technology] According to the experience, it is a waste of material to press the chip (a piece of structure of the extruded structure; or fixed to the above-mentioned various temperatures, regardless of the use of the chip, the thermal fins are actually wasteful. Because of this experience, Improve heat sink performance

Traditionally used for computer central processing unit (CPU), graphics card GPU) or other memory chips, the radiator is usually made of aluminum to form a base plate and a plurality of scattered axes on the base plate.铝 Aluminum or copper heat dissipation fins together bless the surface of the wafer: the bottom plate of the f-shaped heat sink is covered by the farmer to exclude the high temperature matching fan. It is produced by the test-type extrusion, Shao or copper plate, and the heat sink of the system is concentrated on the bottom plate. The practical application is that the heat absorption is transmitted to the sleeve. This phenomenon cannot have a considerable height (area), but is limited by the complex number

High Scattering = Transfer of heat charge / knife to Scattering __ "The upper end of the chip", the actual heat dissipation effect of the fins is still cut by the heat fins.

'Creation of this case / U * m Huanren people, with his many years of design, manufacturing and production ② Saili R & D proposed a professional radiator manufacturing I see the radiator value, Teng 4 t complex structure design, and it is expected to fully develop its heat dissipation efficacy. Regrets while nuclear

M250224 V. Creation Instructions (2) [Creation Content] The main purpose of this creation is to provide a layered heat sink structure design, which is mainly based on the combination of multiple layers of heat sinks and heat pipes. The heat is dispersed, and a plurality of layers of heat dissipation fins of appropriate height can be used to quickly dissipate heat. For the above purposes, this creative system consists of a main heat sink, a sub heat sink, and 2 heat pipes, so that one or more sub heat sinks are stacked on the main fan seat, and the main heat sink and the sub heat sink are placed between There is one or more heat-conducting pipes, and the heat-conducting pipes are attached to the main and

The hot seat is selected to form a layered heat sink, which has a fast heat dissipation effect. 77 and [Embodiment] The following is a detailed description of the structural features of the creation and other works according to the embodiments of the drawings: As shown in the drawings, the juice of the creation includes the main heat sink 1 and the auxiliary cover as required. An air guide cover 4 fan is installed, in which: a heat sink 2 and a heat pipe 3 are provided for the structure of the "layer transfer heat sink" a to provide one or more heat dissipation

The main heat sink 1 and the sub heat sink 2 (as shown in the first figure and the first are respectively formed by selecting a metal base plate u, 21 with a plurality of heat sink fins 1S, μ, and each heat sink fin 12, Although Nandu is an effective heat transfer device, the bottom plate i 2 2 is composed of a plurality of heat dissipation fins 12, 22, which can be constructed by aluminum extrusion, copper welding, or welding. , ... number of heat dissipation y or

Page 6 M250224 V. Creation instructions (3), 2 2 series can be vertical or curved U, 21, and there is no restriction on the heat pipe 3 '(such as a hollow pipe body, used as a wind guide cover 4, (if formed 'The main cooling fan can be installed on the hollow side plate 41 and a top plate 4 2, and a plurality of fan locks are provided on the 43 side of the composite plate. The heat pipes 3 in the main fan base 1 and the auxiliary heat sink 2 are respectively selected from the main board and the auxiliary heat sink 1 and the reciprocating heat sinks on the surfaces of the bottom board 1 and 12 respectively, and the base board 11 with this creative layer is used. In the case of electrical applications, in addition to using the bottom to simultaneously absorb the high-temperature heat pipe 3 with the heat transfer tube 3 at a concentration of 11 degrees and the bottom plate 21 to absorb the surface, it is possible to obtain a combination of thermal folding, side-by-side or radial arrangement & The third figure and the second figure show that the heat is sufficient. The heat sink 1 and the shell are screwed into the shell at the front end of the shell. Grasp the metal plate to learn the periphery of the auxiliary heat sink 2, the sides and the top of the Ganhu body are bent and locked. 43, Yun Yao You Ya Yu is one or more of the scatters are widely hollowed out to serve as the air outlet, and the steel type of the wind is shown in the fourth picture.) At least the space between the hot seat 1 is selected to have at least a tube. Adjacent to the side wall, and optional 2 peripherals, by the full and fast cooling device, the brain central processing board 11 and its scattered surface are transmitted to the auxiliary scattered contact structure with the bottom plate. The main ^ is a heat pipe 3, and the main and auxiliary heat sinks are used to selectively guide the air guide cover 4 | J = to print the heat dissipation effect which is the second of this creation. Said f structure design, when the main heat sink (CPU) or other wafers on the thermal transfer plate 1 2 exhaust high temperature, 11 contact structure, can be the bottom plate ..., 2 bottom plate 2 and guide, let The heat is evenly dispersed by the base plate 2 1 South temperature. And ❿

Page 7 M250224 V. Creative Instructions (4) f. The thermal fins 1, 2 and 2 are set to appropriate heights (with the appropriate surface to '疋 to make full use of each cooling fin 1 2, 2 2 Prepared for transmission, heat is absorbed and exhausted to further obtain rapid heat dissipation effect, avoiding waste of materials. Because the heat transfer pipe 3 is in contact with the side wall 11 and d η! Of the base plate, the heat can be used in addition to the heat. It is transmitted to the sub-radiation base 2 and ^ I distributes the transmitted high temperature around the base plate 12, which enables the scattered power to absorb and dissipate evenly, so as to further improve the heat dissipation efficiency, and make the Yuedian central processing unit (CPU) or other The operation of the chip tends to be stable. Limitation, the installation of the τ moxibustion heat pipe 3, 1 does not use the above embodiment as a thermal seat]: (shown in the figure below). It can also be set between the main and the auxiliary fan 2 according to actual needs. There are two or more heat conducting tubes 3, and the shape of the guide tube is not limited to a specific one. Also, “the main heat sink 丄 is not on top” ^ The embodiment of placing a sub heat sink 2 is limited, (refer to Section 丄 丄 ΐ Π, according to actual needs, multiple sub heat sinks 层叠 are stacked, and the use of seven Γ ϊΐ 2 As for [the main heat sink 1] is ^ Yu Daozheng. From this, it can be seen that this creative embodiment does not take the above contents ^ Any simple changes and replacements using the spirit or means of the previous disclosure are included in the patent of this case In the scope, it is only combined with the specified. In summary, the "layer-level dispersal f :: for this creation has indeed been practical and creative, and the means of its use are two =, and the efficacy is in line with the design purpose, It has been said that it is reasonable; Ying ..., and u have filed a new patent application, but I would like to ask the Bureau to benefit v. I pray for the grant of a patent, and I feel very good.

Claims (1)

M250224 6. Scope of patent application 1. A layered heat dissipation device, which consists of a main heat sink, a sub heat sink and a heat pipe. The main heat sink and the sub heat sink are respectively provided with a plurality of cooling fins on a selected base plate. The structure is characterized in that at least one pair of heat sinks is selected to be stacked on the main heat sink, and at least one heat conduction pipe is arranged between the main heat sink and the auxiliary heat sinks, and the heat conduction pipe system is divided into two ends respectively. The side wall is adjacent to the selected surface of the bottom plate of the main heat sink and the sub heat sink, so that the high temperature of the main heat sink can be dispersed to the sub heat sink by using a heat pipe. 2. The layered heat sink as described in item 1 of the scope of the patent application, the main heat sink and the sub heat sink can be made of aluminum extrusion or welded to the base plate by aluminum or copper sheet welding. 3. According to the layered heat dissipation device described in item 1 of the scope of patent application, the main heat sink and the auxiliary heat sink can be optionally covered with a wind guide cover, and the air guide cover and the cooling fan are combined. Page 10