M258337 四、創作說明（1) 【新型所屬之技術領域】 本創作係有關於一種熱管散熱器結構改良，尤其是指 一種可令該熱管於製作過程上更為簡化，不但提高熱傳效 率’並同時令製作成本更為低廉，而不僅可於整體施行使 用上極具熱傳導及散熱效能，且亦能提高產品良率並亦更 能提供其產品競爭力之熱管散熱器創新詰構改良應用者。 【先前技術】 按，各式電腦主機、電腦相關設備於使用上，其為了 月b使内部晶片〔如：中央處理器（c p u )、繪圖晶片（ GPU)......〕以更高之工作時脈進行運作，使得必須增 . 加設於該晶片内之電晶體數量，而隨著該電晶體數量的增 加亦會讓耗電量、功率隨之增加，連帶造成該晶片於使用 上會產生較高的熱量，此時，若晶片之散熱效率不佳，則 易導致該晶片產生故障或電腦當機之狀況發生，也因此， 於電腦晶片效能、工作時脈不斷提升的現今市場上，該晶 片的散熱效率即為一極重要之問題。 其中，如第五圖所示，其係為一種常見之散熱器（5 )，該散熱器（5)具有散熱鰭片（51)，而散熱 1^)上方裝設一風扇（52)，將散熱器（5)隨 一層導熱膏（53)裝設於電腦晶片（54)之通= 腦晶片（54)i生之熱能傳導至散熱 Ιίΐ*再藉風扇（5 2 ) <風力冷卻散熱藉片（5 i ) 腦晶“5 ί)散熱之目的，使電腦可持二ii 疋的運作；但，由於為增加可供風力散熱的面M258337 IV. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation relates to the improvement of the structure of a heat pipe radiator, especially to a method that can simplify the manufacturing process of the heat pipe, not only improve the heat transfer efficiency 'and At the same time, the production cost is lower, and it can not only have extremely high heat conduction and heat dissipation performance in the overall implementation and use, but also improve the product yield and also provide its product competitiveness. [Previous technology] Press, all kinds of computer mainframes and computer-related equipment are used. For the month b, the internal chip [such as: central processing unit (cpu), graphics chip (GPU) ...] is higher. The working clock runs to make it necessary to increase the number of transistors installed in the chip. As the number of transistors increases, the power consumption and power will increase, which will cause the chip to be used. Higher heat will be generated. At this time, if the heat dissipation efficiency of the chip is not good, it will easily cause the chip to malfunction or the computer to crash. Therefore, in the current market where the performance of the computer chip and the working clock are continuously improved. The heat dissipation efficiency of the chip is an extremely important issue. Among them, as shown in the fifth figure, it is a common radiator (5). The radiator (5) has radiating fins (51), and a fan (52) is installed above the radiating 1 ^). The heat sink (5) is installed on the computer chip (54) with a layer of thermal paste (53) = brain chip (54). The thermal energy generated by the chip is transmitted to the heat sink, and the fan (5 2) is borrowed by the wind cooling fan. Tablet (5 i) brain crystal "5 ί) for the purpose of heat dissipation, so that the computer can support the operation of II II 疋;
M258337 四、創作說明（2) 界大多採用減少兩散熱鰭片之間距，增加散熱鰭片的片數 ，但，如此一來卻因散熱鰭片變薄，使得該散熱鰭片底部 之熱能無法有效且完全、快速的傳導至頂端，再者，風扇 之風力到達散熱鰭片底部之際，風壓已然減小，如此一來 ，造成了散熱鰭片頂端與底部之溫差加大，散熱效率不佳 ;另，為了有更佳之散熱效率，不得不加大散熱鰭片及換 裝轉速更快、風力更強之風扇；不過，此種大體積之散熱 器，勢必不適用於講究輕薄短小、講究機動性之筆記型電 腦。 於是，業界即又發展出一種如第六圖所示之散熱器（ 6)，該散熱器（6)係於散熱鰭片（61)裝設一熱管 (6 2)之冷卻器，該熱管（62)請一併參閱第七圖所 示，其係由管殼（621)、工作液體〔熱媒液體〕和毛 細構造物（6 2 2 )所組成，將該熱管（6 2 )抽真空後 ，再充填適量之工作液體，且藉毛細構造物（6 2 2)吸 收，飽含工作液體後再密封熱管（62)，熱管（62) 一端為蒸發段，另一端為冷卻段，當熱能使蒸發段之工作 液體蒸發汽化，在蒸汽壓的壓差下流向冷卻段，以釋放熱 能，同時冷凝成液態而由毛細構造物（6 2 2 )吸收，並 藉毛細力流回蒸發段，藉由工作液體不斷的相變化循環以 帶走熱能，達到散熱之目的，而於熱管（6 2)之蒸發段 則裝設有一金屬片（63)，藉此金屬片（63)與主機 板（66)上的電腦晶片（65)隔著一層導熱膏（64 )貼合，以吸收帶走電腦晶片（6 5 )之熱能，同時藉熱M258337 IV. Creative Instructions (2) Most of the world adopts to reduce the distance between two cooling fins and increase the number of cooling fins. However, because the cooling fins become thinner, the thermal energy at the bottom of the cooling fins cannot be effectively used. And it is completely and quickly conducted to the top. Furthermore, when the fan's wind reaches the bottom of the fin, the wind pressure has already decreased. As a result, the temperature difference between the top and the bottom of the fin increases and the heat dissipation efficiency is not good. In addition, in order to have better heat dissipation efficiency, it is necessary to increase the cooling fins and replace fans with faster rotation speed and stronger wind; however, such large-volume radiators are bound to be unsuitable for lightness, shortness, and mobility. Sex laptop. Therefore, the industry has developed a heat sink (6) as shown in the sixth figure. The heat sink (6) is a cooler equipped with a heat pipe (62) on the heat dissipation fin (61). The heat pipe ( 62) Please also refer to the seventh figure, which is composed of a shell (621), a working liquid [heat medium liquid], and a capillary structure (6 2 2). After the heat pipe (6 2) is evacuated, Then, fill with a proper amount of working liquid and absorb it with the capillary structure (6 2 2). After being filled with the working liquid, seal the heat pipe (62). One end of the heat pipe (62) is the evaporation section, and the other end is the cooling section. When the heat energy causes the evaporation The working liquid in the section evaporates and vaporizes, and flows to the cooling section under the pressure difference of the vapor pressure to release heat energy, while condensing to a liquid state and absorbed by the capillary structure (6 2 2), and flows back to the evaporation section by capillary force. The continuous phase change cycle of the liquid takes away the heat energy to achieve the purpose of heat dissipation, and a metal piece (63) is installed in the evaporation section of the heat pipe (62), whereby the metal piece (63) and the main board (66) The computer chip (65) is attached through a layer of thermal paste (64) to absorb and take away the computer chip (6 5) The heat energy, while borrowing heat
第7頁 M258337 (3) )之優 藉風扇 雖然熱 身僅具 熱’而 以高效 ，創作 熱器構 並於9 器構造 散熱器 鰭部任 的熱能 可持續 ，該「 熱，能 卻仍發 成，不 其之技 構於製 型内容 四、創作說明 管（6 2 _ )，並 然， 1但其本 及風扇散 失，無法 因此 「熱管散 〕，該案 熱管散熱 ，且於該 ，該散熱 液體傳遞 過熱，而 然而 片不致過 作過程中 末燒結而 成本’且 該整體結 r新 良熱傳導 (67) 管具有優 傳遞熱能 如之前述 率帶走熱 人即於9 造改良」 3年3月 改良」主 之冷卻段 何位置之 可搭配風 的穩定運 熱管散熱 穩定運作 現，該結 僅於製作 術層次較 作上仍存 性能， 之風力 良的熱 之功效 ’散熱 量。 2年2 〔申請 2 2曰 要係於 成型有 等溫性 扇快速 作。 器構造 之預期 構之金 上較為 高，於 有極大 傳遞熱能於散熱 散熱。 - 傳導性能，是熱的超導 ，依然必須依賴散熱鳍 *鰭片仍具有極待改呈 ^之缺 月17日向鈞局提出— 案號·· 9 2 2 〇 2 4 經鈞局核准專利，該「 内設有金屬燒結塊 $，二二之散熱《部 二袖Ϊ可使藉汽態之工作 被▼走’使電腦晶片不致 2」雖可達到使電腦晶 功效，但於其 屬燒結塊由實施製 麻煩不便粉 ^ ΐ為不易，使得 問題困擾之處南待改i: 本創作之熱管散熱器結構改良，其主 段之上蓋與底座間設有受熱體，且於該受執係於熱管蒸發 細構造物’而該毛細構造物可為破璃纖維$趙之上設有毛 ' 數層貼合的Page 7 of M258337 (3)) Although the warm-up fan only has heat, it is highly efficient. The thermal energy created by the thermal structure and the radiator fins of the nine-structure structure is sustainable. The "heat, energy, but still produces The technique of constructing it is based on the content of the production. Fourth, the creation description tube (6 2 _), and concurrently, 1 but the book and the fan are lost, so it ca n’t be “heat pipe scattered”. The heat pipe in this case dissipates heat. The liquid transfers overheating, but the sheet will not be sintered during the overheating process and the cost is' and the overall junction is a good heat transfer (67). The tube has excellent heat transfer energy, and the heat is removed as described above. The cooling section of the main part of the "Moon improvement" can be matched with the wind to stabilize the operation of the heat pipe. The heat dissipation and stable operation now appear. The knot only has performance at the level of production technology. 2 years 2 [Application 22 2nd is to be made quickly by forming an isothermal fan. The structure of the device is expected to be relatively high in terms of metal structure, so that it can greatly transfer thermal energy to dissipate heat. -Conduction performance, which is thermal superconductivity, still has to rely on heat dissipation fins * The fins still have to be changed to be submitted to Jun Bureau on the 17th — Case No. ·· 9 2 2 0 2 4 Patent approved by Jun Bureau, The "with metal sintered block inside, the second part of the heat dissipation" the second sleeve can make the work in the vapor state can be taken away to make the computer chip not 2 "Although it can achieve the effect of computer crystal, but it is a sintered block The implementation of the system is inconvenient and difficult, making the problem difficult to be solved. I: The structure of the heat pipe radiator of this creation is improved. The main body is provided with a heating body between the upper cover and the base. The heat pipe evaporates the fine structure, and the capillary structure can be a broken glass fiber.
M258337 四、創作說明（4) 金屬網或陶瓷棉 此，以於該熱管 製作成本者。 【實施方式 首先’請先 .)、受熱體（ 組成；其中： 該上蓋（1 11) ’該散熱 (1 1 )兩側端 凹弧狀之補強部 該受熱體（ :2 1 )，該各 之接合部（3 1 交換面積，而於 2 ) ° ’再於上蓋與底座間灌注有工作液體；藉 之製作上更為簡易、便利，並同時能降低 ] 參閱第一、二圖所示，本創作係由上蓋（ 2)、毛細構造物（3)及底座（4)所 )’其於上端面一侧凸具有數散熱鰭部（ 轉部（1 1 )係呈中空狀，且於散熱鰭部 面皆呈波浪狀，另於上蓋（1 )凹設有數 (12)。 2 ) ’其上端面排列凹具形成有諸多嵌溝 敗溝（2 1 )則恰可供毛細構造物（3 ) )頂抵接觸而容設於其中，如此可增加熱 受熱體（2 )底端面則凸設有吸熱部（2 "亥毛細構造物（3 )，其可為玻璃纖維布、數層貼合 的金屬網或陶竟棉所製成，於毛細構造物（3 )之一段下 端面則彎折形成有數道接合部（3 i )。 該底座（4 )’其恰可供受熱體（2 )與毛細構造物鲁 (3)容設入内’且同時與上蓋（1)封合固定，於該底 座（4 )對應受熱體（2 )之吸熱部（2 2 )則開具有透 孔（4 1 )。 本創作於組設結合時，請再參閱第一、二圖所示，其M258337 IV. Creation instructions (4) Metal mesh or ceramic wool This is for the production of the heat pipe. [Embodiment first 'please first.), The heat receiving body (composed; of which: the upper cover (1 11)' the heat sink (1 1), the concave arc-shaped reinforcing portions on both sides of the heat receiving body (: 2 1), each The joint (3 1 exchanges area, and at 2) ° 'The working liquid is poured between the upper cover and the base; it is easier and more convenient to make it, and it can be lowered at the same time] See the first and second figures, This creation is composed of the upper cover (2), the capillary structure (3), and the base (4)), which has a number of heat dissipation fins (the turning portion (1 1)) is convex on the upper end side and is hollow and dissipates heat. The fin surfaces are wavy, and the top cover (1) is recessed with a number (12). 2) 'The upper end is arranged with concave tools to form a number of grooves and grooves (2 1), which are just suitable for capillary structures (3 )) It is placed in contact with it, so that the bottom end surface of the heat receiving body (2) can be increased, and a heat absorption part (2 " Hai capillary structure (3)) can be convex, which can be glass fiber cloth, several layers of paste It is made of metal mesh or ceramics, and the lower end surface of one segment of the capillary structure (3) is bent to form several joints (3i). (4) 'It can be accommodated in the heating body (2) and the capillary structure (3)' and is sealed with the upper cover (1) at the same time, and the heat absorption of the heating body (2) corresponding to the base (4) The section (2 2) is provided with a through hole (4 1). When the composition is combined, please refer to the first and second figures as shown in the figure.
M258337 四、創作說明（5) 係令受熱體（2 )與毛細構造物（3 )分別容設於底座（ 4)内，且受熱體（2)之吸熱部（22)恰由底座（4 )之透孔（4 1 )向外凸伸，並預先將二者焊接，並同時 令毛細構造物（3)之接合部（3 1 )容設於受熱體（2 )之嵌溝（2 1)内，再於底座（4)上方蓋合上蓋（1 )，令上蓋（1)與底座（4)封合固定抽真空，而於上 蓋（1 )與底座（4 )間則灌注有工作液體。 如此一來，即能利用受熱體（2 )之吸熱部（2 2 ) 貼合於晶片上，以藉由受熱體（2 )將熱能直接由嵌溝（ 2 1)傳導至毛細構造物（3)之接合部（3 1)上，令 4 毛細構造物（3 )飽含吸收之工作液體受熱汽化進入上蓋 (I) 之散熱鰭部（1 1)内，而散熱鰭部（1 1)再加 以風扇〔圖中未示〕吹拂冷卻汽化後之工作液體，使工作 液體再冷凝液化滴下被毛細構造物（3 )吸收，並藉毛細 力讓工作液體流向接合部（31)，而達反覆加速散熱之 目的。 另，請再參閱第三圖所示，本創作於應用在桌上型電 腦時，亦可對應電腦晶片大小分別設有適當尺寸之上蓋（ 1)、受熱體（2)、毛細構造物（3)及底座（4)， 該上蓋（1)直接於上端面凸具有中空容室之數散熱鰭部 〇 (II) ，其兩側端面皆呈波浪狀，而受熱體（2 )則直 接於上端面凹具形成設有嵌溝（2 1 )，以供利用該嵌溝 (2 1 )與毛細構造物（3 )相對應之接合部（3 1 )相 頂抵接觸，該受熱體（2 )下端面之吸熱部（2 2 )則亦M258337 IV. Creation instructions (5) The heating body (2) and the capillary structure (3) are respectively housed in the base (4), and the heat absorption part (22) of the heating body (2) is formed by the base (4). The through hole (4 1) protrudes outward, and the two are welded in advance, and the joint (3 1) of the capillary structure (3) is accommodated in the groove (2 1) of the heat receiving body (2). Then, the upper cover (1) is closed over the base (4) so that the upper cover (1) and the base (4) are sealed and evacuated, and the working liquid is filled between the upper cover (1) and the base (4). In this way, the heat-absorbing part (2 2) of the heat-receiving body (2) can be attached to the wafer, so that the heat energy (2) can directly transfer the heat energy from the embedded groove (2 1) to the capillary structure (3). On the joint portion (3 1) of), the 4 capillary structures (3) are filled with the absorbed working fluid and vaporized into the heat dissipation fin (1 1) of the upper cover (I), and the heat dissipation fin (1 1) is added. The fan (not shown in the figure) blows and cools the vaporized working liquid, causes the working liquid to condense and liquefy, and drips and is absorbed by the capillary structure (3), and uses the capillary force to make the working liquid flow to the joint (31), and repeatedly accelerates heat dissipation. Purpose. In addition, please refer to the third figure again. When this creation is applied to a desktop computer, it can also be equipped with an appropriate size cover (1), a heating body (2), and a capillary structure (3) corresponding to the size of the computer chip. ) And the base (4), the upper cover (1) has a number of radiating fins (0) of a hollow container directly on the upper end surface, both end surfaces of which are wavy, and the heat receiving body (2) is directly on the upper surface. A recessed groove (2 1) is formed on the end surface recess, so that the recessed groove (2 1) and the joint portion (3 1) corresponding to the capillary structure (3) abut against each other, and the heat receiving body (2) The heat absorption part (2 2) on the lower end is also
第10頁 M258337 四、創作說明Page 10 M258337 IV. Creative Instructions
同樣由底座（4)之透孔（4 1 )處向外凸伸，並預先 兩者焊接，如此一來，即可供以該吸熱部' 桌上型電腦之晶片上，不但可減少熱阻又可辦士為# ,^ 』增加熱傳效韋 ，而達快速散熱之功效者。 又，請再參閱第四圖所示，本創作之上蓋（i , 直接形成一中空管狀，並於另一端可抽真空後並 係可 將上蓋（1)直接蓋掣封合於受熱體（2)周緣，g ’再 體（2)之嵌溝（2 1)亦與毛細構造物（3)之而雙熱 (3 1 )相互嵌固結合後，而同樣可達加速散熱合部 藉由以上所述，該元件之組成與使用實施^明，效。 本創作與習用相較下，由於本創作利用受熱體之w可知’ 直接將熱能傳導至由玻璃纖維布、數層貼:的金1，部， 瓷棉所製成之毛細構造物上，使得相較於習用之網或陶 塊，本創作於整體施行製作上更為快速、古你 屬繞結 品良率外，更能降低製作成本者。 ” 3加產 綜上所述’本創作實施例確能達到所預期之 ，又其所揭露之具體構造，不僅未曾見諸於同類2功致 亦未曾公開於申請前’誠已完全符合專利法之 品中， ’爰依法提出新型專利之申請，懇請惠予寇杏 '、與要求 利，則實感德便。 —，並賜准專 M258337 圖式簡單說明 【圖式簡單 第一圖 第二圖 第三圖 第四圖 第五圖 第六圖 第七圖 〔參照圖號 (1 ) (12) (21) (3 ) (4 ) (5 ) (52) (54) (61) (621) (63) (65) (67) 說明】 本創 本創 本創 本創 習用 另一 另一 上蓋 補強 嵌溝 毛細 底座 散熱 風扇 電腦 散熱 管殼 金屬 電腦 風扇 作之立 作之側 作之另 作之又 之使用 習用之 習用局 部 構造物 器 晶片 縛片 片 晶片 體分解圖 視剖視圖 一實施例端視剖視圖 一實施例端視剖視圖 狀態參考圖. 使用狀態參考圖 部剖面示意圖 (11) (2 ) (.22) (31) (41) (51) (53) (6 ) (62) (622 (64) (66) 散熱鰭部 受熱體 吸熱部 接合部 透孔 散熱鰭片 導熱膏 散熱器 熱管 毛細構造物 導熱膏 主機板Similarly, the through hole (4 1) of the base (4) is protruded outward, and the two are welded in advance. In this way, it can be used on the chip of the heat sink 'desktop computer, which can not only reduce the thermal resistance. You can also increase the heat transfer effect for #, ^ 』, and achieve the effect of rapid heat dissipation. Also, please refer to the fourth figure again. The upper cover (i) of this creation is directly formed into a hollow tube, and the other end can be evacuated and the upper cover (1) can be directly sealed to the heat receiving body (2). ) Peripheral edge, after the embedded groove (2 1) of g 'body (2) and the double structure (3 1) of the capillary structure (3) are embedded and combined with each other, the heat radiation joint can also be accelerated by the above. As mentioned above, the composition and use of this element are clear and effective. Compared with the conventional use, this creation uses the heat source to know that 'the heat energy is directly transmitted to the glass fiber cloth and several layers of gold: On the capillary structure made of porcelain cotton, compared with the traditional net or ceramic block, this creation is faster in the overall implementation of production, and the yield of ancient products is lower, and the production can be reduced. The cost increase. ”In summary of the above 3 production increases,“ This creative embodiment can indeed achieve the expectations, and the specific structure disclosed by it has not only been seen in the same category, nor has it been disclosed before the application. ” Among the products that comply with the Patent Law, 'Converted to file an application for a new patent. ', And demand benefits, then the real sense of morality. — And give Zhunzhuan M258337 a simple explanation of the diagram [simple diagram first picture second picture third picture fourth picture fifth picture sixth picture sixth picture seventh picture [refer to the figure No. (1) (12) (21) (3) (4) (5) (52) (54) (61) (621) (63) (65) (67) Explanation] Original creation Original creation Use another cover to reinforce the grooved capillary base. Cooling fan. Computer cooling tube. Metal computer fan. Side work. Another work. Customary local structure. Wafer chip. Chip exploded view. Cross-sectional view of an embodiment End-view cross-sectional view of an embodiment End-view cross-sectional view of the state reference diagram. The use state of the reference diagram section schematic diagram (11) (2) (.22) (31) (41) (51) (53) (6) ( 62) (622 (64) (66) Radiating fins Heat-receiving part Joints Through-hole heat dissipation fins Thermal paste Heat sink Capillary structure Thermal paste Main board
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