TWM257478U - Improved structure of heat conducting plate - Google Patents

Description

M257478 IV. Creation Description (1) [Technical Field to which the New Type belongs] This creation relates to a heat-conducting plate, heat-generating electronic components (such as a CPU), heat exchange plate, the increase in the vapor phase of the heat-conducting plate, the speed plus the heat dissipation efficiency. [Previous technology] Press 'As the technology industry develops faster and faster, especially when the central processing unit turns, the heat generated is also getting higher and higher, and it is distributed to the environment outside the mainframe to maintain the central operation.' J processor is usually installed on the central processor to dissipate heat to increase the cooling capacity. The higher the speed, the more heat generated by the device. If the heat sink 2 is still unable to load the central processor's heat dissipation, then there is a kind of heat conduction plate. * w + e /, there is a hollow casing la, and the ancient woven 2a, which is also filled with woolen oil, and the supporting member 3a of the shell, is now housed in a branch; among :; The work in the vacuum will be absorbed and exchanged after the central processor is running. The rolling will be emitted upwards, and it will restore the heat to the top of the casing la:? La and far from the bottom, and continue. The structure improvement, especially the structure of the heat conduction plate, quickly improves the whole, so that the computer can increase the density of the thermal processor at a higher temperature when the operation speed is higher, but it will be used as the central processing. In the case of high conditions, the design of the cooling fan is located inside the casing la, and the heat is separated from the heating body by the heat generated by the fluid. The liquid is heated as shown in the first figure. There are four heat sources around the support structure that will be replaced. At birth, the temperature body is exchanged by hair. This is to make the heat conducting plate perform, and its transportation capacity can assist the transportation of the middle device. Generally, as shown, the inner wall corrugated member 3a generates less heat to the casing la, < »

M257478

However, the guide of the above knowledge. _,--* ^ M Ιέ: a) The capillary structure 2 in the V hot plate 10a is only on the wall, and is not completely combined. 'If there is an empty house, the wind body h Capillary tissue 2a guides the liquid to the shell 1 & bottom: Lu: Day: 'will reduce thermal efficiency and cannot be used to increase temperature and space between them' (b) The conventional heat conductive plate 103 is woven only on its inner wall surface 2a 'prevents the liquid formed after cooling from being absorbed quickly, and reduces the heat exchange efficiency of the heat conducting plate 10a. Capillary set is provided Capillary tissue 2 a

In view of the problems arising from the above-mentioned knowledge, the creator of this case has worked in the industry for many years, and actively researched and improved in the spirit of excellence. This led to the creation of "the heat transfer plate structure improvement" in this creation. [New content] ° One of the objectives of this creation is to provide a structural improvement of the heat transfer plate, which makes the capillary tissue in the heat transfer plate not only be used as a supporting member, but also can be firmly combined on the inner wall surface of the heat transfer plate to improve Capillary tissue absorption speed and time. Another purpose of this creation is to provide an improvement in the structure of the heat transfer plate, which can increase the condensation area and the condensation efficiency in the heat transfer plate, so that the hot gas generated by the heat source after heat exchange can be quickly cooled into a liquid. Another purpose of this creation is to provide an improved structure of the heat transfer plate, which allows the cooled liquid in the heat transfer plate to quickly absorb and conduct to the bottom surface of the heat transfer plate in a capillary manner, thereby increasing the amount of vapor phase change of the heat transfer plate. Speeding up ', thus improving the heat dissipation efficiency of the entire heat conducting plate. One feature of this creation is that the heat transfer plate has a hollow shell,

M257478 IV. Creation instructions (3) The surface of the upper and lower sintered members of the body, the surface of the building and the upper fluid of the shell will increase the heating gas, and each of the additional capillary tissue shells and the top shell that support this creation And the top shell counterparts, and the body is thermally treated 'and the support members of the page are heat exchanged [the embodiment is related to the present, but the restrictions are made on the wall surface directly provided to support the lower surface of the shell The capillary group of the grooves of the shell after the support member is exchanged is provided with continuous grooves, a plurality of support members and a porous capillary. Organize the body and use the grooved moon dagger for more stable joints for heat exchange, and the grooves on the part are quickly and coldly absorbed in the shell. The shell is set by the bottom shell member on the bottom shell and the horizontal The position of the coupler can be set at the corresponding position, and the formed hot gas is cooled from the opening into a liquid, and then weaves it quickly to absorb and transfer it. In this way, it can be set to make the branches together, and after the heat exchange, after cooling, it is conducted to the shell and the top shell constructed by the top shell, and the groove is continued, and there is a small amount of gold with openings. From above, the bottom surface of the liquid formed by the supporting member is supported by powder and the like. In order to make the bottom and bottom shell sintered, the shell to the top shell is combined with the detailed description and technical content of continuous creation. The accompanying drawings, such as the drawings, are provided for reference and explanation only. Person 0 This creation is a kind of "heat-conducting plate structure improvement", please refer to the second and third figures. 'In this embodiment, the heat-conducting plate 10 is used on the central processing unit 20 to perform the processing on the central processing unit 20. Heat exchange heat dissipation; wherein the heat conduction

Page 7 M257478 IV. Creation instructions (4) The plate 10 has a hollow shell 1, which is composed of a bottom shell 丨 and a top shell 12 'and is disposed on the inner surfaces of the bottom shell 11 and the top shell 12 The horizontal continuous grooves 111 and 121 are separately provided, and a small amount of metal sintered matter can be provided at the positions of the bottom case 11 and the top case 12 corresponding to the central processing unit 20.

^ In addition, the heat conducting plate 10 is provided with a plurality of supporting members 2 each of which is uniformly distributed in accordance with the size and shape of the inside of the housing 1; in the embodiment described in this creation, these supporting members 2 are Radial diffusion arrangement, and the f-branch member 2 is formed in the shell 1 by powder sintering, so that each support, the surface of the member 2 is formed with a porous capillary structure, and the support members 2 An opening 21 is enclosed at a position corresponding to the central processing unit 20, so that the heat generated after heat exchange in the casing 丨 can be radiated upward from the opening 21 to the top casing 12.

As shown in Figures 4, 5, and 6 of the Mingshen makeup, in this creation, each supporting structure is ordered 2: the way of knotting is directly formed in the shell 1, because the bottom of the shell and the top shell 12 Grooves ⑴ and 娃 # are formed on the wall, so that when the supporting members 2 are sintered in the housing 1, each branch is known by the use of the grooves 111, 121 and the bottom shell 11 and the top shell. 12 Separate inscriptions S make the support members 2 and the housing 1 closely fit together for a long time, and are provided with 4U2. It can be more sintered in the housing 1 β, and in the housing 1 20 as shown in the figure. When the heat transfer plate 10 is used in the center, and the systems are placed on the upper surface of the central processing unit 20, In addition, the opening 2 1 sighed in the poor road corresponds to the central processing unit 2 丨 An aluminum extruded heat sink 3 junction M257478 is installed above the heat transfer plate 10 IV. Creation instructions (5) Cooling fan. The generated heat source will be radiated through the holes 2 1 generated after heat exchange. 'Because there is a heat sink 3 above the guide, the upwardly radiated gas will be absorbed by the liquid, and the liquid will be absorbed by the capillary tissue formed by the top shell as a fluid. When the heat conduction plate 10 with the center is continuously used for heat dissipation, when the central processing unit 20 carries heat exchange with the working fluid in the heat conduction plate 10, the heat will be heated along the heat provided by each support member 2. The top of the board 10 is far away from the central processing unit 20, and the temperature at the top surface of the heat conducting board 10 will be lower, while the grooves 12 of the top shell 12 are cooled to a liquid, and the grooves of the wall surface 12 1 2 1 is shaped by each supporting member 2 and then transferred to the bottom case 丨 丨 of the housing 1 so that the processor 20 After exchanging the above structure, we can know the advantages of this invention: (a) In this work, the capillary structure in the heat conductive plate 10 can be used as the support 2 and can be firmly combined with the heat conductive plate 10. (B) In this creation, continuous grooves 1 2 1 are provided on the inner wall surface of the top shell 12 of the heat conductive plate 10, so the condensation area and the surface area can be increased. Condensing efficiency, so that the hot gas generated after the heat source is replaced by the heat source can be quickly cooled into a liquid. (C) In this creation, the cooled liquid in the heat transfer plate 10 can be quickly absorbed and conducted to the heat conduction in a capillary manner. The bottom surface of the plate 10 increases the amount of vapor phase change of the heat transfer plate 10 and increases the speed, thereby improving the heat dissipation efficiency of the entire heat transfer plate. In summary, the "guided structure disclosed above, "Achieving the improvement of the structure of the hot plate" can indeed be borrowed. And before this creation application

Page 9 M257478 IV. Creative Instructions (6) It has not been seen in publications or used publicly. It has already met the requirements for novelty and progress of new patents. However, the figures and descriptions disclosed above are only examples of this creation, and are not intended to limit the examples of this creation. Anyone who is familiar with the technique, based on the characteristics of this creation, does other things. Equivalent changes or modifications should be covered by the scope of patent application in the following case.

Page 10 M257478 Brief description of the drawings [Simplified description of the drawings] The first picture is a sectional view of a conventional heat-conducting plate. The second picture is an exploded view of the three-dimensional appearance of the heat transfer plate. The second picture is an exploded view of the cross section of the heat transfer plate. The fourth figure is a combined sectional view of the original heat transfer plate. The fifth diagram is an enlarged schematic diagram of the fourth diagram A. The sixth figure is the combined appearance of the heat transfer plate. The seventh figure is a cross-sectional view of the use of the heat transfer plate of this creation. The representative symbol of the component] < conventional > heat transfer plate 10a housing 1 a capillary structure 2a support member 3a < this creation > heat transfer plate 10 housing 1 Bottom case 11 Top case 12 Continuous groove 111, 121 Support member 2 Opening hole 21 Central processing unit 20 Radiator 3 Ο

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Claims (1)

M257478 V. Application for Patent Scope 1. An improvement of the structure of the heat-conducting plate, which has a hollow shell, with horizontal continuous grooves at the upper and lower inner surfaces of the shell, and a plurality of supporting members. The grooves provided in the casing 'and the lower inner surface of the casing ^' are respectively embedded together, so that a porous capillary structure is formed on the surface of the supporting member. 2. The heat-conducting plate structure is improved according to item 1 of the scope of patent application, wherein the shell is composed of a bottom shell and a top shell. 3. The heat-conducting plate structure improvement as described in item 2 of the scope of the patent application, wherein the bottom case and the top case have trace amounts of metal sintered material at positions corresponding to the central processing unit. 4. The structure of the heat conducting plate is improved as described in item 1 of the scope of the patent application, wherein the supporting members are radially diffused and arranged inside the casing. 5. The structural improvement of the heat conducting plate as described in item 1 of the scope of patent application, wherein the supporting members are fixed in the shell by powder sintering, and are tightly combined with the inner wall surface of the shell. 6. The structural improvement of the heat conducting plate as described in item 1 of the scope of patent application, wherein an opening is formed at a position corresponding to the central processing unit of the supporting members. Page 12