TWI617783B - Vapor chamber - Google Patents

Abstract

A temperature-equalizing plate includes an upper plate and a lower plate. The lower plate is sealed with the corresponding upper plate, and forms a chamber together with the upper plate, and the chamber is filled with a working medium. The upper plate has a first surface facing the cavity, and a microstructure is formed on part of the first surface, and the lower plate has a second surface facing the cavity. A net-like capillary structure is interposed between the first surface and the second surface.

Description

Temperature plate

The invention relates to a heat dissipation device, in particular to a temperature equalizing plate.

Vapor chamber is a kind of heat dissipation device. Its working principle is similar to that of heat pipe. The difference is that the heat conduction of the heat pipe is the transmission in the one-dimensional direction, and the temperature even plate is the transmission in the two-dimensional direction. The temperature equalizing plate is mainly composed of an upper plate, a lower plate and a chamber. When the lower plate is in contact with a heat source such as a heat-generating electronic component, the working medium in the chamber will be converted from liquid to gas and move toward the upper plate. Finally, the heat energy is transferred through the upper plate or the heat dissipation device on the outside such as fins. At this time, the working medium will be converted back to the liquid and returned to the lower plate for the next cycle.

However, because the chamber in the temperature equalization plate is a three-dimensional space, how to make the working medium be stably converted into liquid and gas, be smoothly guided to the upper plate, spread evenly around, and finally return to the bottom The indirectly heated area of the board has always been the goal that the R & D personnel have to solve and achieve.

In order to achieve the above objectives, the present invention provides a temperature-equalizing plate including an upper plate; and a lower plate, the lower plate is sealed to the upper plate, and forms a chamber with the upper plate, the chamber is filled with a working medium; , The upper plate has a first surface facing the cavity, and A microstructure is formed on the divided first surface, the lower plate has a second surface facing the cavity, and a mesh capillary structure is interposed between the first surface and the second surface, while in the vertical direction, the microstructure The distribution range of, covers the network capillary structure or partially overlaps with the network capillary structure.

In another embodiment of the present invention, the lower plate has a capillary structure formed on the second surface, or a capillary structure is provided between the second surface and the mesh capillary structure.

In an embodiment of the invention, the network capillary structure is sandwiched between the microstructure and the second surface.

In an embodiment of the invention, the mesh capillary structure is a metal braided mesh.

In an embodiment of the present invention, the lower plate has a heat receiving area, and the direct heat receiving area may be in thermal contact with a heat source.

In an embodiment of the invention, in the vertical direction, the mesh capillary structure corresponds to the directly heated area, the mesh capillary structure covers the directly heated area, or the mesh capillary structure is located in the directly heated area.

In an embodiment of the present invention, the upper plate includes a first sealing surface, and the lower plate includes a second sealing surface, the first sealing surface and the second sealing surface are correspondingly disposed, wherein the first sealing surface includes a The solder groove, and the solder groove and the microstructure are formed together by etching.

In an embodiment of the invention, the upper plate includes a first sealing surface, and the lower plate includes a second sealing surface, the first sealing surface and the second sealing surface are correspondingly disposed, wherein the second sealing surface includes a The solder groove, and the solder groove and the capillary structure are formed together by etching.

In an embodiment of the invention, the lower plate further includes an outwardly extending boss.

1‧‧‧average temperature plate

11‧‧‧Upboard

111‧‧‧ First surface

111A‧‧‧Microstructure

112‧‧‧The first sealing surface

113‧‧‧Solder bath

12‧‧‧Lower plate

12A‧‧‧Directly heated area

12B‧‧‧Indirect heated area

121‧‧‧Second surface

121A‧‧‧Capillary structure

122‧‧‧Second sealing surface

123‧‧‧ solder bath

124‧‧‧Boss

13‧‧‧ chamber

14‧‧‧Net capillary structure

15‧‧‧heat source

2‧‧‧average temperature plate

21‧‧‧Upboard

211‧‧‧ First surface

211A‧‧‧Microstructure

212‧‧‧The first sealing surface

213‧‧‧Solder bath

22‧‧‧Lower plate

22A‧‧‧Directly heated area

22B‧‧‧Indirect heated area

221‧‧‧Second surface

221A‧‧‧Capillary structure

222‧‧‧Second sealing surface

223‧‧‧Solder bath

224‧‧‧Boss

23‧‧‧ chamber

24‧‧‧Net capillary structure

25‧‧‧heat source

FIG. 1A is a three-dimensional schematic diagram of the temperature equalizing plate provided by the first embodiment of the present invention.

FIG. 1B is a schematic cross-sectional view of the temperature equalizing plate taken along the section line 1B-1B in FIG. 1A.

FIG. 1C is a three-dimensional exploded schematic view of the temperature equalizing plate provided by the first embodiment of the present invention.

FIG. 1D is a schematic diagram of the relative position between the temperature equalizing plate and the heat source provided by the first embodiment of the present invention.

FIG. 1E is a schematic cross-sectional view of the temperature equalizing plate provided by the first embodiment of the present invention when a solder groove is provided on an upper plate or a lower plate.

FIG. 1F is a schematic cross-sectional view of the temperature equalizing plate provided by the first embodiment of the present invention, where the lower plate includes a boss.

FIG. 2A is a three-dimensional schematic diagram of the temperature equalizing plate provided by the second embodiment of the present invention.

Figure 2B is a schematic cross-sectional view of the temperature equalizing plate taken along the section line 2B-2B in Figure 1A.

FIG. 2C is a three-dimensional exploded schematic view of the temperature equalizing plate provided by the second embodiment of the present invention.

FIG. 2D is a schematic diagram of the relative position between the temperature equalizing plate and the heat source provided by the second embodiment of the present invention.

FIG. 2E is a schematic cross-sectional view of the temperature equalizing plate provided by the second embodiment of the present invention when the microstructure and the mesh capillary structure partially overlap.

FIG. 2F is a schematic cross-sectional view of the temperature equalizing plate provided by the second embodiment of the present invention when the microstructure and the mesh capillary structure do not overlap.

FIG. 2G is a schematic cross-sectional view of a temperature equalizing plate provided in a second embodiment of the present invention when a solder groove is provided on an upper plate or a lower plate.

FIG. 2H is a schematic cross-sectional view of the temperature equalizing plate provided by the second embodiment of the present invention when the lower plate includes a boss.

According to the first embodiment of the present invention, a temperature equalizing plate 1 is provided. Please refer to FIG. 1A, FIG. 1B, and FIG. 1C at the same time, which are a perspective schematic view, a cross-sectional schematic view, and a perspective exploded schematic view of the temperature equalizing plate 1. The temperature equalizing plate 1 includes an upper plate 11 and a lower plate 12, wherein the lower plate 12 is sealed to the upper plate 11 and forms a chamber 13 together with the upper plate 11, the chamber 13 is filled with working medium (in the figure Not shown). The upper plate 11 has a first surface 111 facing the cavity 13, and a microstructure 111A is formed on part of the first surface 111; the lower plate has a second surface 121 facing the cavity 13. The temperature equalizing plate 1 provided in this embodiment is located between the first surface 111 of the upper plate 11 and the second surface 121 of the lower plate 12, and a net-shaped capillary structure 14 is interposed therebetween. The net-shaped capillary structure 14 may be A metal braided mesh or other mesh structure.

The lower plate 12 of the temperature equalizing plate 1 may choose to directly form a capillary structure 121A on the second surface 121 or provide an additional layer of capillary structure 121A. The capillary structure 121A is located between the second surface 121 and the mesh-shaped capillary structure 14, and its main function is to allow the working medium to accumulate to perform liquid-gas conversion, and also by the mesh-shaped capillary structure 14 The contact of the gas allows the gaseous working medium to be transferred (upward) to the mesh capillary structure 14 later.

In addition, this embodiment chooses to interpose metal braided mesh etc. after many tests The reasons for the mesh-like capillary structure 14 include: (1) It is possible to prepare a metal braided mesh of appropriate specifications in advance and place it in a temperature equalizing plate, the manufacturing process is simple; (2) the pore diameter or gap of the capillary can be accurately controlled And the height, compared with sintering or other processes, is more predictable and less likely to fail; (3) The mesh-like capillary structure 14 can be fixed by the microstructure 111A of the upper plate 11 or the capillary structure 121A of the lower plate 12 to avoid Position or offset.

As shown in FIG. 1D, the lower plate 12 of the temperature equalizing plate 1 can be divided into a heat receiving area 12A and a non-direct heat receiving area 12B. The direct heat receiving area 12 is in thermal contact with at least one heat source 15. In the temperature equalizing plate 1 provided in this embodiment, the "direct" heated area 12A means that the area (12A) can be in direct thermal contact with the heat source 15 and therefore includes direct contact with the heat source 15 structurally, or It is the case of indirect contact with the heat source 15 by thermal paste or other media. The temperature equalizing plate 1 provided in this embodiment, when designing the configuration of each internal component, selects the vertical direction so that the mesh-shaped capillary structure 14 corresponds to the directly heated area 12A of the lower plate 12, so that the position can be ensured The working medium (not shown in the figure) directly above the heated area 12A of the lower plate 12 can be smoothly converted into liquid and gas, and after being guided by the mesh capillary structure 14, it is transferred to the direction of the upper plate 11 and converted into The liquid working medium can also be transferred from the upper plate 11 to the lower plate 12 by the guidance of the mesh capillary structure 14.

In this embodiment, the arrangement of the mesh-shaped capillary structure 14 corresponds to the directly heated area 12A. As shown in FIG. 1D, the mesh-shaped capillary structure 14 can be distributed larger than the directly heated area 12A, or vertically The direction directly covers the directly heated area 12A; alternatively, the mesh capillary structure 14 can be located directly above the directly heated area 12A, and the distribution range of the two is very close or the same; or, it can also be selected in the vertical direction , Only part of the mesh-like capillary structure 14 is located in the directly heated area 12A, that is, the two only partially overlap; or, you can choose to let the straight The heat receiving area 12A has a larger distribution range than the net-shaped capillary structure 14, that is, in the vertical direction, the net-shaped capillary structure 14 is located in the directly heated area 12A. The above-mentioned distribution range and size between the mesh-shaped capillary structure 14 and the direct heat receiving layer 12A can be adjusted according to product characteristics, specifications or customer needs, and this embodiment is not limited. In addition, the mesh-like capillary structure 14 is also responsible for transferring the liquid working medium located on the upper plate 11 back to the directly heated area 12A of the lower plate 12.

In addition, the temperature equalizing plate 1 provided in this embodiment is formed on the first surface 111 of the upper plate 11 facing the chamber 13, and a microstructure 111A is partially formed. Therefore, when the gaseous working medium passes through or passes through the mesh When the capillary structure 14 is transferred to the microstructure 111A, it can spread evenly around the net-like capillary structure 14, and then by the structural characteristics of the microstructure 111A, the liquid working medium can be accumulated to a certain extent. Drip down to the lower plate 12 for the next cycle, or be transferred from the upper plate 11 to the lower plate 12 by the guidance of the mesh capillary structure 14. In addition, since the area where the working medium is dropped has been controlled by the design of this embodiment in the non-directly heated area 12B of the lower plate 12, it will not affect the ongoing liquid-gas conversion directly above the heated area 22A. In this embodiment, the meshed capillary structure 14 and the microstructure 111A are designed to allow the gaseous working medium to be guided from the lower plate 12 to the top of the heat source and move upwards compared to the conventional design with only microstructures. Plate 11, so it will not spread around in the chamber 13 during the movement; compared with the conventional design with only a net-like capillary structure, the present invention allows the working medium to reach the upper plate 11 because of Because of the existence of the microstructure 111A, it will spread evenly around, and there will be no defect that the working medium concentrates in some directions.

In the temperature equalizing plate 1 provided in this embodiment, the mesh-shaped capillary structure 14A is sandwiched between the microstructure 111A of the upper plate 11 and the second surface 121 or the capillary structure 121A of the lower plate, wherein the microstructure 111A The distribution range is larger than the distribution range of the mesh capillary structure 14, or, in In the vertical direction, the distribution range of the microstructure 111A covers the network capillary structure 14.

In this embodiment, the upper plate 11 of the temperature equalizing plate 1 is formed with a microstructure 111A on the "partial" first surface 111, and the reason why the first surface 111 is a partial rather than a full-scale is because the microstructure 111A It is composed of multiple uneven structures. The multiple uneven structures can be connected together, or not connected or spaced apart, and at the bend, side wall or joint surface of the upper plate 11, It is also not easy to form the microstructure 111A.

In this embodiment, the microstructure 111A of the first surface 111 of the upper plate 11 can be formed by a common method in the industry, such as etching or grinding, which is not limited in this embodiment. If it is selected to be formed by etching, this embodiment particularly provides another design that saves the temperature equalizing plate 1 process, that is, the solder groove 113 of the upper plate 11 is also formed together with the microstructure 111A during the etching process, and It is easier to learn that the steps for forming the two separately are more simplified. Please refer to FIG. 1E. In the temperature equalizing plate 1 provided in this embodiment, the upper plate 11 includes a first sealing surface 112, and the lower plate 12 includes a second sealing surface 122. The first sealing surface 112 and The second sealing surface 122 is correspondingly disposed, wherein the first sealing surface 112 includes a solder groove 113. In this embodiment, when an etching process is used to form the microstructure 111A on the upper plate 11, the solder groove 113 is also etched at the same time, which simplifies the process and time for manufacturing the temperature equalizing plate 1. In addition, in the temperature equalizing plate 1 provided in this embodiment, the lower plate 12 may also be provided with a solder groove 123 on the second sealing surface 122 and made by an etching process. This is when the lower plate 12 of the temperature equalizing plate 1 chooses to directly form the capillary structure 121A on its second surface 121, and this capillary structure 121A is formed by etching, the capillary structure can be formed simultaneously by the same etching process 121A 及 焊 槽 槽 123. This also simplifies the process and time for manufacturing the temperature equalizing plate 1.

In addition, in the temperature equalizing plate 1 provided in this embodiment, the lower plate 12 can extend outwardly (or downwardly) a boss 124 according to the height of the heat source 15 as shown in FIG. 1F. example When the temperature equalizing plate 1 adopts such a design with a boss 124, the design and composition of the temperature equalizing plate 1 mentioned above will also be adjusted due to changes in height or structure, such as mesh capillary The height of the structure 14 may be increased, and the capillary structure 121A originally distributed in a plane shape may have a stepped shape or a stepped distribution.

According to the second embodiment of the present invention, a temperature equalizing plate 2 is provided. Please refer to FIGS. 2A, 2B, and 2C at the same time, which are a perspective schematic view, a cross-sectional schematic view, and a perspective exploded schematic view of the temperature equalizing plate 2. Compared with the first embodiment, the second embodiment is different in that it provides another configuration change between the microstructure and the net-like capillary structure, so that the temperature equalizing plate can be further reduced in height.

The temperature equalizing plate 2 provided in this embodiment includes an upper plate 21 and a lower plate 22, wherein the lower plate 22 is sealed to the upper plate 21, and forms a cavity 23 with the upper plate 21, and the cavity 23 is filled There is a working medium (not shown). The upper plate 21 has a first surface 211 facing the cavity 23, and a microstructure 211A is formed on part of the first surface 211, and the lower plate has a second surface 221 facing the cavity 23. The temperature equalizing plate 2 provided in this embodiment is located between the first surface 211 of the upper plate 21 and the second surface 221 of the lower plate 22, and a mesh-shaped capillary structure 24 is interposed therebetween. The mesh-shaped capillary structure 24 may be A metal braided mesh or other mesh structure.

The lower plate 22 of the temperature equalizing plate 2 may choose to directly form a capillary structure 221A on the second surface 221 or provide an additional layer of capillary structure 221A. The capillary structure 221A is located between the second surface 221 and the mesh-shaped capillary structure 24. Its main function is to allow the working medium to accumulate and perform liquid-gas conversion. The contact of the gas allows the gaseous working medium to be transferred (upward) into the mesh capillary structure 24, or the liquid working medium is also transferred from the upper plate 21 to the lower plate 22 by the guidance of the mesh capillary structure 24. .

In addition, this embodiment chooses to interpose metal braided mesh etc. after many tests The reasons for the mesh-like capillary structure 24 include: (1) The metal braided mesh of appropriate specifications can be prepared in advance and placed in the temperature-averaging plate, the manufacturing process is simple; (2) The pore diameter or gap of the capillary can be accurately controlled And the height, compared with sintering or other processes, is more predictable and less likely to fail; (3) The mesh-like capillary structure 24 can be fixed by the microstructure 211A of the upper plate 21 or the capillary structure 221A of the lower plate 22 to avoid Position or offset.

As shown in FIG. 2D, the lower plate 22 of the temperature equalizing plate 2 can be divided into a heat receiving area 22A and a non-direct heat receiving area 22B. The direct heat receiving area 22 is in thermal contact with at least one heat source 25. In the temperature equalizing plate 2 provided in this embodiment, the "direct" heated area 22A means that the area (22A) can be in direct thermal contact with the heat source 25, and therefore includes direct contact with the heat source 25 structurally, or It is the case of indirect contact with the heat source 25 by thermal paste or other medium. When designing the configuration of the internal components of the temperature equalizing plate 2 provided in this embodiment, the capillary structure 24 in the vertical direction can be selected to correspond to the directly heated area 22A of the lower plate 22, so that it can ensure The working medium (not shown in the figure) located directly above the heated area 22A of the lower plate 22 can be smoothly converted into liquid and gas, and after being guided by the mesh capillary structure 24, it is transferred to the direction of the upper plate 21, or The liquid working medium is also transferred from the upper plate 21 to the lower plate 22 by the guidance of the mesh capillary structure 24.

In this embodiment, the arrangement of the mesh capillary structure 24 corresponds to the directly heated area 22A. As shown in FIG. 2D, the distribution range of the mesh capillary structure 24 is larger than that of the directly heated area 22A, or vertical The direction directly covers the directly heated area 22A; alternatively, the mesh capillary structure 24 can be located directly above the directly heated area 22A, and the distribution range of the two is very close or the same; or, it can also be selected in the vertical direction , Only part of the mesh-shaped capillary structure 24 is located in the directly heated area 22A, that is, the two only partially overlap; or, you can choose to make the directly heated area 22A distribution range is larger than the mesh-shaped capillary structure 24, also In the vertical direction, The mesh capillary structure 24 is located in the directly heated area 22A. The above-mentioned distribution range and size between the mesh capillary structure 24 and the direct heat receiving layer 22A can be adjusted according to product characteristics, specifications or customer needs, and this embodiment is not limited.

In addition, when the temperature equalizing plate 2 provided in this embodiment is operated, the gaseous working medium is first transferred to the first surface 211 of the upper plate 21 by or through the mesh capillary structure 24, and then changes direction to the mesh capillary structure Diffusion around 24, at this time, because the mesh-like capillary structure 24 is surrounded by microstructures, the working medium can be evenly dispersed, and then, by the structural characteristics of the microstructure 211A, the liquid working medium After accumulating and reaching a certain level, it drops down to the lower plate 22 for the next cycle, or is transferred from the upper plate 21 to the lower plate 22 by the guidance of the mesh capillary structure 24. In this embodiment, the mesh capillary structure 24 and the microstructure 211A are designed to allow the gaseous working medium to be guided from the lower plate 22 to the top of the heat source and move to the upper plate compared with the conventional design with only microstructures. 21, so it will not spread around in the chamber 23 during the movement. Compared with the conventional design with only a net-like capillary structure, the present invention allows the working medium to reach the upper plate 21 evenly after reaching the upper plate 21 It spreads all around, so that there will not be a lack of concentrated diffusion of the working medium in certain directions.

In the temperature equalizing plate 2 provided in this embodiment, the mesh capillary structure 24 is sandwiched between the upper plate 21 and the lower plate 22, wherein the distribution range of the microstructure 211A is the distribution range of the mesh capillary structure 24, The arrangement in the vertical direction is close to complementary, so that the overall thickness of the temperature equalizing plate 2 can be reduced, or the first surface 211 where the microstructure 211A is not formed can also be used to fix the net-like capillary structure 24. The temperature distribution plate 2 provided in this embodiment has a distribution range of the microstructures 211A as shown in FIG. 2B, which is completely complementary to the mesh capillary structure 24, and the boundary between the two is very close, or, in this embodiment Alternatively, as shown in FIG. 2E, the division of the microstructure 211A can be selected The distribution range, in the vertical direction, partially overlaps with the mesh capillary structure 24, that is, the two are still partially connected, and this design also allows the microstructure 211A to be used to fix the mesh capillary structure 24; Alternatively, in this embodiment, as shown in FIG. 2F, the distribution range of the microstructure 211A may be selected so that there is no overlap with the mesh capillary structure 24 in the vertical direction, that is, there is a certain distance between the two without Connection, and this design allows the working medium to be further away from the heat source, or closer to the sealing of the upper plate 21 and the lower plate 22, only accumulates at the microstructure 211A and drops down to the lower plate 22 . Since the working medium dripping area has been controlled by the design of this embodiment in the indirect heat receiving area 22B of the lower plate 22, it will not affect the ongoing liquid-gas conversion directly above the heat receiving area 22A. The above three setting methods can be selected according to the situation or product requirements, and this embodiment is not limited. Because the overlap between the microstructure 211A and the mesh capillary structure 24 provided in this embodiment has been reduced or even not, there is an opportunity for the temperature equalizing plate to reduce the overall height.

In this embodiment, the upper plate 21 of the temperature equalizing plate 2 is formed with a microstructure 211A on the "partial" first surface 211. The reason why the first surface 211 is partially but not entirely is because the microstructure 211A is It is composed of multiple uneven structures. The multiple uneven structures can be connected together, unconnected or separated, and at the bend, side wall or joint surface of the upper plate 21, also It is not easy to form microstructures.

In this embodiment, the microstructure 211A of the first surface 211 of the upper plate 21 can be formed by a common method in the industry, such as etching or grinding, which is not limited in this embodiment. If it is selected to be formed by etching, this embodiment particularly provides another process-saving design, that is, the solder groove 213 of the upper plate 21 is also formed together with the microstructure 211A in the etching process, saving the production of a temperature-averaged plate 2 steps. Please refer to Figure 2G, the temperature equalization board provided in this embodiment In 2, the upper plate 21 includes a first sealing surface 212, and the lower plate 22 includes a second sealing surface 222. The first sealing surface 212 and the second sealing surface 222 are disposed correspondingly, wherein the first sealing surface 212 includes a solder bath 213. In this embodiment, when an etching process is used to form the microstructure 211A on the upper plate 21, the solder groove 213 is also etched at the same time, which simplifies the process and time for manufacturing the temperature equalizing plate 2. In addition, in the temperature equalizing plate 2 provided in this embodiment, the lower plate 22 may also be provided with a solder groove 223 on the second sealing surface 222 and made by an etching process. For example, when the lower plate 22 of the temperature equalizing plate 2 selects to directly form the capillary structure 221A on the second surface 221, and the capillary structure 221A is formed by etching, the capillary structure 221A can be simultaneously formed by the same etching process和 焊 槽 槽 223. This also simplifies the process and time for manufacturing the temperature equalizing plate 2.

In addition, in the temperature equalizing plate 2 provided in this embodiment, the lower plate 22 can extend outwardly (or downwardly) a boss 224 according to the height of the heat source 25, as shown in FIG. 2H. For example, when the temperature equalizing plate 2 adopts such a design with a boss 224, the design and composition of the temperature equalizing plate 2 mentioned above will also be adjusted due to changes in height or structure, such as mesh The height of the capillary structure 24 may be increased, and the capillary structure 221A originally distributed in a plane will exhibit a stepped shape or a stepped distribution.

2‧‧‧average temperature plate

21‧‧‧Upboard

211‧‧‧ First surface

211A‧‧‧Microstructure

212‧‧‧The first sealing surface

22‧‧‧Lower plate

221‧‧‧Second surface

221A‧‧‧Capillary structure

222‧‧‧Second sealing surface

23‧‧‧ chamber

24‧‧‧Net capillary structure

Claims (9)

A temperature-equalizing plate includes: an upper plate; and a lower plate, the lower plate is sealed to the upper plate, and forms a chamber with the upper plate, the chamber is filled with a working medium; wherein, the upper plate has A first surface faces the cavity, and a microstructure is formed on part of the first surface, the lower plate has a second surface facing the cavity, and between the first surface and the second surface, A mesh-shaped capillary structure is interposed, and in the vertical direction, the distribution range of the microstructure covers the mesh-shaped capillary structure or partially overlaps with the mesh-shaped capillary structure. As in the temperature equalizing plate of claim 1, the lower plate has a capillary structure formed on the second surface, or a capillary structure is provided between the second surface and the mesh capillary structure. As in the temperature-averaging plate of claim 1, the network capillary structure is interposed between the microstructure and the second surface. As in the temperature-averaging plate of claim 1, the mesh-shaped capillary structure is a metal woven mesh. As in the temperature equalizing plate of claim 1, wherein the lower plate has a heat receiving area all the time, the direct heat receiving area may be in thermal contact with a heat source. If the temperature-averaging plate of claim 5, in the vertical direction, the network capillary structure corresponds to the directly heated area, the network capillary structure covers the directly heated area, or the network capillary structure is located in the directly heated area within the area. If the temperature equalizing plate of claim 1, the upper plate includes a first sealing surface, the lower plate It includes a second sealing surface, the first sealing surface is corresponding to the second sealing surface, wherein the first sealing surface includes a solder groove, and the solder groove and the microstructure are by etching Form together. As in the temperature equalizing plate of claim 1, the upper plate includes a first sealing surface, and the lower plate includes a second sealing surface, the first sealing surface and the second sealing surface are disposed correspondingly, wherein the first The two sealing surfaces include a solder groove, and the solder groove and the capillary structure are formed together by etching. As in the temperature equalizing plate of claim 1, the lower plate further includes an outwardly extending boss.