TW584799B - Flat-board loop type micro heat pipe - Google Patents

Abstract

The present invention provides a flat type micro loop heat pipe. The present invention utilizes part areas of two metal sheets enclosing a capillary structure to form a board container capable of forming an evaporating terminal and a condensing terminal communicating with each other via a transmission pipe. The container is filled with working fluid which will have a phase change when being heated, so as to quickly transfer the heat absorbed by the evaporating terminal to the remote condensing terminal for dissipating heat, thereby providing a heat dissipating device with the advantages of loop type heat pipe and flat micro heat pipe. On the other hand, based on different heat source locations of the object to be used, it further arranges thermal layout for the micro heat pipe to achieve flexible utilization in space and effect of eliminating the hot point of heat generating device.

Description

M4799 5. Description of the invention (l) [Scope of application of the invention The present invention has a heat-dissipating effect of a ring-shaped heat-generating device. [Background of the invention The recent leap forward has led to the dissipation of efficiency to operation. It is said that the amount of heat added to the heating or additional fan components is higher. Because the heat is transmitted far, this kind of object is in the Lu block and the heating resistance, plus the extruded heat dissipation die that is in contact with it, so the current Thermal resistance is related to metal block 1 2

: Related, two kinds of heat-dissipating components, especially one suitable for thin, such as flat-panel loop-type micro-circuit heat pipes and flat-type micro-heat pipes, such as notebook computers, to provide more J], the rapid development of sub-industries, various electronics Due to the large function of the product: the heat generation of the bit area is getting higher and higher. In order to keep the environment outside these systems, the method of maintaining the components in the permitted operating temperature is to increase the size of the area and increase the electronic components. The overall dispersal = 3 to the political heat film ^ ^ /, the area of the political heat of the basket, by the iron convection, the forced convection method of six. Iron% π t +… yes ;;, L. _ Forbearance, in recent years, due to the increasing thunder; the size has become more and more deformed. This, that is, the surface temperature caused by the lying shield A hunting aid originally used in space End-to-end communication from ru τ ~ & water subsidy: the exchange of components, such as heat sinks, fans lacking the mainstream heat transfer. Modes have complex ..., the surface of the component and the duct exists' because of heat conduction The general metal heat transfer characteristic is not a special hot-melt sheet that cannot be effectively used. In addition, the cost structure of each unit, unit, unit, unit, and unit is based on the concept of the present invention. The product produced by the wrong person will be cooled by the push wave of the mouth. The module will be subject to heat dissipation, such as rsheng n—with electronic components. "Bull :: Thermal resistance between 12 genus blocks", In addition to the resistance, it affects the heating area heat 584799 V. Description of the invention (2) The resistance value also includes 3 heating electrons ^ 1 Q and contact gold such as ^ ^ ^ ^ ^ Thermal resistance (SPreadering resistanc〇, thermal resistance value is relatively high. The existence of 13 in the body: the force: ic〇: nj increases and must use a larger heat sink, known as a knife, to make up for the heat sink 丨3 Dispersion of resistance thumb It is known from the theory that it is necessary to try to reduce the dispersion: the problem of addition. Through the present invention, the conventional inconvenient resistance can be removed, and the heating electrons can be reduced. The outer surface and gold = heat dissipation Dispersed thermal resistance between the electronic component 10 and the heat sink 13. The ghost 12 and the purpose and summary of the invention f The purpose of the creation is to reveal a technology for the flat-type thermal layout.心 Heart elements of the characteristics of heat transfer heat pipes and flat micro heat pipes: It is mainly based on the principle of micro heat pipes. According to the distribution state and shape of the heat source in the sealed container, the flat ends and the one-way heat that connects the two zones mentioned above are created by this integrated means. ， The advantages of the flat-type micro-heat pipe are scattered pieces, the loop-type heat pipe and the heat source provide the role of heat dissipation, and ==== for more than one large heat-dissipating plane, it can be quickly dispersed evenly as much as possible. Depending on the size of the condensing end,

Better space utilization. The main foot of the present invention is an integrated loop-type heat pipe with 管 k and 疋 k for better heat dissipation effect; 5 P-bows and Tomita Cheng handle 彳% road-type micro heat pipes. , Shuanghe, and the space-operated dry-pull type of work. The plate group has different condensing ends, which form a number of plates. The end area is used as a supplement and then the plate shape. In other words, the suction tube flows to the cold of the structure, and it can have the characteristics of the flat body and the hair with the inner part exposed, the steam transported with different areas and grooves, and the plate-shaped domain. One of the plate-assisted liquids meets the thermal energy container. The bulk process is the condensation end of the heat source element. The condensate is transported to the heat source loop-type heat and vaporized. Therefore, the plate-shaped container, the upper and lower areas of each container: the evaporation end, According to the heat source area, the surface of the chip is formed on the surface of the upper plate, and the sample is proofed in close contact. Outside the cold upper plate, and inside the fine structure. The working fluid is filled to transfer thermal energy. The liquid working fluid is continuously transported by capillary loops and recirculated by the present invention. The heat transfer distance is long and the plates are not plate loop type micro heat pipes. They are composed of a fine structure. Among them, the plate-shaped closed space area delivery pipe and the condensate delivery pipe having vacuum properties are shaped according to the shape. In the area of the evaporation end, the heat source element of the lower plate contacts to transfer heat; to support the upper plate and the auxiliary capillary knot can be based on the shape of the heat source and a number of surface grooves, in addition to supporting the working fluid to the adjacent bottom end of the wool The heat transfer medium that generates phase change, that is, the heat generated by this fluid that changes phase through the pores existing in the capillary structure, the liquid vaporizes on the wall of the condensing end to condense, and then flows back to the hair end. And the purpose of component heat dissipation.

Pipe (Loop Heat Pipe; LHP vapor and condensed liquid working fluids have a higher heat transfer capacity than the South;

V. Description of the invention (4) The number of sources increases, while the difference between cold and traditional comparisons is that the use of the overall space is more ^ The feature is that the number of evaporation ends can be increased or reduced according to demand, This is the advantage of integrating it all into a plate-shaped container. Further progress: In order to make the review committee understand and approve the present invention in detail, we will make a detailed explanation in accordance with the detailed content and technology of the drawings, such as [the metal example of the implementation of the invention by the creator] If the flat plate is used to form a closed metal plate in the closed container and the connected evaporation end plate type closed metal flat plate, and in a suitable area, the conditional configuration is in the thousand plate area. The efficiency will also be flat here. In order to determine the steaming area, it belongs to the gold installation. The larger the single land is, the closer the plate is, the denser the end is, and the above is the simple origin. It belongs to the space of pure gold. Second, the area of the condensing container can be as simple as it is, and the area of the area is better. The principle area of the source area is the single-ended and inner volume of the source area. Therefore, only the heat transfer is planned. Of course, if the volume becomes larger, the specific 'use of flat sheet cloth to the heat leaflet to heat'. In addition to this, the condensation circuit is based on the heat. The air is scattered to implement the two ends of the source other than the closed circuit of the closed loop and the shape of the loop. The close container can be constructed with an example of the thermal area, and the steam planning and layout of the remaining area of the volume Simply depending on the actual permission, it will be relatively cool for Lu Xiongming to dissipate heat from the flat-plate type heat source components, such as circuit boards, according to the present invention. First, as shown in the "loop-type micro heat pipe 20 in Figure 2", "High power density electronic components" shows that the present invention has a single-

584799

Not shown in the loop) The plate-shaped pieces 23 are like copper, 50, condensed electrons, and after steaming, the steam evaporates and starts at 30 and the flow channel; Or, an example of a heat band, which is in close contact with the capillary tube container 21, and the gold end 40 of the group or inscription and the cold part are placed at the end 30, and the delivery pipe 50 is opened to the condensation end 40, and the condensation end 40 is effective, and Cold is condensing away. Contains structure 34, composed of two pieces, the material of which belongs to the condensate. The condensate is transported to the evaporation end 40, which can be connected to the steam end 40. As a condensed end, 40 end 40 can be placed in a plate-shaped container. The metal plate is heated in addition to the 60-shaped end 30 of the steam delivery tube, which is based on the heat source originating end 30 and the flow channel. The area where the cold working fluid needs to be placed is when the fan works, Figure 4, and the upper plate. 22 The higher the transmission coefficient is, the end is 30, and the steam forms a loop. The surface is condensed at 40 with the number of phase components, and it is used as a condensate delivery pipe. 60 After the condensation, it flows to a number of fins, which can be cooled according to the heat dissipation requirements. It is better to force the hot fluid (Figure J) ° with the lower plate. For example, in the conveying pipe, the heating contact is passed; the work flow is also connected to the evaporation end 30, which is used to increase and become larger or convection. When the flat loop micro-heat pipe 20 a of the present invention is used as a pen. The heat dissipation of a personal computer, the flow path of the heat pipe (Thermal Uy) can be determined according to the existing circuit board layout (Circuit Layout). ut 'for example, there are many electrons that generate heat In the case of "7th ^", it is not the case with two heat sources. At this time, it must include two. Among them, the evaporation end 30a, the steam delivery pipe 50a, the condensation end 40a and the cold The reduced-pressure conveying pipe 60a forms a loop, and the evaporation end 30b, the steam conveying pipe fb, the condensing end 40a, and the condensate conveying pipe 60b form another loop. Road to the tropical heat generated by different heat sources, reaching

Page 8 584799 V. Description of the invention (6): J heat: of course, of course, there can also be set up a '-bad road' with two unique and condensing ends-the relationship of the-pair-relationship It can be the many-to-many relationship of the previous condensing end, or the many-to-many relationship of the two evaporation end pairs mentioned above, and it is not limited to the circuit board design and the required between the terminal and the condensing end. Actually ^ as early as a loop, but can have great flexibility. First, π ..., depending on the needs of the situation, there is quite another 'When the circuit board has a protrusion such as a gap 2 5 to avoid π too much * If the I components need to be avoided, the central area of 2la幵 〇 Dog-like components, or when the whole plate is described to reduce the weight of the whole-... any pipeline, you can open a slot 24 to the effect of iL II: to achieve the flexible container 2ia space The unofficial road space that makes the diffuser can also be used for heat dissipation. It will preheat it: Electricity: Yuan: It does not form a conventional heat sink. So: The f tube has been integrated into the upper and lower plates. 22, 23 inside, with metal secrets! 〇 4 heat dissipation module, reduce the characteristics of the heat pipe 11 in the "Figure 1". ▲ The contact thermal resistance between t has the advantages of easy assembly and single structure, that is, the overall efficiency in the present invention still has the current rate of the heat pipe, because the j property is equivalent to dozens of times higher than that of the general metal chain material. The heat generated by 70 pieces of 50 heat transfer tubes can be quickly transmitted to the condensing end and discharged through the steam conveying tube 50.疋 In addition, the workflow system is a thermal medium filled inside the plate-shaped passenger cry 21 "'and the pressure difference in the plate-shaped container 21 = ;, the flow system is

584799 V. Description of the invention (7) The material is easy to produce phase change when the temperature changes, and condensed to form a liquid state, such as pure water shells. ^ The choice of the material that forms steam when heated depends on the working fluid being too methanol or propane. Material, its latent heat absorption is large, and its compatibility with the phase and liquid phase into a vapor phase 44 (that is, can not afford chemical change :: with capillary structure 34, the filling amount depends on the plate-shaped container 21 The inside is filled with wool structure; flow, filled working fluid, evaporation end 30 and heart gas wheel :; 2 4G liquid condensing end of all pores and condensate transport condensate on the inner wall of the ㈣. 2 "body and pound structure 3 :," It is placed in the evaporation end 30, the condensing end 40 and the condensate delivery officer 60, and the inner surface of one side of the 柘 μ w / bu Jing tablet 23 is in contact with each other to transfer the liquid working fluid. Generally speaking, Wool 钿 纴 铷 search for 铷. The capillary structures 34 and 44 can be roughly selected from porous material structures such as copper metal mesh, a plurality of grooves or sintered metal powder.-This flat plate type loop micro heat pipe The cross-sectional structure of the evaporation end 3 of 20 is as shown in "Figure 3". The structure of the hair end 30 is a plate-shaped container 31 composed of two metal copper plates stamped and formed, upper and lower plates 32, 33 and a metal mesh capillary structure 34. The upper plate 32 has an outer surface that is concave downward. The design of the groove 320 is to contact the capillary structure 34 as a structural support to increase the mechanical strength of the upper plate 32 and form a steam flow channel with the capillary structure 34. The lower plate 33 is stamped into several pieces The groove is used as an auxiliary flow channel 3 3 0 to assist the liquid working fluid to flow, and a plurality of protruding areas are formed on the surface of the lower plate 3 3 to contact the heat source element to transfer heat. The inner wall of the plates 32, 33 is covered with a layer of capillary structure 34, and the surface of the capillary structure 34 can just be in close contact with the end face of the groove 32 0 of the upper plate 32 and the lower plate 33 page 10 584799 5. Description of the invention (8) The upper plate 3 2 has a condensing end at the outlet of the steam during the vaporization of the fluid 40. There is an opening at the upper end of the working flow for returning flow, and the lower plate 3 3 has a hole for the inlet of the body (see " Figures 5 and 6 "and the structure is very different At the warm steam end, the liquid state of the two plates remains unchanged. On the other side, the condensate produced by the structure 43 flows back to 60, and there is an outlet. There is also a flat plate in the present invention. 2 The fine structure 44 formed after the condensation, and the additional pieces 4 2, 4 and 3 are suitable for the working fluid to flow out of the cold working fluid inlet and outlet. The steam state and the cold are respectively shown in "Figure 5 South temperature vaporization working stream end 4 0 After condensing, the evaporation end 30 is used to prevent the vapor state and the evaporation end 30 from entering the seeding block 61, which is composed of wool, but the flow resistance of the remaining nozzles. Plate-shaped container 2 1 Internal-shaped micro heat pipe 20 It The cross-sectional structure of the condensing end 40 is similar to that of the evaporating end 30. Compared with the groove 420, it can be used as a high-level working fluid to flow to the lower plate 43 and the heat transfer area of the upper plate 42 at the bottom. These capillary structures 44 help to condense the delivery pipe 60, while the high-temperature steam and condensation maintain the same structural loop type as the evaporation end 30. The condensate on the outer surface is added to the condensate during the condensation. The cold fine structure at the working stream passes through the condensing cycle, but only the flat surface of the inner surface of the working fluid is conveyed. The returning condensate is conveyed to the entire layer. The slippery steam tube 60 is shown in the figure. Therefore, the capillary condensate in the delivery pipe 60 is full of condensate capillary delivery pipe, and the capillary condensate in the evaporation vapor conveying section is close to the cold interior. Then, the evaporation end 30, the steam conveying pipe 50, and the cooling pipe 60 are reduced respectively.

Page 11 584799 Description of the invention (9) The minus end 40 and the condensate delivery pipe 60 are assembled and then welded together to form a prototype structure of a flat loop type micro-heat pipe 200. However, in order to ensure that the bursting end 30 during the initial heating period does not cause dry out due to the lack of working fluid, the filling hole (not shown) is placed near the evaporation end 30, and is evacuated and filled. After an appropriate amount of working fluid is welded and sealed, a flat plate loop type micro heat pipe 20 can be manufactured. The above-mentioned flat-plate loop-type micro heat pipe 20 has the advantages of = there is no mutual use between the evil working fluid and the liquid working fluid, and a large heat transfer wheel capacity can be obtained. In order to be able to understand more clearly ^: 1 The working principle of the present invention, 4: month ... Therefore, we go further-extensively describe the 33 plates under the amount of hair; type loop type micro heat pipe 20 in the steamer as the fluid; : And: And: the plate pressure will follow the steam conveying pipe 50 flow of the steam state of the working fluid, the pressure will be lower than the condensing end 40. When it is a liquid working fluid and the inner wall plate is cold, it will be condensed due to heat release. The capillary pressure on the inner wall of the condensing end 40 and the gravity structure 44 on the inner wall of the condensed liquid 44 flow to the bottom end, collect to the capillary, and transport $ 6 through the condensate. You will realize that the regional capillary pressure difference is 30 '. The working fluid may have a lower internal capillary pressure than the starting end. Endless cycle to achieve the purpose of transferring heat

According to thermal management theory, Feng "W (2 σ / 〇, σ is the working fluid: the maximum capillary pressure provided by f is the surface tension of the body, rc is the capillary structure of the

Page 12 ^ 84799, description of the invention (10) j radius, taking the metal mesh capillary structure as an example, rc is equal to the metal mesh wire diameter and line-half of t ', so long as the maximum capillary pressure difference is greater than when the working fluid is circulated = the flow pressure Loss, liquid flow pressure loss and gravity pressure loss (ie = ΔΡ 即 + ΔΡι + APg), the heat pipe can operate at any angle, and because the working fluid injection in the valley shape 2 1 is under vacuum and is dense Therefore, the working fluid in the plate-shaped container 21 is in a saturated state of vapor-liquid equilibrium. = The uppermost layer of the capillary structure at 30 ° at the evaporation end of the moon towel is just down. = The 320 side is in contact with the side. 'When the heat pipe is operating, the liquid workflow system flows in the channels that communicate with the morning layer of hole 2' and in the capillary structure. 34 surface wins 2 3 = ★. The capillary pressure is determined by the pore size of the surface layer of the capillary structure 34 = 疋. Therefore, when the surface pores of the capillary structure 34 are small, increasing the capillary pressure flow structure 34 will increase the pore size of the liquid working fluid. Coupled with the flow of steam and liquid each other ::: mutual contact, @this steam and the condensing working fluid are low " "and 'this can improve the heat transfer capacity.' The absorption and release of the evaporation end 30 and the cold end 1 of 40 of the flat-type loop type micro heat pipe 20 are in a two-dimensional ^ ^ approximate isothermal mode :, may ;: or the condensation end 4 ° is at the maximum effect. , And this η :: or latent heat film is used, so its heat conduction coefficient is lighter than the commonly used high thermal conductivity when condensing; belong to ==, the current electronic damage, off the plate as a mechanism to enhance heat dissipation, 584799

V. Description of the invention (π) However, it is still inferior to the heat pipe. In addition, the mode of the present invention can reduce the thermal resistance of the existing heat pipe heat sink heat dissipation module, which can effectively improve its heat dissipation capacity. Fang Ming, the traditional solution to high-temperature hot spots, not only possesses the electronic components 10 of the thermal resistance and heat generation of the contact surface between the loop type heat pipe high heat transfer block 12 and the heat pipe 11, but also can absorb or release the heat and power of the wafer. Reduce, and reduce the thermal effect, and can be based on the overall heat sink), and the vast surroundings without proofing is enough to make various changes in space. The difference between the formulas is that through the advantages of the present invention, and can reduce the conductive gold, it also has the effect of guiding the local height to the far end. This amount is dispersed quickly in the horizontal direction, so that heat sinks can be added to the remaining components in a timely manner (the area of the heat plate can also assist heat dissipation, which can make the whole plate into a heat plate according to another aspect of the present invention). When in contact, the electronic components of the plate may originally cause the temperature of the hot plate to rise, which will cause the component temperature to rise. It needs to be evaporated and terminated with the heat dissipation device to be cut into a moderately sized board in addition to having a uniform temperature and temperature. The present invention is equivalent to the junction of a large-scale heat sink and a heat pipe. The application of the overall temperature of the heat pipe soaking sheet does not mean that if these components are touched by the present invention, the heat will be heated, and there is no shaped container to increase the current integration of the flat plate. When the heat rises to a certain temperature and other surrounding environmental design, the rapid conductive proofing plate adds heat to make the type heat sink preheat the module and the ring and the evaporation end and the component and temperature, level, However, some components can be sent to the condensing area. The overall heat-condensing end heat pipe is only a little because of the preheating and heat. Only the end, and then by plates environment needs tube, will have at

584799 V. Description of the invention (12) The effect of the heat spreader (Spreader) can reduce the heat source and increase the efficiency of the heat sink at the heat output end, and achieve a better heat dissipation effect, so please make a profit. [Effects of the invention] The flat-type loop type micro-type disclosed in the present invention is · 1 · It can reduce contact thermal resistance and dispersion thermal resistance, and the production bodies do not contact each other during operation, S characteristics; ^ Simultaneously It accepts multiple heat sources and uses the heat dissipation of the plate-shaped container without increasing the cost of the heat-dissipating components. The core of the tube -L ^ youU is determined according to the existing circuit board circuit, and the number of g of the evaporation end can be based on the area of the second. The effect of increasing or shrinking the application according to the needs; and the ten-plate type road-type micro-heating unit that is integrated into the flat place, and has a single structure. With the foregoing, the preferred embodiment reveals the spirit and the second person. Any person who is familiar with this skill can protect the animal 2 and make some changes and retouching. § The attached towel, as defined by the patent scope, has low power density at the wheel-in end. The contact thermal resistance and sub-junction bureau granted the special 2 3 4 heat pipe, and its effect state is in flow with the liquid JL. ^ The rest of the heat transfer can be used as a path (the number of Thermal is determined, and small, the space can be managed. It has the assembly content as above, but it is not inseparable from the present invention, so the person of the present invention shall prevail.

Page 15 584799 Brief description of the drawings [Simplified description of the drawings] Fig. 1 is for the purpose of knowing a kind of heat dissipating module to provide electronic components to dissipate heat. Fig. 2 is a flat loop micro-heat of the present invention. Schematic diagram of the tube; Fig. 3 is a sectional view taken along the line III-III of the evaporation end of the flat-type loop-type micro-heat pipe of "Fig. 2"; Fig. 4 is a flat-type loop-type micro heat of "Fig. 2" Section IV-IV sectional view of the condensing end of the tube; Figure 5 is a sectional view of the steam outlet of the evaporation end of the flat loop microheat pipe of the present invention; Figure 6 is a flat loop microheat pipe of the present invention A cross-sectional view of the condensed liquid outlet at the condensing end; and FIG. 7 is a schematic view of the application of the flat loop microheat pipe of the present invention to multiple heat sources. [Illustration of symbols] 10 ..... electronic components 11 ..... heat pipe 12 ..... metal block 13 ..... heat sink 20, 20a ..... flat loop type Micro heat pipe 2 1, 2 1 a ..... plate-shaped container 22, 22a ..... upper plate 23, 23a ...

584799

Simple illustration on page 17 24 • • • • Slot 25 • • • • • Notch 30 ^ 30a, 30b ..... Evaporating end 31 • • • Plate container 32 • • • Upper plate 320 • • • Groove 33 • • • • • Lower plate 330 • • • Auxiliary runner 34 • • • • Capillary structure 40, 40a ..... Condensing end 41 • • • Plate-shaped container 42 • • • Upper plate Sheet 420 • • • Groove 43 • • • • • Lower plate 430 • • • Auxiliary runner 44 • • • Capillary structure 50 ^ 5 0a, 50b ..... Steam duct 60 > 6 0a, 60b ..... Condensate delivery pipe 61 · • • Stop

Claims (1)

584799 Case No. 8911007 A / February / W 胗 Correction / Correction / Supplementary middle-aged month 丨 Amendment VI. Patent application scope Flat-plate loop type micro heat pipe used for heat dissipation of heat source components 2 3 4 It includes cold shout At the end of the conveying pipeline, the diathermy is returned through the condensate. Such as the application where the formation. If applied, the fluid flow plate-shaped container, and the condensing working fluid, respectively, are produced by heat. The steam wheel is sent to the capillary structure, and sent to the tube, and the evaporation end is used. The patent scope No. loop is a true patent scope No. 1 plate-shaped container, the patent range No. 1 upper plate and the patent range No. 1 upper plate and the patent range No. 1 upper plate and the capillary knot whose definition includes at least There is an evaporation end, a loop connecting a vapor-liquid conveying pipe between the evaporation end and the condensing end; the annular phase change filled inside the plate-shaped container, and the tube absorbed by the evaporation end is transmitted to the condensation And the flat loop-type micro heat pipe described in item 1, which is placed on the evaporation end, the condensation end, and the cold to transfer the working fluid in a liquid state by capillary action. The flat loop-type micro heat pipe according to item 1 is composed of an upper plate and a lower plate that are in close contact with each other. The flat loop-type micro heat pipe according to item 3, and the lower plates are each formed by stamping. The plate-type loop-type microthermal technology plate described in item 3 is tightly welded by means of welding: e, the plate-type plurality of concave portions described in item 3 to assist: ^ imitation cooked s' structure. A little help for the liquid Page 18 2003-i2.〇u ^ 584799 _ Case No. 89linnn7 VI. Scope of patent application Year I 7 8 9 The flat loop type micro-heat pipe as described in item 3 of the patent claim, wherein the upper plate also has a plurality of grooves and the capillary structure ^ to provide support. ^ The flat loop type micro heat pipe as described in item 3 of the scope of patent application, wherein one side of the capillary structure is in contact with the inner surface of the lower plate. The flat loop-type micro heat pipe described in item 1 of the scope of patent application, wherein the relationship between the number of evaporation ends and the number of condensing ends is-to 0. · The flat panel officer described in item 1 of the scope of patent application ' The number of the evaporation ends and the number of the condensation ends are many-to-one. The relationship between the type of loop type micro-heating items is the flat loop type micro-heating tube as described in item i of the patent application range, wherein the relationship between the number of evaporation ends and the number of condensation ends is many-to-many. 23 The flat-plate loop-type micro-thermal official 'described in item 1 of the scope of patent application, which further includes a heat sink provided at the condensation end. 33. The flat-plate loop type micro-heat I 'described in item 1 of the scope of the patent application, wherein the evaporation end and the condensation end further include a plurality of grooves as auxiliary flow channels to assist the flow of the working fluid. 43. The flat-type loop type micro-heat official according to item 1 of the scope of the patent application, wherein the connection between the evaporation end and the condensate delivery pipe further includes a load to prevent the working fluid in the vapor state from flowing back to the condensation. Fluid delivery pipe. 5 · Flat loop micro-heat as described in item 14 of the scope of patent application Page 19 2003.12.01.019 M4799 Into --- Case No. 8911007 'tube for patent application' where the stopper is a capillary structure 6 Capillary is said to be a flat loop micro-heat tube as described in item 1 of the patent application scope, where The connection between the condensing end and the condensate delivery pipe also includes a stopper to prevent the working fluid in the vapor state from flowing to the condensate. 7 8 9 2 〇 2 2 2 4 Delivery pipe & Flat plate loop type micro-heat as described in item 6 " where the stopper is a capillary structure; ring plate, the plate type as described in item 1, 15 or 17; such as Κΐ 官, where the capillary structure is Copper metal mesh. The loop type micro heat pipe is a flat plate type as described in item 5 or 17. If the scope of patent application is the number of grooves. The loop type micro heat pipe is a porous material formed by the flat plate type described in item 15 or 17. The capillary structure is shaped by sintered metal powder »as in the patent application. The scope of the tube, in which the work flow 髀, said flat-type loop-type micro-heat-drying as in the patent application Fanyuan G pure water; and, where the working fluid The flat-plate loop-type micro-heat: as described in patent application C. g, wherein the plate-type loop type micro-heat described in the working fluid 2 is a plate-type heat-dissipating K-ketone. The combination of e and flat micro heat pipe is used to provide a heat dissipation device that has both loop-type heat and airtight plate type. It includes: °, which contains the working fluid used to transfer heat. 2 2 7 8 Ο 6 returns the unidirectional heat from the plate-shaped Rongqin to the second zone to the evaporation end to evaporate to the vapor phase and to condense the evaporation end at the condensing end; and a capillary structure system Equipped with the working fluid in a liquid state, such as the inside of the plate type container in the second patent range, and the inside of the plate type container and the one-way heat transfer circuit in the second patent range. The plate type container is composed of two: if the plate type container in the second patent range is requested, the one-way thermal transfer circuit in the second scope of the patent is required to evaporate at the evaporation end to the end; and a condensate The working fluid in the liquid phase of the wheel is used. • If the condensate delivery pipe system in the second patent scope is requested, and according to the distribution state of the heat source and the shape of the hair end, a condensing end, and the connection path, the one-way heat transfer circuit is used. In order to guide the working fluid in the condensing end, the working fluid in the liquid phase is led back to the plate and transferred back to the 4 items, the 4 items in the vacuum, the 4 items in each product, the 4 items in each product, and 7 items in each other. All simple 4 items include less vapor phase. Tube, return to the flat state of the type container placed in the 9 items. Said Zhiping is the sum of the steam. Shu Zhiping The closely related Zhi Zhiping metal The Zhi Zhiping are:-This work is used to finely evaporate the end of the evaporation end into the capillary end. The plate-type heat sink is composed of a plate-type heat sink and a metal plate. A plate heat sink with a flat area. A plate heat sink, whose steam delivery pipe is used to guide the fluid to the condensation, condensed to 0 at the condensation end, a plate heat sink, which, the condensation end and the cold surface Page 21 〇3 · 12 · 〇ι · 〇21 _i ^ 89n〇〇〇7 ^ Jr \ y ^ Lg-M_- VI. Patent application scope Condensate delivery tube. 3 1 · The flat-plate heat sink according to item 24 of the scope of the patent application, wherein the connection between the evaporation end and the condensate delivery pipe further includes a sowing block to prevent the working fluid from being mixed with steam from flowing back to the condensate. Conveying pipe 0 3 2 · The flat plate heat sink as described in item 31 of the scope of patent application, wherein the supporting block is a capillary structure. 3 3 · The flat plate heat sink according to item 24 of the scope of patent application, wherein the connection between the condensing end and the condensate delivery pipe further includes a stopper 'to prevent the working fluid in the vapor state from flowing to the condensate Conveying pipe 3 4 · If you apply for the special stopper 3 5 · If you apply for the special heat sink 3 6 · If you apply for the special heat sink 3 7 · If you apply for the special heat sink 3 8 · If you apply for the special Wherein the JL # 3 9 · As described in the application of the JL # benefit range of the flat plate type heat sink described in item 33, is a capillary structure. The flat plate according to the item 24, 32 or 34, wherein the capillary structure is a copper metal mesh. The flat plate according to item 24, 32, or 34, wherein the capillary structure is a plurality of grooves. The flat plate according to item 24, 32 or 34, wherein the capillary structure is a material formed by sintering metal powder. = Flat plate type # 埶 as described in item 24 of the range, Ling body is pure water. Government, ..., device = flat-type bulk device described in item 24 of the rail, the fluid is methanol. Huan ... device Page 22 2003.12.01.022 584799 Case No. 8911007 Noon ^ year (v month 丨 amendment 6) Patent application scope 40 · The flat plate heat sink as described in item 24 of the patent application scope, wherein the working fluid is acetone. 23 pages 2003.12.01.023