TWM279915U - Water-cooling heat dissipation mechanism - Google Patents

Water-cooling heat dissipation mechanism Download PDF

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Publication number
TWM279915U
TWM279915U TW94210693U TW94210693U TWM279915U TW M279915 U TWM279915 U TW M279915U TW 94210693 U TW94210693 U TW 94210693U TW 94210693 U TW94210693 U TW 94210693U TW M279915 U TWM279915 U TW M279915U
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TW
Taiwan
Prior art keywords
water
scope
item
cooled
heat
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TW94210693U
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Chinese (zh)
Inventor
Qiang-Fei Duan
Original Assignee
Cooler Master Co Ltd
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Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Priority to TW94210693U priority Critical patent/TWM279915U/en
Publication of TWM279915U publication Critical patent/TWM279915U/en
Priority to DE202006005160U priority patent/DE202006005160U1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Description

/M279915/ M279915

【新型所屬之技術領域】 本創作係有關於一種水冷 在電腦之發熱元件(如:CPU) 式散熱機構,尤指 上之水冷式散熱機 一種應用 構。 【先前技術】 按,現今電腦的運算功能愈來愈強大,且其運管 士迅速提高,❿其整體造形、構造及與主機板連接;:: 疋突破傳統之巢窠,可謂是電腦業界之重大改革, =一代中央處理器挾帶超速的運算功能,也使得中央虎理 斋在處理運异指令時所產生的溫度更高,故如何利用〜 的導熱及散熱系統來使中央處理器在其所允許的溫产^ 常工作,已被業界視為極重要之課題。 又 —是以,即有業者設計出一種水冷式散熱系統,請參照 弟一圖所示,該水冷式散熱系統100a包括有一安裝在中央 處理器2 0 0a上之散熱座10a,於散熱座1〇a之兩端分別設有 出水口101a及入水口 l〇2a,入水口102a上連結有管路1〇3& 至一水幫浦2 0 a的出水口 2 0 1 a處,而散熱座丨〇 a的出水口 l〇la則再連結管路104a至一水冷排3〇a的入水口3〇“,水 冷排30a係可由複數個散熱鰭片3〇3a所構成,該水冷排3〇a 之出水口302a再連接管路3〇4a至一水箱4〇a的入水口 4〇la,水箱4〇a的出水口則再連結管路4〇2&至水幫浦2〇a的 1水口 202a處,以形成一水冷式循環散熱系統1〇〇a。使用 =,由水幫浦20a將冷水輸送至散熱座10a内進行熱交換後 流出熱水,熱水再經由管路丨04a流入於水冷排3〇&内乂進行[Technical field to which the new type belongs] This creation relates to a water-cooled heat-dissipating device (such as a CPU) type heat dissipation mechanism in a computer, especially an application structure of the water-cooled type heat sink on the computer. [Previous technology] According to the press, the computing functions of today's computers are becoming more and more powerful, and their operators are rapidly improving. ❿Its overall shape, structure, and connection with the motherboard; : 疋 Break through the traditional nest 窠, it can be described as the computer industry Major reforms = The generation of central processing units with super-speed computing functions has also made Central Tiger Lizhai produce higher temperatures when processing different instructions, so how to use ~ 's heat conduction and heat dissipation system to make the central processing unit The allowable warm production and regular work have been regarded by the industry as a very important issue. And yes, that is, a water-cooled heat dissipation system is designed by the industry. Please refer to the figure below. The water-cooled heat dissipation system 100a includes a heat sink 10a installed on the central processor 2 0a, and a heat sink 1 Both ends of 〇a are provided with a water outlet 101a and a water inlet 102a respectively. The water inlet 102a is connected with a pipe 103 & to a water outlet 20a of a water pump 20a, and a heat sink. The water outlet 10a of 丨 〇a is then connected to the pipeline 104a to the water inlet 30a of a water-cooled row 30a. The water-cooled row 30a may be composed of a plurality of heat sink fins 30a, and the water-cooled row 30. The water outlet 302a of a is connected to the water inlet 40a of the water tank 40a, and the water outlet of the water tank 40a is connected to the water tube 40 & 1 to the water pump 20a. The water outlet 202a is used to form a water-cooled circulating heat dissipation system 100a. Use =, the cold water is transported by the water pump 20a to the heat sink 10a for heat exchange, and then the hot water flows out, and the hot water flows in through the pipeline 04a In the water-cooled row 30 &

第5頁 -M279915 * > 四、創作說明(2) 熱交換後形成A > _ 持續進行循環K二由“管路3°切流回至水箱術内1 飞的熱父換散熱處理。 l〇a、水幫浦;0:冷系統1〇〇“系分別由獨立的散執座 裝置間所串接的路二:3°;及水箱4〇a所组成,再加上各 水冷式散熱系心:體V::: 304a、4〇2a,造成整個 間,這對於朝向t s 而佔用非常多的安裝空 決的課題。輊缚化的電腦主機而言’無疑是另—欲解 該行ί;年i i:知所j 3問胃,本案創作人遂以從事 良’遂有本創作『水;式積極研究改 【新型内容】 本創作之一目的在於提 直接利用該殼體作為熱能傳 組成結構’俾大幅縮小水冷 材料及減輕重量。 本創作之另一目的在於 係直接在該殼體内安裝有液 具有水箱儲水、水流循環以 可提高熱交換效率者。 本創作之一特徵在於該 進行導、散熱,包括有一與 質的殼體,殼體内形成有一 供一種 導,以 式散熱 提供一 體驅動 及將熱 水冷式 熱源接 容置室 水冷式 簡化水 機構的 種水冷 裝置, 能帶離 散熱機構,其係、 冷式散熱機構的 體積’進而節省 式散熱機構,其 使整個機構同時 熱源專功能,且 散熱機構,用以對熱源 觸之一面為金屬導熱材 ’供裝設一液體驅動裝Page 5-M279915 * > IV. Creation instructions (2) Form A after heat exchange > _ Continue the cycle K2 from "pipe 3 ° cut back to the water tank for 1 fly heat exchange heat treatment. l〇a, water pump; 0: Cooling system 100 "is composed of two roads connected in series between independent disperse base devices: 3 °; and water tank 40a, plus each water-cooled Cooling system: body V ::: 304a, 402a, resulting in the whole room, which is a problem for installations that occupy a lot of space towards ts. For the bound computer host, it is undoubtedly another-want to unravel the line; year ii: Zhisuo j 3 asked the stomach, the creator of this case then engaged in good work, and thus has the original creation of "water; active research and reform [new type] Contents] One of the purposes of this creation is to directly use the shell as a heat transfer structure to reduce water-cooled materials and reduce weight. Another purpose of this creation is to install a liquid directly in the casing, which has a water tank to store water and circulate water to improve heat exchange efficiency. One of the characteristics of this creation is that it conducts and dissipates heat, and includes a shell with good quality. The shell is formed with a kind of guide, which provides integrated drive with heat dissipation and a water-cooled simplified water mechanism that connects the hot-water-cooled heat source to the receiving room. This kind of water-cooling device can have a discrete thermal mechanism, which is the volume of the cold-type heat-dissipating mechanism, and further saves the heat-dissipating mechanism. It makes the entire mechanism have a dedicated heat source function at the same time, and the heat-dissipating mechanism is used to conduct heat from one side of the heat source to metal. Material 'for a liquid-driven device

第6頁Page 6

M279915 四、創作說明(3) 置,且在1上設有-人水π及出水口連通於 該入水口及出水口並連接至一水冷排處。各。t置至, 機構安裝在熱源上:’該殼體為金屬導熱:質:…動 觸在熱源上’即可藉由該金屬導敎从 、、 面係貼 室内,並與其内的冷卻液進行;;:質將熱能傳導至容置 裝置將熱交換後之液體輸送至水、人 用邊夜體驅動 本創作之另一特徵在於該殼;=士循環流動。 形成有流道,該流道可由複數個凹2至内的底面處係 成,以增加熱交換面積,另,、 5 柱或螺旋槽所構 件、定子腔及定子構件所成广體驅動裝置係由轉子構 輪,而定子構件則包含有♦风,轉子構件包含有磁極及葉 體驅動裝置安裝在殼體之,線圈及鐵芯等,當將液 係位於流道的正上方,在2 至内時’該轉子構件的葉輪 葉輪各點之線速度略相等了 _ =靛,下,此處液體流速與 以加速熱交換效率。、使奋置至内之液體流速增快, [實施方式】 有關本創作之詳細說 下,然而所附圖示僅提技術内谷,配合圖式說明 作加以限制者。^參考㈣W,並㈣來對本: 為Ϊ七=二,該水冷式散熱機構100係作 敎機構100包括有一筏妒;)放熱,其中,該水冷式散 …入s、# 双體1,殼體與CPU 2 0 0相接觸之一外 表面為以孟屬*熱材質所製纟,在本實M279915 Fourth, the creation instructions (3), and on the 1-there is-human water π and water outlet connected to the water inlet and outlet and connected to a water-cooled drain. each. Set it to, the mechanism is installed on the heat source: 'the shell is metal heat conductive: quality: ... moving on the heat source', the metal guide can be used to attach to the room, and carry out with the cooling liquid inside it ;;: The mass transfers heat energy to the accommodating device to transfer the heat-exchanged liquid to water, and the human side body drives the other feature of this creation; the circulation of the taxi. A flow channel is formed. The flow channel can be tied to a plurality of concave bottom surfaces to increase the heat exchange area. In addition, a wide-body driving device system consisting of a 5-post or spiral groove member, a stator cavity, and a stator member is formed. The rotor is structured by the rotor, while the stator contains the wind. The rotor contains the magnetic poles and blades. The drive unit is installed in the housing, the coil and the iron core. When the fluid system is located directly above the flow path, Internal time, the linear velocity of each point of the impeller and impeller of the rotor member is slightly equal to _ = ind. Here, the liquid velocity and the speed of heat exchange are accelerated. To make the flow velocity of the liquid set up faster, [Embodiment] The details of this creation will be described below. However, the attached figure only mentions the technical valley, and it is limited with the illustration of the diagram. ^ Refer to ㈣W and make the following: For Ϊ 七 = 二, the water-cooled heat-dissipating mechanism 100 is used as a mechanism. The mechanism 100 includes a raft;) exothermic, where the water-cooled diffuser ... 入 s, # 双 体 1, shell One of the outer surfaces of the body that is in contact with the CPU 2 0 0 is made of Meng * thermal material.

M279915 3、創作說明(4) 以其外表底面11與CPU2nnte# 其他具高導熱性之材質所製t導熱材質可為銅、 殼體I内形成有一容置官 形成有流道13,本創作之一 ,谷置室12内的底面處係 凹洞13i所排列而成,而在^施例中該流道13係由複數j固 驅動裝置2,f玄液體驅動/置二至12内並裝設有-液1 及定子構件23所構^動趙衣工置2係由轉子構件2i、定子腔22 212,而定;=成,#子構件21包含有磁極211及葉輪 233笔* ί構件則包含有電路板231、線圈2 3 2及鐵芯 專’备將液體驅動裝置2安裝在殼體丨之容置室12内 才二±子構件21的葉輪21 2係位於流道1 3的正上方。 1 4月二、只參恥第一、三圖所示,在殼體1上設有一入水口 4执二ΐ水口15連通於該容置室12,而在殼體1的頂面處 並5又有岔封圈16及上蓋I? 〇 骋!明#參第四圖所示’當欲將液體驅動裝置2組裝在殼 在々之合处置至12内時’令轉子構件21及定子構件23先安裝 疋子^ 2 2上’騎後將液體驅動裝置2組裝於容置室1 2 内μ使f子構件21的葉輪212正對應於容置室12内底面處 所σ又的/瓜道1 3 ’最後,於殼體1的頂面置設密封圈1 6,再 利用螺才王元件1 8將上蓋1 7鎖固在殼體1頂面處,即可完成 組裝。 月參照第五圖所示,該水冷式散熱機構1 0 0欲安裝在 CPU 2 0 0上方時’係先在殼體1的頂面利用螺栓元件2 0 2鎖 固一CPU固定座2〇1,再將該CPU固定座201鎖固在主機板M279915 3. Creation instructions (4) The outer surface bottom surface 11 and CPU2nnte # are made of other materials with high thermal conductivity. The thermally conductive material can be copper. A housing is formed in the housing I and a flow channel 13 is formed. First, the recesses 13i are arranged at the bottom surface of the valley chamber 12, and in the embodiment, the flow channel 13 is driven by a plurality of j-solid driving devices 2, and is driven by two x12 liquids. Equipped with -liquid 1 and stator member 23 ^ Zhaoyigongji 2 is composed of rotor member 2i and stator cavity 22 212; = Cheng, # 子 件 21 includes magnetic pole 211 and impeller 233 pens It includes the circuit board 231, the coil 2 3 2 and the iron core. The impeller 21 2 of the sub-component 21 is located in the flow path 1 3, and the liquid drive device 2 is installed in the housing 12 of the housing. Directly above. 1 As shown in the first and third figures in April and April, a water inlet 4 is provided on the casing 1 and a water inlet 15 is connected to the accommodation chamber 12, and the top surface of the casing 1 is connected to 5 There are fork seal ring 16 and upper cover I? 〇 骋!明 #Refer to the fourth figure, 'When the liquid drive device 2 is to be assembled in the casing and disposed within 12', let the rotor member 21 and the stator member 23 be installed with the rafter first. ^ 2 2 "After riding the liquid The driving device 2 is assembled in the accommodation chamber 1 2 so that the impeller 212 of the f sub-member 21 is directly corresponding to the bottom space σ of the accommodation chamber 12 / guaidao 1 3 ′ Finally, it is placed on the top surface of the housing 1 The seal ring 16 is used, and then the screw cap king element 18 is used to lock the upper cover 17 to the top surface of the housing 1 to complete the assembly. As shown in the fifth figure, when the water-cooled heat-dissipating mechanism 100 is to be installed above the CPU 2000, it is necessary to lock a CPU fixing seat 201 with a bolt element 2 02 on the top surface of the housing 1 first. , Then lock the CPU mount 201 to the motherboard

第8頁 M279915 四、創作說明(5) 3 0 0上(如第六圖所示),使殼體1貼觸在CpiJ 2〇〇上;嗣後 再利用官路3的一端分別接設在殼體1的入水口丨4及出水口 1 5,而Z路3的另一端則接設在一水冷排4上,該水冷排4 具有一箱體41,箱體41兩側處係分別形成有一進水區42及 /出水區43,忒體1之入水口 14係由管路3與出水區43相接 設,殼體1之出水口 15則由管路3與進水區42相接設,而在 箱體1中間處則由複數道散熱片44所疊設而成,令進水區 42内的熱水由該等散熱片44進行熱交換而形成冷水, 至出水區43處。當然,亦可在該等散熱片以的側* 有一散熱風扇45,以加速熱交換效果。 处鎖設 請參照第七圖所示,使用時可利用殼體丨之金 材質,將CPU 200運轉後所產生的熱量傳導至容置熱 内,而液體驅動裝置2會將水冷排4内的冷水,從i 2 經由管路3及殼體1之入水口14輸送至容置室12,=區43 量能與冷水進行熱交換,嗣後再利用液體驅動裝件該熱 交換後之熱水,經由殼體】之出水口15及管路3, /熱 冷排4之進水區42内,令進水區42内的熱水由該等^至水 44進行熱交換後形成冷水,再流至出水區㈡處產/…^片 動,以進行下一次的熱交換散熱。 销裱流 請參照第八圖所*,係本創作另一實施例, 置室12内底面之流道13係可由複數凸柱132所排列、中^容 另’請參照第九圖所示,係本創作又一實施例,成。 置室12内底面處之流道13亦可由複數螺旋槽133所、义該容 成。 长攻而Page 8 M279915 IV. Creation instructions (5) 3 0 0 (as shown in the sixth figure), make the case 1 touch CpiJ 2000; then use one end of the official road 3 to connect to the case The water inlet 4 and the water outlet 15 of the body 1 are connected to the other end of the Z channel 3 on a water-cooled row 4, which has a box 41, and a box 41 is formed on each side of the box 41 The water inlet area 42 and / the water outlet area 43, the water inlet 14 of the carcass 1 is connected to the water outlet area 43 through the pipeline 3, and the water outlet 15 of the shell 1 is connected to the water inlet area 42 through the pipeline 3. In the middle of the box 1, a plurality of fins 44 are stacked, so that the hot water in the water inlet area 42 is exchanged by these fins 44 to form cold water, and reaches the water outlet area 43. Of course, there may also be a cooling fan 45 on the side of the heat sinks to accelerate the heat exchange effect. Please refer to the seventh figure for the lock setting. During use, the gold material of the casing 丨 can be used to transfer the heat generated after the CPU 200 runs to the accommodation heat, and the liquid drive device 2 will displace the The cold water is transported from i 2 to the accommodating chamber 12 through the pipeline 3 and the water inlet 14 of the casing 1. The area 43 can exchange heat with the cold water, and then use the liquid to drive the hot water after the heat exchange. Through the water outlet 15 of the casing] and the water inlet area 42 of the hot / cold row 4 so that the hot water in the water inlet area 42 is heat exchanged from the water to the water 44 to form cold water, and then flow Move to the water outlet area to produce /...^ tablets for the next heat exchange. Please refer to the eighth figure for the pinned flow *, which is another embodiment of this creation. The flow channel 13 on the bottom surface of the housing 12 can be arranged by a plurality of convex pillars 132, and the contents are shown in the ninth figure. This is another embodiment of this creation. The flow channel 13 at the bottom surface of the housing chamber 12 can also be formed by a plurality of spiral grooves 133. Long attack

第9頁 M279915 t % 习、創作說明(6) 本創作中,由於係直接利用該水冷式散熱機構1〇〇的 殼體1作為熱量之傳導,故可簡化水冷式散熱機構1〇〇的組 成結構,俾大幅縮小整體結構的體積,進而節省材料及減 輕重量。且係直接在殼體1内安裝有液體驅動裝置2,使整 個機構100同時具有水箱儲水、纟流循環以及將埶量帶離 熱源等功能;同—時:該轉子構件21的葉輪212係位於流道 1』的正上方’:在葉輪jl2的旋轉下’使此處液體流速與 葉輪21 2各點之線速度略相等,传交罟它〗9A —、杰 增快,以提高熱交換效率。“置至12内之液體流速 綜上所二,=作之「水冷式散熱機構 由上述所揭露之構造’ 4到所述之功效。且本創作申 未見於刊物亦未公開使用,誠已鉻人 Μ則 步等要件。 减已付合新型專利之新穎、進 ρ惟/述ΐΪί圖式及說明,僅為本創作之實施例而 士,其所依本創作之特徵範缚 ^ 傅,皆應涵蓋在以下本案之申請專利範圍内或修 _Page 9 M279915 t% Xi, creation instructions (6) In this creation, since the housing 1 of the water-cooled heat dissipation mechanism 100 is directly used as a heat transfer, the composition of the water-cooled heat dissipation mechanism 100 can be simplified. Structure, greatly reducing the volume of the overall structure, thereby saving materials and weight. And the liquid drive device 2 is directly installed in the casing 1, so that the entire mechanism 100 has the functions of water storage in the water tank, circulation of the flow, and removal of heat from the heat source; at the same time: the impeller 212 of the rotor member 21 Located "directly above the flow channel 1": Under the rotation of the impeller jl2, 'the liquid flow velocity here is slightly equal to the linear velocity of each point of the impeller 21 2 and it is passed on to it. 9A —, Jie faster, to improve heat exchange effectiveness. "In summary, the liquid flow rate within 12 is the same as that of the" water-cooled heat dissipation mechanism from the structure disclosed above '4 to the effect described. And this application has not been seen in publications and has not been used publicly. It has been chromium. The person M is a step and so on. The novelty, novelty, description, and description of the new patents that have already been paid are only examples of the creation, and the features and scope of the creation are bound by ^ Fu, both Should be covered within the scope of the patent application or repair of the following case _

苐10頁 M279915 圖式簡單說明 【圖式簡單說明】 第一圖係習知水冷式散熱系統之外觀圖。 第二圖係本創作之立體分解圖。 第三圖係本創作另一視角之立體分解圖。 第四圖係本創作之組合剖面圖。 第五圖係本創作與CPU固定座之立體外觀圖。 第六圖係本創作與水冷排連接後一同安裝至CPU之立體外 觀圖 第七圖係本創作安裝在CPU後之作動剖視圖。 第八圖係本創作另一實施例之立體外觀圖。 第九圖係本創作又一實施例之立體外觀圖。 〔元件代表符號〕[習知] 水冷式散熱系統l〇〇a 中央處理器2 0 0 a 水幫浦2 0 a 散熱鰭片3 0 3a 出水口101a、201a、302 入水口102a > 2 0 2a、301 管路 103a、104a、3 04a, [本創作] 水冷式散熱機構100 殼體1 散熱座1 0 a 水冷排3 0 a 水箱4 0 a 、401 40 2a 外表底面11苐 Page 10 M279915 Schematic description [Schematic description] The first diagram is the appearance of a conventional water-cooled heat dissipation system. The second picture is a three-dimensional exploded view of this creation. The third picture is a three-dimensional exploded view of another perspective of this creation. The fourth picture is a combined sectional view of this creation. The fifth picture is the three-dimensional appearance of the creation and the CPU mount. The sixth picture is a three-dimensional external view of the original installation after being connected to the water cooling radiator and installed to the CPU. The seventh picture is an action sectional view of the original installation after being installed in the CPU. The eighth figure is a three-dimensional appearance diagram of another embodiment of the present invention. The ninth figure is a three-dimensional appearance view of another embodiment of the present invention. [Representative Symbols of Components] [Knowledge] Water-cooled cooling system 100a CPU 2 0 a Water pump 2 0 a Radiating fins 3 0 3a Water outlet 101a, 201a, 302 Water inlet 102a > 2 0 2a, 301 pipes 103a, 104a, 3 04a, [this creation] water-cooled heat dissipation mechanism 100 housing 1 heat sink 1 0 a water-cooled row 3 0 a water tank 4 0 a, 401 40 2a outer bottom surface 11

M279915 圖式簡單說明 容置室12 流道1 3 凹洞1 3 1 凸柱1 3 2 螺旋槽1 3 3 入水口 1 4 出水口 1 5 密封圈1 6 上蓋17 螺栓元件1 8、2 0 2 液體驅動裝置2 轉子構件2 1 磁極2 11 葉輪212 定子腔2 2 定子構件2 3 電路板2 3 1 線圈2 3 2 鐵芯2 3 3 管路3 水冷排4 箱體41 進水區4 2 出水區4 3 散熱片44 散熱風扇4 5 CPU 200 固定座201 主機板300M279915 Brief description of the drawing room 12 flow channel 1 3 recess 1 3 1 convex column 1 3 2 spiral groove 1 3 3 water inlet 1 4 water outlet 1 5 seal 1 6 cap 17 bolt element 1 8, 2 0 2 Liquid drive device 2 Rotor component 2 1 Magnetic pole 2 11 Impeller 212 Stator cavity 2 2 Stator component 2 3 Circuit board 2 3 1 Coil 2 3 2 Iron core 2 3 3 Pipe 3 Water-cooled drain 4 Box 41 Water inlet area 4 2 Water outlet Zone 4 3 Heat sink 44 Cooling fan 4 5 CPU 200 Fixture 201 Motherboard 300

第12頁Page 12

Claims (1)

M279915 五、申請專利範園 1. 一糗水 冷式政熱機構’用以對熱綠進行導 散熱 包括: 面係以 裝填之 體上設 ---- 填於容 2. 中該外 3. 構,其 4. 中該殼 密封圈 5. 中該流 6. 中該流 7. 中該流 8. 中該液 成,轉 具有至少 熱材質所 ,該容置 水口及一 動裝置’ 之冷卻液 專利範圍 形成於殼 專利範圍 屬導熱材 專利範圍 面處係設 殼髎 金屬導 容襄$ / A 雜軀 置f内 如申# 表承係 如申言青 中该金 如f言青 體的谓 有 液 一與熱源相接觸之认φ 製成,該殼體内心面,該外表 至内的底面形成有# ' 为心逼,另,在殼 出水口連通於該容置室; 安裝在殼體之容置室内,以驅動裝 產生循環流動。 第1項所述之水冷式散熱機構,其 體之底部。 第1或第2項所述之水冷式散熱機 質為銅或鋁之任一種材質。 第1項所述之水冷式散熱機構,其 有上蓋,上蓋與殼體之間並置設有 。申請專利範圍第1項所述之水冷式散熱機構,其 t #由複數凹洞所排列而成。 t申請專利範圍第1項所述之水冷式散熱機構,其 道係由複數凸柱所排列而成。 如申請專利範圍第1項所述之水冷式散熱機構,其 道係由複數螺旋槽所環設而成。 如申請專利範圍第1項所述之水冷式散熱機構,其 體驅動裝置係由轉子構件、定孑腔及定子構件所構 子構件包含有磁極及葉輪,而定子構件則包含有電M279915 V. Applying for a patent Fan Yuan 1. A water-cooled government-heating organization 'used to conduct and dissipate hot green heat includes: The surface is provided with a filling body ---- filled in the volume 2. in the outside 3. structure 4. Its shell sealing ring 5. Middle the stream 6. Middle the stream 7. Middle the stream 8. The liquid is turned to have at least a thermal material, the receiving water port and a moving device 'cooling fluid patent The scope is formed in the shell patent scope belongs to the thermal conductive material patent scope. The shell is equipped with the metal guide capacity. / 杂 体 置 f 内 如 申 # The table is inherited as the gold body of the Yancheng Qingyan. The contact with the heat source is made of φ. The inner surface of the casing and the bottom surface of the outer surface are formed with # 'as the core force. In addition, the water outlet of the casing is connected to the accommodation chamber; it is installed in the accommodation of the casing. Indoor, to drive the device to generate cyclic flow. The water-cooled heat-dissipating mechanism described in item 1, the bottom of the body. The water-cooled heat sink described in item 1 or 2 is made of copper or aluminum. The water-cooled heat-dissipating mechanism according to item 1 has an upper cover, and is arranged side by side between the upper cover and the casing. The water-cooled heat-dissipating mechanism described in item 1 of the patent application scope, wherein t # is formed by a plurality of recesses. tThe water-cooled heat-dissipating mechanism described in item 1 of the scope of the patent application is composed of a plurality of convex columns. The water-cooled heat-dissipating mechanism described in item 1 of the scope of patent application, is formed by a plurality of spiral grooves. According to the water-cooled heat-dissipating mechanism described in item 1 of the scope of the patent application, the body driving device is composed of a rotor component, a fixed cavity and a stator component. The sub-component includes a magnetic pole and an impeller, and the stator component includes electricity. 第13頁 M279915 五、申請專利範圍 路板、線圈及鐵芯。 9.如申請專利範圍第8項所述之水冷式散熱機構,其 中該轉子構件的葉輪係位於流道的正上方。 1 0.如申請專利範圍第1項所述之水冷式散熱機構,其 中該殼體的入水口及出水口係接設有管路至一水冷排上, 該水冷排具有一箱體’箱體兩側處係分別形成有一進水區 及出水區,而在箱體中間處則由複數道散熱片所疊設而 成。 11.如申請專利範圍第1 0項所述之水冷式散熱機構,其 中可在該等散熱片的側邊處固設有一散熱風扇。Page 13 M279915 5. Scope of patent application Road boards, coils and iron cores. 9. The water-cooled heat dissipation mechanism according to item 8 of the scope of patent application, wherein the impeller train of the rotor member is located directly above the flow channel. 10. The water-cooled heat dissipation mechanism according to item 1 of the scope of the patent application, wherein the water inlet and the water outlet of the casing are connected with a pipeline to a water-cooled row, and the water-cooled row has a box body A water inlet area and a water outlet area are respectively formed on both sides, and a plurality of heat sinks are stacked at the middle of the box body. 11. The water-cooled heat dissipation mechanism according to item 10 of the scope of patent application, wherein a heat dissipation fan may be fixed at the side of the heat sink. 第14頁Page 14
TW94210693U 2005-06-24 2005-06-24 Water-cooling heat dissipation mechanism TWM279915U (en)

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DE202006005160U DE202006005160U1 (en) 2005-06-24 2006-03-30 Water cooling system for use in CPU of computer, has channel designed in base for accommodating coolant, and recycling device placed in cavity for recycling coolant

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US9986632B2 (en) 2016-02-24 2018-05-29 Cooler Master Co., Ltd. Water cooling system

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DE202011102654U1 (en) 2011-06-06 2011-08-19 Megware Computer Gmbh Arrangement for operating a high-performance computer
DE102013019245A1 (en) 2013-10-24 2015-04-30 Alexander Dominik Höbel Device for cooling electronic components
DE202018102582U1 (en) 2018-01-23 2018-05-22 MEGWARE Computer Vertrieb und Service GmbH High temperature direct liquid cooled high performance computer system
CN109769362A (en) * 2019-03-08 2019-05-17 陈新宇 A kind of Cabinet that communication waterproof performance is good
CN113660824A (en) * 2021-06-30 2021-11-16 杭州长川科技股份有限公司 Cooling structure, pressure head assembly and test equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9986632B2 (en) 2016-02-24 2018-05-29 Cooler Master Co., Ltd. Water cooling system

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