當風扇運轉時所帶動之空氣吸取散熱韓片上的孰量 後’會發散於電腦機殼之内部空 I 1间，因此長時間下來，大 部分的廢熱會蓄留在電腦機殼内， 净蚁電恥機殼内的溫度 吏付電子元件的散熱效率減緩。 M328608 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種水冷式電腦散熱裝置，尤指一種使 用冷卻液增加傳熱效果，並利用㈣供/應器之風扇直接將 熱散逸至電腦機殼外的水冷式電腦散熱裝置。 【先前技術】 惟隨著科技的演進’電腦所要處理的運算工作日益繁 雜，故電子元件的内部電路設計亦日趨複雜，導致各= 70件在工作枯均會產生廢熱，例如中央處理器、功率 體或南北橋晶片。 Μ 因此，一般電腦運作時，為有效降低中央處理器之溫 度’既有的散熱裝置係以-金屬散熱座裝設於發埶電子元 表面上’該金屬散熱座之外側表面另形成有複數 政一片’再於散熱鰭片之外側端部處裝設—風扇，藉由 該金屬散熱座吸取發熱電子元件所散發之熱量，並料致 縛片上，再由風扇運轉時所帶動流動之空氣吸取散 …〜片上的熱量，以對發熱電子元件進行散熱。 由上述可知 進。 既有的電腦散熱裝 置仍有待進《—步之改 4 5 ·· »3 M328608 【新型内容】 • 為此，本創作之主要目的在提供一種水冷式電腦散熱 裝置’其可減少廢熱留在電腦機殼，以有效地提高散熱效 果。 為達成前述目的所採取之主要技術手段係令前述水冷 式電腦散熱裝置包括： 一水冷頭’其内係裝填有冷卻液，並供設於一電腦主 _ 桡板上發熱電子元件之表面，而由該冷卻液對該發熱電 子元件進行熱交換； 一果浦’係與該水冷頭連通，以對冷卻液施加壓力， 令該冷卻液流動；以及 一散熱益’係以導管連接該泵浦和水冷頭，且對應設 一電源供應器之風扇進氣 旁，又該散熱器内部係具有 複數供冷卻液流過之流道，以與該冷卻液進行熱交換，再 由U亥電源仏應益之風扇運轉時而流動的空氣吸取散熱器自 該冷卻液吸取之熱量， 里’後由該電源供應器之風扇將吸熱後 的空氣吹送至電腦機殼外散逸。 上述技術手段係利用於水冷頭吸取發熱電子元件When the air driven by the fan draws the amount of heat on the Korean film, it will diverge in the internal space of the computer case, so most of the waste heat will remain in the computer case for a long time. The heat dissipation efficiency of the electronic components in the shame case is slowed down. M328608 VIII. New Description: [New Technology Field] This paper is about a water-cooled computer heat sink, especially a coolant that increases the heat transfer effect, and uses the fan of (4) the heater to directly dissipate the heat to the computer. Water-cooled computer cooling device outside the casing. [Prior Art] However, with the evolution of technology, the computing work that computers have to deal with is becoming more and more complicated, so the internal circuit design of electronic components is becoming more and more complicated, resulting in the use of waste heat, such as central processing unit, power. Body or north-south bridge chip. Μ Therefore, in general, when the computer is in operation, in order to effectively reduce the temperature of the central processor, the existing heat sink is mounted on the surface of the hairpin electronic unit with a metal heat sink. A piece of fan is mounted on the outer end of the heat sink fin, and the metal heat sink absorbs heat generated by the heat-generating electronic component, and is attached to the sheet, and then the air flowing by the fan is sucked and dispersed. ...~ heat on the chip to dissipate heat from the hot electronic components. It can be seen from the above. The existing computer cooling device still needs to be entered into the "step change" 4 5 ··3 M328608 [new content] • For this reason, the main purpose of this creation is to provide a water-cooled computer cooling device that can reduce waste heat and stay in the computer. The case is designed to effectively improve the heat dissipation effect. The main technical means for achieving the above-mentioned purposes is that the water-cooled computer heat sink comprises: a water-cooling head which is filled with a cooling liquid and is provided on the surface of a heating electronic component on a computer main slab, and Heat exchange is performed on the heat-generating electronic component by the coolant; a fruit pump is connected to the water-cooling head to apply pressure to the coolant to flow the coolant; and a heat dissipation system is connected to the pump by a conduit The water-cooled head is adjacent to the fan inlet of the power supply, and the inside of the radiator has a plurality of flow passages through which the coolant flows to exchange heat with the coolant, and then the U-Hui power supply The air flowing during the operation of the fan absorbs the heat absorbed by the radiator from the coolant, and then the fan of the power supply blows the heat-absorbing air to the outside of the computer casing to dissipate. The above technical means are used for water-cooling head to absorb heat-generating electronic components
至電腦機殼外， 進氣口處，而將冷卻液傳來的熱有效散逸 不僅為水冷頭設置位置的電子元件散熱， M328608 有效地提高散 更能狗減少蓄積電子元件廢熱在電腦機殼 熱裝置之散熱效果。 【實施方式】 β月參閱第一圖所示，太合 ^ 本創作之水冷式電腦散熱裝置係 设於一電腦機殼（1 η、 .^ β )内’該電腦機殼（1 0 )内係設 有一電源供應器（1 1 )盥 、 ；與一主機板（12)，其中該電 源供應益上係設有一風戶 / η ^、 羽’该風扇具有一面朝向電腦機殼 (10)内部的進氣口 、丄丄1)與一朝向電腦機殼（1 0)外的出氣口（圖中去 τ禾不），而該主機板（1 2 )上則 設有複數個發執電子开& , t …电于70件’例如中央處理器（1 2 1 )、 南北橋晶片或功率電晶轉楚 日體專，以下係以中央處理器（1 2 1 )舉例說明。 本創作之水冷式電腦散熱裝置包括-水冷頭（2 0 )、 -泵浦（30)以及-散熱器（4〇)。 上述水冷頭\〜y v 4 u)内係装填有冷卻液，並供設於該 中央處理器（121、 x ^之表面，而由該冷卻液對該中央處 理器（121)進行熱交換。 、上述I /# ( 3 〇 )係可直接設於該水冷頭（2 〇 )上， 並與忒水冷頭（2〇)連通，或透過一導管（圖中未示） 連接該水冷頭（2 η 1 ^、 ^ υ }，於本實施例中，該泵浦（3 0 ) 係直接設於該水冷頭「η Ν . 、（2〇)上並與該水冷頭（20)連 、矛J用η亥泵浦（3 〇 )對冷卻液施加壓力，令該冷卻液 流動。 M328608 上述政熱益（4 〇 )係對應設於該電源供應器（工 之風扇進乱口（111}旁’並以兩導管（5〇)分別連 接《浦（3 0 )和水冷頭（2 〇 );於本實施例中，該 政熱益（4 Q )係固設於該電源供應^ (丄丄）上 勺 括： 匕 一散熱葉片組（4 1 )，係包含有複數散熱葉片（4 11) ’各散熱葉片（4U)係具有流道（圖中未示） 供冷卻液於其内流通； 兩合-(4 2 ) ( 4 3 )，係設於該散熱葉片組（4 1 )之兩側，且各散熱葉片（4 1 1 )内的流道兩端係分 別與該兩容器（4 2 ) ( 4 3 )連通，又其中一容器（4 係透過—導管（50)連接該水冷頭（2〇)，另_ 谷益（43)則透過另一導管（5〇)連接該泵浦（3〇)。 、由上述可知，當該泵浦（3 0 )運作時，即會令冷卻 、、：泵浦（3〇)、散熱器（4〇)和水冷頭（2〇)之 間循環流動’藉此利用流經該水冷頭（2 Q ) &冷卻液吸 取中央處理器（i 2 i )所產生之熱量，當吸取熱量後的 、-2液机經政熱器（4 〇 )時，該流道會與該冷卻液進行 :;矣並傳至散熱葉片（4 1 1 )上，因此當該電源供應 (1 1 )之風扇運轉而帶動空氣流動時，空氣會流經散 Ί、 4 1 1 )並吸取熱量，最後再由該電源供應器（1 1 )之風扇將吸熱後的空氣吹送至電腦機殼（i 〇 )外散 逸（如第二圖所示）。 准本則作雖已於前述實施例中揭露，但並不僅限於前 M328608 述實施例中所提及之範疇，在不脫離本創作之精神和範圍 内所作之任何變化與修改，例如將該散熱器固設於主機板 上，而位於該電源供應器之風扇進氣口旁，亦屬於本創作 之保護範圍。 綜上所述，本創作實為一極具進步性與實用性之佳 作，且未見於刊物或公開使用’符合新型專利之申請要件， 爰依法提出申請。 【圖式簡單說明】 第-圖：係本創作裝設於一電腦機殼内之示意圖 第二圖：係'第-圖之電腦機殼内的空氣流向圖。 【主要元件符號說明】 (1 〇)電腦機殼 (1 1 )電源供應器 (1 2 )主機板 (2 0 )水冷頭 (3 0 )泵浦 (4 0 )散熱器 (111)進氣口 (1 2 1 )中央處理器 (5 0 )導管To the outside of the computer case, at the air inlet, the heat from the coolant is effectively dissipated not only for the electronic components in the position where the water cooling head is placed, but also the M328608 effectively improves the heat dissipation of the accumulated electronic components in the computer case. The heat dissipation effect of the device. [Embodiment] As shown in the first figure, the water-cooled computer cooling device of the present invention is set in a computer case (1 η, .^ β ) in the computer case (10). The utility model is provided with a power supply (1 1 ), and a motherboard (12), wherein the power supply is provided with a wind/ η ^, feather 'the fan has one side facing the computer casing (10) The air inlet, the raft 1) and an air outlet facing the computer casing (10) (the figure goes to τhe), and the motherboard (12) is provided with a plurality of hair extensions. & , t ... electricity in 70 pieces 'such as the central processing unit (1 2 1), north-south bridge chip or power transistor, the following is exemplified by the central processing unit (1 2 1). The water-cooled computer cooling device of the present invention includes a water-cooled head (20), a pump (30), and a heat sink (4 turns). The water-cooling head \~yv 4 u) is filled with a cooling liquid and is provided on the surface of the central processing unit (121, x^), and the central processing unit (121) exchanges heat with the cooling liquid. The above I /# (3 〇) system can be directly placed on the water-cooled head (2 〇) and connected to the water-cooled head (2 〇) or connected to the water-cooled head through a conduit (not shown) (2 η 1 ^, ^ υ }, in the present embodiment, the pump (30) is directly disposed on the water-cooling head "η Ν . , (2〇) and connected to the water-cooling head (20), and the spear is used. η海泵 (3 〇) applies pressure to the coolant to make the coolant flow. M328608 The above-mentioned political heat (4 〇) is corresponding to the power supply (the fan of the work is next to the mouth (111} and The two conduits (5 〇) are respectively connected to the "pu (30) and the water-cooled head (2 〇); in this embodiment, the political heat (4 Q) is fixed on the power supply ^ (丄丄) The scoop includes: a heat-dissipating blade group (4 1 ), which includes a plurality of heat-dissipating blades (4 11). Each heat-dissipating blade (4U) has a flow path (not shown) for the coolant to circulate therein; And - (4 2 ) ( 4 3 ) are disposed on both sides of the heat dissipating blade group (4 1 ), and the two ends of the flow path in each of the heat dissipating blades (4 1 1 ) are respectively associated with the two containers (4 2 (4 3 ) Connected, one of the containers (4 is connected to the water-cooled head (2〇) through the conduit (50), and the other _ Gu Yi (43) is connected to the pump through another conduit (5〇) ( 3〇). As can be seen from the above, when the pump (30) is operated, it will circulate between cooling, pumping (3〇), radiator (4〇) and water-cooling head (2〇). The flow 'by taking advantage of the heat generated by the water-cooling head (2 Q ) & coolant to draw the central processor (i 2 i ), when the heat is extracted, the -2 liquid machine passes the thermal heater (4 〇) At this time, the flow path will be carried out with the coolant: 矣 and transmitted to the heat dissipating blades (4 1 1 ), so when the fan of the power supply (1 1 ) is operated to drive the air to flow, the air flows through the divergence. 4 1 1 ) and take in heat, and finally the fan of the power supply (1 1 ) blows the endothermic air to the outside of the computer case (i 〇) (as shown in the second figure). Although already in the above It is disclosed in the examples, but is not limited to the scope of the above-mentioned embodiments of the present invention, and any changes and modifications made without departing from the spirit and scope of the present invention, such as fixing the heat sink to the motherboard, The fan inlet located next to the power supply is also within the scope of this creation. In summary, this creation is a highly progressive and practical work, and is not seen in the publication or public use 'in accordance with The application requirements for new patents, 提出 apply in accordance with the law. [Simple description of the diagram] The first picture: the schematic diagram of the creation of this creation in a computer case. The second picture: the air flow diagram inside the computer case of the first figure. [Main component symbol description] (1 〇) computer case (1 1 ) power supply (1 2 ) main board (2 0) water-cooled head (3 0) pump (4 0) radiator (111) air inlet (1 2 1) central processing unit (50) catheter