TWI432131B - Heat dissipation device - Google Patents

Description

Heat sink

The invention relates to a heat dissipating device, in particular to a heat dissipating device for dissipating heat of electronic components.

As the electronic information industry continues to evolve, electronic components (especially central processors) continue to operate at an increasing rate. However, the high-frequency and high-speed causes the heat generated by the electronic components to increase, which causes the temperature to rise continuously, which seriously threatens the performance of the electronic components during operation. To ensure the normal operation of the electronic components, the large amount of electronic components must be discharged in time. Heat.

To this end, the industry generally uses a heat sink for heat dissipation. The heat sink generally includes a base and a plurality of heat dissipation fins disposed on the base. The bottom surface of the heat dissipation base is a smooth solid metal for attaching to the surface of the central processing unit. . As the size of the central processing unit becomes smaller and smaller, the heat generation is more concentrated. Due to the heat transfer performance of the metal, the heat at the center of the heat dissipation base is often too concentrated, and cannot be effectively transmitted to the periphery of the heat sink, thereby seriously affecting The overall heat dissipation effect makes the performance of the central processing unit declining and it is impossible to maintain effective operation.

In order to overcome the above problems, heat-dissipating devices using heat pipes are increasingly increasing. The heat pipes are provided with capillary structures (such as powder sintered materials, groove structures, wire mesh structures, etc.) in the metal pipe body, and are sealed and filled with working liquids (such as water, alcohol, etc.). ), and then pumped to a vacuum state, depending on the working liquid is heated, the liquid-gas two-phase change to absorb and release heat work Because the heat transfer speed of the heat pipe is fast, non-directional and the heat transfer distance is long, the performance of the heat sink is greatly improved.

At present, the commonly used heat pipe heat dissipating device generally comprises an aluminum bottom plate in contact with a heat source, a plurality of fins horizontally stacked on the bottom plate, and a three U-shaped heat pipe thermally connecting the bottom plate and the fin. The heat pipes include a horizontal portion uniformly embedded on the bottom plate and a vertical portion extending vertically upward from both ends of the horizontal portion and penetrating at both ends of the fin. The horizontal portions of the heat pipes conduct heat from the bottom plate to the vertical portion and then from the vertical portions to the fins, thereby dissipating heat to the surrounding environment to achieve the effect of cooling the electronic components. However, metal materials with high thermal conductivity are generally denser and more expensive, such as copper; metals with low thermal conductivity are generally less dense and less expensive, such as aluminum. Therefore, if the bottom plate is made of aluminum material with relatively low heat conduction, the heat dissipation efficiency will be limited. However, if a copper base plate with a high thermal conductivity is used to improve the efficiency, the cost and weight of the heat sink device are greatly improved. .

The present invention is directed to a heat pipe type heat sink that achieves higher performance at a relatively low cost.

A heat dissipating device includes a base, a heat sink group and at least one heat pipe connecting the base and the heat sink group, the at least one heat pipe comprising an evaporation section and a condensation section penetrating in the heat sink group, the base comprising a fixing And a heat conducting plate coupled to the bottom surface of the fixing frame, the evaporation portion of the at least one heat pipe is received in the fixing frame and is in thermal contact with the heat conducting plate.

Compared with the prior art, the base formed by the combination of the heat-dissipating plate and the fixing frame of the heat-dissipating device uses a material with high thermal conductivity in a high-heat region, and a material with relatively low cost and weight is used around the heat-dissipating device, so that the base is not significant. Increase cost and weight It has better heat transfer performance, which in turn improves the performance of the entire heat sink.

10‧‧‧Base

12‧‧‧ Fixing frame

120‧‧‧Fixed frame

122‧‧‧floor

1220‧‧‧through hole

124‧‧‧ beams

1240‧‧‧Perforation

1242‧‧‧Plywood

14‧‧‧heat conducting plate

140‧‧‧ raised parts

142‧‧‧First accommodating slot

144‧‧‧Second accommodating slot

20‧‧‧ Heat sink set

22‧‧‧ Heat sink

220‧‧‧through hole

222‧‧‧ 缘缘

24‧‧‧ accommodating holes

30‧‧‧Heat management group

32‧‧‧First heat pipe

322‧‧‧First evaporation section

324‧‧‧First Condensation Section

34‧‧‧second heat pipe

342‧‧‧Second evaporation section

344‧‧‧Connection section

346‧‧‧second condensation section

40‧‧‧Top cover

42‧‧‧ top frame

44‧‧‧ top board

46‧‧‧Cylinder

1 is a perspective assembled view of a heat sink according to an embodiment of the present invention.

2 is an exploded perspective view of the heat sink of FIG. 1.

Figure 3 is an inverted view of the heat sink of Figure 1.

Figure 4 is an exploded view of the heat sink of Figure 3.

Figure 5 is a perspective view of the base of Figure 2 in combination with a heat pipe set.

1-4, the heat dissipating device in an embodiment of the present invention is configured to dissipate heat from an electronic component (not shown), and includes a base 10, a heat sink group 20 on the base 10, and a heat conductive connection base 10. And a heat pipe group 30 of the heat sink group 20 and a top cover 40 covering the top of the heat sink group 20.

The base 10 includes a mounting bracket 12 and a heat conducting plate 14 coupled to the bottom of the mounting bracket 12 to engage the heat pipe assembly 30. Preferably, the holder 12 is made of a lower density material such as aluminum or the like so that the base 10 has a lighter quality, thereby reducing the quality of the heat sink as a whole, thereby effectively reducing the load of the electronic component. The fixing frame 12 includes a rectangular fixing frame 120, a bottom plate 122 extending inwardly from the bottom of the fixing frame 120, and a cross beam 124 extending across the middle of the bottom plate 122 and connecting the two ends of the fixing frame 120 to the inner side of the frame. A through hole 1220 is defined in the middle of the bottom plate 122. The shape of the through hole 1220 is adapted to the shape of the heat conducting plate 14 for the heat conducting plate 14 to be embedded therein. Preferably, the through hole 1220 has a rectangular shape. The beam 124 is perpendicular to the two opposite frames of the fixing frame 120 and is located above the through hole 1220 and corresponds to the center line of the through hole 1220. A through hole 1240 is formed in the beam 124. The through hole 1240 has an elongated shape and is located on the beam 124. The middle portion extends along the length of the beam 124. Two opposing plates 1242 extend horizontally outwardly from opposite outer sides of the beam 124. The two clamping plates 1242 extend outwardly from the upper end portion of the beam 124 and are correspondingly located above the through hole 1220 of the bottom plate 122. The fixing frame 120 of the fixing frame 12, the beam 124 and the top surface of the clamping plate 1242 on both sides of the beam 124 are flush with each other to receive the heat sink group 20 thereon.

The heat conducting plate 14 is made of a material having good thermal conductivity, such as copper. The heat conducting plate 14 has a rectangular shape and is sized to fit the through hole 1220 of the fixing frame 12 to be coupled to the middle of the bottom surface of the fixing frame 12 and cover the through hole 1220. . The bottom surface of the heat conducting plate 14 is parallel to the top surface of the fixing frame 12 and is used for contacting the electronic component to absorb heat generated by the electronic component. The top surface of the heat conducting plate 14 forms a convex portion 140, and the top surface of the convex portion 140 is recessed. The first accommodating groove 142 and the second accommodating groove 144 are respectively located at two sides of the first accommodating groove 142, and the first accommodating groove 142 is located in the middle of the convex portion 140 and the second accommodating groove 144. The opposite side edges of the heat conducting plate 14 are parallel.

The heat sink group 20 includes a plurality of heat sinks 22 stacked horizontally. The heat sink 22 has a rectangular shape and is made of a heat conductive material such as copper or aluminum. The heat sinks 22 are equally spaced from each other and are connected to the base 10 . The top surface is parallel. Each of the fins 22 is provided with two rows of through holes 220 spaced apart from each other and arranged in a direction parallel to the two long side edges of the fins 22, and each column includes three spaced through holes 220. An annular rim 222 extends upwardly from an inner periphery of the through hole 220. The through holes 220 and the corresponding sleeves 222 of all the fins 22 of the heat sink group 20 form two rows of corresponding receiving holes 24, and each column includes three spaced receiving holes 24 corresponding to the through holes 220 of the heat sink 220. The receiving hole 24 is perpendicular to the heat sink 22 .

The heat pipe group 30 includes a first heat pipe 32 and two second heat pipes 34 on both sides of the first heat pipe 32. The first heat pipe 32 has a U shape, and includes a first evaporation section 322 and a slave Two first condensation sections 324 extending vertically upward from opposite ends of the first evaporation section 322. The second heat pipe 34 includes a second evaporation section 342, two connecting sections 344 extending horizontally from one end of the second evaporation section 342, and two second condensation sections 346 extending vertically upward from the ends of the two connecting sections 344, respectively. The second evaporation section 342 and the two connecting sections 344 are in the same plane and curved in a U shape, and the two second condensation sections 346 are perpendicular to the plane in which the second evaporation section 342 and the two connecting sections 344 are located.

The top cover 40 includes a top frame 42 having a size and shape conforming to the fixing frame 120 of the fixing frame 12 and a top plate 44 formed on the top of the top frame 42. A plurality of hollow cylinders 46 are protruded downwardly from the bottom surface of the top plate 44. The cylinders 46 respectively correspond to the receiving holes 24 of the heat sink group 20 for receiving the end portions of the heat pipe group 30 protruding from the top of the heat sink group 20. .

Referring to FIG. 5 , when the heat dissipating device is in the assembled state, the convex portion 140 of the heat conducting plate 14 is received in the through hole 1220 of the bottom plate 122 of the fixing frame 12 , and the heat conducting plate 14 is located on the top surface surrounding the convex portion 140 . It is connected to the bottom surface of the bottom plate 122 of the fixing frame 12. The first evaporating section 322 of the first heat pipe 32 is inserted into the through hole 1240 of the cross member 124 of the fixing frame 12, and the lower end portion of the first evaporating section 322 is received in the first receiving groove 142 of the top surface of the heat conducting plate 14. . The second and second evaporating sections 342 of the second heat pipe 34 are respectively received in the second accommodating grooves 144 of the heat conducting plate 14 and parallel to the first evaporating section 322, and are sandwiched between the heat conducting plate 14 and the fixing frame 12 The connecting sections 344 of the two second heat pipes 34 extend from the corresponding second evaporating sections 342 to the two sides, and the connecting sections 344 are received on the bottom plate 122 of the fixing frame 12 and are received in the gaps 1242. The fixing frame 12 of the fixing frame 12 is inside. The first condensation section 324 and the second condensation section 346 of the heat pipe group 30 vertically pass through the top surface of the base 10 fixing frame 12 and pass through the corresponding receiving holes 24 of the heat sink group 20 . The heat sink group 20 is received on the top surface of the base 10. The top cover 40 is placed on the top of the heat sink group 20 and completely covers the heat sink group 20 under the top cover 40 and the base 10 Should be parallel. The upper ends of the first condensation section 324 and the second condensation section 346 are passed up through the fin group 20 and housed in the cylinder 46 inside the top cover 40.

The heat sink group 20 of the heat sink is interposed between the top cover 40 and the base 10, and the evaporation section of the heat pipe group 30 is partially received in the base 10, and the condensation section of the heat pipe group 30 is disposed in the heat sink group 20. And the upper end portion of the condensing section portion protrudes from the top of the fin group 20 and is housed in the top cover 40. Therefore, the heat pipe group 20 is completely accommodated in the heat dissipating device, so as to avoid the overall appearance of the heat dissipating device due to the exposure of the end portion of the heat pipe group 20, so that the heat dissipating device has a compact structure.

The bottom surface of the copper heat conducting plate 14 is in contact with the electronic component to absorb the heat thereof. The heat conducting plate 14 is coupled to the bottom of the fixing frame 12, and the first evaporation section 322 of the first heat pipe 32 and the second evaporation section of the second heat pipe 34. The first condensation section 324 of the first heat pipe 32 and the second condensation section 346 of the second heat pipe 34 are placed in the receiving hole 24 of the heat sink group 20 with the top surface of the fixing frame 12 facing upward. The heat conducting plate 14 conducts heat absorbed from the electronic component to the first evaporation section 322 and the second evaporation section 342 of the heat pipe group 30, and is evenly distributed to the heat dissipation through the first condensation section 324 and the second condensation section 346 of the heat pipe group 30. On the wafer set 20, the base 10 formed by combining the heat conducting plate 14 and the fixing frame 12 uses a metal material having high thermal conductivity in a high heat region, and a metal material having a relatively low cost and weight is used around the substrate, so that the base is not conspicuous. Increased cost and weight have better thermal conductivity, which in turn improves the performance of the entire heat sink.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧Base

12‧‧‧ Fixing frame

120‧‧‧Fixed frame

122‧‧‧floor

1220‧‧‧through hole

124‧‧‧ beams

1240‧‧‧Perforation

1242‧‧‧Plywood

14‧‧‧heat conducting plate

140‧‧‧ raised parts

142‧‧‧First accommodating slot

144‧‧‧Second accommodating slot

20‧‧‧ Heat sink set

22‧‧‧ Heat sink

220‧‧‧through hole

222‧‧‧ 缘缘

24‧‧‧ accommodating holes

30‧‧‧Heat management group

32‧‧‧First heat pipe

322‧‧‧First evaporation section

324‧‧‧First Condensation Section

34‧‧‧second heat pipe

342‧‧‧Second evaporation section

344‧‧‧Connection section

346‧‧‧second condensation section

40‧‧‧Top cover

Claims (7)

A heat dissipating device includes a base, a heat sink group, a first heat pipe connecting the base and the heat sink group, and two second heat pipes located at two sides of the first heat pipe, the first heat pipe including a first evaporation The segment and the two first condensation sections extending upward from the two ends of the first evaporation section are improved in that the base comprises a fixing frame and a heat conducting plate coupled to the bottom surface of the fixing frame, and the first evaporation section of the first heat pipe is received in the The heat conducting plate is made of a material that is in thermal contact with the heat conducting plate. The material of the heat conducting plate has a higher thermal conductivity than the material of the fixing frame. The fixing frame includes a fixing frame and a bottom plate formed at the bottom of the fixing frame, and the first heat pipe is first. The evaporating section is received in the fixing frame, the bottom plate is provided with a through hole corresponding to the heat conducting plate, and the first evaporating section is in contact with the heat conducting plate in the through hole of the bottom plate, and the opposite side of the fixing frame is connected with a crossing of the bottom plate a beam, the beam is provided with a perforation for receiving the first evaporation section. The heat dissipating device of claim 1, wherein the bottom plate through hole is located at a middle portion of the bottom plate, and the cross member is opposite to the middle of the through hole. The heat dissipating device of claim 1, wherein the second heat pipe comprises a second evaporation section, two connecting sections extending horizontally from one end of the second evaporating section, and extending upward from the ends of the two connecting sections respectively. The second condensing section of the second condensing section is received on the bottom plate of the fixing frame and received in the fixing frame of the fixing frame. The heat dissipating device of claim 3, wherein the fixing beam extends two sides to two sides, and the second evaporation sections of the two second heat pipes are respectively sandwiched between the two clamping plates and the heat conducting plate. The heat dissipating device of claim 4, wherein the fixing frame, the beam and the top surface of the clamping plate are flush with each other, and the heat sink group comprises a plurality of fins stacked at intervals and parallel to the top surface of the fixing frame. The heat dissipating device according to any one of claims 3 to 5, wherein the top surface of the heat conducting plate is formed The bulging portion is disposed in the through hole of the bottom plate of the fixing frame, and the protruding portion defines a receiving groove for accommodating the first evaporation section of the first heat pipe and the bottom of the second evaporation section of the second heat pipe. The heat dissipating device according to any one of claims 3 to 5, further comprising a top cover comprising a top frame received on the top of the heat sink group and a top plate formed on the top of the top frame, the top plate A cylinder is extended to the fin group, and the first condensation section of the first heat pipe and the upper end of the second condensation section of the second heat pipe protrude from the top of the fin group and are housed in the corresponding cylinder.