CN113133177A - High-precision multilayer circuit board - Google Patents
High-precision multilayer circuit board Download PDFInfo
- Publication number
- CN113133177A CN113133177A CN201911411650.4A CN201911411650A CN113133177A CN 113133177 A CN113133177 A CN 113133177A CN 201911411650 A CN201911411650 A CN 201911411650A CN 113133177 A CN113133177 A CN 113133177A
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- CN
- China
- Prior art keywords
- plate
- heat
- heat conducting
- conducting
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2045—Protection against vibrations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a high-precision multilayer circuit board which sequentially comprises a current-conducting plate, an insulating plate, a heat-conducting plate and a base plate from top to bottom, wherein a heat-conducting column penetrating through the insulating plate and the current-conducting plate is arranged on the heat-conducting plate, an insulating layer is wrapped on the heat-conducting column, a plurality of heat-conducting pipes are transversely arranged in the heat-conducting plate, and radiating fins are arranged at two ends of each heat-conducting pipe.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a high-precision multilayer circuit board.
Background
The circuit board is an indispensable basic part of all electronic products, is a carrier of all electronic components, and is a main supporting body for mounting and interconnecting electronic components. With the continuous development of electronic technology, the integration level of a circuit board is higher and higher, the number of electronic components on a high-precision multilayer circuit board is higher and higher, and the power is higher and higher, so that the temperature of the surface of the circuit board is also increased, the requirement on the heat dissipation effect of the circuit board is higher and higher, and as electronic products enter the era of component miniaturization, high-density installation and high-heat-generation assembly, in summary, how to provide a circuit board with excellent heat dissipation performance is a problem that needs to be solved urgently by technical personnel in the field at present. At present, the heat dissipation of the high-precision multilayer circuit board is realized by blowing a heat dissipation fan in an electronic product over the surface of a very small element on the circuit board, the heat dissipation is very slow in the heat dissipation mode, the effect is not good, and the service life of the circuit board can be influenced by the performance reduction and even burning of chips and elements due to untimely heat dissipation.
Disclosure of Invention
The present invention is directed to a high-precision multilayer circuit board to solve the above-mentioned problems of the related art.
In order to achieve the purpose, the invention provides the following technical scheme: a high-precision multilayer wiring board comprising:
the heat conduction plate is provided with a heat conduction plate below, the heat conduction plate is provided with heat conduction columns matched with the heat conduction holes, the heat conduction columns are wrapped with insulating films, a plurality of parallel through holes are horizontally formed in the heat conduction plate, heat conduction pipes are arranged in the through holes, two ends of each heat conduction pipe extend out of the heat conduction plate and are provided with radiating fins, a liquid suction core is arranged on the pipe wall of each heat conduction pipe, the heat conduction pipes are pumped into a negative pressure state, a certain amount of cooling liquid is filled in each heat conduction pipe, a base plate is arranged below each heat conduction plate, a plurality of fixing holes penetrating through the heat conduction plates, the insulating plates and the heat conduction plates are formed in the base plate, and screws are arranged in the fixing holes.
Furthermore, a plurality of springs are arranged between the heat-conducting plate and the base plate, and two ends of each spring are respectively fixed on the heat-conducting plate and the base plate.
Furthermore, be provided with a plurality of adjustable buckles on the lateral wall of current conducting plate, the both ends of buckle are fixed respectively the top of current conducting plate with the bottom of heat conducting plate.
Further, the insulating plate and the insulating film are made of silicone rubber.
Further, the heat-conducting plate and the heat-conducting column are made of aluminum.
Further, the wick is made of a capillary porous material.
Further, the heat conduction holes are uniformly distributed around the electric appliance element.
Compared with the prior art, the invention has the beneficial effects that:
according to the high-precision multilayer circuit board, the heat-conducting columns are uniformly dispersed around the electric element, so that heat generated by the electric element can be timely conducted to the heat-conducting plate, after the heat-conducting pipe arranged in the heat-conducting plate absorbs the heat, cooling liquid in the heat-conducting pipe is evaporated and diffused towards two ends, the heat dissipated by vapor in the heat-radiating fin is changed into liquid again, and the liquid flows back into the heat-conducting pipe again through the liquid-absorbing core, so that the heat generated by the electric element is timely dissipated, and the overhigh temperature of the electric element is avoided; the insulating plate and the insulating film are used, so that the problems of short circuit and the like of the circuit board are avoided, and the safety of the circuit board is ensured; the screws and the buckles are matched for use, so that the current conducting plate, the insulating plate and the heat conducting plate are tightly attached; the spring is arranged between the conductive plate and the base plate, so that the vibration generated in the running process of the circuit board is reduced, and the circuit board is prevented from being bent or broken under the action of external force.
Drawings
FIG. 1 is a schematic structural view of the present invention,
the heat conducting plate comprises a conducting plate 1, a conducting plate 2, an insulating plate 3, a heat conducting plate 4, a heat conducting column 5, an insulating film 6, a heat conducting pipe 7, a radiating fin 8, a base plate 9, a screw 10 and a spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a high-precision multilayer wiring board comprising:
the heat conduction plate comprises a heat conduction plate (1), an electric element is arranged on the heat conduction plate (1), an insulation plate (2) is arranged below the heat conduction plate (1), a plurality of heat conduction holes penetrating through the insulation plate (2) are formed in the heat conduction plate (1), a heat conduction plate (3) is arranged below the insulation plate (2), heat conduction columns (4) matched with the heat conduction holes are arranged on the heat conduction plate (3), an insulation film (5) is wrapped on the heat conduction columns (4), a plurality of parallel through holes are horizontally formed in the heat conduction plate (3), heat conduction pipes (6) are arranged in the through holes, two ends of each heat conduction pipe (6) extend out of the heat conduction plate (3) and are provided with heat radiating fins (7), a liquid absorbing core is arranged on the pipe wall of each heat conduction pipe, the liquid absorbing core is pumped into a negative pressure state in each heat conduction, the base plate (8) is provided with a plurality of fixing holes penetrating through the heat-conducting plate, the insulating plate and the heat-conducting plate, and screws (9) are arranged in the fixing holes.
A plurality of springs (10) are arranged between the heat-conducting plate (3) and the base plate (8), and two ends of each spring (10) are fixed on the heat-conducting plate (3) and the base plate (8) respectively.
The side wall of the current-conducting plate (1) is provided with a plurality of adjustable buckles, and two ends of each buckle are respectively fixed at the top of the current-conducting plate (1) and the bottom of the heat-conducting plate (3).
The insulating plate (2) and the insulating film (5) are both made of silica gel.
The heat conducting plate (3) and the heat conducting columns (4) are made of aluminum.
The wick is made of a capillary porous material.
The heat conduction holes are uniformly distributed around the electric appliance element.
In summary, in the invention, the heat-conducting columns are uniformly dispersed around the electrical component, so that heat generated by the electrical component can be timely conducted onto the heat-conducting plate, after the heat-conducting pipe arranged in the heat-conducting plate absorbs the heat, the cooling liquid in the heat-conducting pipe is evaporated and diffused towards two ends, the heat dissipated by the vapor in the heat-radiating fin is changed into liquid again, and the liquid flows back into the heat-conducting pipe again through the liquid-absorbing core, so that the heat generated by the electrical component is timely dissipated, and the over-high temperature of the electrical; the insulating plate and the insulating film are used, so that the problems of short circuit and the like of the circuit board are avoided, and the safety of the circuit board is ensured; the screws and the buckles are matched for use, so that the current conducting plate, the insulating plate and the heat conducting plate are tightly attached; the spring is arranged between the conductive plate and the base plate, so that the vibration generated in the running process of the circuit board is reduced, and the circuit board is prevented from being bent or broken under the action of external force.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A high-precision multilayer circuit board is characterized by comprising a conductive plate, wherein an electric element is arranged on the conductive plate, an insulating plate is arranged below the conductive plate, a plurality of heat conducting holes penetrating through the insulating plate are formed in the conductive plate, a heat conducting plate is arranged below the insulating plate, heat conducting columns matched with the heat conducting holes are arranged on the heat conducting plate, insulating films wrap the heat conducting columns, a plurality of parallel through holes are horizontally formed in the heat conducting plate, heat conducting pipes are arranged in the through holes, two ends of each heat conducting pipe extend out of the heat conducting plate and are provided with radiating fins, a liquid absorbing core is arranged on the pipe wall of each heat conducting pipe, the heat conducting pipes are pumped into a negative pressure state, a certain amount of cooling liquid is filled in each heat conducting pipe, a base plate is arranged below the heat conducting plate, and a plurality of, and a screw is arranged in the fixing hole.
2. The high-precision multilayer circuit board according to claim 1, wherein a plurality of springs are disposed between said heat-conducting plate and said substrate, and both ends of said springs are fixed to said heat-conducting plate and said substrate, respectively.
3. The high-precision multilayer circuit board according to claim 1 or 2, wherein a plurality of adjustable buckles are arranged on the side wall of the conductive plate, and two ends of each buckle are respectively fixed on the top of the conductive plate and the bottom of the conductive plate.
4. The high-precision multilayer wiring board according to claim 1, wherein the insulating plate and the insulating film are each made of silicone rubber.
5. The high-precision multilayer wiring board of claim 1, wherein the thermally conductive plate and thermally conductive posts are made of aluminum.
6. The high-precision multilayer wiring board of claim 1, wherein the wick is made of a capillary porous material.
7. The high-precision multilayer wiring board according to claim 1, wherein the heat-conducting holes are uniformly distributed around the electric component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911411650.4A CN113133177A (en) | 2019-12-31 | 2019-12-31 | High-precision multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911411650.4A CN113133177A (en) | 2019-12-31 | 2019-12-31 | High-precision multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113133177A true CN113133177A (en) | 2021-07-16 |
Family
ID=76770616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911411650.4A Pending CN113133177A (en) | 2019-12-31 | 2019-12-31 | High-precision multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113133177A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114423214A (en) * | 2022-01-24 | 2022-04-29 | 广州弘高科技股份有限公司 | High-precision multilayer circuit board with good heat dissipation performance |
-
2019
- 2019-12-31 CN CN201911411650.4A patent/CN113133177A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114423214A (en) * | 2022-01-24 | 2022-04-29 | 广州弘高科技股份有限公司 | High-precision multilayer circuit board with good heat dissipation performance |
| CN114423214B (en) * | 2022-01-24 | 2022-10-25 | 广州弘高科技股份有限公司 | Multilayer circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210716 |
|
| WD01 | Invention patent application deemed withdrawn after publication |