CN216146503U - Double-sided circuit board - Google Patents
Double-sided circuit board Download PDFInfo
- Publication number
- CN216146503U CN216146503U CN202121503766.3U CN202121503766U CN216146503U CN 216146503 U CN216146503 U CN 216146503U CN 202121503766 U CN202121503766 U CN 202121503766U CN 216146503 U CN216146503 U CN 216146503U
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- circuit board
- board body
- heat dissipation
- double
- dissipation fan
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a double-sided circuit board, which comprises a circuit board body, wherein the circuit board body comprises an aluminum substrate, heat-conducting insulating layers are arranged on the upper end surface and the lower end surface of the aluminum substrate, a circuit layer is arranged on the upper end surface of the heat-conducting insulating layers, a plurality of electronic elements are welded on the upper end surface of the circuit layer, supporting seats are arranged on two sides of the circuit board body, a sliding groove matched with the circuit board body is formed in the inner side wall of each supporting seat, the circuit board body is movably arranged in the sliding groove, a condensation groove is arranged in each supporting seat, and a condensation duct is embedded in each condensation groove; the circuit board up end still electric connection has radiator unit, radiator unit includes heat dissipation fan installing frame, install miniature heat dissipation fan in the heat dissipation fan installing frame, heat dissipation fan installing frame surface is provided with the dust cover.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a double-sided circuit board.
Background
The double-sided circuit board is a circuit board body production base and provides instructions for producing double-sided circuit board bodies, PCB boards, circuit boards, SMT welding and the like. The circuit board enables the circuit to be visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. With the development of technology, the circuit board is also continuously developed and advanced, wherein the double-sided circuit board is also widely used. The double-sided circuit board on the market has poor heat dissipation effect, and the circuit board is easy to have overhigh temperature after being used, so that heat dissipation is inconvenient, and elements on the circuit board are damaged.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model provides a double-sided circuit board which can effectively solve the problems in the background art.
The technical scheme adopted by the utility model for solving the technical problems is as follows:
a double-sided circuit board comprises a circuit board body, wherein the circuit board body comprises an aluminum substrate, heat-conducting insulating layers are arranged on the upper end face and the lower end face of the aluminum substrate, a circuit layer is arranged on the upper end face of each heat-conducting insulating layer, a plurality of electronic elements are welded on the upper end face of each circuit layer, supporting seats are arranged on two sides of the circuit board body, sliding grooves matched with the circuit board body are formed in the inner side walls of the supporting seats, the circuit board body is movably arranged in the sliding grooves, condensing grooves are formed in the supporting seats, and condensing pipes are embedded in the condensing grooves; the circuit board body up end still electric connection has radiator unit, radiator unit includes heat dissipation fan installing frame, install miniature heat dissipation fan in the heat dissipation fan installing frame, heat dissipation fan installing frame surface is provided with the dust cover.
As a further explanation, a movable gap is reserved between the sliding groove and the circuit board body, and the movable gap is 0.1-0.5 mm.
As further elaboration, the outer surface of the circuit layer is uniformly coated with a heat dissipation coating layer.
As a further elaboration, the upper end face of the circuit layer is further provided with a plurality of groups of radiating fins, and the radiating fins are distributed on the circuit layer.
As a further illustration, the condensing conduit is filled with a condensate.
Compared with the prior art, the utility model has the beneficial effects that:
according to the double-sided circuit board provided by the embodiment, through the matching among the condensation groove, the condensation conduit and the condensate, after the double-sided circuit board generates heat in use, the heat can be absorbed by the condensate in the condensation conduit, the condensate is vaporized and flows in the condensation conduit after being heated, and the released heat is condensed into liquid when the condensate flows to a low-temperature position, so that the heat of the double-sided circuit board is quickly transferred and dissipated, and therefore, the circuit board body is cooled, the temperature of the circuit board body is prevented from being higher, and the normal use of the circuit board body is ensured; through the arrangement of the miniature heat dissipation fan, heat generated by the circuit board body can be effectively dissipated, the heat is prevented from being accumulated on the circuit layer, and the faults of electronic elements are reduced; meanwhile, the dust cover can effectively prevent dust from falling onto the heat dissipation fan, and the normal operation of the circuit board body is ensured; in addition, through the setting of fin and heat dissipation coating layer, can effectually distribute away the heat that the circuit board body produced to the radiating effect of effectual improvement circuit board body.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a double-sided circuit board according to the present invention;
FIG. 2 is a schematic structural diagram of a double-sided circuit board according to the present invention;
fig. 3 is another schematic structural diagram of a double-sided circuit board according to the present invention.
Reference numbers in the figures: 1-a circuit board body; 2-an aluminum substrate; 3-heat conducting insulating layer; 4-a circuit layer; 5-an electronic component; 6-a support seat; 7-a condensation tank; 8-a condensation conduit; 9-a heat dissipation assembly; 10-a miniature heat dissipation fan; 11-a dust cover; 12-a heat dissipation coating layer; 13-a heat sink; 14-a condensate; 15-a heat dissipation fan mounting frame; 16-chute.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-3, the double-sided circuit board provided in this embodiment includes a circuit board body 1, the circuit board body 1 includes an aluminum substrate 2, heat-conducting insulating layers 3 are disposed on upper and lower end surfaces of the aluminum substrate 2, a circuit layer 4 is disposed on an upper end surface of the heat-conducting insulating layer 3, a plurality of electronic components 5 are welded on an upper end surface of the circuit layer 4, supporting seats 6 are disposed on two sides of the circuit board body 1, a chute 16 adapted to the circuit board body 1 is disposed on an inner side wall of each supporting seat 6, the circuit board body 1 is movably disposed in the chute 16, a condensation groove 7 is disposed in the supporting seat 6, a condensation duct 8 is embedded in the condensation groove 7, a condensate 14 is injected into the condensation duct 8, and after heat is generated by the double-sided circuit board during use through cooperation between the condensation groove 7, the condensation duct 8 and the condensate 14, the heat can be absorbed by condensate 14 in the condensing pipe 8, the heated condensate 14 is vaporized and flows in the condensing pipe 8, and the released heat condenses into liquid when flowing to a low-temperature position, so that the heat of the double-sided circuit board is quickly transferred and dissipated, the circuit board body 1 is cooled, the temperature of the circuit board body 1 is prevented from being high, and the normal use of the circuit board body 1 is ensured.
The upper end face of the circuit board body 1 is also electrically connected with a heat dissipation assembly 9, the heat dissipation assembly 9 comprises a heat dissipation fan installation frame 15, a miniature heat dissipation fan 10 is installed in the heat dissipation fan installation frame 15, a dust cover 11 is arranged on the outer surface of the heat dissipation fan installation frame 15, and through the arrangement of the miniature heat dissipation fan 10, heat generated by the circuit board body 1 can be effectively dissipated, the heat is prevented from being accumulated on the circuit layer 4, and the occurrence of faults of the electronic element 5 is reduced; meanwhile, the dust cover 11 can effectively prevent dust from falling into the heat dissipation fan, and normal operation of the circuit board body 1 is guaranteed.
The outer surface of the circuit layer 4 is uniformly coated with the heat dissipation coating layer 12, heat on the heat conduction insulating layer 3 can be effectively conducted to the heat dissipation coating layer 12 through the arrangement of the heat dissipation coating layer 12, the heat dissipation coating layer 12 discharges the heat, and the heat dissipation performance of the whole circuit board is greatly improved.
The upper end face of the circuit layer 4 is also provided with a plurality of groups of radiating fins 13, the radiating fins 13 are distributed on the circuit layer 4, and heat generated by the circuit board body 1 can be effectively dissipated through the arrangement of the radiating fins 13, so that the radiating effect of the circuit board body 1 is effectively improved.
In summary, according to the double-sided circuit board provided by the embodiment, through the cooperation of the condensation groove 7, the condensation duct 8 and the condensate 14, after the double-sided circuit board generates heat during use, the heat can be absorbed by the condensate 14 in the condensation duct 8, the condensate 14 is vaporized and flows in the condensation duct 8 after being heated, and when the double-sided circuit board flows to a low-temperature position, the released heat is condensed into a liquid state, so that the heat of the double-sided circuit board is quickly transferred and dissipated, and therefore the circuit board body 1 is cooled, the circuit board body 1 is prevented from being high in temperature, and the normal use of the circuit board body 1 is ensured; through the arrangement of the micro heat dissipation fan 10, heat generated by the circuit board body 1 can be effectively dissipated, the heat is prevented from being accumulated on the circuit layer 4, and the faults of the electronic element 5 are reduced; meanwhile, the dust cover 11 can effectively prevent dust from falling onto the heat dissipation fan, and the normal operation of the circuit board body 1 is ensured; in addition, through the setting of fin 13 and heat dissipation coating layer 12, can effectually distribute away the heat that circuit board body 1 produced to the radiating effect of effectual improvement circuit board body 1.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (5)
1. A double-sided circuit board, its characterized in that: the circuit board comprises a circuit board body, wherein the circuit board body comprises an aluminum substrate, heat-conducting insulating layers are arranged on the upper end surface and the lower end surface of the aluminum substrate, a circuit layer is arranged on the upper end surface of each heat-conducting insulating layer, a plurality of electronic elements are welded on the upper end surface of each circuit layer, supporting seats are arranged on two sides of the circuit board body, sliding grooves matched with the circuit board body are formed in the inner side walls of the supporting seats, the circuit board body is movably arranged in the sliding grooves, condensing grooves are formed in the supporting seats, and condensing pipes are embedded in the condensing grooves; the circuit board body up end still electric connection has radiator unit, radiator unit includes heat dissipation fan installing frame, install miniature heat dissipation fan in the heat dissipation fan installing frame, heat dissipation fan installing frame surface is provided with the dust cover.
2. The double-sided wiring board of claim 1, wherein: a movable gap is reserved between the sliding groove and the circuit board body, and the movable gap is 0.1-0.5 mm.
3. The double-sided wiring board of claim 1, wherein: and the outer surface of the circuit layer is uniformly coated with a heat dissipation coating layer.
4. The double-sided wiring board of claim 1, wherein: the upper end face of the circuit layer is also provided with a plurality of groups of radiating fins which are distributed on the circuit layer.
5. The double-sided wiring board of claim 1, wherein: and condensate is injected into the condensation conduit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121503766.3U CN216146503U (en) | 2021-07-01 | 2021-07-01 | Double-sided circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121503766.3U CN216146503U (en) | 2021-07-01 | 2021-07-01 | Double-sided circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216146503U true CN216146503U (en) | 2022-03-29 |
Family
ID=80801421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121503766.3U Active CN216146503U (en) | 2021-07-01 | 2021-07-01 | Double-sided circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216146503U (en) |
-
2021
- 2021-07-01 CN CN202121503766.3U patent/CN216146503U/en active Active
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