CN114501961A - Electronic device and method for manufacturing the same - Google Patents
Electronic device and method for manufacturing the same Download PDFInfo
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- CN114501961A CN114501961A CN202210277531.XA CN202210277531A CN114501961A CN 114501961 A CN114501961 A CN 114501961A CN 202210277531 A CN202210277531 A CN 202210277531A CN 114501961 A CN114501961 A CN 114501961A
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- heat dissipation
- heating element
- dissipation assembly
- liquid metal
- heat
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The technical scheme of the application discloses an electronic device and a preparation method thereof, wherein the electronic device comprises: the circuit board is fixedly arranged in the shell of the electronic equipment; the heating element is fixedly arranged on the circuit board and is electrically connected with the circuit board, and the heating element generates heat when in a working state; the heat dissipation assembly is fixedly connected with the heating element, is in contact with the heating element and is used for exchanging heat with a fluid medium; the liquid metal is positioned between the microstructures of the contact surfaces of the heating elements and between the microstructures of the contact surfaces of the heat dissipation assembly and used for reducing the thermal resistance between the heat dissipation assembly and the heating elements; and the sealing member surrounds the periphery of the heating element and is used for sealing the liquid metal and preventing the liquid metal from leaking. According to the technical scheme, the speed of heat transfer to the heat dissipation assembly caused by the work of the heating assembly is increased, and the heat dissipation performance is improved.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to electronic equipment and a preparation method thereof.
Background
With the continuous development of science and technology, more and more electronic devices are used in daily life and work of people, bring huge convenience to daily life and work of people, and become an indispensable important tool for people at present.
In order to meet the use requirements of people, a large number of electronic components are often integrated in electronic equipment to realize various functions. The electronic component is generally a heating element, and generates heat during operation. If the heat cannot be dissipated timely, the performance of the heating element is affected, and the reliability and stability of the electronic device are further affected.
In the prior art, a heat dissipation module is generally directly bonded and fixed on a heating element through a heat conducting adhesive. However, for a heating element with high power consumption, the requirement on the temperature condition is high, and the heat dissipation performance cannot meet the requirement in a conventional mode of bonding a heat dissipation module through heat conducting glue.
Disclosure of Invention
In view of this, the present application provides an electronic device and a method for manufacturing the same, and the scheme is as follows:
an electronic device, comprising:
the circuit board is fixedly arranged in the shell of the electronic equipment;
the heating element is fixedly arranged on the circuit board and is electrically connected with the circuit board, and the heating element generates heat when in a working state;
the heat dissipation assembly is fixedly connected with the heating element, is in contact with the heating element and is used for exchanging heat with a fluid medium;
the liquid metal is positioned between the microstructures of the contact surfaces of the heating elements and between the microstructures of the contact surfaces of the heat dissipation assemblies and used for reducing the thermal resistance between the heat dissipation assemblies and the heating elements;
and the sealing member surrounds the periphery of the heating element and is used for sealing the liquid metal and preventing the liquid metal from leaking.
Preferably, in the electronic apparatus, the sealing member is a connecting member between the heat dissipating component and the heat generating element;
the seal in the first state also serves to support the heat dissipation assembly.
Preferably, in the electronic device, the heat dissipation assembly is compressed to the first state by the elasticity of the sealing member in the second state during the connection process between the heat dissipation assembly and the heat generating element, so that the heat dissipation assembly is in zero-distance contact with the heat generating element, the liquid metal is located between the microstructures of the contact surfaces of the heat generating element and between the microstructures of the contact surfaces of the heat dissipation assembly, and the liquid metal is prevented from leaking.
Preferably, in the electronic device, when the sealing member is in the second state, a side surface of the heat generating element facing away from the circuit board has a plurality of liquid droplets of the liquid metal arranged in a lattice;
when the sealing element is in the first state, the liquid drops of the liquid metal arranged in the dot matrix are compressed and diffused by the heat dissipation assembly, and the micro structures of the contact surfaces of the heating element and the micro structures of the contact surfaces of the heat dissipation assembly are filled in a seamless mode.
Preferably, in the electronic apparatus, the heat generating element includes: the device comprises a substrate and a boss positioned on the substrate; the surface of one side of the substrate, which is far away from the boss, is fixed on the circuit board;
the sealing element surrounds the boss and is provided with an opening exposing the boss;
wherein the heat dissipation assembly covers the opening and abuts against the sealing member.
Preferably, in the electronic device, at least one of the following modes is included:
further comprising a protective material surrounding the seal;
a preset gap is formed between the sealing element and the side wall of the heating element, and the liquid heat-conducting medium is arranged in the preset gap;
the heat conductivity coefficient of the liquid metal is more than 20W/m.K;
the maximum thickness of the liquid metal between the heat dissipation assembly and the heat generating element is no more than 20 μm.
Preferably, in the electronic apparatus, a surface of the heat generating element facing the heat dissipating component is a first contact surface; the surface of the heat dissipation assembly facing the heating element is a second contact surface;
the first contact surface is provided with a plurality of first micro-protrusions, and first micro-recesses are formed between every two adjacent first micro-protrusions; the liquid metal is filled between the first micro-protrusions and the second surface and between the first micro-recesses and the second contact surface;
and/or the second contact surface is provided with a plurality of second micro-protrusions, and second micro-recesses are arranged between the second micro-protrusions; the liquid metal is filled between the second micro-protrusion and the first contact surface, and is filled between the second micro-recess and the first contact surface.
Preferably, in the electronic device, the heat dissipation assembly is fixed to the circuit board by a fixing member, and the heat dissipation assembly applies a force to the sealing member by the fixing member, so that the sealing member is in a first state of being compressed;
wherein the fixing member is located on a side of the sealing member facing away from the heat generating element.
The application also provides a preparation method of the electronic equipment, which comprises the following steps:
bonding a heating element on the circuit board; the heating element is fixedly arranged on the circuit board and electrically connected with the circuit board, and the heating element generates heat in a working state;
after liquid metal is arranged on the surface of one side, away from the circuit board, of the heating element, a heat dissipation assembly is fixedly connected above the heating element on the basis of a sealing piece surrounding the heating element, and the heat dissipation assembly is in contact with the heating element and used for exchanging heat with a fluid medium;
the liquid metal is positioned between the microstructures of the contact surfaces of the heating elements and between the microstructures of the contact surfaces of the heat dissipation assembly and used for reducing the thermal resistance between the heat dissipation assembly and the heating elements; the sealing element is used for sealing the liquid metal and preventing the liquid metal from leaking.
Preferably, in the above manufacturing method, after the liquid metal is disposed on a surface of the heating element on a side away from the circuit board, a heat dissipation assembly is fixedly connected above the heating element based on a sealing member surrounding the heating element, and the method includes:
arranging a plurality of liquid metal droplets arranged in a lattice manner on the surface of one side of the heating element, which is far away from the circuit board;
fixing the heat dissipation assembly on the heating element, wherein the heat dissipation assembly is compressed to the first state through the elasticity of the sealing piece in the second state in the process of connecting the heat dissipation assembly and the heating element, so that the heat dissipation assembly is in zero-distance contact with the heating element, the liquid metal is positioned between the microstructures of the contact surfaces of the heating element and between the microstructures of the contact surfaces of the heat dissipation assembly, and the liquid metal is prevented from leaking.
As can be seen from the above description, in the electronic device and the manufacturing method thereof provided in the technical solution of the present application, the electronic device includes: the circuit board is fixedly arranged in the shell of the electronic equipment; the heating element is fixedly arranged on the circuit board and is electrically connected with the circuit board, and the heating element generates heat when in a working state; the heat dissipation assembly is fixedly connected with the heating element, is in contact with the heating element and is used for exchanging heat with a fluid medium; the liquid metal is positioned between the microstructures of the contact surfaces of the heating elements and between the microstructures of the contact surfaces of the heat dissipation assembly and used for reducing the thermal resistance between the heat dissipation assembly and the heating elements; and the sealing member surrounds the periphery of the heating element and is used for sealing the liquid metal and preventing the liquid metal from leaking. According to the technical scheme, the heating element is in contact with the radiating assembly and is filled with the microstructures on the opposite surface of the radiating assembly through the liquid metal, so that the speed of heat generated by the working of the heating assembly and transferred to the radiating assembly is increased, and the radiating performance is improved. And the liquid metal is sealed by the sealing member, so that the liquid metal can be prevented from leaking.
Drawings
In order to more clearly illustrate the embodiments of the present application or technical solutions in related arts, the drawings used in the description of the embodiments or prior arts will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
The structures, proportions, and dimensions shown in the drawings and described in the specification are for illustrative purposes only and are not intended to limit the scope of the present disclosure, which is defined by the claims, but rather by the claims, it is understood that these drawings and their equivalents are merely illustrative and not intended to limit the scope of the present disclosure.
FIG. 1 is a schematic diagram of a conventional heat dissipation structure;
fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;
FIG. 3 is an enlarged view of a portion of the contact surface of the heat generating component and the heat dissipating assembly of FIG. 2;
fig. 4 is a schematic structural diagram of another electronic device provided in the embodiment of the present application;
fig. 5 is a schematic structural diagram of another electronic device according to an embodiment of the present application.
Detailed Description
The embodiments in this application will be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1, fig. 1 is a schematic diagram of a conventional heat dissipation structure, wherein a heat dissipation module 13 is fixed on a surface of a heating element 11 by bonding via a thermal conductive adhesive 12. The thermally conductive paste 12 includes an organic paste base material and particulate matter mixed in the base material.
First, the thickness of the thermal conductive paste 12 is limited by the coating process required for the substrate and the size of the filled particles, and the minimum thickness is not less than 20 μm and is larger. The larger heat conductive adhesive 12 not only affects the heat transfer rate, but also increases the thickness of the electronic device.
Secondly, the filling capability (wettability) of the thermal conductive adhesive 12 is poor, and the micro structure on the surface of the heating element 11 and the micro structure of the heat dissipation module 13 cannot be effectively filled, so that a small air gap exists between the two, which causes a large thermal resistance between the two, and affects the speed of transferring the heat of the heating element 11 to the heat dissipation module 13.
Furthermore, due to the limitation of materials, the thermal conductivity of the thermal conductive adhesive is small, generally not more than 10W/m, and the heat dissipation performance cannot be effectively improved.
In view of this, an embodiment of the present application provides an electronic device and a manufacturing method thereof, in which a heating element is arranged to contact a heat dissipation assembly, and a microstructure of a surface of the heating element opposite to the heat dissipation assembly is filled with a liquid metal, so that a speed of transferring heat generated by the operation of the heating assembly to the heat dissipation assembly is increased, and thus heat dissipation performance is improved. And the liquid metal is sealed by the sealing member, so that the liquid metal can be prevented from leaking.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description.
As shown in fig. 2 and fig. 3, fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present application, and fig. 3 is a partial enlarged view of a contact surface between a heat generating element and a heat dissipating assembly in fig. 2, where the electronic device includes:
the circuit board 21 is fixedly arranged in a shell of the electronic equipment;
the heating element 22 is fixedly arranged on the circuit board 21 and electrically connected with the circuit board 21, and the heating element 22 generates heat when in a working state;
the heat dissipation assembly 23 is fixedly connected with the heating element 22, and the heat dissipation assembly 23 is in contact with the heating element 22 and is used for exchanging heat with a fluid medium;
the liquid metal 24 is positioned between the microstructures of the contact surfaces of the heating element 22 and between the microstructures of the contact surfaces of the heat dissipation component 23, and is used for reducing the thermal resistance between the heat dissipation component 23 and the heating element 22;
a seal 25, said seal 25 surrounding said heating element 22 for sealing said liquid metal 24 against leakage of said liquid metal 24.
The heat dissipation assembly 23 may be a heat sink or a heat pipe. The heat dissipation assembly 23 is in the fluid medium environment. The heat dissipation assembly 23 exchanges heat with a fluid medium, such as air or water.
When the fluid medium is air, the electronic device further includes an active heat dissipation member, and the active heat dissipation member is used to accelerate the flow speed of the fluid medium, so as to accelerate the heat dissipation speed of the surface of the heat dissipation assembly 23. The active heat sink may be a fan.
In the electronic device according to the embodiment of the present application, the heating element 22 and the heat dissipation assembly 23 are in direct contact, and the two are not bonded and fixed by a heat conductive adhesive, so that the thickness is reduced. Moreover, the heating element 22 and the heat dissipation assembly 23 can conduct heat in a contact manner, so that the conduction speed of heat from the heating element 22 to the heat dissipation assembly 23 is increased. And the liquid metal is used for filling the microstructure between the opposite contact surfaces of the heating element 22 and the heat dissipation assembly 23, so that a better filling effect is realized based on the fluidity of the liquid material, and meanwhile, the liquid metal has a higher heat conductivity coefficient, so that the conduction speed of heat from the heating element 22 to the heat dissipation assembly 23 can be further improved.
In the embodiment of the present application, the sealing member 25 is a connection member between the heat dissipation assembly 23 and the heat generating element 22; the seal 25 in the first state also serves to support the heat sink assembly. Therefore, the sealing element 25 is used for bearing and fixing the heat dissipation assembly 23 and is used as a connecting piece of the heat dissipation assembly 23 and the heating element 22, other structural parts for installing and fixing the heat dissipation assembly 23 do not need to be added independently, the equipment structure is simplified, and the manufacturing cost is reduced.
When the sealing member 25 is in the first state, the sealing member 25 is elastically compressed by the heat dissipation assembly 23, and at this time, the height of the side surface of the sealing member 25 facing away from the circuit board 21 and the height of the side surface of the heating element 22 facing away from the circuit board 21 satisfy the same condition, that is, the height of the side surface of the sealing member 25 facing away from the circuit board 21 and the height of the side surface of the heating element 22 facing away from the circuit board 21 are the same, or are approximately equal to the height of the side surface of the heating element 22 facing away from the circuit board 21 and not less than the height of the side surface of the heating element 22 facing away from the circuit board 21.
The sealing member 25 comprises an elastically deformable elastic member. The heat dissipation assembly 23 is compressed to the first state by the elasticity of the sealing member 25 in the second state during the connection process of the heat dissipation assembly 23 and the heating element 22, so that the heat dissipation assembly 23 is connected with the heating element 22 for zero distance contact, the liquid metal 24 is located between the microstructures of the contact surface of the heating element 22 and between the microstructures of the contact surface of the heat dissipation assembly 23, and the liquid metal is prevented from leaking. Wherein, when the sealing member 25 is in the second state, it refers to a state that the sealing member 25 is not compressed, and a height of a side surface of the sealing member 25 facing away from the circuit board 21 is greater than a height of a side surface of the heating element 22 facing away from the circuit board 21.
Based on the elastic property of the sealing member 25, the heat dissipation assembly 23 is fixedly compressed, so that the direct sealing performance of the contact surface of the heat dissipation assembly 23 and the sealing member 25 is ensured, and the leakage of the liquid metal 24 is avoided.
As shown in fig. 2, a predetermined gap 26 may be provided between the sealing member 25 and the sidewall of the heating element 22, and the predetermined gap is used for accommodating the liquid metal 24 overflowing from the contact surface between the heat dissipation assembly 23 and the heating element 22 when the heat dissipation assembly 23 presses the surface of the heating element 22.
As shown in fig. 4, fig. 4 is a schematic structural diagram of another electronic device provided in the embodiment of the present application, and based on the above embodiment, in the manner shown in fig. 4, a protective material 27 surrounding the sealing member 25 is further included. The protective material 27 is used to prevent damage from mechanical impact. The protective material 27 may be foam.
Alternatively, the heat dissipation assembly 23 may be fixed to the circuit board 21 by a fixing member 28, and the heat dissipation assembly 23 compresses the sealing member 25 by the fixing member 28, so that the sealing member 25 is elastically compressed.
In the embodiment of the present application, when the sealing member 25 is in the second state, a side surface of the heating element 22 facing away from the circuit board 21 has a plurality of liquid droplets of the liquid metal 24 arranged in a lattice; when the sealing member 25 is in the first state, the liquid droplets of the liquid metal 24 arranged in the plurality of lattices are compressed and diffused by the heat dissipation assembly 23, and no gap is filled between the microstructures of the contact surfaces of the heat generating element 22 and between the microstructures of the contact surfaces of the heat dissipation assembly 23.
The size and shape of the liquid drop of the liquid metal 24 can be precisely controlled, so that the dosage of the liquid metal 24 is moderate, on one hand, the micro-structure that the respective contact surfaces of the heating element 22 and the heat dissipation assembly 23 cannot be completely filled due to insufficient dosage of the liquid metal 24 is avoided, and on the other hand, the liquid metal 24 overflows due to excessive dosage of the liquid metal 24, so that the liquid metal 24 cannot be effectively sealed by the sealing element 25.
In the embodiment shown in fig. 2 and 4, the heating element 22 has a flat plate structure. The sealing member 25 may be laid out based on the shape of the heating element 22.
As shown in fig. 5, fig. 5 is a schematic structural diagram of another electronic device provided in this embodiment of the present application, and based on the foregoing embodiment, in a manner shown in fig. 5, the heating element 22 includes: a substrate 221 and a boss 222 located on the substrate 221; the surface of one side of the substrate 221, which faces away from the boss 222, is fixed on the circuit board 21; the seal 25 surrounds the boss 222 and has an opening exposing the boss 222; the sealing member 25 is located on a side surface of the substrate 221 facing away from the circuit board 21. Wherein the heat dissipation assembly covers the opening and abuts against the sealing member.
In the embodiment shown in fig. 5, since the heating element 22 has the boss 222, a gap may be provided between the sealing member 25 and the sidewall of the boss 222 to collect the liquid metal 24 overflowing from the contact surface of the heat dissipating assembly 23 and the heating element 22 when they are pressed against each other.
In the manner shown in fig. 5, in order to improve the protection effect, the electronic device further includes: a protective material 27, said protective material 27 surrounding said seal 25. The protective material 27 is located on the surface of the circuit board 21 and compressed by the heat dissipation assembly 23 to improve the sealing effect.
As mentioned above, a predetermined gap 26 is formed between the sealing member 25 and the sidewall of the heating element 22, and the liquid heat-conducting medium 24 is disposed in the predetermined gap 26 to collect the liquid metal 24 overflowing from the contact surface between the heat dissipation assembly 23 and the heating element 22 when they are pressed against each other.
In the embodiment of the present application, the liquid metal 24 is used to fill the micro-structures on the contact surface of the heat dissipation assembly 23 and the heating element 22, and the liquid metal 24 has a higher thermal conductivity coefficient relative to the heat conductive adhesive made of an organic material, so that the heat dissipation speed can be improved. Wherein the liquid metal 24 has a thermal conductivity greater than 20W/m.K.
Since the heat dissipation assembly 23 is in direct contact with the heat generating element 22, the liquid metal 24 fills the microstructure of the two opposite surfaces, and therefore the thickness of the liquid metal 24 is small, which is equal to the maximum height formed by the microstructure on the contact surface of the heat dissipation assembly 23 and the heat generating element 22. Typically, the maximum thickness of the liquid metal 24 between the heat dissipation assembly 23 and the heat generating element 22 does not exceed 50 μm.
For the heating element 22, which is generally a chip prepared by a semiconductor process, the surface of the heating element, which is used for contacting with the heat dissipation assembly 23, is generally processed by a planarization process such as CMP (chemical mechanical polishing), and the like, and has the advantages of small roughness, good surface smoothness, good planarization and small microstructure size. In the heat dissipating member 23, the surface thereof to be in contact with the heat generating element 22 is generally metal-plated, and the surface roughness is large. Therefore, in the embodiment, the maximum thickness of the liquid metal 24 between the heat dissipation assembly 23 and the heat generating element 22 depends on the surface roughness of the heat dissipation assembly 23 and the surface roughness of the heat generating element 22, and if the roughness of the respective contact surfaces of the heat generating element 22 and the heat dissipation element 23 is small, the maximum thickness of the liquid metal 24 between the heat dissipation assembly 23 and the heat generating element 22 can be no more than 30 μm, and can reach 20 μm or even less.
The surface of the heating element 22 facing the heat dissipation assembly 23 is a first contact surface; the surface of the heat dissipation assembly 23 facing the heat generating element 22 is a second contact surface. In an actual product, the first contact surface and the second contact surface have certain roughness because the first contact surface and the second contact surface have no absolutely smooth planes. As shown in fig. 3, the first contact surface has a plurality of first micro-protrusions, and a first micro-recess is formed between adjacent first micro-protrusions; the liquid metal 24 is filled between the first micro-protrusions and the second surface, and between the first micro-recesses and the second contact surface; and/or the second contact surface is provided with a plurality of second micro-protrusions, and second micro-recesses are arranged between the second micro-protrusions; the liquid metal is filled between the second micro-protrusion and the first contact surface, and is filled between the second micro-recess and the first contact surface. Based on the liquid fluidity of the liquid metal 24, the microstructure between the two opposite contact surfaces can be completely filled, so that good thermal contact without gas gaps between the opposite contact surfaces of the heating element 22 and the heat dissipation assembly 23 is realized, and the heat dissipation efficiency is improved.
To the tradition heat conduction glue that has the particulate matter, because the particulate matter has certain size and incompressible, when the particulate matter is located heating element 22 or the micro-structure on the cooling module 23 contact surface, can lead to filling incompletely, form the pore space, because substrate mobility is poor and the particulate matter is incompressible, when setting up cooling module 23 in heating element 22 top, must reserve the heat conduction glue after certain between the two. In the technical scheme of the application, a plurality of liquid drops arranged in a lattice manner are formed on the surface of the heating element 22 through a dispensing process, the liquid drops are kept in a liquid drop state before the heat dissipation component 23 is pressed and bonded by using the surface tension of the liquid drops of the liquid metal 24, and when the heat dissipation component 23 is pressed and bonded above the sealing element 25, the liquid metal 24 has no particles and has good fluidity, so that the heating element 22 and the heat dissipation component 23 can be in contact with each other, the liquid drops are compressed and diffused, and the gaps are not filled between the microstructures of the contact surface of the heating element 22 and between the microstructures of the contact surface of the heat dissipation component 23.
The microstructure of the first contact surface comprises the first micro-protrusions and the first micro-recesses; the microstructure of the second contact surface comprises the second micro-protrusions and the second micro-recesses; since the heat dissipation assembly 23 is in contact with the heat generating element 22, at least one of the following ways is included: the first micro-protrusion and the second micro-protrusion are mutually abutted; the first micro-protrusion and the second micro-recess are mutually abutted; the first micro-recess and the second micro-recess are mutually abutted; the first micro-recess and the second micro-protrusion are mutually abutted.
As described above, in the electronic device according to the embodiment of the present application, the heat dissipation assembly 23 is fixed to the circuit board 21 by the fixing member 28, and the heat dissipation assembly 23 applies a force to the sealing member 25 by the fixing member 28, so that the sealing member 25 is in the first state of being compressed; wherein the fixing element 28 is located on a side of the sealing element 25 facing away from the heat generating element 22.
The circuit board has a first metal layer inside, the first metal layer may be a metal ground, the fixing element 28 extends to the inside of the circuit board to contact with the first metal layer, and the fixing element 28 is a metal element, such as a metal screw rod, so that a part of heat on the heat dissipation assembly 23 can be dissipated into the fluid medium through the fluid medium environment where the heat dissipation assembly is located, and a part of heat can be conducted to the first metal layer of the circuit board 21 through the fixing element 28 to dissipate heat through the first metal layer.
Optionally, the surface of the circuit board 21 has a heat conduction layer, and the heating element 22 is fixed on the heat conduction layer. The heat conducting layer may be a second metal layer, and a through hole filled with a heat conducting medium is provided between the heat conducting layer and the first metal layer. In this way, a part of the heat generated by the heating element 22 can be upwards radiated by the heat radiation component 23, and the other part of the heat can be downwards quickly transferred to the second metal layer through the heat conduction layer, so that the heat is radiated by the second metal layer, and thus, the three-dimensional omnibearing heat radiation is realized.
In the electronic device according to the embodiment of the present application, the liquid metal 24 includes gallium. Typically, gallium has a melting point of 29.76 ℃ and a surface temperature sufficient to maintain gallium in a liquid state during operation of the heating element. It is also possible to mix additives with gallium for adjusting the fluidity and viscosity of the liquid metal 24 and for adjusting the melting point of the liquid metal 24.
Because the liquid material has a good filling effect, the liquid metal 24 can fill the microstructure on the contact surface of the heat dissipation assembly 23 and the heating element 22 with high quality, and eliminate the air gap between the opposite surfaces when the heat dissipation assembly 23 is in contact with the heating element 22, so as to improve the heat dissipation performance.
Moreover, the heat dissipation assembly 23 is in contact with the heating element 22, and the liquid metal 24 fills the microstructure between the opposite surfaces of the heat dissipation assembly 23 and the heating element 22 when in contact, so that the thickness of the liquid metal layer 24 is small, and the thermal resistance of the heat dissipation assembly 23 and the heating element 22 when in contact can be reduced.
The experimental result shows that for the same heating element, heat dissipation is performed under the same working power, and compared with the conventional scheme of adopting heat conducting glue, the temperature of the technical scheme in the embodiment of the application is 9 ℃. Moreover, because this application technical scheme can accelerate heat transfer in the heating element 22 extremely the speed of radiator unit 23 improves heating element 22's radiating rate, consequently to the heating element 22 that needs adopt the fan to carry out the heat dissipation, can reduce the power of fan to make the fan rotational speed change more steady, make its average noise value reduce 2 dB.
The effect of the technical solution described in the embodiment of the present application will be further explained below by taking a single-chip CPU as the heat dissipation element 22 by way of example with reference to specific experimental data.
If the temperature of the CPU single chip is set to be constant 92 ℃, and the rotating speed of the fan is 4000rpm, the power of the CPU single chip can only be 71W by adopting the scheme of the heat-conducting adhesive conventionally, the power can reach 80W by adopting the technical scheme of the application, so that the CPU single chip can have higher power at the same temperature and the same rotating speed of the fan, and the power improvement rate is 12.7%.
If the power of the CPU single chip is set to be constant 60W, and the rotating speed of the fan is 4000rpm, the temperature of the CPU single chip can only be controlled to be 80.1 ℃ by adopting the conventional scheme of the heat-conducting adhesive, the temperature can be reduced to 71 ℃ by adopting the technical scheme of the application, so that the CPU single chip can have lower temperature under the same power and the same rotating speed of the fan, and the temperature improvement rate is 11.4%.
The same evaluation software is adopted to evaluate the hardware of the electronic equipment, the evaluation of the conventional scheme adopting the heat-conducting glue is 1985, the technical scheme of the application can reach 2048, and the improvement rate of the hardware evaluation is 3.2%.
When the video decoding time is compared, the technical scheme of the application can reduce the time for use compared with the scheme of the conventional heat-conducting glue.
The electronic device in the embodiment of the present application may be an all-in-one machine, a desktop computer, a mobile phone, a tablet computer, and other electronic devices that can only be worn, and the heating element 22 includes, but is not limited to, a CPU or a GPU.
Based on the foregoing embodiment, another embodiment of the present application further provides a method for manufacturing an electronic device, where the method is used to manufacture the electronic device in the foregoing embodiment, and a structure of the electronic device may be as described in the foregoing embodiment, and the method includes:
step S11: bonding a heating element 22 on the circuit board 21; the heating element 22 is fixedly disposed on the circuit board 21 and electrically connected to the circuit board 21, and the heating element 22 generates heat in a working state.
Step S12: after a liquid metal 24 is disposed on a side surface of the heating element 22 away from the circuit board 21, a heat dissipation assembly 23 is fixedly connected above the heating element 22 based on a sealing member 25 surrounding the heating element 22, and the heat dissipation assembly 23 is in contact with the heating element 22 and is used for exchanging heat with a fluid medium.
The sealing member 25 may be a silicon rubber or a UV rubber, and has a compressive sealing property, so that the liquid metal 25 can be sealed around the heating element 22 to prevent leakage and oxidation.
In an embodiment of the present application, the preparation method further includes: a seal 25 is formed surrounding the heating element 22. The sealing member 25 surrounding the heating element 22 may be formed after the liquid metal 24 is disposed on the surface of the heating element 22 facing away from the circuit board 21, or the sealing member 25 surrounding the heating element 22 may be formed first, and then the liquid metal 24 may be disposed on the surface of the heating element 22 facing away from the circuit board 21.
The liquid metal 24 is located between the microstructures of the contact surfaces of the heating element 22 and between the microstructures of the contact surfaces of the heat dissipation assembly 23, and is used for reducing the thermal resistance between the heat dissipation assembly 23 and the heating element 22; the seal 25 is used to seal the liquid metal 24 against leakage of the liquid metal 24.
Further, the preparation method also comprises the following steps: the outside of the seal 25 is surrounded by foam as a protective material.
In the manufacturing method according to the embodiment of the present application, after the liquid metal 24 is disposed on the surface of the side of the heating element 22 away from the circuit board 21, the heat dissipation assembly 23 is fixedly connected above the heating element 22 based on the liquid metal 25 surrounding the heating element of the sealing member, and the method includes:
step S21: a plurality of liquid drops of liquid gold 24 arranged in a lattice manner are arranged on the surface of one side of the heating element 22, which is far away from the circuit board 21.
The liquid metal 24 is liquid at normal temperature, has high fluidity, and can have a melting point of about 8 ℃ by adjusting the proportion. Optionally, a surface of the heat generating component 22 facing the heat dissipating assembly 23 has a protective layer for preventing corrosion by the liquid metal 24, and/or a surface of the heat dissipating assembly 23 facing the heat generating component 22 has a protective layer for preventing corrosion by the liquid metal 24. The protective layer may be a nickel plating layer.
In one embodiment, the sealing member 25 surrounding the heating element 22 is formed, and then a plurality of liquid droplets of the liquid metal 24 are formed in a lattice arrangement by dispensing. The sealing member 25 may be formed by coating, dispensing, or printing. The top surface of the sealing member 25 is higher than the top surface of the heating element 22, so that the sealing member 25 can be compressed by the heat dissipation assembly 23 in the subsequent process, and a good sealing effect can be realized.
Fixing the heat dissipation assembly 23 on the heating element 22, wherein the heat dissipation assembly 23 is compressed to the first state by the elasticity of the sealing member 25 in the second state during the connection process of the heat dissipation assembly 23 and the heating element 22, so that the heat dissipation assembly 23 is in zero-distance contact with the heating element 22, the liquid metal 24 is located between the microstructures of the contact surfaces of the heating element 22 and the microstructures of the contact surfaces of the heat dissipation assembly 23, and the liquid metal is prevented from leaking.
In the embodiment of the application, through the mechanical automation dot matrix type spraying mode heating element 22 deviates from the liquid gold 24's that the side surface of circuit board 21 formed the dot matrix and arranged liquid drop, can save the spraying time, can also accurately control the spraying quantity of liquid metal 24, the volume of liquid drop and the height of liquid drop.
Specifically, the coating may be performed by a screw valve of a dispenser, and the dispensing coating may be performed on a surface of the heating element 22 away from the circuit board 21 according to a predetermined path. Quantitative coating is realized by fixing parameters such as feeding air pressure, screw rotating speed, needle size, needle dispensing height, needle advancing speed and the like. The height, width and path of the dispensing liquid drop can be detected through the 3D CCD camera, and the micro structure between the contact surfaces can be fully filled after the liquid drop is compressed by the heat dissipation assembly 23. And coating the liquid metal by using a piezoelectric valve of a dispenser, and accurately controlling the amount error of the liquid metal within 1 mg. The quantitative coating is realized by controlling the vibration frequency, the feeding air pressure, the advancing speed, the valve opening and closing frequency and other parameters of the piezoelectric valve. The preset edge area of the film on the side, away from the circuit board 21, of the heating element 22 is left, so that the liquid metal 24 is prevented from being directly extruded out of the contact surface when the heat dissipation assembly 23 is installed, surface liquid drops are smoothly filled into the microstructure between the contact surfaces, and the excessive liquid metal 24 is collected through the preset gap between the sealant 25 and the heating element 22. The heat dissipation member 23 may be fixed to the circuit board 21 by screws as fixing members.
For example, the total amount of the surface coating of each heating element 22 may be set to 100 mg. + -.1 mg and the coating thickness may be set to 100. mu.m. The specific spray parameters may be adjusted based on the size of the heating element 22, which is not particularly limited in the embodiments of the present application.
In the preparation method of the embodiment of the application, the liquid metal and the protective glue are coated by the dispenser, so that accurate and quantitative control can be realized; detecting by using a plurality of 3D CCDs, and ensuring the sealing reliability of each machine; the sealing member 25 can be prepared by using moisture curing glue, so that the curing steps such as separate heating or UV irradiation are saved, and the cost and the time are saved.
The embodiments in the present description are described in a progressive manner, or in a parallel manner, or in a combination of a progressive manner and a parallel manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments can be referred to each other. For the preparation method disclosed in the embodiment, since the preparation method corresponds to the electronic device disclosed in the embodiment, the description is relatively simple, and the relevant points can be referred to the description of the corresponding part of the electronic device.
It is to be understood that in the description of the present application, the drawings and the description of the embodiments are to be regarded as illustrative in nature and not as restrictive. Like numerals refer to like structures throughout the description of the embodiments. In addition, the figures may exaggerate the thickness of some layers, films, panels, regions, etc. for ease of understanding and description. It will also be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. In addition, "on …" means that an element is positioned on or under another element, but does not essentially mean that it is positioned on the upper side of another element according to the direction of gravity.
The terms "upper," "lower," "top," "bottom," "inner," "outer," and the like refer to an orientation or positional relationship relative to an orientation or positional relationship shown in the drawings for ease of description and simplicity of description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in an article or device that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. An electronic device, comprising:
the circuit board is fixedly arranged in the shell of the electronic equipment;
the heating element is fixedly arranged on the circuit board and is electrically connected with the circuit board, and the heating element generates heat when in a working state;
the heat dissipation assembly is fixedly connected with the heating element, is in contact with the heating element and is used for exchanging heat with a fluid medium;
the liquid metal is positioned between the microstructures of the contact surfaces of the heating elements and between the microstructures of the contact surfaces of the heat dissipation assembly and used for reducing the thermal resistance between the heat dissipation assembly and the heating elements;
and the sealing member surrounds the periphery of the heating element and is used for sealing the liquid metal and preventing the liquid metal from leaking.
2. The electronic device of claim 1, the seal being a connection of the heat dissipating component to the heat generating element;
the seal in the first state also serves to support the heat dissipation assembly.
3. The electronic device of claim 2, wherein the heat dissipation assembly is compressed to the first state by the elasticity of the sealing member in the second state during the connection process between the heat dissipation assembly and the heat generating element, so that the heat dissipation assembly is in zero-distance contact with the heat generating element, the liquid metal is located between the microstructures of the contact surfaces of the heat generating element and between the microstructures of the contact surfaces of the heat dissipation assembly, and the liquid metal is prevented from leaking.
4. The electronic device of claim 3, wherein when the sealing member is in the second state, a side surface of the heat generating element facing away from the circuit board has a plurality of liquid droplets of the liquid metal arranged in a lattice;
when the sealing element is in the first state, the liquid drops of the liquid metal arranged in the dot matrix are compressed and diffused by the heat dissipation assembly, and the micro structures of the contact surfaces of the heating element and the micro structures of the contact surfaces of the heat dissipation assembly are filled in a seamless mode.
5. The electronic device of claim 1, the heat generating element comprising: the device comprises a substrate and a boss positioned on the substrate; the surface of one side of the substrate, which is far away from the boss, is fixed on the circuit board;
the sealing element surrounds the boss and is provided with an opening exposing the boss;
wherein the heat dissipation assembly covers the opening and abuts against the sealing member.
6. The electronic device of claim 1, comprising at least one of:
further comprising a protective material surrounding the seal;
a preset gap is formed between the sealing element and the side wall of the heating element, and the liquid heat-conducting medium is arranged in the preset gap;
the heat conductivity coefficient of the liquid metal is more than 20W/m.K;
the maximum thickness of the liquid metal between the heat dissipation assembly and the heat generating element is no more than 20 μm.
7. The electronic device of claim 1, wherein a surface of the heat generating element facing the heat dissipating component is a first contact surface; the surface of the heat dissipation assembly facing the heating element is a second contact surface;
the first contact surface is provided with a plurality of first micro-protrusions, and first micro-recesses are formed between every two adjacent first micro-protrusions; the liquid metal is filled between the first micro-protrusions and the second surface and between the first micro-recesses and the second contact surface;
and/or the second contact surface is provided with a plurality of second micro-protrusions, and second micro-recesses are arranged between the second micro-protrusions; the liquid metal is filled between the second micro-protrusion and the first contact surface, and is filled between the second micro-recess and the first contact surface.
8. The electronic device of claim 1, the heat dissipation assembly being secured to the circuit board by a fastener, and the heat dissipation assembly applying a force to the seal via the fastener such that the seal is in a compressed first state;
wherein the fixing member is located on a side of the sealing member facing away from the heat generating element.
9. A method of making an electronic device, comprising:
bonding a heating element on the circuit board; the heating element is fixedly arranged on the circuit board and electrically connected with the circuit board, and the heating element generates heat in a working state;
after liquid metal is arranged on the surface of one side, away from the circuit board, of the heating element, a heat dissipation assembly is fixedly connected above the heating element on the basis of a sealing piece surrounding the heating element, and the heat dissipation assembly is in contact with the heating element and used for exchanging heat with a fluid medium;
the liquid metal is positioned between the microstructures of the contact surfaces of the heating elements and between the microstructures of the contact surfaces of the heat dissipation assemblies and used for reducing the thermal resistance between the heat dissipation assemblies and the heating elements; the sealing element is used for sealing the liquid metal and preventing the liquid metal from leaking.
10. The manufacturing method according to claim 9, after disposing a liquid metal on a side surface of the heat generating element facing away from the circuit board, fixedly attaching a heat dissipating component above the heat generating element based on a sealing member surrounding the heat generating element, comprising:
arranging a plurality of liquid metal droplets arranged in a lattice manner on the surface of one side of the heating element, which is far away from the circuit board;
fixing the heat dissipation assembly on the heating element, wherein the heat dissipation assembly is compressed to the first state through the elasticity of the sealing piece in the second state in the process of connecting the heat dissipation assembly and the heating element, so that the heat dissipation assembly is in zero-distance contact with the heating element, the liquid metal is positioned between the microstructures of the contact surfaces of the heating element and between the microstructures of the contact surfaces of the heat dissipation assembly, and the liquid metal is prevented from leaking.
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| CN202210277531.XA CN114501961A (en) | 2022-03-21 | 2022-03-21 | Electronic device and method for manufacturing the same |
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| CN202210277531.XA CN114501961A (en) | 2022-03-21 | 2022-03-21 | Electronic device and method for manufacturing the same |
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| CN215991758U (en) * | 2021-09-27 | 2022-03-08 | 东莞钱锋特殊胶粘制品有限公司 | Metal heat conducting sheet structure with particle and phase change |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6665186B1 (en) * | 2002-10-24 | 2003-12-16 | International Business Machines Corporation | Liquid metal thermal interface for an electronic module |
| TWM579819U (en) * | 2019-03-04 | 2019-06-21 | 華碩電腦股份有限公司 | Heat dissipation structure |
| CN211297483U (en) * | 2019-12-13 | 2020-08-18 | 厦门市匠研新材料技术有限公司 | Heat radiation structure |
| CN215834516U (en) * | 2021-08-02 | 2022-02-15 | 东莞钱锋特殊胶粘制品有限公司 | Heat conducting device for electronic element |
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