KR20190078460A - Heat transferring member - Google Patents

Abstract

Disclosed is a heat transferring member capable of exhibiting an efficient and reliable heat transferring function with a simple structure. The heat transferring member includes: an elastic container having a through hole penetrating the upper and lower surfaces in a thickness direction; a thermally conductive sheet adhered to the bottom surface of the container; and a thermoelectric element fitted into or filled with the through hole in contact with the side wall of the through hole and the thermally conductive sheet and exposed to the outside from the upper surface of the container. The thermoelectric element is spread by an external force due to the flowability of the thermoelectric element. The thermal conductivity of the thermoelectric element is higher than that of the container.

Description

[0001] Heat transferring member [0002]

The present invention relates to a heat conducting member.

As electronic communication devices including mobile phones become more sophisticated and highly functional, the processing speed of microprocessors also increases, and electromagnetic waves and heat generation are becoming a big problem.

In order to solve such a problem, for example, a heat dissipating unit is usually used to rapidly discharge the heat generated from the microprocessor to the outside.

The heat-dissipating unit is pressed and used between a case for cooling and an electronic component for generating heat to be mounted on a circuit board. For example, a heat-dissipating element such as a microprocessor mounted on a circuit board, One side of the thermal interface material (TIM) is attached and the other side is attached to the case, and the heat generated by the heating element is transferred to the case through the thermoelectric element.

Generally, a thermoelectric element sandwiched and pressed between a heating element and a cooling case is pressed well against a small force of an opposed object, has elasticity with respect to the object and is widely and closely adhered, and at least one surface has self- It is preferable that it is easy to attach to and detachable from, and easy to handle.

As an example of the prior art, domestic patent registration No. 1715988 of Dexerials Corp. of Japan, An anisotropic thermally conductive filler; An extruding step of extruding a thermally conductive composition containing a filler by an extruder and molding an extrudate in which an anisotropic thermally conductive filler is oriented along an extrusion direction, a curing step of curing the extrudate to obtain a cured product, Is cut at a predetermined thickness in a direction perpendicular to the extrusion direction by using an ultrasonic cutter, and a thermally conductive sheet is disclosed.

Since the thermally conductive sheet is not formed with pores in the silicone rubber, the elasticity and the restoring force are insufficient and the mechanical strength is high enough to be produced by extruding at a large pressure, so that the flowability is low. It is difficult to fabricate such a product. Further, since the hardness of the thermally conductive sheet is high (for example, Shore A 50 or more), there is a disadvantage that the pressing force is so large that it can damage components such as an IC or the like and is difficult to adhere well.

According to another prior art, there is a thermally conductive silicone sheet having a self-adhesive force which is prepared by mixing, casting and curing a thermally conductive powder such as alumina uniformly on a liquid silicone rubber to form a sheet and cutting it into a desired shape.

According to this technique, there is a disadvantage in that the thermally conductive sheet lacks pores and is lacking in elasticity and elastic restoring force, so that the elastic working distance is small, and it is produced in a sheet shape for easy processing and handling and is relatively hard.

According to another conventional technology, a thermoelectric element in a thermally conductive paste state having a high viscosity capable of dispensing in a container such as a syringe, or a thermoelectric element in a putty state having a viscosity higher than that of the thermoelectric element is provided on the surface of the semiconductor chip Dispenser is formed by discharging. Then, a metal case for cooling is covered on the thermoelectric element, and the thermoelectric element is pressed. At this time, the thermoelectric element is formed by being interposed between the semiconductor chip and the case while spreading laterally by the pressing force of the case.

Here, the high viscosity means that the paste or putty maintains a constant shape even if there is a small vibration in the plane of room temperature, and can provide a viscosity that is comparatively uniform and can provide a thick thickness. For example, a paste or putty having a high viscosity can be provided in a thick thickness of 0.3 mm or more, so that it is easy to apply to an assembly of an electronic system such as an automobile having a relatively large dimensional tolerance between a heat generating element and a metal case.

According to this conventional technology, an expensive dispenser is required to discharge a thermoelectric element in a paste or putty state, which is disadvantageous in that it is difficult to apply to production of a small quantity of items.

In addition, since the thermoelectric element has a relatively high viscosity, it is difficult to provide a uniform thickness on the heat generating element due to its poor fluidity due to the jamming and a large force.

Particularly, when assembled, the thermally conductive paste may be pushed to the outer portion of the heating element to contaminate the circuit board.

In addition, when the distance between the heat-generating semiconductor chip and the cooling metal case is relatively large, the dimensional tolerance is large, so that when the semiconductor chip and the case are assembled, the thermoelectric element spreads in various shapes and is difficult to provide a reliable and uniform heat conduction . For example, the semiconductor chip and the case may be combined with each other to provide an air layer on a portion of the thermoelectric element, which results in a non-uniform thickness of the thermoelectric element, and as a result, it is difficult to provide reliable heat transfer.

In addition, it is difficult to handle, which makes attachment and detachment inconvenient, and surface mounting by vacuum pickup is difficult.

In addition, the thermoelectric elements have a similar upper and lower viscosity and thus are difficult to detach in one direction.

According to another prior art similar to this, a paste-type thermoelectric element having a viscosity (intermediate viscosity) as high as that of a general Honey in a container is provided on a semiconductor chip, which is a heating element, When the metal heat sink for cooling is put on and pressed, the thermoelectric element has a medium viscosity, so it is pushed sideways by a small force and spreads well, and is interposed with a thin thickness between the semiconductor chip and the heat sink.

Here, the intermediate viscosity may mean a viscosity at which the paste can not maintain a constant shape due to a part of the flowability even though the paste does not oscillate at a plane of normal temperature, and it is difficult to provide a relatively uniform thick thickness. For example, And may be a thermal grease applied to the substrate. For example, the paste having an intermediate viscosity is easy to provide in a thin thickness of 0.3 mm or less, so that it is easy to apply to an assembly of an electronic system such as a notebook computer having a small gap between mechanisms of a heating element and a metal case and a comparatively small dimensional tolerance.

As described above, the thermoelectric element in the paste state having an intermediate viscosity is easily pressed by the external force and spreads to the side and spreads. As a result, there is an advantage that a small force is applied to the opposing object. However, since it is difficult to uniformly provide a thick thickness, It is difficult to apply it to an automotive part having a large dimensional tolerance.

In addition, an air layer may be provided on a part of the thermoelectric element at the time of assembly, and the thickness of the thermoelectric element may be uneven, resulting in a difficulty in providing reliable heat transfer.

In addition, when the thermally conductive paste is pushed to the outer portion of the heating element during assembly, the circuit board may be contaminated, and if vibration is provided after assembly, it may move more easily or may escape to the outside. For this reason, there is a disadvantage that the thermally conductive paste can be provided only on a part of the surface of the heating element and can contaminate the surroundings.

In addition, there is a disadvantage that it is difficult to handle and accordingly, installation and detachment are inconvenient.

In addition, the thermoelectric elements have a similar upper and lower viscosity and thus are difficult to detach in one direction.

Accordingly, an object of the present invention is to provide a heat conduction member having a thermoelectric element having a viscosity that can be easily pushed and spread in the horizontal direction by a force in the vertical direction without using a dispenser or a printer or the like at a work site .

Another object of the present invention is to provide a thermally conductive member which provides a thermoelectric element having a viscosity and flowability with a uniform shape and dimensions.

Another object of the present invention is to provide a heat conducting member having a small pressing force, a pressing force spreading sideways, a close contact with an object, and a thermoelectric element having a large area.

Another object of the present invention is to provide a heat conduction member provided with a constant thickness during assembly.

Another object of the present invention is to provide a thermally conductive member which can provide a thermoelectric element having a high viscosity with a comparatively large thickness, and which is easy to accommodate even if the dimensional tolerance of the opposing mechanism is large.

Another object of the present invention is to provide a reliable heat conducting member having an intermediate viscosity and a viscosity and having a uniform thickness. For example, it is possible to provide a thermoelectric element having an intermediate viscosity with a relatively thin thickness, and to provide a thermally conductive member that is easily accommodated even if the dimensional tolerance of the opposing mechanism is small.

Another object of the present invention is to provide a heat conduction member having improved elasticity and restoring force.

Another object of the present invention is to provide a heat conduction member which can easily absorb vibration and impact transmitted from an object and is easy to adhere to the heat conductive sheet.

Another object of the present invention is to provide a heat conduction member capable of reliably transferring heat generated from a heat generating element to metal for cooling at the shortest distance.

It is another object of the present invention to provide a heat conduction member which is protected in an external environment and in which a thermoelectric element does not flow out to the outside during a vibration test of an automobile or the like.

Another object of the present invention is to provide a heat conduction member which is easy to attach and detach to an object and is easily detachable in one direction.

Another object of the present invention is to provide a thermally conductive member having a high viscosity and capable of surface mounting by vacuum pick-up.

According to an aspect of the present invention, there is provided a heat conduction member interposed between opposed objects including a heat generating element and a cooling unit and performing heat transfer in a vertical direction, the heat conduction member having a through hole penetrating the upper surface and the lower surface in the thickness direction, ; A thermally conductive sheet adhered to the lower surface of the receptor; And a thermoelectric element having a viscosity and being fitted or filled in the through hole so as to be in contact with the side wall of the through hole and the thermally conductive sheet and exposed to the outside from the upper surface of the receptacle, Wherein the thermoelectric element and the thermally conductive sheet are in contact with the object, wherein the thermoelectric element and the thermo-conductive sheet are in contact with each other by flow or spreading due to pressure exerted by the object due to flowability and spreadability, and the thermal conductivity of the thermoelectric element is higher than the thermal conductivity of the receptor. A heat conducting member is provided.

Preferably, the resilient restoring force of the receptor may be greater than the resilient restoring force of the thermoelectric element, and may be more than 40% of the original height.

Preferably, the upper surface of the receptacle and the lower surface of the thermally conductive sheet are planar.

Preferably, the through-holes may be symmetrical with respect to the horizontal and vertical intermediate planes of the receptors.

Preferably, the receptors and the thermally conductive sheet may be adhered to each other via a pressure-sensitive adhesive, wherein the pressure-sensitive adhesive may be an acrylic resin or a urethane resin adhesive having self-adhesiveness.

Preferably, the upper surface of the thermally conductive sheet has a self-adhesive force, and the receptacle and the thermally conductive sheet can be adhered to each other by the self-adhesive force.

Preferably, the receptacle may be a urethane rubber sponge or a silicone rubber sponge as a foam, and a skin layer is formed on at least one of the upper and lower surfaces, and the body including the side wall of the through hole and the outer cut surface of the receptor Pores having an open cell structure can be provided.

Preferably, when the thermoelectric element is pressed in a state interposed between the objects, the receptors can be pressed together.

Preferably, the flow rate of the thermoelectric element is determined by the flow rate of a paste or a grease spreading in a certain horizontal direction when there is no vibration in a state of being placed on a plane, It may be the degree of flow of paste or putty that maintains its shape.

Preferably, the exposed surface of the thermoelectric element is substantially planar.

Preferably, at least a part of the thermoelectric element can be pushed into a pore formed in a side wall of a through hole of the receptor, and a size of at least part of the thermally conductive powder contained in the thermoelectric element is a thickness And at least a part of the thermoelectric element pushed by the pores can be pushed out of the pores when the receptor is pressed.

Preferably, the thermoelectric element has a self-adhesive force due to the viscosity of the thermoelectric element.

Preferably, the surface area of the exposed surface of the thermoelectric element may be equal to or slightly less than the surface area of the contact surface of the heating element.

Preferably, the thickness of the thermally conductive sheet may be less than 1/2 of the thickness of the receptor.

Preferably, the thermally conductive sheet has a thermally conductive adhesive on at least one surface of the thermally conductive substrate, and the thermally conductive substrate may be a metal foil containing at least copper or aluminum, or a fiber having a metal layer of such a metal.

Preferably, a thermally conductive coating layer may be formed on the lower surface of the thermally conductive sheet.

Preferably, the thermally conductive sheet may be composed of a thermally conductive adhesive without a substrate.

Preferably, the thermally conductive sheet may have a self-adhesive property by forming a thermally conductive adhesive on at least one side of the polymer film base.

Preferably, the thermally conductive sheet can be adhered by the adhesive of the receptor.

Preferably, the lower surface of the thermally conductive sheet has a self-adhesive property and can be self-adhered to the surface of any one of the objects.

Preferably, the thermoelectric element and the thermally conductive sheet may directly contact the surface of the heating element or the cooling unit.

Preferably, the thermoelectric element may be a thermally conductive powder or a thermally conductive fiber mixed with a silicone rubber or an acrylic resin.

Preferably, the surface area of the thermoelectric element may be equal to or less than the surface area of the heating element and the cooling unit.

According to another aspect of the present invention, there is provided a heat conduction member interposed between opposing objects including a heat generating element and a cooling unit and transferring heat in an up and down direction, the through hole being formed through the upper surface and the lower surface, ; A thermally conductive sheet adhered to a lower surface of the receptor via an adhesive; A thermoelectric element which is sandwiched or filled in the through hole to contact the side wall of the through hole and the thermally conductive sheet and is exposed to the outside from the upper surface of the receptacle; And a thermally conductive elastic coating layer formed on a lower surface of the thermally conductive sheet, wherein the thermoelectric element is spread by external force due to the flowability of the thermoelectric element, the thermoelectric coefficient of the thermoelectric element is higher than the thermal conductivity of the receptor, And the thermoelectric element and the thermally conductive sheet are in contact with the object, respectively.

Preferably, the thermally conductive sheet is made of aluminum foil, copper foil or metal plated fiber, and the coating layer is a thermally conductive silicone rubber coating layer, which may be higher than the hardness of the thermoelectric element.

Preferably, irregularities extending in the height direction along the inner surface of the through hole of the receptor can be formed.

According to another aspect of the present invention, there is provided a heat exchanger comprising: a heat conduction member interposed between opposed objects to transfer heat in a vertical direction; A sheet-shaped release member on which the heat conduction member is disposed; And a protective cover mounted on the release member and covering the heat conduction member, wherein the heat conduction member comprises: an elastic receptor having a through hole penetrating the upper surface and the lower surface in a thickness direction; A thermally conductive sheet adhered to the lower surface of the receptor; And a thermoelectric element having a high viscosity (viscous) that is sandwiched or filled in the through-hole to make contact with the side wall of the through-hole and the thermally conductive sheet and exposed from the upper surface of the receptacle, wherein the thermoelectric element and the thermally conductive sheet A plurality of heat sinks, each of which is in contact with the object.

Preferably, the protective cover may not be in contact with the thermoelectric element.

Preferably, the thermally conductive member can be surface-mounted by vacuum pick-up by the release member and the protective cover.

Preferably, the mold release member and the protective cover are individually packaged individually or a plurality of them are uniformly packaged.

According to the above structure, since a thermally conductive sheet, a receiver having elasticity, and a thermoelectric element having a viscosity and a flowability are provided as a single unit that is reliably combined, it is possible to provide a uniform shape A thermoelectric element having a dimension and a viscosity can be used.

Further, by fully utilizing the advantage of the thermoelectric element having the characteristics of viscosity and flowability, when the thermoelectric element is pressed in the vertical direction, the thermoelectric element can easily form a plane in the horizontal direction.

In addition, the thermoelectric element spreads well in the horizontal direction so that the thermoelectric element can be closely adhered to the opposed object with a large area, and the heat transfer is good, and it is easy to have a uniform thickness and a large and uniform area to provide reliable heat transfer.

Further, at the time of assembly, the thickness is not pressed to a certain thickness or less depending on the thickness of the receptor, and as a result, the receptors provide a certain distance to the heating element and the cooling unit.

In addition, at least a part of the receptor is placed on the heating element along the edge of the heat generating element, and a part of the thermoelectric element existing in the pores of the side wall of the receptacle in the through hole exists so that the thermoelectric element is in elastic contact with the object in the up- have.

Further, a part of the thermoelectric element existing in the bubble in the side wall of the receiver in the through hole returns to the pressing force and the thermal conductivity in the vertical direction is improved.

In addition, a thermoelectric element having viscous and flow properties is contained in the through hole formed in the solid-state receptor having a constant thickness, so that the thermoelectric element is physically protected against external interference during transportation, handling and processing.

Further, the thickness of the high receptor can provide a thermoelectric element having a comparatively high viscosity at a similar thickness, so that it is easy to accommodate even if the interval of the opposing mechanisms is high.

In addition, it is possible to provide a thermoelectric element having an intermediate viscosity with a similar thickness by the thickness of a low receptor, so that it is easy to accommodate even if the gap of the opposite mechanism is low.

In addition, one of the through holes can be produced economically by facilitating insertion or insertion of the thermoelectric element into the through hole of the receptacle clogged by the thermally conductive sheet.

In addition, the surface of the receptor becomes a skin layer, which is easily adhered to the object and is well adhered to the thermally conductive sheet, so that vibration and shock transmitted from the object can be easily absorbed.

Further, the heat generated from the heat generating element through the through holes located inside the receiver can be transferred to the metal for cooling at the shortest distance through the thermally conductive sheet and the thermoelectric element, so that heat transfer can be performed quickly.

In addition, the thermoelectric element is advantageous in that it is difficult for the thermoelectric element to be sidewardly pushed out or flowed out by the receiver, so that the periphery of the circuit board or the like is not contaminated, and the thermoelectric element is difficult to flow down in a vibration test of an automobile or the like.

Further, the thermally conductive sheet having good thermal conductivity and mechanical strength is easy to handle, mount and detach, and can easily be separated in one direction when reworked or recycled by different adhesive forces.

Further, since the surface area of the thermoelectric element is smaller than the surface area of the thermally conductive sheet, a more efficient heat transfer or cohesion is provided when the thermoelectric element is adhered to the surface of the heating element and the thermally conductive sheet is adhered to the cooling unit.

Further, since the hardness of the thermoelectric element is lower than the overall hardness of the thermally conductive sheet, a physical force is less applied to the semiconductor, which is a heat generating element.

In addition, more efficient heat transfer is provided when the thermoelectric element is adhered to the thermo-conductive sheet by the self-adhesive force of the thermoelectric element.

In addition, it is made into a single body, has a mechanical strength of a certain level or more as a whole, is easy to handle, and is easy to mount and detach.

Further, when the thermoelectric element has a high viscosity, the thermoelectric element does not come into contact with the protective cover, and the thermally conductive sheet has little or no self-adhesive force, surface mounting by vacuum pick-up is possible.

1 shows a heat conducting member according to an embodiment of the invention.
Figure 1A shows a receptor according to another example.
2 is a sectional view taken along line 2-2 in Fig.
Figures 3 (a) -3 (c) show various thermally conductive sheets.
Fig. 4 shows an example of a state of supplying the heat conduction member.
5 (a) to 5 (c) show a state in which the heat conduction member of the present invention is applied.
Figure 6 shows a heat conducting member according to another embodiment of the invention.

It is noted that the technical terms used in the present invention are used only to describe specific embodiments and are not intended to limit the present invention. In addition, the technical terms used in the present invention should be construed in a sense generally understood by a person having ordinary skill in the art to which the present invention belongs, unless otherwise defined in the present invention, Should not be construed as interpreted or interpreted in an excessively reduced sense. In addition, when a technical term used in the present invention is an erroneous technical term that does not accurately express the concept of the present invention, it should be understood that technical terms can be understood by those skilled in the art. In addition, the general terms used in the present invention should be interpreted according to a predefined or prior context, and should not be construed as being excessively reduced.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings.

Fig. 1 shows a heat-conducting member according to an embodiment of the invention, Fig. 2 is a sectional view taken along line 2-2 in Fig. 1, and Figs. 3 (a) to 3 (c) show various heat-conductive sheets.

The heat conduction member is composed of a body 100 and a thermoelectric element 200 that fills or fits into the through hole 112 of the body 100. The body 100 includes a body 110, And a thermally conductive sheet 120 having a self-adhesive force to be adhered to the lower surface of the thermally conductive sheet 110.

The receptacle 110 is a component serving as a container for containing a thermoelectric element 200 having a high viscosity or an intermediate viscosity together with a thermally conductive sheet 120 adhered to a lower surface.

 The lower surface of the receptor 110 may or may not have the adhesive 130 attached thereto and the thermally conductive sheet 120 may or may not have a self-adhesive force depending on the presence or absence of the adhesive 130.

The thermally conductive sheet 120 may be adhered to the lower surface of the receptor 110 by the adhesive 130 and the thermally conductive sheet 120 may be adhered to the lower surface of the receiver 110 without the adhesive 130. [ May be adhered to the lower surface of the receiver 110 due to adhesiveness of the upper surface of the thermally conductive sheet 120. [

In particular, since the thermally conductive sheet 120 is adhered to the lower surface of the receiver 110 when the adhesive 130 is present, the upper surface of the thermally conductive sheet 130 does not need to be tacky, For example, aluminum, so that the thermoelectric element 200 can be in direct contact with the aluminum so that the thermal conduction is good.

The pressure sensitive adhesive 130 may be a pressure sensitive adhesive of acrylic resin, silicone rubber or urethane resin having a self-adhesive property, but may be a double-sided pressure sensitive adhesive tape having a polyester film interposed between the pressure sensitive adhesive 130, Thereby increasing the mechanical strength.

The adhesive agent 130 is applied to the entire lower surface of the receptor 110 before the through hole 112 is formed and then the through hole 112 is formed so that the adhesive 110 is applied to the lower surface of the receptor 110 except for the through hole 112 130 are attached.

Since the adhesive 130 is formed on the lower surface of the receiver 110 except for the through hole 112, the adhesive 130 is not directly related to the thermal conductivity and may have a poor thermal conductivity as the receiver 110.

The structure and function of each component will be described below.

1) a container 110,

The receptacle 110 is made of a thermoplastic urethane rubber sponge, polyethylene sponge, or the like, which is a foam having formed therein pores so that the elastic force and restoring force of the thermoelectric element 200 are good, the elastic working distance is large, It may be a thermosetting silicone rubber sponge. For example, the receptor 110 may be a kind of Poron, a trademark of Rogers Corp of the United States.

The receptacle 110 serves to prevent the thermoelectric element 200 from escaping to the outside of the through hole 112 and to help the thermoelectric element 200 elastically contact the heating element or the cooling metal, The density of the receptors 110 is much lower than the density of the thermoelectric elements 200 so that the thermoelectric elements 100 are pressed with a small amount of external force and the restoring force of the receptors 110 is much higher than the restoring force of the thermoelectric elements 200 .

The upper surface and the lower surface of the receiver 110 form a skin layer in the process of forming the foam so that the surface thereof is smoothly in contact with the opposed object in a lot of contact to absorb vibration and impact, Lt; RTI ID = 0.0 > 120 < / RTI >

The outer surface of the receptacle 110 has no self-adhesive force and is not adhered to the protective cover covering the heat conduction member as described later.

The inside of the through hole 112 of the receptacle 110 includes at least a part of the pores of the open cell structure so that the thermoelectric element 200 is partially pushed into the pores at the time of manufacturing the thermoelectric element, The bonding force between the receptors 110 is improved and a part of the thermoelectric elements 200 is pushed back from the pores of the receptors 110 when the receptors 110 are pressed on the upper surface.

Here, open cell means that at least some pores are connected to each other and not all pores are connected to each other.

When the upper and lower surfaces of the receptacle 110 form a skin layer, the outer cut surface of the receptacle 110 includes pores of an open cell structure, so that the receptacle 110 can be elastically pressed in a vertical direction.

The thermoelectric element 200 is pushed up and down together with the receptacle 110. At this time, a part of the thermoelectric element 200 is exposed to the outside of the receptacle 110 through the pores of the open cell structure formed on the side surface of the through hole 112 It can leak to the pores of the open cell structure formed on the cut surface.

Therefore, it is necessary to design the size of the receptor 110 including the distance between the edge of the through hole 112 and the edge of the receptor 110 in order to prevent the occurrence of such phenomenon.

Figure 1A shows a receptor according to another example.

According to this embodiment, the concavities and convexities 114 extending in the height direction are formed along the inner surface of the through hole 112.

Since the thermoelectric element 200 has viscosity and spreadability when the thermoelectric element 200 is filled or fitted in the through hole 112, the thermoelectric element 200 is not limited to the irregularities 114). ≪ / RTI >

In this state, when the object is pressed by the object, the thermoelectric element 200 is reduced in height and spread sideways. Even before the receptor 110 spreads laterally by the thermoelectric element 200, A part of the recess 200 is filled in the recess 114, so that the unevenness 114 partially accommodates the spread of the thermoelectric element 200.

Particularly, when the thermoelectric element 200 is filled in the through hole 112, a part of the irregularity 114 may be present as an empty space without being filled with the thermoelectric element 200, A part of the thermoelectric element 200 is filled in the empty space.

The thermal conductivity of the receptor 110 may be lower than that of the thermoelectric element 200, for example, 0.3 W or less so as to improve elasticity and restoring force, may be electrically insulated so as not to cause electrical interference with the object, But is not limited thereto.

The receptacle 110 has an upper surface and a lower surface, and has a through hole 112 formed through the upper surface and the lower surface. If the thickness of the receptacle 110 is too small, the amount of the thermoelectric element 200 accommodated in the through hole 112 is too small. If the thermoelectric element 200 is too thick, It may be effective to use a metal spring or find another alternative because of the cost of the tool 200. [

When the thickness of the receptacle 110 is relatively large, it can be applied to a place having a relatively large space and dimensional tolerance. When the thickness of the receptacle 110 is relatively small, The thermoelectric element 200 having a viscosity and flowability that does not flow well can be applied.

The through hole 112 may be formed in a precise dimension in the interior of the receiver 110 by a blade mold, and may be rectangular, circular, or polygonal as in this embodiment, but is not limited thereto. .

The shape of the through hole 112 may be the same as or different from the shape of the outer circumference of the receptacle 110. The shape of the through hole 1120 is preferably such that the receptacle 110 has a large contact area with the object, And may be formed in a square shape similar to the surface shape of the semiconductor chip.

The through holes 112 are made symmetrical with respect to the horizontal and vertical intermediate planes of the receptors 110 so that the through holes 112 are located in the center of the heat generating elements when the heat conducting members are accurately matched to the heat generating elements, Can be most efficiently performed.

The through hole 112 formed in the receptor 110 and the receptacle 110 serves as a vessel for containing the thermoelectric element 200 having an intermediate viscosity and a high viscosity and has a low specific gravity and hardness, The surface of the thermoelectric element 200 is smooth, so that the thermoelectric element 200 having a low mechanical strength is maintained in a constant shape while being not separated from the horizontal surface, and is coupled with the side surface of the thermoelectric element 200 to provide elasticity to the thermoelectric element 200. In addition, it physically protects thermoelectric elements 200 that are mechanically weak during transportation, handling, and processing, while absorbing external impact and mechanically serving as a frame of a heat conduction member.

2) The thermoelectric element 200,

The thermoelectric element 200 may be any one of silicone rubber or acrylic resin in which a thermally conductive powder or a thermally conductive fiber is uniformly mixed.

The thermoelectric element 200 has viscosity, flowability, and spreadability, and can spread or flow in the horizontal direction by the pressure exerted by the object.

The thermoelectric element 200 may be in a thermally conductive paste or a thermally conductive clay, putty state having a high viscosity or a thermally conductive paste or a thermally conductive grease state having an intermediate viscosity.

Viscosity is a qualitative expression that refers to the inherent tackiness of the fluid (ie, the sticky and sticky nature of the material), ie, the properties of the fluid elements that partially adhere to it, or the internal resistance of the fluid against fluid motion, Viscosity ratio, viscosity ratio) is a quantitative value indicating a degree of resistance to a fluid. In general, the viscosity and the degree of resistance increase as the viscosity of the fluid increases.

The term 'high viscosity' in the present invention refers to a relatively larger viscosity when defining the conventionally known 'honey' as an intermediate viscosity. When the honeycomb is horizontally maintained at room temperature in a state of being discharged on a plane using a syringe, It is defined to mean a viscosity of about the degree that it can spread in various directions including the horizontal direction when the original shape is maintained without flowing down but pressed with a small force in the vertical direction.

The 'intermediate viscosity' of the present invention maintains a shape that flows down even when there is no vibration when it is held horizontally at room temperature in a state of being discharged on a plane using a syringe, but when it is pressed with a small force in the up and down direction, It is defined to mean roughly the degree of viscosity that can be spread more easily.

In the case of Dispensable Gap Filler (trade name Tputty 508), which can be dispensed from Laird Technology Inc. (www.lairdtech.com) of the United States, it is difficult to express the definition of "high viscosity" numerically, The flow rate can be expressed as 75cc taper tip, 0.125 "orifice, and 50g / min at 40psi.

The thermoelectric element 200 of the present invention is formed into a sheet shape when it has a high viscosity and is not inserted into the through hole 112 or is difficult to be provided in a sheet form when it has an intermediate viscosity, And may fill the hole 112.

Thus, the thermoelectric element 200 having a weak mechanical strength can be inserted or filled into the through hole 112 of the solid-state receiver 110.

The thermoelectric element 200 may be a hardened product or, in some cases, a hardened product. The advantages and disadvantages of the hardened thermoelectric element 200 may be selectively applied according to need, according to known techniques.

The thermoelectric element 200 can be adhered to an object to be contacted with a self-adhesive force according to its own viscosity. In other words, the acrylic resin or silicone rubber constituting the thermoelectric element 200 can have a sticky property of stickiness due to the viscosity thereof.

The thermal conductivity of the thermoelectric element 200 is much better than the thermal conductivity of the receptor 110. For example, the thermal conductivity of the thermoelectric element 200 may be about 1W to 50W.

As described above, the exposed surface of the thermoelectric element 200 may have a self-adhesive force so as to be in contact with the heating element by self-adhesive force. In this case, there is a problem that the exposed surface of the thermoelectric element 200 is adhered to other objects during handling or transportation. The conductive member itself can be covered with a plastic protective cover or the like.

The thermoelectric element 200 may be electrically insulated or may have electrical (semi-) conductivity. When thermally conductive ceramic powder such as alumina powder or boron is mixed with acrylic resin or silicone rubber, it is electrically insulated. It is an electric (semi-) conductivity when metal powders are mixed.

The size of the thermally conductive powder may be limited so that the thermally conductive powder included in the thermoelectric element 200 is partially pushed into the pores of the receptor 110.

In one embodiment, the thermally conductive powder included in the thermoelectric element 200 may be pushed into the pores by an external force by having a diameter smaller than the diameter of the pores of the receptacle 110.

As described above, since the thermoelectric element 200 is fitted or filled in the through hole 112 and a part of the thermoelectric element 200 is pushed through the pores of the receptacle 110 during the process, The coupling force is increased while having the same shape, and when the thermoelectric element 200 is pushed by an external force, the receptors 110 can be partly pressed together.

The exposed surface 210 of the thermoelectric element 200 after the thermoelectric element 200 is inserted or filled in the through hole 112 of the receptacle 110 may be flat but it is not precisely flat since it is used between the objects It is acceptable. For example, the thermoelectric element 200 can be pushed into the horizontal plane by being pressed against even a small force vertically provided in the semiconductor chip after being filled in the through hole 112.

In this case, the thermoelectric element 200 has the upper surface and the lower surface of the thermoelectric element 200 in a horizontal plane, and the thermoelectric element 200 has a thickness similar to that of the thermoelectric element 200, However, the present invention is not limited thereto as long as the thermoelectric element 200 can meet the object of the present invention depending on the viscosity, viscosity and size of the thermoelectric element 200.

For example, if the thermoelectric element 200 has a 'high viscosity', a horizontal level similar to that of the upper surface of the receptor 110 can be obtained. If the thermoelectric element 200 has a 'medium viscosity' May be preferred.

The surface area of the exposed surface 210 of the thermoelectric element 200 is made as small as possible or as small as the surface area of the contact surface of the heat generating element so as to maximize the contact area with the object to increase the thermal conductivity in the vertical direction.

In the case where the thermoelectric element 200 protrudes from the inlet of the through hole 112, since the thermoelectric element 200 first contacts the exposed surface 210 of the thermoelectric element 200 when a force is applied to the object, 200, the force of the object can be increased until the object touches the receptacle 110 of the body 100, resulting in a large pressing force.

However, since the thermoelectric element 200 has flowability and spreading characteristics, a slightly higher temperature may not be a problem.

When the exposed surface of the thermoelectric element 200 has the same horizontal level as that of the upper surface of the receptacle 110, the thermoelectric element 200 and the receptacle 110 are easily brought into contact at the same time when a force is applied to the object, And the dimensional tolerance of the thermoelectric element 200 may be slightly different. However, the thermoelectric element 200 has little flow and spreading characteristics and is not a serious problem.

When the exposed surface of the thermoelectric element 200 is slightly lower than the horizontal level of the upper surface of the receptacle 110, the receptacle 110 contacts first when a force is applied to the object, but the density and hardness of the receptacle 110 are low Therefore, the object can easily contact the thermoelectric element 200.

In this embodiment, it is assumed that the exposed surface 210 of the thermoelectric element 200 has substantially the same horizontal level as that of the upper surface of the receptor 110.

As described above, a part of the thermoelectric element 200 constituted by the silicone oil, the binder and the additive having viscosity and flowability is pushed through the pores of the open cell structure formed on the inner surface of the through hole 112 of the receiver 110 The bonding force between the thermoelectric element 200 and the receptor 110 increases.

As a result, it is possible to partially prevent the thermoelectric element 200 from moving up or down in the through hole 112 due to a force in the vertical direction by the object or by vibration or shock, Are partly mechanically integrated and also provide some elasticity to the side surface of the thermoelectric element 200.

In addition, the receiver 110 and the thermoelectric element 200 can receive external vibrations or shocks integrally to easily absorb external vibrations and shocks.

In addition, since the receptor 110 is firmly integrated with the thermoelectric element 200, the phenomenon that the thermoelectric element 200 is separated from the receptor 110 due to an external force is reduced, Do.

In addition, since the outer wall of the thermoelectric element 200, which is comparatively less resilient and less restoring, is integrally integrated with the receptacle 110 having good elasticity and restoring force, when the thermally conductive member is pressed and spread by the object, The integrated thermoelectric element 200 can be partially restored according to its height.

3) The thermally conductive sheet 120,

The thermally conductive sheet 120 is adhered to the lower surface of the receptacle 110 to block the through hole 112 of the receptacle 110 to make the through hole 112 a container, It is self-adhesive to or contacts the same object.

In one embodiment, the thermally conductive sheet 120 is formed by uniformly mixing thermally conductive powder in a silicone rubber or an acrylic resin, and has a thermal conductivity of 0.5 W to 10 W, which is lower than that of the thermoelectric element 200.

Preferably, the thermally conductive sheet 120 and the thermoelectric element 200 are composed of the same or similar series of polymer materials to maintain excellent adhesion to each other.

The thermally conductive sheet 120 may or may not have a self-adhesive property, and the self-adhesive force of the thermally-conductive sheet 120 is greater than the self-adhesive force of the thermoelectric element 200 when the self-

 As described above, the thermal conductivity of the thermally conductive sheet 120 is lower than the thermal conductivity of the thermoelectric element 200, but the thickness of the thermally conductive sheet 120 is made as thin as possible, for example, 0.05 mm to 0.2 mm, can do.

Including this embodiment, the thermally conductive sheet 120 may have various structures.

3 (a) shows a thermally conductive pressure-sensitive adhesive sheet 121 which is uniformly mixed with silicone rubber or acrylic resin and has a self-adhesive force on both sides thereof, as in this embodiment. In the middle, The same substrate is not provided and the mechanical strength is weak.

The thermally conductive pressure sensitive adhesive sheet 121 can be used when there is no pressure sensitive adhesive on the lower surface of the receptor 110, and can be produced by casting a liquid thermally conductive silicone rubber or acrylic resin and curing.

3 (b) shows a structure in which a thermally conductive adhesive sheet 121 is formed on both surfaces of a thermally conductive substrate 122, and FIG. 3 (c) shows a thermally conductive adhesive sheet 121 ) Are formed. The substrate 122 may be a PET film, a metal foil such as copper or aluminum, or a fiber having a metal layer formed thereon.

The thermally conductive pressure-sensitive adhesive sheet 121 can be used when there is no pressure-sensitive adhesive on the lower surface of the receiver 110, and can be manufactured by casting a liquid thermally conductive silicone rubber or acrylic resin on the thermally conductive substrate 122, have.

When the thermally conductive substrate 122 is a metal foil such as aluminum having a good thermal conductivity, heat transfer with the thermoelectric element 200 is good.

A thermally conductive elastic coating layer such as silicone rubber may be used instead of the thermally conductive pressure sensitive adhesive sheet 121 having the same structure as described above, and the coating layer may or may not have self-adhesive force, which will be described later.

The heat conduction member having such a structure is used interposed between a heating element such as an IC or a semiconductor chip and a cooling unit such as a metal case.

Preferably, the thermoelectric element 200 is brought into contact with the surface of the heat generating element.

At this time, it is possible to efficiently select whether or not the heat conducting member is attached to the metal case first and then assembled to the semiconductor chip or the semiconductor chip and assembled to the metal case. For example, the thermally conductive sheet 120 having an exposed surface wider than the thermoelectric elements 200 is attached to a metal case as a cooling unit, and then the printed circuit board and the case on which the semiconductor chips are mounted can be assembled easily and simply.

In this structure and configuration, the thermoelectric element 200 having a small exposed surface area and a small self-adhesive force at the time of rework or recycle can be easily separated from the semiconductor chip, thereby facilitating rework and recycling.

In addition, since the thermoelectric element 200 is embedded inside the receptor 110 and a part of the thermoelectric element 200 is exposed to the outside, the heat conduction performance inherent to the thermoelectric element 200 and the elasticity and restoring force inherent to the receptor 110 can be exerted.

Further, by applying the thermally conductive sheet 120, the mechanical strength of the receptor 110 can be reinforced. For example, the receptacle 110 is a foamed body, which is excellent in elasticity, resilience, and flexibility. However, since the mechanical strength is low, handling and processing are inconvenient. The thermally conductive sheet 120, It is easier to handle, mount and detach.

In addition, one of the through holes 112 can be easily and reliably and easily produced by fitting or pushing the thermoelectric element 200 into the through hole 112 of the receptacle 110 blocked by the thermally conductive sheet 120.

Further, it is possible to provide the thermoelectric elements with a uniform thickness according to the thickness of the receptors 110, so that it is easy to accommodate the thermoelectric elements even if the gap or the dimensional tolerance of the opposing mechanism is large or small.

Further, when the object is pressed in the vertical direction by the heat conducting member, the thermoelectric element 200 can be easily pushed in the horizontal direction with a small force, resulting in a large area contact and good close contact without applying force to the opposed object. At this time, the thermoelectric element 200 having flowability by the receptor does not leak sideways so as not to pollute the periphery, and the receptor 110 is deformed in the vertical direction so that the thermoelectric element 200 ) To assist in elastic contact.

Further, since the thermoelectric element 200 is housed in the through hole, it is protected from the external environment, and the thermoelectric element 200 does not flow out to the outside during a vibration test of an automobile or the like.

Fig. 4 shows an example of a state of supplying the heat conduction member.

The heat conduction member is arranged on the release film 10 and can be supplied in a state in which the surface of the thermoelectric element 200 exposed to the outside by the protective cover 20 made of plastic is not covered.

According to this configuration, since the exposed surface 210 of the thermoelectric element 200 having the self-adhesive force is protected from the internal and external environments by the cap-shaped protective cover 20, the thermoelectric element 200 is generated during handling or transportation of the thermoelectric element 200 Can be eliminated.

If the lower surface of the thermally conductive sheet 120 does not have a self-adhesive force, the cover 20 and the thermoelectric element 200 do not adhere to each other and the surface of the receptor 110 does not have self- And can be vacuum-picked up from the lower surface of the sheet 120 to be surface-mounted.

5 (a) to 5 (c) show a state in which the heat conduction member of the present invention is applied.

5 (a), when the size of the thermoelectric element 200 is equal to the size of the semiconductor chip 60, the receptacle 110 does not sufficiently support the semiconductor chip 60, but the pores of the receptacle 110 Since the receptor 110 and the thermoelectric element 200 are coupled to each other by the thermoelectric element 200 pushed in, the receptor 110 improves the elasticity of the thermoelectric element 200 partially.

Heat generated from the semiconductor chip 60 is transferred to the metal case 70 sequentially through the thermally conductive sheet 120 and the thermoelectric element 200.

5 (b), when the size of the thermoelectric element 200 is smaller than that of the semiconductor chip 60, the receiver 110 sufficiently supports the semiconductor chip 60 from underneath, But the overall heat conduction area is relatively small.

5 (c), when the size of the thermoelectric element 200 is wider than the size of the semiconductor chip 60, the semiconductor chip 60 is not supported at all from the bottom of the receptacle 110, It is difficult to reliably provide and the material cost also increases due to the price of the thermoelectric element 200.

As a result, it is preferable that the size of the thermoelectric element 200 is equal to or slightly smaller than the size of the semiconductor chip 60 for efficient heat transfer between the objects in the vertical direction.

Figure 6 shows a heat conducting member according to another embodiment of the invention.

In this embodiment, the thermally conductive sheet 120 is made of an aluminum foil, a copper foil, or a metal plated fiber, and a thermally conductive elastic coating layer 140 is formed on at least a lower surface thereof.

The thermally conductive sheet 120 can be adhered to the receptor 110 by the adhesive 130 adhered to the lower surface of the receptor 110 when the thermally conductive sheet 120 does not have a self-adhesive force.

The coating layer 140 may be a thermally conductive silicone rubber coating layer. The coating layer 140 may have a hardness of about 30 to about 70 shore A, which is higher than that of the paste or putty thermoelectric element 200.

Since the coating layer 140 has a hardness higher than that of the thermoelectric element 200 and has a low flowability, when the thermoelectric element 200 is pressed in the vertical direction, the thermoelectric element 200 spreads horizontally and is pressed against the opposing object.

As a result, the thermoelectric element 200 serves as a flowable thermoelectric element, and the coating layer 140 serves as a non-flowable thermoelectric element, which can complement each other. As a result, There is an advantage that the device 200 can be used.

The coating layer 140 may be formed by thinly coating and curing a liquid thermally conductive silicone rubber on an aluminum foil, and the aluminum foil may have a thickness of 5 to 150 microns and the coating layer 140 may have a thickness of 10 to 80 microns have.

The lower surface of the coating layer 140 may have a self-adhesive property or a self-adhesive property.

Vacuum pickup is easy when heat transfer is easier and there is no self-adhesive force in case of self-adhesive force. When there is no self-adhesive force, a release film having a slight self-adhesive force can be used to facilitate processing and handling.

According to this structure, since the heat conduction member having excellent thermal conductivity composed of the thermoelectric element-metal foil (aluminum foil) -thermally conductive coating layer is in direct contact between the cooling unit and the heat generating element, heat conduction is performed well in the vertical direction, When the thermal conductivity of the device 200 and the coating layer 140 are similar, the thermal conductivity can be maximized.

Since the thermoelectric element 200 having some elasticity comes into direct contact with the aluminum foil 120 and the coating layer 140 having a certain elasticity comes into direct contact with the heating element or the cooling unit and is in close contact therewith, Thermal conductivity is good.

Further, the combination of the aluminum foil 120 and the coating layer 140 improves the overall mechanical strength, facilitating handling, and facilitating mounting and detachment.

In addition, the aluminum foil or the copper foil constituting the thermally conductive sheet 120 has a characteristic that the price is low and the foil is stretched well.

Further, it is advantageous in that it is easy to manufacture, has various characteristics, and is easy to use.

In this embodiment, the size of the thermally conductive powder may be limited to prevent the thermally conductive powder from scarring the object.

For example, when the size of the alumina or boron powder having a high mechanical strength included in the coating layer 140 is large, alumina or boron powder is moved by the movement of the vibration during the vibration test after interposing the heat conduction member between the objects, The size of the alumina or boron powder needs to be smaller than the thickness of the receptor 110 or the coating layer 140 when compressed to the maximum.

The heat conduction member of the present invention is a heat conduction member that is interposed between an object such as a semiconductor, a speaker, a motor, or a display panel that provides heat generation inside an electronic device and a metal case or a heat sink that provides cooling, It absorbs shocks.

As described above, the present invention provides a thermoelectric sheet, a receiver having elasticity, and a flow and a viscous thermoelectric element connected to each other in a monolithic state on a release film, so that a customer can use a dispenser or a printer A thermoelectric element having a relatively uniform shape having viscosity and flowability can be easily used.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Accordingly, the scope of the present invention should not be construed as being limited to the embodiments described above, but should be construed in view of the claims set forth below.

100: Body
110: elastic receptor
112: Through hole
120: thermally conductive sheet
200: thermoelectric element

Claims (38)

A heat conduction member interposed between opposed objects including a heat generating element and a cooling unit and transferring heat in the vertical direction,
An elastic receptor having a through hole penetrating the upper surface and the lower surface in the thickness direction;
A thermally conductive sheet adhered to the lower surface of the receptor; And
A thermoelectric element having a viscosity and being fitted or filled in the through hole so as to be in contact with the side wall of the through hole and the thermally conductive sheet and exposed to the outside from the upper surface of the receptacle,
The thermoelectric element flows or spreads due to the pressure exerted by the object due to flow and spreadability of the thermoelectric element,
The thermal conductivity of the thermoelectric element is higher than the thermal conductivity of the receptor,
Wherein the thermoelectric element and the thermally conductive sheet are in contact with the object, respectively. In claim 1,
Wherein the elastic restoring force of the receptor is better than the elastic restoring force of the thermoelectric element. In claim 1,
Wherein the upper surface of the receptacle and the lower surface of the thermally conductive sheet form a plane. In claim 1,
Wherein the through holes are symmetrical with respect to an intermediate plane in the horizontal and vertical directions of the receptacle. In claim 1,
Wherein the receptacle is pressed at least 40% of its original height. In claim 1,
Wherein the receptacle and the thermally conductive sheet are adhered to each other via a pressure-sensitive adhesive. In claim 6,
Wherein the pressure-sensitive adhesive is an acrylic resin or a urethane resin pressure-sensitive adhesive having self-adhesive property. In claim 1,
Wherein the upper surface of the thermally conductive sheet has a self-
Wherein the receptacle and the thermally conductive sheet are adhered to each other by the self-adhesive force. In claim 1,
Characterized in that the receptacle is a foam, in which a skin layer is formed on at least one of an upper surface and a lower surface, and a body including an outer cut surface of the receptacle and a side wall of the through hole has pores of an open cell structure Conductive member. In claim 1,
And the receptacle is pressed together when the thermoelectric element is pressed in a state interposed between the objects. In claim 1,
Wherein the receptacle is a urethane rubber sponge or a silicone rubber sponge. In claim 1,
The degree of flow of the thermoelectric element is determined by the degree of flow of paste or grease spreading in some horizontal direction when there is no vibration in a state of being in a plane, Wherein the heat conduction member is a degree of flow of a paste or a putty. In claim 1,
Wherein the exposed surface of the thermoelectric element is substantially planar. In claim 1,
And at least a part of the thermoelectric element is pushed into a pore formed in a side wall of a through hole of the receptor. In claim 14,
Wherein a size of at least a part of the thermally conductive powder contained in the thermoelectric element is smaller than a thickness when the receptacle is pressed to the maximum. In claim 14,
Wherein at least a portion of the thermoelectric element pushed into the pores is pushed out of the pores when the receptacle is pushed. In claim 1,
Wherein the thermoelectric element has a self-adhesive force due to viscosity of the thermoelectric element. In claim 1,
Wherein the surface area of the exposed surface of the thermoelectric element is equal to or slightly smaller than the surface area of the contact surface of the heat generating element. In claim 1,
Wherein the thickness of the thermally conductive sheet is 1/2 or less of the thickness of the receptacle. In claim 1,
Wherein the thermally conductive sheet has a thermally conductive adhesive formed on at least one surface of the thermally conductive substrate. In claim 1,
Wherein the thermally conductive base material is a metal foil containing at least copper or aluminum, or a fiber having a metal layer of such a metal. In claim 21,
And a thermally conductive coating layer is formed on a lower surface of the thermally conductive sheet. In claim 1,
Wherein the thermally conductive sheet is made of a thermally conductive adhesive without a substrate. In claim 1,
Wherein the thermally conductive sheet has a self-adhesive property by forming a thermally conductive adhesive on at least one side of the polymer film base. In claim 1,
Wherein the thermally conductive sheet is adhered by the adhesive of the receptor. In claim 1,
Wherein the lower surface of the thermally conductive sheet is self-adhesive to the surface of one of the objects. In claim 1,
Wherein the thermoelectric element and the thermally conductive sheet are in direct contact with the surface of the heating element or the cooling unit. In claim 1,
Wherein the thermoelectric element is formed by mixing thermally conductive powder or thermally conductive fiber with silicone rubber or acrylic resin. In claim 1,
Wherein a surface area of the thermoelectric element is equal to or smaller than a surface area of the heating element and the cooling unit. A heat conduction member interposed between opposed objects including a heat generating element and a cooling unit and transferring heat in the vertical direction,
An elastic receptor having a through hole penetrating the upper surface and the lower surface in the thickness direction;
A thermally conductive sheet adhered to a lower surface of the receptor via an adhesive;
A thermoelectric element which is sandwiched or filled in the through hole to contact the side wall of the through hole and the thermally conductive sheet and is exposed to the outside from the upper surface of the receptacle; And
And a thermally conductive elastic coating layer formed on a lower surface of the thermally conductive sheet,
Flows or spreads by the pressure exerted by the object due to the flowability and spreadability of the thermoelectric element,
The thermal conductivity of the thermoelectric element is higher than the thermal conductivity of the receptor,
Wherein the thermoelectric element and the thermally conductive sheet are in contact with the object, respectively. [0041] In claim 30,
Wherein the thermally conductive sheet is composed of an aluminum foil, a copper foil or a metal plated fiber,
Wherein the coating layer is a thermally conductive silicone rubber coating layer, and the hardness of the thermoelectric element is higher than that of the thermoelectric element. The method of claim 1 or 30,
And the height of the heat conduction member is 0.03 mm to 3 mm. The method of claim 1 or 30,
Wherein the height of the thermoelectric element is lower than or equal to the height of the receptacle. The method of claim 1 or 30,
Wherein a concavity and convexity extending in a height direction is formed along an inner surface of the through hole of the receiver. A heat conduction member interposed between the opposed objects to transmit heat in the vertical direction;
A sheet-shaped release member on which the heat conduction member is disposed; And
And a protective cover mounted on the release member and covering the heat conduction member,
Wherein the heat conduction member comprises:
An elastic receptor having a through hole penetrating the upper surface and the lower surface in the thickness direction;
A thermally conductive sheet adhered to the lower surface of the receptor; And
And a thermoelectric element which is fitted in or filled in the through hole and is in contact with the side wall of the through hole and the thermally conductive sheet and is exposed on the upper surface of the receptacle and has viscosity, flowability and spreadability,
Wherein the thermoelectric element and the thermally conductive sheet are in contact with the object, respectively. 35. The method of claim 35,
Wherein the protective cover is not in contact with the thermoelectric element. 35. The method of claim 35,
Wherein the thermally conductive member is surface-mountable by vacuum pick-up by the release member and the protective cover. 35. The method of claim 35,
Wherein the release member and the protective cover are individually packaged individually or in a plurality of uniformly packaged packages.

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