CN106572618A - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN106572618A CN106572618A CN201610934291.0A CN201610934291A CN106572618A CN 106572618 A CN106572618 A CN 106572618A CN 201610934291 A CN201610934291 A CN 201610934291A CN 106572618 A CN106572618 A CN 106572618A
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- China
- Prior art keywords
- heat
- circuit board
- radiated
- radome
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a circuit board. A heat conduction piece which makes contact with at least one object, whose heat is to be taken away, on a substrate is arranged to conduct and transfer heat of the object, so that heat of the object can be transferred out timely and then taken away. The conduction piece can conduct and transfer heat, heat near the object whose heat is to be taken away can be reduced to certain extent, the problem that the heat radiation effect is not good due to the fact that the heat of the object cannot be taken away timely and still stays in positions near the object is solved, the heat radiation effect and the heat radiation efficiency are improved, and users can obtain better experiences.
Description
Technical field
The present invention relates to electronic circuit field, more particularly, it relates to a kind of circuit board.
Background technology
With the continuous progress of science and technology, electronic product has gradually tended to diversified, and spreads all over people's life each
The electronic products such as aspect, mobile phone, panel computer, MP3 or MP4 have become communication or the converter tools that people carry with,
It is well known that, these electronic products can all distribute when in use heat, but be often directly to pass through certain in prior art
A little heat sink materials come out the heat that electronic component in electronic product is produced, therefore, the radiation processes of electronic product are often
It is exactly directly to carry out where electronic component generation heat in electronic product, thus will result in electronic product inside and produce
Heat still rest near electronic component, it is impossible to be delivered to the external world in time and radiated, so as to cause radiating effect bad,
Cause electronic component overheated or even damage.
The content of the invention
The technical problem to be solved in the present invention is the heat transfer that in time cannot be produced in electronic component in prior art
Radiated to the external world, cause heat still to rest near electronic component, the problem for causing electronic component overheated or even damaging.
For the technical problem, there is provided a kind of circuit board.
To solve above-mentioned technical problem, the present invention provides a kind of circuit board, waits to dissipate including at least one on substrate
Heat target, and for carrying out conducting the heat-conducting piece of transfer to the heat of the object to be radiated；The heat-conducting piece is treated with described
Radiating object contacts, and the object to be radiated at least partly is covered.
Wherein, the object to be radiated is the radome on substrate, and the radome is enclosed out with the substrate
Shielding chamber, the shielding chamber is used to accommodate at least one electronic component for needing to be electromagnetically shielded.
Wherein, the depression that the inwall of the radome is provided with the shape of electronic component corresponding with this, size matches,
It is described to be recessed for cooperating with the electronic component for protruding the substrate.
Wherein, Heat Conduction Material is filled with the space beyond the radome content nano-electron element.
Wherein, the object to be radiated is to install electronic component on the substrate, or the substrate back with it is described
The corresponding region of electronic component set location.
Wherein, the region coating that the object to be radiated contacts with the heat-conducting piece has heat conduction glue-line.
Wherein, the fixed form between the heat-conducting piece and the object to be radiated be it is following it is several in any one：
Be adhesively fixed mode, screw fixation method and crimping fixed form.
Wherein, the heat-conducting piece is flexible PCB.
Wherein, the circuit board also includes radiating piece, and the radiating piece contacts with each other with the heat-conducting piece.
Wherein, the radiating piece is metal material.
Beneficial effect
The circuit board that the embodiment of the present invention is proposed, is contacted by arranging with least one object to be radiated on substrate
Heat-conducting piece with treat radiating object heat carry out conduction transfer, as such, it is possible to the heat for enabling object to be radiated is passed in time
Lead to be transferred out and radiated again, because heat can be carried out heat-conducting piece the heat near conduction transfer, therefore object to be radiated
Amount can also be reduced to a certain extent, and avoided the heat of object to be radiated and can not be passed in time, still be stopped
The bad problem of the radiating effect that causes near object to be radiated, is further carried radiating effect and radiating efficiency
Rise, so as to ensure that the reliability of the electronic product comprising foregoing circuit plate, enable user to obtain preferably experience.
Description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing：
Fig. 1 is the first structure schematic diagram of circuit board in first embodiment of the invention；
Fig. 2 is the second structural representation of circuit board in first embodiment of the invention；
Fig. 3 is the 3rd structural representation of circuit board in first embodiment of the invention；
Fig. 4 is a kind of front view of the circuit board in first embodiment of the invention in example；
Fig. 5 is the 4th structural representation of circuit board in first embodiment of the invention；
Fig. 6 is the structural representation of circuit board in second embodiment of the invention；
Fig. 7 is the front view of the circuit board in a kind of example of second embodiment of the invention；
Fig. 8 is the front view of the circuit board in second embodiment of the invention another kind example；
Specific embodiment
First embodiment
In order that the heat of object to be radiated can conduct in time being transferred out, the radiating effect of object to be radiated is lifted,
A kind of circuit board is present embodiments provided, specifically be may refer to shown in Fig. 1, wait to dissipate including at least one on substrate 11
Heat target 12, and for treat radiating object 12 heat carry out conduct transfer heat-conducting piece 13, the heat conduction in the present embodiment
Part 13 and object to be radiated 12 contact with each other, and object to be radiated 12 is at least partly covered.That is to say leading in the present embodiment
Warmware 13 can all cover the exposed region of object to be radiated 12, it is also possible to cover object to be radiated 12 exposed outside
A part of region.
Furthermore, it is necessary to explanation, the substrate 11 in the present embodiment can for PCB (Printed Circuit Board,
Printed circuit) plate.Wherein, can be with only one of which object 12 to be radiated on the substrate 11 in the present embodiment, it is possibility to have multiple to treat
Radiating object 12.When have on the substrate 11 in the present embodiment it is multiple wait radiate object 12 when, a heat conduction directly can be only set
The all of part of object to be radiated 12 is covered or is all covered by part 13, it is also possible to for each object to be radiated 12 or
Part radiating object is independently arranged respective heat-conducting piece 13, and respectively the corresponding heat-conducting piece 13 of radiating object is same can radiate this
Object part is covered, it is also possible to all cover the radiating object, wherein, the heat-conducting piece 13 that each radiating object is correspondingly arranged is used for
The heat of each self-corresponding object to be radiated 12 is guided into transfer.In addition it should be noted that treating in the present embodiment dissipates
Heat target 12 can be mounted in the radome on substrate 11, or the electronic component that can be mounted on substrate 11, or
It is the back side of substrate 11 region corresponding with electronic component set location, naturally it is also possible to be components and parts that other can be radiated
Or region.
When the object 12 that radiates is to install radome on the substrate 11, radome encloses with substrate 11 in the present embodiment
Close out shielding chamber to accommodate the electronic component that at least one needs are electromagnetically shielded.It should be appreciated that in the present embodiment
Shielding within the chamber can accommodate multiple electronic components, for example, two or three electronic components can be accommodated.Wherein, shield
The size and shape of the shielding chamber that cover is enclosed out with substrate 11 can be according to the size of the electronic component to be electromagnetically shielded
It is correspondingly arranged with number.Accordingly, shown in Figure 2, the heat-conducting piece 13 in this example can be arranged on outside radome 21
On surface, namely heat-conducting piece 13 is contacted with the outer surface of radome 21, and the outer surface of radome 21 is at least partly covered, its
Electronic component 22 is also accommodated in middle radome 21.
Of course, projection and depression can be set on the outer wall of radome 21, can so increase the radiating of radome 21
Area such that it is able to improve the radiating efficiency of radome 21, it should be noted that on the outer wall of radome 21 in the present embodiment
Raised and depression quantity can arbitrarily be arranged by manufacturer, and now, the heat-conducting piece 13 in the present embodiment can be arranged
On the outer wall of radome 21, and contact with projection and depression on the outer wall of radome 21, while on the outer wall of heat-conducting piece 13
Corresponding raised and depression can also be set, and with radome 21 on projection and depression match, it is possible thereby to increase heat conduction
The contact area of part 13 and radome 21, so as to lift the effect of heat conduction between heat-conducting piece 13 and radome 21.
In object to be radiated 12 is for a kind of example of radome 21, it is right with this to arrange on the inwall of radome 21
The depression for answering the shape of electronic component 22, size to match, the depression can electronic component for protruding substrate 11 corresponding with this
22 cooperate, and so, the heat that electronic component 22 is produced just can be distributed directly by radome 21；Treating that radiating is right
As 12 for radome 21 another example in, can shielding chamber in accommodate electronic component 22 beyond space in fill
Heat Conduction Material, it should be appreciated that the Heat Conduction Material in the present embodiment can be the various materials with heat conductivility, for example,
Can be the various metals for being capable of heat conduction, or the gas for being capable of heat conduction.Of course, the thickness of radome 21 in the present embodiment
Directly can specifically be arranged according to the size or volume of electronic component 22, for example, can be larger by the volume of electronic component 22
The thickness of the radome 21 corresponding to region arranges thinner, by the radome 21 corresponding to the small volume region of electronic component 22
Thickness arrange thicker.It is understood that the thermal conductivity of the Heat Conduction Material filled in the present embodiment can be more than air
Thermal conductivity, can so cause the radiating efficiency of radome 21 further to be lifted.
When in the present embodiment when the object 12 that radiates is to install electronic component 22 on the substrate 11, object to be radiated 12
Can be the arbitrary electronic component 22 on substrate 11, for example, it may be install chip on the substrate 11, resistance or
Person's electric capacity etc., specifically may refer to shown in Fig. 3, now, in order to the heat guiding for producing in electronic component 22 is transferred to outward
Boundary is preferably being radiated, it is also possible to directly arrange heat-conducting piece 13 on the surface of electronic component 22, maximum shadow region in Fig. 3
Domain is the region that electronic component 22 contacts with heat-conducting piece 13.Because electronic component 22 is often that heat is produced in circuit board
Root, so directly the heat that electronic component 22 is produced to be guided away the temperature that more can on the whole reduce circuit board.
When the object to be radiated 12 in the present embodiment is the back side of substrate 11 region corresponding with the set location of electronic component 22
When, its front view may refer to shown in Fig. 4, and the heat-conducting piece 13 in the present embodiment can be arranged on the back side of substrate 11 and electronic component
On the corresponding region of 22 set locations, and by the back side of substrate 11 region part corresponding with the set location of electronic component 22 or entirely
Portion covers.
In addition it is also necessary to explanation, in order to strengthen the heat-conducting effect between object to be radiated 12 and heat-conducting piece 13, can be with
In the region coating heat conduction glue-line that object to be radiated 12 contacts with heat-conducting piece 13.For example, can object to be radiated 12 with lead
The region coating heat conductive silica gel that warmware 13 contacts.
It should be appreciated that the fixed form between the heat-conducting piece 13 and object to be radiated 12 in the present embodiment include but not
It is limited to the mode of being adhesively fixed, screw fixation method and crimping fixed form.
It should be noted that the shapes and sizes of the heat-conducting piece 13 in the present embodiment can arbitrarily be arranged, and certainly, system
The person of making children can also be correspondingly arranged heat conduction according to the size and shape of the size and shape of circuit board or object to be radiated 12
The size and shape of part 13.
Further, since flexible PCB has good thermal diffusivity, so the heat-conducting piece 13 in the present embodiment can be soft
Property circuit board, or can also be made by the exsertile material of other heat conductivity.It is understood that working as the present embodiment
In heat-conducting piece 13 when being flexible PCB, can be directly by electronic component 22 on the flexible PCB, such flexible electrical
Road plate not act as the role of heat-conducting piece 13 merely with the heat conductivility of its own, can also utilize its own line layer and
Solderability serves as the role of substrate 11.
In order that heat-conducting piece 13 can be transmitted in time from the heat that the guiding of object to be radiated 12 is transferred out distribute, this
Embodiment provide circuit board can also include radiating piece 51, specifically may refer to shown in Fig. 5, wherein, radiating piece 51 with lead
Warmware 13 contacts with each other, and shape and the size of certain radiating piece 51 can also flexibly be arranged by manufacturer.For example, radiating piece 51
Shape could be arranged to cuboid, square or spheroid etc..Radiating piece 51 in the present embodiment can be metal material,
Can be for example metallic copper or metallic iron or metallic aluminium etc., certainly in addition, the radiating piece 51 in the present embodiment
Can also be and be made by the material of other capacity of heat transmission and good heat dispersion performance.
The circuit board that the present embodiment is provided, by arranging the heat conduction contacted with least one object to be radiated on substrate
Part carries out conduction transfer with the heat for treating radiating object, as such, it is possible to the heat for enabling object to be radiated conducts in time transfer
Go out to be radiated again, because heat can be carried out heat near conduction transfer, therefore object to be radiated one by heat-conducting piece
Determining to be reduced in degree, and avoid the heat of object to be radiated to pass in time, still rest on and wait to dissipate
The bad problem of the radiating effect that causes near heat target, further makes radiating effect and radiating efficiency be improved, from
And user can be made to obtain preferably experience.
Second embodiment
In order to be better understood from the present invention, the present embodiment provides a kind of more specific circuit board, shown in Figure 6,
Including pcb board 61, and the object to be radiated on pcb board 61, for ease of understanding, the present embodiment is with object to be radiated as screen
Cover cover 21 to be specifically described, certainly, object to be radiated can also be that electronic component 22 or the PCB back sides are arranged with electronic component
The corresponding region in position, additionally, the circuit board that the present embodiment is provided also includes the flexible PCB 62 being arranged on radome 21,
Flexible PCB 62 in the present embodiment is used to carry out conduction transfer to the heat of radome 21.
Because flexible PCB 62 can require arbitrarily to arrange arrangement according to space layout, for example it can with free bend,
Winding, fold etc., therefore the flexible PCB 62 in the present embodiment can be arranged on radome 21 with arbitrary shape.Example
Such as, flexible PCB 62 can be made to contact with each other with each face of radome 21 completely, namely incites somebody to action can flexible PCB 62
Radome 21 is completely covered, and specifically may refer to shown in Fig. 7, and Fig. 7 is what flexible PCB 62 was completely covered radome 21
Front schematic view；Certainly, flexible PCB 62 can also be contacted only with the top surface of radome 21, and now, flexible PCB 62 will
The front schematic view that the top surface of radome 21 is completely covered may refer to shown in Fig. 8.
When multiple radomes 21 are included on pcb board 61 in the present embodiment, a flexible PCB directly can be only set
The part of all of radome 21 is covered or is all covered by 62, it is also possible to be independently arranged for each radome 21 respective
Flexible PCB 62 by the heat of each self-corresponding radome 21 so that guide transfer.
In addition it should be noted that the radome 21 in the present embodiment encloses out shielding chamber with pcb board 61, chamber is shielded
In can accommodate multiple electronic components 22, for example can be accommodate one or two or three electronic components, it is certainly, right
The number of the electronic component 22 accommodated in shielding chamber, manufacturer can be according to the size of electronic component 22 and shielding chamber
Size specifically arranging, it is to be understood that the radome 21 in the present embodiment can to shielding chamber in each electricity for accommodating
Subcomponent 22 is electromagnetically shielded.
In order that the radiating effect of radome 21 more preferably, lifts on the whole the radiating efficiency of radome 21, the present embodiment
Accommodate in shielding chamber in the space beyond electronic component 22 and be also filled with Heat Conduction Material, it should be appreciated that in the present embodiment
Heat Conduction Material can be the various materials with heat conductivility, for example, it may be the various metals for being capable of heat conduction, or can
The gas of heat conduction.It should be noted that the thermal conductivity of the Heat Conduction Material filled in the present embodiment should be more than the thermal conductivity of air,
The radiating efficiency of radome 21 can be so caused further to be lifted.
Additionally, in order to strengthen it is to be shielded cover 21 and flexible PCB 62 between heat-conducting effect, can radome 21 with
The region coating heat conduction glue-line that flexible PCB 62 contacts.For example, the area that can be contacted with heat-conducting piece in object to be radiated
Domain coated with thermally conductive silica gel.Additionally it is understood that the fixation side between the heat-conducting piece and object to be radiated in the present embodiment
Formula includes but is not limited to the mode that is adhesively fixed, screw fixation method and crimping fixed form.
In order that heat-conducting piece can be transmitted in time from the heat that object to be radiated guiding is transferred out distributing, this enforcement
The circuit board that example is provided can also include radiating piece, wherein, radiating piece contacts with each other with flexible PCB 62, certainly, radiating piece
Shape can also flexibly be arranged by manufacturer with size.For example, the shape of radiating piece could be arranged to cuboid, square
Or spheroid etc..Radiating piece in the present embodiment can be metal material, for example can for metallic copper or metallic iron or
Person's metallic aluminium etc., certainly in addition, the radiating piece in the present embodiment can also be by other capacity of heat transmission and heat dispersion
Preferably material is made.
The circuit board that the present embodiment is provided, by arranging the flexible PCB contacted with the radome on pcb board with right
The heat of radome carries out conduction transfer, as such, it is possible to the heat for enabling radome conducts to be transferred out in time and dissipated again
Heat, because the heat near radome has been carried out conduction transfer by flexible PCB, therefore, the heat near radome also just subtracts
It is few, further also just make the overall radiating effect of circuit board and radiating efficiency be improved, so as to user can obtain
More preferable experience.
It should be noted that herein, term " including ", "comprising" or its any other variant are intended to non-row
His property is included, so that a series of process, method, article or device including key elements not only include those key elements, and
And also include other key elements being not expressly set out, or also include for this process, method, article or device institute inherently
Key element.In the absence of more restrictions, the key element for being limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
Also there is other identical element in the process of key element, method, article or device.
The embodiments of the present invention are for illustration only, do not represent the quality of embodiment.
Through the above description of the embodiments, those skilled in the art can be understood that above-described embodiment side
Method can add the mode of required general hardware platform to realize by software, naturally it is also possible to by hardware, but in many cases
The former is more preferably embodiment.Based on such understanding, technical scheme is substantially done to prior art in other words
Going out the part of contribution can be embodied in the form of software product, and the computer software product is stored in a storage medium
In (such as ROM/RAM, magnetic disc, CD), including some instructions are used so that a station terminal equipment (can be mobile phone, computer takes
Business device, air-conditioner, or network equipment etc.) perform method described in each embodiment of the invention.
Embodiments of the invention are described above in conjunction with accompanying drawing, but be the invention is not limited in above-mentioned concrete
Embodiment, above-mentioned specific embodiment is only schematic, rather than restricted, one of ordinary skill in the art
Under the enlightenment of the present invention, in the case of without departing from present inventive concept and scope of the claimed protection, can also make a lot
Form, these are belonged within the protection of the present invention.
Claims (10)
1. a kind of circuit board, it is characterised in that include at least one object to be radiated being located on substrate, and for described
The heat of object to be radiated carries out conducting the heat-conducting piece of transfer；The heat-conducting piece contacts with the object to be radiated, and by institute
State object to be radiated at least partly to cover.
2. circuit board as claimed in claim 1, it is characterised in that the object to be radiated is the shielding on substrate
Cover, the radome encloses out shielding chamber with the substrate, and the shielding chamber is used for receiving at least one to be needed to carry out electricity
The electronic component of magnetic shield.
3. circuit board as claimed in claim 2, it is characterised in that the inwall of the radome is provided with electronics corresponding with this
The depression that the shape of element, size match, the depression is used to be cooperated with the electronic component for protruding the substrate.
4. circuit board as claimed in claim 2, it is characterised in that in the space beyond the radome content nano-electron element
Filled with Heat Conduction Material.
5. circuit board as claimed in claim 1, it is characterised in that the object to be radiated is to install electricity on the substrate
Subcomponent, or substrate back region corresponding with the electronic component set location.
6. circuit board as claimed in claim 1, it is characterised in that the area that the object to be radiated contacts with the heat-conducting piece
Domain is coated with heat conduction glue-line.
7. circuit board as claimed in claim 1, it is characterised in that the fixation between the heat-conducting piece and the object to be radiated
Mode be it is following it is several in any one：Be adhesively fixed mode, screw fixation method and crimping fixed form.
8. the circuit board as described in any one of claim 1-7, it is characterised in that the heat-conducting piece is flexible PCB.
9. the circuit board as described in any one of claim 1-7, it is characterised in that also including radiating piece, the radiating piece and institute
State heat-conducting piece to contact with each other.
10. circuit board as claimed in claim 9, it is characterised in that the radiating piece is metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610934291.0A CN106572618A (en) | 2016-10-31 | 2016-10-31 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610934291.0A CN106572618A (en) | 2016-10-31 | 2016-10-31 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106572618A true CN106572618A (en) | 2017-04-19 |
Family
ID=58534361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610934291.0A Pending CN106572618A (en) | 2016-10-31 | 2016-10-31 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106572618A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107172872A (en) * | 2017-06-26 | 2017-09-15 | 上海传英信息技术有限公司 | The heat abstractor and electric terminal of electric terminal |
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|---|---|---|---|---|
| CN107172872A (en) * | 2017-06-26 | 2017-09-15 | 上海传英信息技术有限公司 | The heat abstractor and electric terminal of electric terminal |
| CN107172872B (en) * | 2017-06-26 | 2024-02-13 | 上海传英信息技术有限公司 | Heat abstractor and electronic terminal of electronic terminal |
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Application publication date: 20170419 |
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