CN205304903U - Mobile phone - Google Patents
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- CN205304903U CN205304903U CN201620017501.5U CN201620017501U CN205304903U CN 205304903 U CN205304903 U CN 205304903U CN 201620017501 U CN201620017501 U CN 201620017501U CN 205304903 U CN205304903 U CN 205304903U
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Abstract
The utility model provides a mobile phone, include: electronic components, the heat conduction structure, heat radiation structure, electronic components is through heat conduction structure and heat radiation structure contact heat exchange, skeleton texture, electronic components support on skeleton texture, heat radiation structure and skeleton texture contact heat dissipation. The bad problem of the interior electronic components heat dissipation of mobile phone among the prior art has been solved in this application.
Description
Technical field
The utility model relates to communication apparatus technical field, in particular to a kind of mobile phone.
Background technology
At present, the communication apparatus ubiquity bad problem of dispelling the heat.
Taking smart mobile phone as example, CUP is as heat generating components main in electronic devices and components, and the quality of its heat dispersion, affectsThe speed of service of mobile phone.
Existing mobile phone, after long-time use, easily cause hot-spot, back cover overheated, affect user's experience. In addition, looseHeat is uneven, in the service life that can damage electronic devices and components, causes system running speed slow, even crashes.
Utility model content
Main purpose of the present utility model is to provide a kind of mobile phone, to solve in prior art in mobile phone cooling electronic component notGood problem.
To achieve these goals, the utility model provides a kind of mobile phone, comprising: electronic devices and components; Conductive structure; Heat radiationStructure, electronic devices and components are by conductive structure and radiator structure contact heat-exchanging; Skeleton structure, electronic devices and components are supported on skeleton knotOn structure, radiator structure contacts heat radiation with skeleton structure.
Further, skeleton structure comprises center and back cover, and radiator structure contacts heat radiation with center and/or back cover.
Further, electronic devices and components comprise cpu chip, conductive structure and cpu chip contact heat-exchanging.
Further, the first end of conductive structure and cpu chip contact heat-exchanging, second end relative with first end of conductive structureWith radiator structure contact heat-exchanging.
Further, in the direction of extending to the second end perpendicular to first end, the projection of conductive structure on cpu chip wideDegree be greater than cpu chip width 2/3rds.
Further, the end face of second end one side away from conductive structure of the end face of the first end of conductive structure and cpu chip is flatNeat setting.
Further, after the assembling of cpu chip and conductive structure, the projection of cpu chip on conductive structure is positioned at conductive structureBetween the end of the end of first end and the second end.
Further, in the direction of extending to the second end at first end, the contact length of conductive structure and cpu chip is more than or equal toCpu chip the party upwards length 1/5th.
Further, conductive structure and radiator structure are all placed along the center line of cpu chip.
Further, the center of radiator structure with respect to the second end of conductive structure the first end near conductive structure.
Further, conductive structure is that material with carbon element or copper product are made.
Further, conductive structure has double layer hollow structure.
Further, in the form of sheets, the thickness of conductive structure is in the form of sheets more than or equal to 0.25 millimeter and be less than or equal to 0.35 to conductive structureMillimeter.
Further, the thickness of conductive structure is in the form of sheets 0.3 millimeter.
Further, radiator structure in the form of sheets.
Further, the area of radiator structure is in the form of sheets more than or equal to 60*60 square millimeter.
Further, radiator structure is graphite heat radiation fin or Nanometer Copper material fin.
Application the technical solution of the utility model, by setting up conductive structure and radiator structure, so that the heat on electronic devices and components,Can be passed on radiator structure to accelerate heat radiation by conductive structure. Like this, will make heat on electronic devices and components by as early as possibleDistribute, avoid mobile phone hot-spot, extended the service life of electronic devices and components, avoid the speed of service of the system that affects,Improve user's experience.
Brief description of the drawings
The Figure of description that forms the application's a part is used to provide further understanding of the present utility model, of the present utility modelSchematic description and description is used for explaining the utility model, does not form improper restriction of the present utility model. In the accompanying drawings:
Fig. 1 shows according to the installation of CUP chip, conductive structure and the radiator structure of an optional embodiment of the present utility modelPosition relationship schematic diagram; And
Fig. 2 shows the cutaway view of an angle of Fig. 1.
Wherein, above-mentioned accompanying drawing comprises the following drawings mark:
10, conductive structure; 11, first end; 12, the second end; 20, radiator structure; 30, cpu chip.
Detailed description of the invention
It should be noted that, in the situation that not conflicting, the feature in embodiment and embodiment in the application can combine mutually.Describe below with reference to the accompanying drawings and in conjunction with the embodiments the utility model in detail.
Be noted that following detailed description is all exemplary, being intended to provides further instruction to the application. Unless separately there is fingerBright, all technology used herein and scientific terminology have with the application person of an ordinary skill in the technical field conventionally to be understoodIdentical meanings.
In the utility model, in the situation that not doing contrary explanation, the noun of locality of use refers to respect to respectively as " inside and outside "The profile of parts itself inside and outside, but the above-mentioned noun of locality is not limited to the utility model.
In order to solve in prior art the bad problem of cooling electronic component in mobile phone, the utility model provides a kind of mobile phone.
As depicted in figs. 1 and 2, mobile phone comprises electronic devices and components (not shown), conductive structure 10, radiator structure 20 and skeletonStructure (not shown), electronic devices and components are by conductive structure 10 and radiator structure 20 contact heat-exchangings, and electronic devices and components are supported on boneOn shelf structure, radiator structure 20 contacts heat radiation with skeleton structure.
By setting up conductive structure 10 and radiator structure 20, so that the heat on electronic devices and components can pass through conductive structure 10Be passed on radiator structure 20 to accelerate heat radiation. Like this, will make the heat on electronic devices and components be distributed as soon as possible, keep awayExempt from mobile phone hot-spot, extended the service life of electronic devices and components, avoid the speed of service of the system that affects, improved user's bodyTest.
Just as is known to the person skilled in the art, skeleton structure comprises center and back cover, and radiator structure 20 contacts with center and/or back coverHeat radiation. Because center is the main frame of mobile phone, thereby can select radiator structure 20 and center contact heat-exchanging. Certainly, for thatPlant the mobile phone that back cover cannot be dismantled, can also select radiator structure 20 and back cover contact heat-exchanging.
Electronic devices and components in the utility model comprise cpu chip 30, conductive structure 10 and cpu chip 30 contact heat-exchangings.Are main heater elements just because of cpu chip 30, thereby conductive structure 10 are connected to Neng Gouxian with cpu chip 30Work improves the problem of mobile phone local pyrexia.
The principle that mobile phone in the utility model adopts first heat conduction to dispel the heat again, the heat that cpu chip is produced discharges as much as possibleGo, heat dissipation capacity can reach 85% effect. Conductive structure 10 has good guiding function, and radiator structure 20 can be by heatBe distributed to equably whole center and get on, finally distribute along the surrounding of center, thereby effectively avoid the excess Temperature of back cover.
Alternatively, center is that aluminum titanium alloy material is made. Center is also referred to as face-piece.
Certainly, electronic devices and components also comprise the parts such as resistance, inductance. Staff can be according to the heating degree of electronic devices and components,The position of reasonable Arrangement conductive structure 10, to carry out radiating treatment to heat generating member.
As depicted in figs. 1 and 2, first end 11 and cpu chip 30 contact heat-exchangings of conductive structure 10, conductive structure 10Second end 12 and radiator structure 20 contact heat-exchangings relative with first end 11. When cpu chip 30 dispels the heat, conductive structure 10 canSo that heat is passed to the second end 12 by first end 11, then exhale via radiator structure 20.
Alternatively, in the direction of extending to the second end 12 perpendicular to first end 11, conductive structure 10 is on cpu chip 30The width of projection be greater than cpu chip 30 width 2/3rds. Through verification experimental verification, when conductive structure 10 and CPU coreWhen the contact area of sheet 30 is too small, can causes the radiating effect variation of cpu chip 30, thereby affect the operational reliability of mobile phone.
Alternatively, second end 12 away from conductive structure 10 of the end face of the first end 11 of conductive structure 10 and cpu chip 30The concordant setting of end face of one side. Like this, make conductive structure 10 and the abundant contact heat-exchanging of cpu chip 30, best loose to ensureThermal effect.
Alternatively, after cpu chip 30 assembles with conductive structure 10, the projection of cpu chip 30 on conductive structure 10 is positioned atBetween the end of the first end 11 of conductive structure 10 and the end of the second end 12. Like this, make conductive structure 10 and CPU coreThe abundant contact heat-exchanging of sheet 30, to ensure best radiating effect.
Alternatively, in the direction of extending to the second end 12 at first end 11, conductive structure 10 is long with contacting of cpu chip 30Degree be more than or equal to cpu chip 30 the party upwards length 1/5th. In the time that contact area is too small, can affect conductive structure10 with the contact heat-exchanging of cpu chip 30. Our experiments show that, the two at least should meet above-mentioned 1/5th contact length and wantAsk.
In order to improve the radiating effect of cpu chip 30, conductive structure 10 and radiator structure 20 are along the center line of cpu chip 30Place. Like this, heat radiation uniformity is best.
In order to improve the radiating effect of cpu chip 30, the center of radiator structure 20 is with respect to the second end of conductive structure 1012 first ends 11 near conductive structure 10.
Alternatively, conductive structure 10 is that material with carbon element or copper product are made.
Alternatively, conductive structure 10 has double layer hollow structure. Like this, under the prerequisite of guarantee heat conductivility, can also effectively fallThe cost of low conductive structure 10, the combination property of raising mobile phone.
Alternatively, in the form of sheets, the thickness of conductive structure 10 is in the form of sheets more than or equal to 0.25 millimeter and be less than etc. to conductive structure 10In 0.35 millimeter. Like this, neither can affect the thickness of mobile phone, can also ensure heat-conducting effect optimization.
Further alternatively, the thickness of conductive structure 10 is in the form of sheets 0.3 millimeter.
Alternatively, radiator structure 20 in the form of sheets. Due to radiator structure 20 in the form of sheets, thereby there is larger area of dissipation, energyEnough heat is distributed to center equably and gets on, finally by aluminium alloy, heat is distributed along surrounding.
Alternatively, the area of radiator structure 20 is in the form of sheets more than or equal to 60*60 square millimeter. Our experiments show that, when heat radiation knotThe area of structure 20 is too small, can affect the integral heat sink performance of mobile phone, thereby should be by the area control of radiator structure 20 reasonablyIn scope.
Alternatively, the area of radiator structure 20 can be changed according to mobile phone size.
Alternatively, radiator structure 20 is graphite heat radiation fin or Nanometer Copper material fin.
When mobile phone is during in holding state, the temperature of cpu chip 30 maintains the normal temperature of 30 degree left and right, now cpu chip 30The heat producing, by the heat transmission of conductive structure 10, and the heat radiation of self, dissipate.
When mobile phone is under normal operating conditions, the temperature of cpu chip 30 reaches 60 degree left and right, the now work of conductive structure 10Use large gross appearance, conductive structure 10 can be by more than 80% heat by self being delivered to the second end 12, with the second end 12 placesRadiator structure 20 contact heat-exchangings, the heat passing over is delivered to whole center by radiator structure 20, finally by aluminium alloyFrame and surrounding frame, distribute heat along surrounding.
When playing games with mobile phone or when high-power use, the temperature of cpu chip 30 reaches 80 degree left and right, now conductive structure10 perfect embodiment of effect, conductive structure 10 can be by more than 85% heat by self being delivered to the second end 12, with the second end12 radiator structures that are connected 20, are delivered to whole center by the heat passing over, finally by aluminium alloy center and surroundingFrame, distributes heat along surrounding.
As can be seen from the above description, the utility model the above embodiments have realized following technique effect:
1. the mobile phone in the utility model can make the heat that cpu chip 30 produces be distributed equably, improves radiating efficiency,Reduce temperature;
2. the perfect heat-dissipating of the mobile phone in the utility model, can effectively improve hardware longevity, is of value to the smooth operation of system,Strengthening user experiences.
It should be noted that the term that used is only in order to describe detailed description of the invention here, but not intention restriction is according to this ShenIllustrative embodiments please. As used herein, unless context explicitly points out in addition, otherwise singulative is also intended toComprise plural form, in addition, it is to be further understood that when using in this manual term " to comprise " and/or when " comprising ", itsIndicate and have feature, step, work, device, assembly and/or their combination.
It should be noted that term " first ", " second " etc. in the application's description and claims and above-mentioned accompanying drawingBe for distinguishing similar object, and needn't be used for describing specific order or precedence. Should be appreciated that the data of such useSuitably in situation, can exchange, so that the application's described herein embodiment can be with except diagram here or describeOrder beyond those is implemented.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for this areaTechnical staff, the utility model can have various modifications and variations. All within spirit of the present utility model and principle, instituteDo any amendment, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (17)
1. a mobile phone, is characterized in that, comprising:
Electronic devices and components;
Conductive structure (10);
Radiator structure (20), described electronic devices and components connect by described conductive structure (10) and described radiator structure (20)Touch heat exchange;
Skeleton structure, described electronic devices and components are supported in described skeleton structure, described radiator structure (20) and described skeletonStructure contact heat radiation.
2. mobile phone according to claim 1, is characterized in that, described skeleton structure comprises center and back cover, described heat radiation knotStructure (20) contacts heat radiation with described center and/or described back cover.
3. mobile phone according to claim 1, is characterized in that, described electronic devices and components comprise cpu chip (30), described in leadHeat structure (10) and described cpu chip (30) contact heat-exchanging.
4. mobile phone according to claim 3, is characterized in that, the first end (11) of described conductive structure (10) with described inCpu chip (30) contact heat-exchanging, second end (12) relative with described first end (11) of described conductive structure (10)With described radiator structure (20) contact heat-exchanging.
5. mobile phone according to claim 4, is characterized in that, perpendicular to described first end (11) to described the second end (12)In the direction of extending, the width of the projection of described conductive structure (10) on described cpu chip (30) is greater than described CPU2/3rds of the width of chip (30).
6. mobile phone according to claim 4, is characterized in that, the end of the described first end (11) of described conductive structure (10)The end face of described second end (12) one sides away from described conductive structure (10) of face and described cpu chip (30) is flatNeat setting.
7. mobile phone according to claim 4, is characterized in that, described cpu chip (30) and described conductive structure (10)After assembling, the projection of described cpu chip (30) on described conductive structure (10) is positioned at described conductive structure (10)The end of described first end (11) and the end of described the second end (12) between.
8. mobile phone according to claim 4, is characterized in that, extends to described the second end (12) at described first end (11)Direction on, the contact length of described conductive structure (10) and described cpu chip (30) is more than or equal to described CPU coreSheet (30) the party upwards length 1/5th.
9. mobile phone according to claim 4, is characterized in that, described conductive structure (10) and described radiator structure (20)All place along the center line of described cpu chip (30).
10. mobile phone according to claim 4, is characterized in that, the center of described radiator structure (20) is with respect to describedSecond end (12) of conductive structure (10) is near the first end (11) of described conductive structure (10).
11. mobile phones according to claim 1, is characterized in that, described conductive structure (10) is that material with carbon element or copper product are made.
12. mobile phones according to claim 1, is characterized in that, described conductive structure (10) has double layer hollow structure.
13. mobile phones according to claim 1, is characterized in that, described conductive structure (10) in the form of sheets, in the form of sheets described inThe thickness of conductive structure (10) is more than or equal to 0.25 millimeter and be less than or equal to 0.35 millimeter.
14. mobile phones according to claim 13, is characterized in that, the thickness of described conductive structure (10) is in the form of sheets 0.3Millimeter.
15. mobile phones according to claim 1, is characterized in that, described radiator structure (20) in the form of sheets.
16. mobile phones according to claim 15, is characterized in that, the area of described radiator structure (20) is in the form of sheets greater than etc.In 60*60 square millimeter.
17. mobile phones according to claim 1, is characterized in that, described radiator structure (20) is graphite heat radiation fin or Nanometer CopperMaterial fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620017501.5U CN205304903U (en) | 2016-01-07 | 2016-01-07 | Mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620017501.5U CN205304903U (en) | 2016-01-07 | 2016-01-07 | Mobile phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205304903U true CN205304903U (en) | 2016-06-08 |
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ID=56485364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620017501.5U Active CN205304903U (en) | 2016-01-07 | 2016-01-07 | Mobile phone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205304903U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106453727A (en) * | 2016-12-07 | 2017-02-22 | 深圳市传奇数码有限公司 | Smart mobile phone heat dissipation device |
| CN106572618A (en) * | 2016-10-31 | 2017-04-19 | 努比亚技术有限公司 | Circuit board |
| CN107979942A (en) * | 2016-10-21 | 2018-05-01 | 东莞爵士先进电子应用材料有限公司 | The thermal dispersant coatings structure of portable electronic devices |
-
2016
- 2016-01-07 CN CN201620017501.5U patent/CN205304903U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107979942A (en) * | 2016-10-21 | 2018-05-01 | 东莞爵士先进电子应用材料有限公司 | The thermal dispersant coatings structure of portable electronic devices |
| CN106572618A (en) * | 2016-10-31 | 2017-04-19 | 努比亚技术有限公司 | Circuit board |
| CN106453727A (en) * | 2016-12-07 | 2017-02-22 | 深圳市传奇数码有限公司 | Smart mobile phone heat dissipation device |
| CN106453727B (en) * | 2016-12-07 | 2019-11-15 | 深圳市传奇数码有限公司 | A kind of smart phone radiator |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |