CN107910318A - Wave dispersion heat structure is inhaled in a kind of electromagnetic radiation - Google Patents
Wave dispersion heat structure is inhaled in a kind of electromagnetic radiation Download PDFInfo
- Publication number
- CN107910318A CN107910318A CN201711269039.3A CN201711269039A CN107910318A CN 107910318 A CN107910318 A CN 107910318A CN 201711269039 A CN201711269039 A CN 201711269039A CN 107910318 A CN107910318 A CN 107910318A
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- heat
- chip
- electromagnetic radiation
- ripple
- suction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention discloses a kind of electromagnetic radiation and inhales wave dispersion heat structure, suction ripple layer including being arranged at chip exterior, chip is arranged on pcb board, ripple layer is inhaled to be made of absorbing material, and covering can be closed by chip by inhaling ripple layer, and the electromagnetic radiation of chip is isolated from the outside, and absorbing material is employed because inhaling ripple layer, electromagnetic radiation is can absorb by its material property and surface micro-structure, electromagnetic wave will not form diffusing reflection and the normal operation of chip is had an impact；Heat caused by chip can be conducted with the fever wafer thermal contact conductance on chip by inhaling ripple layer by inhaling the inner surface of ripple layer, inhaled fitting on the outer surface of ripple layer and set heat sink, heat sink is received and distributed from the heat for inhaling the conduction of ripple layer.Scheme using the present invention, can absorption of electromagnetic radiation to ensure that chip operation is interference-free, and by the timely heat conduction of heat sink and radiate, relative to traditional structure, conductive structure only has one layer, and there is no thermal contact resistance, thus heat transfer efficiency higher, is conducive to the speed of heat radiation.
Description
Technical field
The present invention relates to technical field of semiconductors, further relates to a kind of electromagnetic radiation and inhales wave dispersion heat structure.
Background technology
Existing electronic component usually all each incorporates high-frequency circuit, digital circuit and analog circuit, these electronics member
Part mutually produces electromagnetic interference when working, and not only have impact on the performance of electronic component, but also can be detrimental to health；In order to prevent
Electromagnetic radiation, generally can be all provide with electronic component one closing ground connection electro-magnetic shielding cover, using shielding case by component,
Circuit, sub-assembly, the interference source of cable or whole system surround covering, prevent interference electromagnetic field to external diffusion.
As shown in Figure 1, it is traditional shielding case assembly structure figure；Chip 01 is pyrotoxin, is led on chip 01 in attachment
Thermal cotton 02, is provide with shielding case 03, interior heat conduction foam 02 is contacted with the inner wall of shielding case 03, in shielding case 03 outside chip 01
It is exterior other heat conduction foam 04 is set, heat sink 05 is fitted on outer heat conduction foam 04.Completely cut off chip by shielding case to produce
Electromagnetic radiation, the heat that chip produces is transferred to heat sink by interior heat conduction foam, shielding case, outer heat conduction foam successively, leads to
Cross heat sink and outwardly distribute heat.
Signal is only physically separated by shielding case, electromagnetic radiation diffusing reflection in shielding case, causes that itself disturbs to ask
Topic, have impact on the performance of chip.For those skilled in the art, design one kind can reduce diffusing reflection and chip is produced
The structure of influence, is the current technical issues that need to address.
The content of the invention
The present invention provides a kind of electromagnetic radiation and inhales wave dispersion heat structure, avoids influence of the diffusing reflection to chip signal, and have
It is as follows beneficial to heat dissipation, concrete scheme：
Wave dispersion heat structure is inhaled in a kind of electromagnetic radiation, including is arranged at the suction ripple layer of chip exterior, and the suction ripple layer is by suction ripple
Material is made, and can close the chip and cover, and the inner surface for inhaling ripple layer can be with the fever on the chip
Wafer thermal contact conductance；Fitting sets heat sink on the outer surface for inhaling ripple layer, is passed for receiving and distributing from the suction ripple layer
The heat led.
Alternatively, the suction ripple layer includes back-shaped suction wave plate and inhales ripple heat-conducting silica gel sheet；
The back-shaped suction wave plate is identical with the geomery of the chip, and middle perforation opens up through hole, is covered for matching
Loaded on the fever wafer periphery that protrusion is set among the chip, the back-shaped suction wave plate attachment is fixed on the chip
Surface；
The suction ripple heat-conducting silica gel sheet is made of the suction ripple heat conductive silica gel that can inhale ripple, it is bonded with the fever wafer and connects
Touch, and the fever wafer is completely covered.
Alternatively, the back-shaped thickness for inhaling wave plate is more than the fever wafer, and the suction ripple heat-conducting silica gel sheet passes through institute
The through hole stated among back-shaped suction wave plate is circumferentially spacing.
Alternatively, the back-shaped through-hole side wall inhaled among wave plate is plane；The suction ripple heat-conducting silica gel sheet and the hair
The geomery of hot wafer is identical.
Alternatively, the fever wafer and the thickness summation for inhaling ripple heat-conducting silica gel sheet are more than the back-shaped suction wave plate
Thickness.
Alternatively, the heat sink is in grid-like and the heat sink is fixed on pcb board by clamp button of the spring.
The present invention provides a kind of electromagnetic radiation to inhale wave dispersion heat structure, including is arranged at the suction ripple layer of chip exterior, chip
It is arranged on pcb board, inhales ripple layer and be made of absorbing material, and inhale ripple layer chip can be closed covering, by the electromagnetism of chip
Radiation is isolated from the outside, and employs absorbing material because inhaling ripple layer, electromagnetism spoke is can absorb by its material property and surface micro-structure
Penetrate, electromagnetic wave will not form diffusing reflection and the normal operation of chip is had an impact；Inhale ripple layer inner surface can with chip
Generate heat wafer thermal contact conductance, conducts heat caused by chip by inhaling ripple layer, inhales fitting on the outer surface of ripple layer and sets heat dissipation
Piece, heat sink are received and distributed from the heat for inhaling the conduction of ripple layer.Scheme using the present invention, can absorption of electromagnetic radiation to ensure
Chip operation is interference-free, and by the timely heat conduction of heat sink and radiates, and relative to traditional structure, conductive structure only has one
Layer, there is no thermal contact resistance, thus heat transfer efficiency higher, is conducive to the speed of heat radiation.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is traditional shielding case assembly structure figure；
Fig. 2 is the detonation configuration figure that wave dispersion heat structure is inhaled in electromagnetic radiation in a kind of specific embodiment of the present invention.
Figure includes：
Chip 1, fever wafer 11, inhale ripple layer 2, back-shaped suction wave plate 21, inhale ripple heat-conducting silica gel sheet 22, heat sink 3, Spring Card
Button 4.
Embodiment
The core of the present invention is that providing a kind of electromagnetic radiation inhales wave dispersion heat structure, avoids shadow of the diffusing reflection to chip signal
Ring, and be conducive to radiate.
In order to make those skilled in the art more fully understand technical scheme, below in conjunction with attached drawing and specifically
Embodiment to the present invention electromagnetic radiation inhale wave dispersion heat structure explanation is described in detail.
Wave dispersion heat structure is inhaled in electromagnetic radiation provided by the invention, including is arranged at the suction ripple layer 2 outside chip 1, and chip 1 is pacified
Loaded on the source on pcb board, being electromagnetic radiation and heat, inhale ripple layer 2 and be made of absorbing material, and chip 1 can be closed
Covering, makes chip 1 be isolated from the outside, the electromagnetic wave radiated from chip 1 can be blocked and absorbed by suction ripple layer 2, can not be outside
Boundary propagates, and prevents from producing radiation effect to human body；Absorbing material is employed because inhaling ripple layer 2, it is micro- by its material property and surface
Structure can absorb electromagnetic radiation, and electromagnetic wave will not form diffusing reflection and the normal operation of chip 1 is had an impact.
The middle part of chip 1 is bulge-structure, and higher than surrounding, projection portion is fever wafer 11, and fever wafer 11 is equipped with
Vitreum, fever wafer 11 are the cores of whole chip, and heat is mainly produced by fever wafer.Inhale the inner surface of ripple layer 2
It can conduct heat caused by chip 1 with 11 thermal contact conductance of fever wafer on chip by inhaling ripple layer 2, inhale 2 conduct of ripple layer
The middle conductor of heat conduction；Inhale fitting on the outer surface of ripple layer 2 and heat sink 3 is set, heat sink 3 is received and distributed from suction ripple layer
The heat of 2 conduction, is conducive to quick heat radiating, relative to traditional radiator structure, conductive structure of the invention only has one layer, does not deposit
In thermal contact resistance, thus heat transfer efficiency higher, be conducive to the speed of heat radiation.
Using electromagnetic radiation provided by the invention inhale wave dispersion heat structure, can absorption of electromagnetic radiation avoid produce diffusing reflection,
Ensure that chip normal work is interference-free；And by inhaling ripple layer 2 and 3 timely heat conduction of heat sink and radiating, reduce heat biography
The quantity of structure is passed, is conducive to improve radiating efficiency.
Ripple layer 2 is inhaled on the basis of such scheme, in the present invention to be included back-shaped suction wave plate 21 and inhales ripple heat-conducting silica gel sheet 22,
As shown in Fig. 2, the detonation configuration figure of wave dispersion heat structure is inhaled for electromagnetic radiation in a kind of specific embodiment of the present invention.
The back-shaped shape for inhaling wave plate 21 is in " returning " font, and the periphery of back-shaped suction wave plate 21 is identical with the geomery of chip 1,
It is that the fever that protrusion is set among chip 1 is brilliant and middle perforation opens up through hole, and the periphery of fever wafer 11 is set in for matching
Member 11 provides avoiding space；Gum is set on back-shaped suction wave plate 21, back-shaped wave plate 21 of inhaling mounts the surface for being fixed on chip 1,
Keep fitting closely with the surface of 1 surrounding of chip.
The ripple 22 suction ripple heat conductive silica gel by ripple can be inhaled of heat-conducting silica gel sheet is inhaled to be made, can absorption of electromagnetic radiation, itself and hair
The hot fitting of wafer 11 contact, and fever wafer 11 is completely covered, the electromagnetic radiation of fever wafer 11 can be blocked completely, it is brilliant with fever
The contact area of member 11 reaches maximum, and heating efficiency reaches highest.
Relative to traditional structure, the component of scheme provided by the invention is less, saves a set of shielding case and one group is led
Thermal cotton, reduces thermal losses progressive in heat transfer process, and directly heat sink is connected to by heat conductive silica gel equivalent to chip
On, structure is more succinct, and convenient for disassembly and assembly, after back-shaped suction wave plate 21 is pasted, is placed in the through hole at center and inhales ripple heat conductive silica gel
Piece 22 and heat sink 3.
In above-described embodiment, back-shaped suction wave plate 21 and suction ripple heat-conducting silica gel sheet 22 uses split type structure design, and
Both materials are different, and the suction hot silica gel material softness of waveguide is yielding, therefore is served only for intermediate thermal conductivity part.Certainly, except upper
Outside the structure that offer is provided, if back-shaped wave plate 21 and the suction ripple heat-conducting silica gel sheet 22 inhaled is also possible using the structure of integral type,
Such as the shielding case of traditional structure is made of absorbing material, positioned and supported by shaping equipment, it is specific that form is set all
It should be included within protection scope of the present invention.
Preferably, the back-shaped thickness for inhaling wave plate 21 more than the thickness of fever wafer 11, inhales ripple heat-conducting silica gel sheet in the present invention
22 is circumferentially spacing by the through hole among back-shaped suction wave plate 21.Because the thickness of back-shaped suction wave plate 21 is more than fever wafer 11, work as suction
When the lower surface of ripple heat-conducting silica gel sheet 22 and the upper surface of fever wafer 11, the surrounding of ripple heat-conducting silica gel sheet 22 is inhaled by returning
The through-hole wall that shape inhales among wave plate 21 carries out spacing stop, inhales ripple heat-conducting silica gel sheet 22 and is limited within the scope of through hole,
Prevent its position offset.
The back-shaped through-hole side wall inhaled among wave plate 21 is plane, i.e. the size of through hole everywhere is identical, does not have platform in through hole
Stage structure, so that convenient processing and manufacturing；It is identical with the geomery for wafer 11 of generating heat that ripple heat-conducting silica gel sheet 22 is inhaled at this time.Certainly,
Also can top half cross-sectional area bigger, the latter half cross-sectional area, makes the area of suction ripple heat-conducting silica gel sheet 22 slightly larger than hair
Hot wafer 11, these specific structures should all be protected be subject to the present invention.
It is highly preferred that fever wafer 11 and the thickness summation of suction ripple heat-conducting silica gel sheet 22 are more than the thickness of back-shaped suction wave plate 21
Spend, namely the upper surface of suction ripple heat-conducting silica gel sheet 22 protrudes from back-shaped suction wave plate 2, it is soft because inhaling the hot silica gel material of waveguide, when scattered
Backing 3 oppresses its deformation with inhaling when ripple heat-conducting silica gel sheet 22 contacts, and is preferably contacted with the outer surface of heat sink 3, so as to improve
The efficiency of heat conduction.
Specifically, heat sink 3 is in grid-like in the present invention, and the heat dissipation area bigger with air contact, passes through clamp button of the spring 4
Heat sink 3 is fixed on pcb board, makes heat sink 3 preferably with inhaling 22 thermal contact conductance of ripple heat-conducting silica gel sheet.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle, can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, this hair
It is bright to be not intended to be limited to the embodiments shown herein, and be to fit to and the principles and novel features disclosed herein phase
Consistent most wide scope.
Claims (6)
1. wave dispersion heat structure is inhaled in a kind of electromagnetic radiation, it is characterised in that the suction ripple layer (2) exterior including being arranged at chip (1), institute
State suction ripple layer (2) to be made of absorbing material, and the chip (1) can be closed and covered, the inner surface for inhaling ripple layer (2)
Can be with fever wafer (11) thermal contact conductance on the chip (1)；Fitting sets heat dissipation on the outer surface for inhaling ripple layer (2)
Piece (3), for receiving and distributing the heat from suction ripple layer (2) conduction.
2. wave dispersion heat structure is inhaled in electromagnetic radiation according to claim 1, it is characterised in that the suction ripple layer (2) includes back
Shape inhales wave plate (21) and inhales ripple heat-conducting silica gel sheet (22)；
The back-shaped suction wave plate (21) is identical with the geomery of the chip (1), and middle perforation opens up through hole, for matching
Fever wafer (11) periphery that protrusion is set among the chip (1) is set in, back-shaped suction wave plate (21) attachment is solid
It is scheduled on the surface of the chip (1)；
The suction ripple heat-conducting silica gel sheet (22) is made of the suction ripple heat conductive silica gel that can inhale ripple, it is pasted with the fever wafer (11)
Splice grafting touches, and the fever wafer (11) is completely covered.
3. wave dispersion heat structure is inhaled in electromagnetic radiation according to claim 2, it is characterised in that the back-shaped suction wave plate (21)
Thickness is more than the fever wafer (11), and the suction ripple heat-conducting silica gel sheet (22) passes through logical among the back-shaped suction wave plate (21)
Hole is circumferentially spacing.
4. wave dispersion heat structure is inhaled in electromagnetic radiation according to claim 3, it is characterised in that in the back-shaped suction wave plate (21)
Between through-hole side wall be plane；The suction ripple heat-conducting silica gel sheet (22) is identical with the geomery of the fever wafer (11).
5. wave dispersion heat structure is inhaled in electromagnetic radiation according to claim 3, it is characterised in that the fever wafer (11) and institute
The thickness summation for inhaling ripple heat-conducting silica gel sheet (22) is stated more than the back-shaped thickness for inhaling wave plate (21).
6. wave dispersion heat structure is inhaled in electromagnetic radiation according to claim 3, it is characterised in that the heat sink (3) is in grid
The heat sink (3), is fixed on pcb board by shape by clamp button of the spring (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711269039.3A CN107910318A (en) | 2017-12-05 | 2017-12-05 | Wave dispersion heat structure is inhaled in a kind of electromagnetic radiation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711269039.3A CN107910318A (en) | 2017-12-05 | 2017-12-05 | Wave dispersion heat structure is inhaled in a kind of electromagnetic radiation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107910318A true CN107910318A (en) | 2018-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711269039.3A Pending CN107910318A (en) | 2017-12-05 | 2017-12-05 | Wave dispersion heat structure is inhaled in a kind of electromagnetic radiation |
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| CN (1) | CN107910318A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110466243A (en) * | 2018-05-11 | 2019-11-19 | 重庆莱宝科技有限公司 | A kind of automatic silk screen printing method |
| CN111465263A (en) * | 2020-03-27 | 2020-07-28 | 惠州Tcl移动通信有限公司 | Heat dissipation device and mobile terminal |
| CN112310011A (en) * | 2020-02-05 | 2021-02-02 | 北京字节跳动网络技术有限公司 | Heat conduction device, chip and electronic equipment |
| CN114544697A (en) * | 2022-02-08 | 2022-05-27 | 北京卫星环境工程研究所 | Heat dissipation device for vacuum thermal test and enhanced heat dissipation method thereof |
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| EP0689243A2 (en) * | 1991-08-20 | 1995-12-27 | Kabushiki Kaisha Toshiba | Semiconductor device assembly |
| CN201248218Y (en) * | 2008-08-26 | 2009-05-27 | 英业达股份有限公司 | Fixed device |
| CN204335257U (en) * | 2014-12-19 | 2015-05-13 | 比亚迪精密制造有限公司 | A kind of electronic installation with heat radiation and anti electromagnetic interference structure |
| CN104813760A (en) * | 2014-03-18 | 2015-07-29 | 华为终端有限公司 | Heat radiation assembly and electric device |
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2017
- 2017-12-05 CN CN201711269039.3A patent/CN107910318A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0689243A2 (en) * | 1991-08-20 | 1995-12-27 | Kabushiki Kaisha Toshiba | Semiconductor device assembly |
| CN201248218Y (en) * | 2008-08-26 | 2009-05-27 | 英业达股份有限公司 | Fixed device |
| CN104813760A (en) * | 2014-03-18 | 2015-07-29 | 华为终端有限公司 | Heat radiation assembly and electric device |
| CN204335257U (en) * | 2014-12-19 | 2015-05-13 | 比亚迪精密制造有限公司 | A kind of electronic installation with heat radiation and anti electromagnetic interference structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110466243A (en) * | 2018-05-11 | 2019-11-19 | 重庆莱宝科技有限公司 | A kind of automatic silk screen printing method |
| CN112310011A (en) * | 2020-02-05 | 2021-02-02 | 北京字节跳动网络技术有限公司 | Heat conduction device, chip and electronic equipment |
| CN111465263A (en) * | 2020-03-27 | 2020-07-28 | 惠州Tcl移动通信有限公司 | Heat dissipation device and mobile terminal |
| CN111465263B (en) * | 2020-03-27 | 2022-08-05 | 惠州Tcl移动通信有限公司 | Heat dissipation device and mobile terminal |
| CN114544697A (en) * | 2022-02-08 | 2022-05-27 | 北京卫星环境工程研究所 | Heat dissipation device for vacuum thermal test and enhanced heat dissipation method thereof |
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Application publication date: 20180413 |