CN207216547U - A kind of computer radiator - Google Patents
A kind of computer radiator Download PDFInfo
- Publication number
- CN207216547U CN207216547U CN201721160405.7U CN201721160405U CN207216547U CN 207216547 U CN207216547 U CN 207216547U CN 201721160405 U CN201721160405 U CN 201721160405U CN 207216547 U CN207216547 U CN 207216547U
- Authority
- CN
- China
- Prior art keywords
- heat
- install housing
- fixed
- computer
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 12
- 239000004519 grease Substances 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009102 absorption Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 210000004556 brain Anatomy 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of computer radiator, including install housing and radiating subassembly, the install housing inner chamber is fixedly connected with radiating subassembly, the install housing both sides are welded with heat sink, the install housing inwall is provided with heat-conducting layer, the install housing both ends are welded with installing plate, the radiating subassembly is by fixed disk, heat conduction copper sheet and radiator fan composition, the fixed panel surface is fixed with thermally conductive sheet, the fixed disk inner chamber is fixed with radiator fan, the fixed tray bottom is fixedly connected with mounting post, the fixed disk both sides are fixedly connected with handle.The utility model is designed reasonably is novel; it is easily installed and dismantles; the overall radiating effect of radiator is ideal; and radiator and computer internal structure can reasonably be protected when mounted; so as to carry out effective radiating treatment to computer; increase the service life and service efficiency of computer, there is higher practicality, be adapted to be widely popularized and use.
Description
Technical field
A kind of radiator is the utility model is related to, more particularly to a kind of computer radiator.
Background technology
High temperature is the formidable enemy of integrated circuit.High temperature can not only cause system operation unstable, and service life shortens, or even have can
Can burn some parts.The effect of radiator is exactly by these heat absorptions, then diffuses in cabinet or outside cabinet, protects
The temperature of card machine element is normal, and wind-cooling heat dissipating is most common, and very simple, exactly walks radiator using fan belt
The heat absorbed.It is relatively low with price, install the advantages that simple, but it is higher to condition depended, such as temperature rise
And its heat dispersion will be greatly affected during overclocking, common radiator is radiated using single fan on the market, is dissipated
Hot-air fan is usually fixed at Heat Conduction Material surface, its surface can only be radiated, its radiating efficiency is relatively low, it is impossible to meets to electricity
The cooling requirements of brain, it is easy to cause interim card and the damage of computer, is not suitable for permanent development and use.Therefore, it is proposed that
A kind of computer radiator.
Utility model content
Main purpose of the present utility model is to provide a kind of computer radiator, novelty reasonable in design, be easily installed and
Dismounting, the overall radiating effect of radiator is ideal, and radiator and computer internal structure can be carried out when mounted
Rational protection, so as to carry out effective radiating treatment to computer, increase the service life and service efficiency of computer, have higher
Practicality, be adapted to be widely popularized and use, effectively can solve the problems, such as in background technology.
To achieve the above object, the technical scheme that the utility model is taken is：
A kind of computer radiator, including install housing and radiating subassembly, the install housing inner chamber are fixedly connected with scattered
Hot component, the install housing both sides are welded with heat sink, and the install housing inwall is provided with heat-conducting layer, the mounting cup
Shell both ends are welded with installing plate, and the radiating subassembly is made up of fixed disk, heat conduction copper sheet and radiator fan, the fixed panel surface
Thermally conductive sheet is fixed with, the fixed disk inner chamber is fixed with radiator fan, and the fixed tray bottom is fixedly connected with mounting post, described
Fixed disk both sides are fixedly connected with handle.
Further, the mounting post and installing plate bottom are bonded with soft rubber pad.
Further, the handle is the handle of PPR plastics.
Further, the install housing, fixed disk, heat sink and thermally conductive sheet are that copper material makes.
Further, the heat-conducting layer is specially the heat-conducting layer that silicone grease makes.
Compared with prior art, the utility model has the advantages that：
1. this kind of computer radiator, install housing is fixed on into computer CPU processor surface using installing plate, it is installed
Post and installing plate bottom are bonded with soft rubber pad, computer CPU processor can be protected, avoided by soft rubber pad
When being fixed to install housing, computer CPU processor is destroyed.
2. computer CPU processor is sealed using install housing simultaneously, so as to facilitate the later stage to computer CPU processor
Radiating, its install housing inwall is provided with heat-conducting layer, and its heat-conducting layer is specially the heat-conducting layer that silicone grease makes, the suction of silicon grease material
Hot and thermal conductivity is more satisfactory, effectively can be absorbed the heat of casing interior, using heat sink to install housing
Internal heat sheds.
3. radiating subassembly to be installed on to the computer CPU processor surface of install housing inner chamber using mounting post simultaneously, it is pacified
Dress case, fixed disk, heat sink and thermally conductive sheet are that copper material makes, and copper material has good thermal conductivity and radiating
Property, computer inner chamber can reasonably be radiated.
4. being fixed on by radiator fan inside thermally conductive sheet, change prior art is positioned over Heat Conduction Material surface, Ke Yiyou
The utilization ratio of the increase radiator fan of effect, it is more practical, and can be facilitated using handle and be carried out when being installed to radiating subassembly
It is fixed, avoid, in installation or into during production, holding soft copper thermally conductive sheet, causing thermally conductive sheet to deform upon, influence the later stage
Heat-conducting effect, it is more practical so as to increase the efficiency to the radiating of computer innernal CPU.
Brief description of the drawings
Fig. 1 is the overall structure diagram of the utility model computer radiator.
Fig. 2 is the heat radiation assembly structure schematic diagram of the utility model computer radiator.
In figure：1st, install housing；2nd, radiating subassembly；3rd, heat sink；4th, heat-conducting layer；5th, installing plate；6th, fixed disk；7th, install
Post；8th, thermally conductive sheet；9th, handle；10th, radiator fan.Radiator fan 10, which is powered, to be run, and the heat of the Surface absorption of thermally conductive sheet 8 is quick
Shed, its
Embodiment
Technological means, creation characteristic, reached purpose and effect to realize the utility model are easy to understand, below
With reference to embodiment, the utility model is expanded on further.
As shown in Figure 1-2, a kind of computer radiator, including install housing 1 and radiating subassembly 2, in the install housing 1
Chamber is fixedly connected with radiating subassembly 2, and the both sides of install housing 1 are welded with heat sink 3, and the inwall of install housing 1 is set
There is heat-conducting layer 4, the both ends of install housing 1 are welded with installing plate 5, and the radiating subassembly 2 is by fixed disk 6, heat conduction copper sheet 8 and dissipates
Hot-air fan 10 forms, and the surface of fixed disk 6 is fixed with thermally conductive sheet 8, and the inner chamber of fixed disk 6 is fixed with radiator fan 10, institute
State the bottom of fixed disk 6 and be fixedly connected with mounting post 7, the both sides of fixed disk 6 are fixedly connected with handle 9.
Wherein, the mounting post 7 and the bottom of installing plate 5 are bonded with soft rubber pad.
Wherein, the handle 9 is the handle of PPR plastics.
Wherein, the install housing 1, fixed disk 6, heat sink 3 and thermally conductive sheet 8 are that copper material makes.
Wherein, the heat-conducting layer 4 is specially the heat-conducting layer that silicone grease makes.
It should be noted that the utility model is a kind of computer radiator, during work, pass through install housing 1 and radiating
The combination of component 2, install housing 1 is fixed on computer CPU processor surface using installing plate 5, its mounting post 7 and installing plate 5
Bottom is bonded with soft rubber pad, computer CPU processor can be protected, is avoided to mounting cup by soft rubber pad
When shell 1 is fixed, computer CPU processor is destroyed, while is sealed computer CPU processor using install housing 1, so as to convenient
Radiating of the later stage to computer CPU processor, its inwall of install housing 1 are provided with heat-conducting layer 4, and its heat-conducting layer 4 is specially silicone grease system
The heat-conducting layer of work, the heat absorptivity and thermal conductivity of silicon grease material are more satisfactory, effectively can be inhaled the heat of casing interior
Receive, the heat inside install housing 1 is shed using heat sink 3, while radiating subassembly 2 is installed on installation using mounting post 7
The computer CPU processor surface of the inner chamber of case 1, its install housing 1, fixed disk 6, heat sink 3 and thermally conductive sheet 8 are copper material
Make, copper material has good thermal conductivity and thermal diffusivity, computer inner chamber reasonably can radiated, by radiator fan
10 are fixed on inside thermally conductive sheet 8, and change prior art is positioned over Heat Conduction Material surface, can effectively increase radiator fan 10
Utilization ratio, it is more practical, and be fixed when can facilitate and radiating subassembly 2 is installed using handle 9, avoid installing
Or into during production, hold soft copper thermally conductive sheet 8, cause thermally conductive sheet 8 to deform upon, influence the heat-conducting effect in later stage, from
And increase the efficiency to the radiating of computer innernal CPU, it is more practical.
The advantages of general principle and principal character of the present utility model and the utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Simply illustrate principle of the present utility model, on the premise of the spirit and scope of the utility model is not departed from, the utility model is also
Various changes and modifications are had, these changes and improvements are both fallen within claimed the scope of the utility model.The utility model
Claimed scope is by appended claims and its equivalent thereof.
Claims (5)
1. a kind of computer radiator, including install housing (1) and radiating subassembly (2), it is characterised in that：The install housing
(1) inner chamber is fixedly connected with radiating subassembly (2), and install housing (1) both sides are welded with heat sink (3), the mounting cup
Shell (1) inwall is provided with heat-conducting layer (4), and install housing (1) both ends are welded with installing plate (5), the radiating subassembly (2) by
Fixed disk (6), heat conduction copper sheet (8) and radiator fan (10) composition, fixed disk (6) surface is fixed with thermally conductive sheet (8), described
Fixed disk (6) inner chamber is fixed with radiator fan (10), and fixed disk (6) bottom is fixedly connected with mounting post (7), the fixation
Disk (6) both sides are fixedly connected with handle (9).
A kind of 2. computer radiator according to claim 1, it is characterised in that：The mounting post (7) and installing plate (5)
Bottom is bonded with soft rubber pad.
A kind of 3. computer radiator according to claim 1, it is characterised in that：The handle (9) is the hand of PPR plastics
Handle.
A kind of 4. computer radiator according to claim 1, it is characterised in that：The install housing (1), fixed disk
(6), heat sink (3) and thermally conductive sheet (8) are that copper material makes.
A kind of 5. computer radiator according to claim 1, it is characterised in that：The heat-conducting layer (4) is specially silicone grease
The heat-conducting layer of making.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721160405.7U CN207216547U (en) | 2017-09-12 | 2017-09-12 | A kind of computer radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721160405.7U CN207216547U (en) | 2017-09-12 | 2017-09-12 | A kind of computer radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207216547U true CN207216547U (en) | 2018-04-10 |
Family
ID=61824283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721160405.7U Expired - Fee Related CN207216547U (en) | 2017-09-12 | 2017-09-12 | A kind of computer radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207216547U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110806790A (en) * | 2019-11-04 | 2020-02-18 | 广州科技职业技术大学 | a computer radiator |
| CN112328052A (en) * | 2020-10-20 | 2021-02-05 | 蒙秀花 | CPU circulation heat radiation structure |
-
2017
- 2017-09-12 CN CN201721160405.7U patent/CN207216547U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110806790A (en) * | 2019-11-04 | 2020-02-18 | 广州科技职业技术大学 | a computer radiator |
| CN110806790B (en) * | 2019-11-04 | 2021-03-30 | 广州科技职业技术大学 | Computer radiator |
| CN112328052A (en) * | 2020-10-20 | 2021-02-05 | 蒙秀花 | CPU circulation heat radiation structure |
| CN112328052B (en) * | 2020-10-20 | 2023-05-23 | 深圳市铭瑞达五金制品有限公司 | CPU circulation heat radiation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180410 Termination date: 20180912 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |