CN105519248B - Radiate shielding construction and communication products - Google Patents
Radiate shielding construction and communication products Download PDFInfo
- Publication number
- CN105519248B CN105519248B CN201480001202.6A CN201480001202A CN105519248B CN 105519248 B CN105519248 B CN 105519248B CN 201480001202 A CN201480001202 A CN 201480001202A CN 105519248 B CN105519248 B CN 105519248B
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- CN
- China
- Prior art keywords
- shielding
- radiator
- heat dissipation
- ontology
- shielding case
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a kind of heat dissipation shielding construction, including heater element, circuit board, shielding case and radiator, the heater element is set on the circuit board, the shielding case is fixed on the circuit board and is grounded, shielding space is collectively formed in the shielding case and the circuit board, the heater element is contained in the shielding space, the radiator is connected to the shielding case, the shielding case includes ontology and multiple fixinig plates, the fixinig plate is projected from the ontology towards the outside of the shielding space, the radiator is equipped with multiple notches, the multiple fixinig plate is each passed through the multiple notch and connects the radiator on the body.The present invention also provides a kind of communication products, while heat dissipation shielding construction disclosed by the invention has good heat dissipation function of shielding, it is able to solve the problem of radiator is grounded.
Description
Technical field
The present invention relates to electromagnetic armouring structure more particularly to a kind of heat dissipation shielding constructions.
Background technique
It include the biggish chip of some calorific values in telecom terminal product, such as: power amplifier (PA) etc., the biggish core of calorific value
Piece is usually required to be electromagnetically shielded and be radiated.
Fig. 1 show a kind of heat dissipation shielding construction in the prior art, euthermic chip 11 by circuit board 12, mask frame 13,
The complete shielding cavity that screening cover 14 is formed surrounds, to realize the purpose of electromagnetic shielding, in screening cover 14 and euthermic chip 11
Between heat conductive pad 15 is installed to reduce the thermal resistance between euthermic chip 11 and screening cover 14, while increasing by one above screening cover 14
Radiator 16 is sticked on screening cover 14 by flat-plate radiator 16 by bond plies.
Heat dissipation shielding construction existing defects shown in FIG. 1 are as follows, since radiator is sticked to shielding by bond plies
It covers, bond plies are unfavorable for radiator ground connection, and radiator cannot get good ground connection, can make to radio frequency, Electro Magnetic Compatibility
At adverse effect.
Summary of the invention
Technical problem to be solved by the present invention lies in a kind of heat dissipation shielding construction is provided, there is good heat dissipation to shield function
While energy, it is able to solve the problem of radiator is grounded.
To achieve the goals above, embodiment of the present invention provides the following technical solutions:
The present invention has supplied a kind of heat dissipation shielding construction, a kind of heat dissipation shielding construction, including heater element, circuit board, shielding
Cover and radiator, the heater element are set on the circuit board, and the shielding case is fixed on the circuit board and is grounded, institute
It states shielding case and shielding space is collectively formed in the circuit board, the heater element is contained in the shielding space, described to dissipate
Hot device is connected to the shielding case, and the shielding case includes ontology and multiple fixinig plates, and the fixinig plate is from the ontology direction
The outside of the shielding space projects, and the radiator is equipped with multiple notches, and the multiple fixinig plate is each passed through the multiple
Notch simultaneously connects the radiator on the body.
Wherein, the fixinig plate includes interconnecting piece and positioning region, and the interconnecting piece is connected to the positioning region and described
Between body, the interconnecting piece is housed in the notch, and the positioning region and the ontology are located at and fit in described dissipate
The two sides of hot device.
Wherein, the positioning region is parallel to the ontology, the vertical positioning region of the interconnecting piece.
Wherein, the shielding case is equipped with through-hole, heater element described in the through-hole face, the radiator include plate body and
The ontology of concave portion, the plate body and the shielding case fits, and the notch is set on the plate body, and the female portion is from institute
Plate body is stated towards extending in the shielding space, and the female portion protrudes into the shielding space by the through-hole, and recessed
Portion directly or indirectly contacts the heater element.
Wherein, heat conductive pad is set between the female portion and the heater element.
Wherein, conductive fabric or conductive bubble are set between the plate body of the radiator and the ontology of the shielding case
Cotton, the conductive fabric or conducting foam are distributed in around the through-hole.
Wherein, the surface in face of the radiator of the ontology of the shielding case is equipped with multiple elastic protrusions, described
Elastic protrusion contacts the radiator and generates flexible deformation.
Wherein, the multiple elastic protrusion is shaped in the ontology.
Wherein, the radiator is in tabular.
The present invention also provides a kind of communication products, including heat dissipation shielding construction described in above-mentioned any one.
Heat dissipation shielding construction provided by the invention will by the cooperation of the notch on the fixinig plate and radiator on shielding case
Radiator is connected on shielding case, so that radiator links into an integrated entity with shielding case, and by the ground connection of shielding case, is realized scattered
The ground connection of hot device.
Detailed description of the invention
In order to illustrate more clearly of technical solution of the present invention, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, other attached drawings can also be obtained such as these attached drawings.
Fig. 1 is the schematic diagram of the heat dissipation shielding construction of communication products in the prior art.
Fig. 2 is the schematic diagram for the heat dissipation shielding construction that one embodiment of the present invention provides.
Fig. 3 is the partial enlargement diagram of heat dissipation shielding construction shown in Fig. 2.
Fig. 4 is the heat dissipation shielding construction schematic diagram that another embodiment of the present invention provides.
Fig. 5 is the heat dissipation shielding construction schematic diagram that another embodiment of the present invention provides.
Fig. 6 is the shielding case partial schematic diagram in a kind of heat dissipation shielding construction of embodiment of the present invention.
Specific embodiment
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is carried out clear
Ground description.
Referring to Fig. 2, the present embodiments relate to the heat dissipation shielding constructions in a kind of communication products and communication products.Heat dissipation
Shielding construction includes heater element 20, circuit board 30, shielding case 40 and radiator 50.The heater element 20 is set to the electricity
On road plate 30, heater element 20 can be the biggish chip of communication products internal heat generation amount, such as power amplifier chips, and heater element 20 needs
It is electromagnetically shielded, the electromagnetic shielding to heater element 20 is realized by shielding case 40.The shielding case 40 is fixed on the circuit
Plate 30 is simultaneously grounded, specifically, circuit board 30 is electrically connected to electricity while including ground plane, shielding case 40 and fixed circuit board 30
Ground plane on road plate 30 realizes the ground connection of shielding case 40.Screen is collectively formed with the circuit board 30 in the shielding case 40
Space is covered, the heater element 20 is contained in the shielding space.The radiator 50 is connected to the shielding case 40, described
Shielding case 40 includes ontology 42 and multiple fixinig plates 44, and the fixinig plate 44 is from the ontology 42 towards the outer of the shielding space
Portion projects, and the radiator 50 is equipped with multiple notches 54, and the multiple fixinig plate 44 is each passed through the multiple notch 54 and will
The radiator 50 is connected on the ontology 42.
Heat dissipation shielding construction provided in an embodiment of the present invention passes through on the fixinig plate 44 and radiator 50 on shielding case 40
Radiator 50 is connected on shielding case 40 by the cooperation of notch 54, so that radiator 50 links into an integrated entity with shielding case 40, and logical
The ground connection for crossing shielding case 40 realizes the ground connection of radiator 50.By the cooperation of fixinig plate 44 and notch 54, by radiator 50 with
40 riveting of shielding case forms a component parts together, also facilitates the assembling of communication products.
The shielding case 40 can be the cover of integral type, also may include mask frame and shielding cover board, mask frame and screen
It covers cover board and complements each other to form complete cover.
Please refer to Fig. 3, in a kind of embodiment, the fixinig plate 44 includes interconnecting piece 442 and positioning region 444, institute
It states interconnecting piece 442 to be connected between the positioning region 444 and the ontology 42, the interconnecting piece 442 is housed in the notch 54
Interior, the positioning region 444 is located at the ontology 42 and fits in the two sides of the radiator 50.Fixinig plate 44 by
The rib being stamped and formed out on 40 ontology 42 of shielding case, the bending after the notch 54 of radiator 50 to shield using riveting
Cover 40 is fixedly connected with integrated structure with radiator 50, so that heat dissipation shielding construction is with good stability and can
By property.
In a kind of embodiment, the positioning region 444 is parallel to the ontology 42, and the interconnecting piece 442 is vertical described fixed
Position portion 444.In other embodiment, interconnecting piece 442, which can also tilt, to be connected between positioning region 444 and ontology 42, that is,
Say relationship not vertical between interconnecting piece 442 and ontology 42, what inclination extended.
Referring to Fig. 4, the further improvement as the embodiment of the present invention, the shielding case 40 is equipped with through-hole (not marking),
Heater element 20 described in the through-hole face, the radiator 50 include plate body 52 and concave portion 56, the plate body 52 with it is described
The ontology 42 of shielding case 40 fits, and the notch 54 is set on the plate body 52, and the female portion 56 is from 52 court of plate body
Extend into the shielding space, and the female portion 56 protrudes into the shielding space by the through-hole, and concave portion 56 is straight
Connect or mediate contact described in heater element 20.
Heat conductive pad is set in a kind of embodiment, between the female portion 56 and the heater element 20 or heat-conducting glue 60 is real
Mediate contact now between the two.
Referring to Fig. 5, the plate body 52 of the radiator 50 is described with the shielding case 40 in a kind of embodiment
Conductive fabric is set between ontology 42 or conducting foam 70, the conductive fabric or conducting foam 70 are distributed in around the through-hole.
The setting of conductive fabric or conducting foam 70 can strengthen the effectiveness of present invention heat dissipation shielding construction.
Referring to Fig. 6, in another embodiment, the ontology 42 of the shielding case 40 in face of the radiator 50
Surface is equipped with multiple elastic protrusions 46, and the elastic protrusion 46 contacts the radiator 50 and generates flexible deformation, i.e. radiator
50 are pressed on elastic protrusion 46, so that elastic protrusion 46 generates flexible deformation, while elastic protrusion 46 are connect with radiator 50
Touching.By the cooperation of elastic protrusion 46 and radiator 50, the conducting contact between radiator 50 and shielding case 40 is strengthened, makes to dissipate
Hot device 50 has stable ground connection performance, while can also strengthen the electromagnetic shielding effect of heat dissipation shielding construction of the embodiment of the present invention
Fruit.
Specifically, the multiple elastic protrusion 46 is shaped in the ontology 42.It can also be arranged on ontology 42
Individual elastic piece structure.
Specifically, the radiator 50 is in tabular.Radiator 50 is parallel to circuit board 30.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (10)
1. a kind of heat dissipation shielding construction, including heater element, circuit board, shielding case and radiator, the heater element are set to
On the circuit board, the shielding case is fixed on the circuit board and is grounded, and the shielding case is collectively formed with the circuit board
Shielding space, the heater element are contained in the shielding space, and the radiator is connected to the shielding case, and feature exists
In the shielding case includes ontology and multiple fixinig plates, and the fixinig plate is from the ontology towards the outside of the shielding space
It projects, the radiator is equipped with multiple notches, and the multiple fixinig plate is each passed through the multiple notch and by the radiator
On the body, the multiple fixinig plate is connected between the radiator and the shielding case, so that the heat dissipation for connection
Device links into an integrated entity with the shielding case, and the radiator is made to pass through the Shielding Case grounding.
2. heat dissipation shielding construction as described in claim 1, which is characterized in that the fixinig plate includes interconnecting piece and positioning region,
The interconnecting piece is connected between the positioning region and the ontology, and the interconnecting piece is housed in the notch, the positioning
Portion and the ontology are located at and fit in the two sides of the radiator.
3. heat dissipation shielding construction as claimed in claim 2, which is characterized in that the positioning region is parallel to the ontology, described
The vertical positioning region of interconnecting piece.
4. heat dissipation shielding construction as described in claim 1, which is characterized in that the shielding case is equipped with through-hole, and the through-hole is just
To the heater element, the radiator includes plate body and concave portion, and the ontology of the plate body and the shielding case fits, institute
Notch is stated on the plate body, the female portion from the plate body towards the shielding space in extend, and the female portion
The shielding space is protruded by the through-hole, and concave portion directly or indirectly contacts the heater element.
5. heat dissipation shielding construction as claimed in claim 4, which is characterized in that set between the female portion and the heater element
Set heat conductive pad.
6. heat dissipation shielding construction as claimed in claim 4, which is characterized in that the plate body of the radiator and the shielding
Conductive fabric or conducting foam are set between the ontology of cover, and the conductive fabric or conducting foam are distributed in the week of the through-hole
It encloses.
7. the heat dissipation shielding construction as described in claim 1-4 any one, which is characterized in that the ontology of the shielding case
The surface in face of the radiator be equipped with multiple elastic protrusions, the elastic protrusion, which contacts the radiator and generates elasticity, to be become
Shape.
8. heat dissipation shielding construction as claimed in claim 7, which is characterized in that the multiple elastic protrusion is shaped in described
Ontology.
9. heat dissipation shielding construction as claimed in any one of claims 1 to 6, which is characterized in that the radiator is in tabular.
10. a kind of communication products, which is characterized in that the communication products include as described in any one of claims 1-9 dissipate
Heat shield structure.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2014080749 | 2014-06-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105519248A CN105519248A (en) | 2016-04-20 |
| CN105519248B true CN105519248B (en) | 2019-02-19 |
Family
ID=55725110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480001202.6A Active CN105519248B (en) | 2014-06-25 | 2014-06-25 | Radiate shielding construction and communication products |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105519248B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793724A (en) * | 2016-12-09 | 2017-05-31 | 屈兆辉 | One kind radiating shielding construction |
| TWI644613B (en) * | 2017-12-04 | 2018-12-11 | 和碩聯合科技股份有限公司 | Ciruit board assembly and shielding device |
| TWI652983B (en) * | 2018-04-16 | 2019-03-01 | 緯創資通股份有限公司 | Electronic device and electromagnetic shielding device |
| CN108762451A (en) * | 2018-07-10 | 2018-11-06 | 深圳市优必选科技有限公司 | Heat radiation structure of CPU |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201479458U (en) * | 2009-06-26 | 2010-05-19 | 建汉科技股份有限公司 | Radiation structure capable of controlling electromagnetic radiation |
| CN203136420U (en) * | 2013-03-06 | 2013-08-14 | 惠州Tcl移动通信有限公司 | Terminal and shield with heat radiation structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6740959B2 (en) * | 2001-08-01 | 2004-05-25 | International Business Machines Corporation | EMI shielding for semiconductor chip carriers |
| JP2013110257A (en) * | 2011-11-21 | 2013-06-06 | Panasonic Corp | Substrate fitting apparatus, substrate fitting method, and electronic apparatus |
-
2014
- 2014-06-25 CN CN201480001202.6A patent/CN105519248B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201479458U (en) * | 2009-06-26 | 2010-05-19 | 建汉科技股份有限公司 | Radiation structure capable of controlling electromagnetic radiation |
| CN203136420U (en) * | 2013-03-06 | 2013-08-14 | 惠州Tcl移动通信有限公司 | Terminal and shield with heat radiation structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105519248A (en) | 2016-04-20 |
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