CN105519248A - Thermal shielding structure and communication products - Google Patents

Abstract

The invention discloses a heat dissipation shielding structure, which includes a heating element, a circuit board, a shielding cover and a radiator, the heating element is arranged on the circuit board, the shielding cover is fixed on the circuit board and grounded, the shielding The cover and the circuit board jointly form a shielding space, the heating element is accommodated in the shielding space, the radiator is connected to the shielding case, the shielding case includes a body and a plurality of fixing pieces, and the fixing pieces Protruding from the body toward the outside of the shielding space, the heat sink is provided with a plurality of notches, and the plurality of fixing pieces respectively pass through the plurality of notches and connect the heat sink to the body . The invention also provides a communication product. The heat dissipation shielding structure disclosed in the invention has a good heat dissipation shielding function and can solve the problem of radiator grounding.

Description

Thermal shielding structure and communication products

technical field

The invention relates to an electromagnetic shielding structure, in particular to a heat dissipation shielding structure.

Background technique

Communication terminal products include chips with high heat generation, such as power amplifiers (PA), etc. Chips with high heat generation usually require electromagnetic shielding and heat dissipation.

Figure 1 shows a heat dissipation shielding structure in the prior art. The heating chip 11 is surrounded by a complete shielding cavity formed by a circuit board 12, a shielding frame 13, and a shielding cover 14 to achieve the purpose of electromagnetic shielding. 14 and the heating chip 11 is installed with a thermal pad 15 to reduce the thermal resistance between the heating chip 11 and the shielding cover 14, and at the same time, a flat radiator 16 is added above the shielding cover 14, and the radiator 16 is glued by heat-conducting double-sided adhesive On the shield cover 14.

The heat dissipation shielding structure shown in Figure 1 has the following defects. Since the heat sink is glued to the shield cover by the heat conduction double-sided adhesive, the heat conduction double-sided adhesive is not conducive to the grounding of the heat sink, and the heat sink cannot be well grounded, which will affect the radio frequency, adverse effects on electromagnetic compatibility.

Contents of the invention

The technical problem to be solved by the present invention is to provide a heat dissipation shielding structure, which can solve the problem of radiator grounding while having a good heat dissipation shielding function.

In order to achieve the above object, the embodiment of the present invention provides the following technical solutions:

The invention provides a heat dissipation shielding structure, which includes a heating element, a circuit board, a shielding cover and a radiator, the heating element is arranged on the circuit board, and the shielding cover is fixed on the circuit The shielding case and the circuit board jointly form a shielding space, the heating element is accommodated in the shielding space, the radiator is connected to the shielding case, and the shielding case includes a body and a plurality of The fixing piece protrudes from the body toward the outside of the shielding space, the heat sink is provided with a plurality of gaps, and the plurality of fixing pieces respectively pass through the plurality of gaps and dissipate the heat connected to the body.

Wherein, the fixed piece includes a connecting portion and a positioning portion, the connecting portion is connected between the positioning portion and the body, the connecting portion is accommodated in the notch, and the positioning portion and the body are respectively Located on and attached to both sides of the heat sink.

Wherein, the positioning portion is parallel to the body, and the connecting portion is perpendicular to the positioning portion.

Wherein, the shielding cover is provided with a through hole, the through hole is facing the heating element, the heat sink includes a plate body and a recessed part, the plate body is attached to the body of the shielding cover, the The notch is provided on the board body, the concave portion extends from the board body toward the shielding space, and the concave portion extends into the shielding space through the through hole, and the concave portion directly or indirectly contacts the heating element.

Wherein, a heat conduction pad is arranged between the concave portion and the heating element.

Wherein, conductive cloth or conductive foam is arranged between the plate body of the heat sink and the body of the shielding cover, and the conductive cloth or conductive foam is distributed around the through hole.

Wherein, the surface of the body of the shielding cover facing the heat sink is provided with a plurality of elastic protrusions, and the elastic protrusions contact the heat sink and generate elastic deformation.

Wherein, the plurality of elastic protrusions are integrally formed on the body.

Wherein, the radiator is flat.

The present invention also provides a communication product, including the heat dissipation shielding structure described in any one of the above.

The heat dissipation shielding structure provided by the present invention connects the radiator to the shield through the cooperation of the fixing piece on the shield and the notch on the radiator, so that the radiator and the shield are connected into one body, and the grounding of the shield realizes Grounding of the heat sink.

Description of drawings

In order to illustrate the technical solution of the present invention more clearly, the accompanying drawings used in the implementation will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some implementations of the present invention. As far as technical personnel are concerned, other drawings can also be obtained like these drawings without paying creative work.

FIG. 1 is a schematic diagram of a heat dissipation shielding structure of a communication product in the prior art.

Fig. 2 is a schematic diagram of a heat dissipation shielding structure provided by an embodiment of the present invention.

FIG. 3 is a partially enlarged schematic view of the heat dissipation shielding structure shown in FIG. 2 .

Fig. 4 is a schematic diagram of a heat dissipation shield structure provided by another embodiment of the present invention.

Fig. 5 is a schematic diagram of a heat dissipation shield structure provided by another embodiment of the present invention.

FIG. 6 is a partial schematic diagram of a shielding case in a heat dissipation shielding structure according to an embodiment of the present invention.

detailed description

The technical solutions in the embodiments of the present invention will be clearly described below with reference to the drawings in the embodiments of the present invention.

Please refer to FIG. 2 , the embodiment of the present invention relates to a communication product and a heat dissipation shielding structure in the communication product. The heat dissipation shielding structure includes a heating element 20 , a circuit board 30 , a shielding cover 40 and a radiator 50 . The heating element 20 is arranged on the circuit board 30. The heating element 20 can be a chip with a large amount of heat in the communication product, such as a power amplifier chip. The heating element 20 needs electromagnetic shielding, and the shielding cover 40 is used to realize the protection of the heating element 20. Electromagnetic shielding. The shielding cover 40 is fixed on the circuit board 30 and grounded. Specifically, the circuit board 30 includes a grounding layer, and the shielding cover 40 is fixed to the circuit board 30 while being electrically connected to the grounding layer on the circuit board 30, which realizes The shield case 40 is grounded. The shielding case 40 and the circuit board 30 jointly form a shielding space, and the heating element 20 is accommodated in the shielding space. The heat sink 50 is connected to the shielding case 40, the shielding case 40 includes a body 42 and a plurality of fixing pieces 44, the fixing pieces 44 protrude from the body 42 toward the outside of the shielding space, the The heat sink 50 is provided with a plurality of notches 54 , and the plurality of fixing pieces 44 respectively pass through the plurality of notches 54 and connect the heat sink 50 to the body 42 .

The heat dissipation shielding structure provided by the embodiment of the present invention connects the radiator 50 to the shielding case 40 through the cooperation of the fixing piece 44 on the shielding case 40 and the notch 54 on the radiator 50, so that the radiator 50 and the shielding case 40 are connected into one body , and the grounding of the radiator 50 is realized through the grounding of the shielding case 40 . Through the cooperation of the fixing piece 44 and the notch 54, the heat sink 50 and the shielding cover 40 are riveted together to form a combined part, which is also convenient for the assembly of communication products.

The shielding cover 40 may be an integral cover body, or may include a shielding frame and a shielding cover plate, and the shielding frame and the shielding cover plate cooperate with each other to form a complete cover body.

Please refer to FIG. 3 at the same time. In one embodiment, the fixing piece 44 includes a connecting portion 442 and a positioning portion 444, the connecting portion 442 is connected between the positioning portion 444 and the body 42, and the connecting portion 442 is accommodated in the notch 54 , and the positioning portion 444 and the body 42 are respectively located and attached to two sides of the heat sink 50 . The fixing sheet 44 is bent through the ribs formed by stamping on the body 42 of the shielding cover 40 , passes through the gap 54 of the heat sink 50 , and is then bent by riveting so that the shielding cover 40 and the heat sink 50 are fixedly connected to form an integrated structure. The heat dissipation shielding structure has good stability and reliability.

In one embodiment, the positioning portion 444 is parallel to the body 42 , and the connecting portion 442 is perpendicular to the positioning portion 444 . In other embodiments, the connection portion 442 may also be obliquely connected between the positioning portion 444 and the body 42 , that is to say, the relationship between the connection portion 442 and the body 42 is not vertical, but extends obliquely.

Please refer to FIG. 4 , as a further improvement of the embodiment of the present invention, the shielding cover 40 is provided with a through hole (not marked), the through hole is facing the heating element 20, and the heat sink 50 includes a plate body 52 and The recessed part 56, the plate body 52 is attached to the body 42 of the shielding cover 40, the notch 54 is provided on the plate body 52, and the recessed part 56 is from the plate body 52 toward the shielding The recessed portion 56 extends into the shielding space through the through hole, and the recessed portion 56 contacts the heating element 20 directly or indirectly.

In one embodiment, a heat conduction pad or heat conduction glue 60 is provided between the recessed portion 56 and the heating element 20 to achieve indirect contact between the two.

Please refer to FIG. 5 , in one embodiment, a conductive cloth or conductive foam 70 is arranged between the plate body 52 of the heat sink 50 and the body 42 of the shielding cover 40 , and the conductive cloth or conductive The foam 70 is distributed around the through hole. The arrangement of the conductive cloth or the conductive foam 70 can strengthen the electromagnetic shielding effect of the heat dissipation shielding structure of the present invention.

Please refer to FIG. 6 , in another embodiment, a plurality of elastic protrusions 46 are provided on the surface of the body 42 of the shield 40 facing the heat sink 50 , and the elastic protrusions 46 contact the heat sink 50 And produce elastic deformation, that is, the heat sink 50 presses on the elastic protrusion 46 , so that the elastic protrusion 46 produces elastic deformation, and at the same time makes the elastic protrusion 46 contact with the heat sink 50 . Through the cooperation of the elastic protrusion 46 and the heat sink 50, the conduction contact between the heat sink 50 and the shield cover 40 is strengthened, so that the heat sink 50 has a stable grounding performance, and at the same time, the electromagnetic shielding structure of the heat dissipation shielding structure of the embodiment of the present invention can also be strengthened. Shielding effect.

Specifically, the plurality of elastic protrusions 46 are integrally formed on the body 42 . A separate shrapnel structure can also be provided on the body 42 .

Specifically, the heat sink 50 is flat. The heat sink 50 is parallel to the circuit board 30 .

The above description is a preferred embodiment of the present invention, and it should be pointed out that for those skilled in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications are also considered Be the protection scope of the present invention.

Claims (10)

1. A heat dissipation shielding structure, comprising a heating element, a circuit board, a shielding case and a radiator, the heating element is arranged on the circuit board, the shielding case is fixed on the circuit board and grounded, the shielding case Together with the circuit board, a shielding space is formed, the heating element is accommodated in the shielding space, and the heat sink is connected to the shielding case. It is characterized in that the shielding case includes a body and a plurality of fixing pieces. The fixing piece protrudes from the body toward the outside of the shielding space, the heat sink is provided with a plurality of notches, and the plurality of fixing pieces respectively pass through the plurality of notches and connect the heat sink to the on the body. 2. The heat dissipation shielding structure according to claim 1, wherein the fixing piece comprises a connecting portion and a positioning portion, the connecting portion is connected between the positioning portion and the body, and the connecting portion accommodates In the notch, the positioning portion and the body are respectively located and attached to two sides of the heat sink. 3. The heat dissipation shielding structure according to claim 2, wherein the positioning portion is parallel to the body, and the connecting portion is perpendicular to the positioning portion. 4. The heat dissipation shielding structure according to claim 1, wherein the shielding cover is provided with a through hole, the through hole is facing the heating element, the heat sink includes a plate body and a concave portion, the The plate fits with the body of the shielding cover, the notch is provided on the plate, the concave portion extends from the plate toward the shielding space, and the concave portion passes through the through-hole The hole protrudes into the shielding space, and the concave part directly or indirectly contacts the heating element. 5 . The heat dissipation shielding structure according to claim 3 , wherein a heat conduction pad is arranged between the concave portion and the heating element. 6 . 6. The heat dissipation shielding structure according to claim 4, wherein a conductive cloth or conductive foam is arranged between the plate body of the heat sink and the body of the shielding case, and the conductive cloth or Conductive foam is distributed around the through hole. 7. The heat dissipation shielding structure according to any one of claims 1-4, wherein a plurality of elastic protrusions are arranged on the surface of the body of the shield facing the heat sink, and the elastic protrusions contacts the heat sink and produces elastic deformation. 8. The heat dissipation shielding structure according to claim 7, wherein the plurality of elastic protrusions are integrally formed on the body. 9. The heat dissipation shielding structure according to any one of claims 1-8, wherein the heat sink is in the shape of a flat plate. 10. A communication product, characterized in that the communication product comprises the heat dissipation shielding structure according to any one of claims 1-9.