CN106304797B

CN106304797B - A kind of mobile terminal

Info

Publication number: CN106304797B
Application number: CN201610866550.0A
Authority: CN
Inventors: 龙静; 罗孝平; 梅钱君; 曾婷; 付昭维
Original assignee: Nubia Technology Co Ltd
Current assignee: Nubia Technology Co Ltd
Priority date: 2016-09-29
Filing date: 2016-09-29
Publication date: 2019-03-08
Anticipated expiration: 2036-09-29
Also published as: CN106304797A

Abstract

The invention discloses a kind of mobile terminals, including chip and printed circuit board (PCB)；The chip is fixed on the pcb, and the chip can generate heat at work；The mobile terminal further include: the first conducting-heat elements, first conducting-heat elements are phase change materials；Second conducting-heat elements of insulation, second conducting-heat elements are coated on first conducting-heat elements surface；Shielding case is fixed with the PCB, and the chip is located in the space that the shielding case and the PCB are formed；Wherein, first conducting-heat elements and second conducting-heat elements are filled in the shielding case, PCB and chip and are formed by space.

Description

Mobile terminal

Technical Field

The invention relates to a terminal technology, in particular to a mobile terminal.

Background

With the development of intelligent electronic products, the number of cores of a Central Processing Unit (CPU) is increasing; the pursuit of a user for large three-dimensional (3D) games and high-definition videos leads to an increasing amount of heat generated by products such as mobile phones and tablet computers, and user experience is seriously affected.

In order to solve the heat dissipation problem of these intelligent electronic products, it is proposed to use a metal phase change material with high thermal conductivity as a heat dissipation material used in the electronic products. However, as a heat dissipation material used in electronic products, a metal phase change material undergoes phase change during use, which may cause leakage problems, thereby causing short-circuiting of circuits.

Therefore, how to solve the leakage problem of the metal phase change material is a problem to be solved urgently at present.

Disclosure of Invention

In view of the above, embodiments of the present invention provide a mobile terminal to solve at least one problem in the prior art.

The technical scheme of the embodiment of the invention is realized as follows:

the embodiment of the invention provides a mobile terminal, which comprises a chip and a Printed Circuit Board (PCB); the chip is fixed on the PCB and can generate heat when in work; the mobile terminal further includes:

a first heat conducting member that is a metallic phase change material;

the second heat conducting component is insulated and covers the surface of the first heat conducting component;

the shielding cover is fixed with the PCB, and the chip is positioned in a space formed by the shielding cover and the PCB; wherein,

the first heat-conducting component and the second heat-conducting component are filled in a space formed by the shielding case, the PCB and the chip.

In the above aspect, the space formed by the shield case, the PCB, and the chip is filled with the first heat-conducting member and the second heat-conducting member.

In the above aspect, the second heat conduction member is a sealing film, and the sealing film blocks leakage of the first heat conduction member due to phase change.

In the scheme, the thickness of the sealing film is 0.01-0.03 mm.

In the above scheme, the second heat conduction member is made of polyethylene terephthalate PET.

In the above aspect, the second heat conduction member has a melting point higher than 100 ℃.

In the above scheme, the shielding case is made of cupronickel.

In the above scheme, the shielding case is provided with graphite, and heat generated by the chip during operation is conducted to the graphite through the first heat-conducting member covering the second heat-conducting member, so that the heat is conducted to the shielding case through the graphite and is dispersed.

In the above aspect, when the heat conducting member does not undergo a phase change due to heat generated by the chip, the heat conducting material is in a solid state in the form of a block.

In the above aspect, the first heat conduction member is a metal phase change material formed by adding other chemical elements to tin.

According to the mobile terminal provided by the embodiment of the invention, the chip is fixed on the PCB, and the chip can generate heat when in work; a first heat conducting member that is a metallic phase change material; the second heat conducting component is insulated and covers the surface of the first heat conducting component; the shielding cover is fixed with the PCB, and the chip is positioned in a space formed by the shielding cover and the PCB; the first heat conduction component and the second heat conduction component are filled in a space formed by the shielding cover, the PCB and the chip, and in the heat conduction process, the first heat conduction component is placed in a sealed space formed by the second heat conduction component and is coated with the insulated second heat conduction component, so that when the chip generates heat during working to enable the first heat conduction component to generate phase change, the first heat conduction component cannot generate the leakage problem, and the problem of circuit short circuit caused by the leakage is avoided.

Drawings

Fig. 1 is a schematic hardware configuration diagram of an alternative mobile terminal 100 for implementing various embodiments of the present invention;

FIG. 2 is a diagram of a wireless communication system for the mobile terminal 100 shown in FIG. 1;

fig. 3 is a schematic structural diagram of a mobile terminal according to an embodiment of the present invention;

FIG. 4 is a schematic flow chart illustrating a method of sealing a third heat-transfer member according to an embodiment of the present invention;

fig. 5 is a schematic flow chart illustrating a sealing method of four heat-conducting members according to an embodiment of the present invention.

Detailed Description

It should be understood that the embodiments described herein are only for explaining the technical solutions of the present invention, and are not intended to limit the scope of the present invention.

A mobile terminal implementing various embodiments of the present invention will now be described with reference to the accompanying drawings. In the following description, suffixes such as "module", "component", or "unit" used to denote elements are used only for facilitating the explanation of the present invention, and have no specific meaning in themselves. Thus, "module" and "component" may be used in a mixture.

The mobile terminal may be implemented in various forms. For example, the terminal described in the present invention may include a mobile terminal such as a mobile phone, a smart phone, a notebook computer, a digital broadcast receiver, a Personal Digital Assistant (PDA), a tablet computer (PAD), a Portable Multimedia Player (PMP), a navigation device, etc., and a stationary terminal such as a digital TV, a desktop computer, etc. In the following, it is assumed that the terminal is a mobile terminal. However, it will be understood by those skilled in the art that the configuration according to the embodiment of the present invention can be applied to a fixed type terminal in addition to elements particularly used for moving purposes.

Fig. 1 is a schematic hardware configuration of a mobile terminal 100 implementing various embodiments of the present invention, and as shown in fig. 1, the mobile terminal 100 may include a wireless communication unit 110, an audio/video (a/V) input unit 120, a user input unit 130, a sensing unit 140, an output unit 150, a memory 160, an interface unit 170, a controller 180, a power supply unit 190, and the like. Fig. 1 illustrates the mobile terminal 100 having various components, but it is to be understood that not all illustrated components are required to be implemented. More or fewer components may alternatively be implemented. The elements of the mobile terminal 100 will be described in detail below.

The wireless communication unit 110 typically includes one or more components that allow radio communication between the mobile terminal 100 and a wireless communication system or network. For example, the wireless communication unit 110 may include at least one of a broadcast receiving module 111, a mobile communication module 112, a wireless internet module 113, a short-range communication module 114, and a location information module 115.

The broadcast receiving module 111 receives a broadcast signal and/or broadcast associated information from an external broadcast management server via a broadcast channel. The broadcast channel may include a satellite channel and/or a terrestrial channel. The broadcast management server may be a server that generates and transmits a broadcast signal and/or broadcast associated information or a server that receives a previously generated broadcast signal and/or broadcast associated information and transmits it to a terminal. The broadcast signal may include a TV broadcast signal, a radio broadcast signal, a data broadcast signal, and the like. Also, the broadcast signal may further include a broadcast signal combined with a TV or radio broadcast signal. The broadcast associated information may also be provided via a mobile communication network, and in this case, the broadcast associated information may be received by the mobile communication module 112. The broadcast signal may exist in various forms, for example, it may exist in the form of an Electronic Program Guide (EPG) of Digital Multimedia Broadcasting (DMB), an Electronic Service Guide (ESG) of digital video broadcasting-handheld (DVB-H), and the like. The broadcast receiving module 111 may receive a signal broadcast by using various types of broadcasting systems. In particular, the broadcast receiving module 111 may receive a broadcast signal by using a signal such as multimedia broadcasting-terrestrial (DMB-T), digital multimedia broadcasting-satellite (DMB-S), digital video broadcasting-handheld (DVB-H), forward link media (MediaFLO)^@) A digital broadcasting system of a terrestrial digital broadcasting integrated service (ISDB-T), etc. receives digital broadcasting. The broadcast receiving module 111 may be constructed to be suitable for various broadcasting systems providing broadcast signals and the above-mentioned numberA word broadcast system. The broadcast signal and/or broadcast associated information received via the broadcast receiving module 111 may be stored in the memory 160 (or other type of storage medium).

The mobile communication module 112 transmits and/or receives radio signals to and/or from at least one of a base station (e.g., access point, node B, etc.), an external terminal, and a server. Such radio signals may include voice call signals, video call signals, or various types of data transmitted and/or received according to text and/or multimedia messages.

The wireless internet module 113 supports wireless internet access of the mobile terminal 100. The wireless internet module 113 may be internally or externally coupled to the terminal. The wireless internet access technology referred to by the wireless internet module 113 may include Wireless Local Area Network (WLAN), wireless compatibility authentication (Wi-Fi), wireless broadband (Wibro), worldwide interoperability for microwave access (Wimax), High Speed Downlink Packet Access (HSDPA), and the like.

The short-range communication module 114 is a module for supporting short-range communication. Some examples of short-range communication technologies include bluetooth^TMRadio Frequency Identification (RFID), infrared data association (IrDA), Ultra Wideband (UWB), zigbee^TMAnd so on.

The location information module 115 is a module for checking or acquiring location information of the mobile terminal 100. A typical example of the location information module 115 is a Global Positioning System (GPS). According to the current technology, the location information module 115, which is a GPS, calculates distance information and accurate time information from three or more satellites and applies triangulation to the calculated information, thereby accurately calculating three-dimensional current location information according to longitude, latitude, and altitude. Currently, a method for calculating position and time information uses three satellites and corrects an error of the calculated position and time information by using another satellite. In addition, the location information module 115, which is a GPS, can calculate speed information by continuously calculating current location information in real time.

The a/V input unit 120 is used to receive an audio or video signal. The a/V input unit 120 may include a camera 121 and a microphone 122, and the camera 121 processes image data of still pictures or video obtained by an image capturing apparatus in a video capturing mode or an image capturing mode. The processed image frames may be displayed on the display unit 151. The image frames processed by the cameras 121 may be stored in the memory 160 (or other storage medium) or transmitted via the wireless communication unit 110, and two or more cameras 121 may be provided according to the construction of the mobile terminal 100. The microphone 122 may receive sounds (audio data) via the microphone in a phone call mode, a recording mode, a voice recognition mode, or the like, and can process such sounds into audio data. The processed audio (voice) data may be converted into a format output transmittable to a mobile communication base station via the mobile communication module 112 in case of a phone call mode. The microphone 122 may implement various types of noise cancellation (or suppression) algorithms to cancel (or suppress) noise or interference generated in the course of receiving and transmitting audio signals.

The user input unit 130 may generate key input data to control various operations of the mobile terminal 100 according to a command input by a user. The user input unit 130 allows a user to input various types of information, and may include a keyboard, dome sheet, touch pad (e.g., a touch-sensitive member that detects changes in resistance, pressure, capacitance, and the like due to being touched), scroll wheel, joystick, and the like. In particular, when the touch pad is superimposed on the display unit 151 in the form of a layer, a touch screen may be formed.

The sensing unit 140 detects a current state of the mobile terminal 100 (e.g., an open or closed state of the mobile terminal 100), a position of the mobile terminal 100, presence or absence of contact (i.e., touch input) by a user with the mobile terminal 100, an orientation of the mobile terminal 100, acceleration or deceleration movement and direction of the mobile terminal 100, and the like, and generates a command or signal for controlling an operation of the mobile terminal 100. For example, when the mobile terminal 100 is implemented as a slide-type mobile phone, the sensing unit 140 may sense whether the slide-type phone is opened or closed. In addition, the sensing unit 140 can detect whether the power supply unit 190 supplies power or whether the interface unit 170 is coupled with an external device.

The interface unit 170 serves as an interface through which at least one external device is connected to the mobile terminal 100. For example, the external device may include a wired or wireless headset port, an external power supply (or battery charger) port, a wired or wireless data port, a memory card port (a typical example is a Universal Serial Bus (USB) port), a port for connecting a device having an identification module, an audio input/output (I/O) port, a video I/O port, an earphone port, and the like. The identification module may store various information for authenticating a user using the mobile terminal 100 and may include a User Identity Module (UIM), a Subscriber Identity Module (SIM), a Universal Subscriber Identity Module (USIM), and the like. In addition, a device having an identification module (hereinafter, referred to as an "identification device") may take the form of a smart card, and thus, the identification device may be connected with the mobile terminal 100 via a port or other connection means.

The interface unit 170 may be used to receive input (e.g., data information, power, etc.) from an external device and transmit the received input to one or more elements within the mobile terminal 100 or may be used to transmit data between the mobile terminal 100 and the external device.

In addition, when the mobile terminal 100 is connected with an external cradle, the interface unit 170 may serve as a path through which power is supplied from the cradle to the mobile terminal 100 or may serve as a path through which various command signals input from the cradle are transmitted to the mobile terminal 100. Various command signals or power input from the cradle may be used as signals for recognizing whether the mobile terminal 100 is accurately mounted on the cradle.

The output unit 150 is configured to provide output signals (e.g., audio signals, video signals, alarm signals, vibration signals, etc.) in a visual, audio, and/or tactile manner. The output unit 150 may include a display unit 151, an audio output module 152, an alarm unit 153, and the like.

The display unit 151 may display information processed in the mobile terminal 100. For example, when the mobile terminal 100 is in a phone call mode, the display unit 151 may display a User Interface (UI) or a Graphical User Interface (GUI) related to a call or other communication (e.g., text messaging, multimedia file downloading, etc.). When the mobile terminal 100 is in a video call mode or an image capturing mode, the display unit 151 may display a captured image and/or a received image, a UI or GUI showing a video or an image and related functions, and the like.

Meanwhile, when the display unit 151 and the touch pad are overlapped with each other in the form of a layer to form a touch screen, the display unit 151 may serve as an input device and an output device. The display unit 151 may include at least one of a Liquid Crystal Display (LCD), a thin film transistor LCD (TFT-LCD), an Organic Light Emitting Diode (OLED) display, a flexible display, a three-dimensional (3D) display, and the like. Some of these displays may be configured to be transparent to allow a user to see from the outside, which may be referred to as transparent displays, and a typical transparent display may be, for example, a Transparent Organic Light Emitting Diode (TOLED) display or the like. Depending on the particular desired implementation, mobile terminal 100 may include two or more display units (or other display devices), for example, mobile terminal 100 may include an external display unit (not shown) and an internal display unit (not shown). The touch screen may be used to detect a touch input pressure as well as a touch input position and a touch input area.

The audio output module 152 may convert audio data received by the wireless communication unit 110 or stored in the memory 160 into an audio signal and output as sound when the mobile terminal 100 is in a call signal reception mode, a call mode, a recording mode, a voice recognition mode, a broadcast reception mode, or the like. Also, the audio output module 152 may provide audio output related to a specific function performed by the mobile terminal 100 (e.g., a call signal reception sound, a message reception sound, etc.). The audio output module 152 may include a speaker, a buzzer, and the like.

The alarm unit 153 may provide an output to notify the mobile terminal 100 of the occurrence of an event. Typical events may include call reception, message reception, key signal input, touch input, and the like. In addition to audio or video output, the alarm unit 153 may provide output in different ways to notify the occurrence of an event. For example, the alarm unit 153 may provide an output in the form of vibration, and when a call, a message, or some other incoming communication (communicating communication) is received, the alarm unit 153 may provide a tactile output (i.e., vibration) to inform the user thereof. By providing such a tactile output, the user can recognize the occurrence of various events even when the user's mobile phone is in the user's pocket. The alarm unit 153 may also provide an output notifying the occurrence of an event via the display unit 151 or the audio output module 152.

The memory 160 may store software programs or the like for processing and controlling operations performed by the controller 180, or may temporarily store data (e.g., a phonebook, messages, still images, videos, etc.) that has been output or is to be output. Also, the memory 160 may store data regarding various ways of vibration and audio signals output when a touch is applied to the touch screen.

The memory 160 may include at least one type of storage medium including a flash memory, a hard disk, a multimedia card, a card-type memory (e.g., SD or DX memory, etc.), a Random Access Memory (RAM), a Static Random Access Memory (SRAM), a read-only memory (ROM), an electrically erasable programmable read-only memory (EEPROM), a programmable read-only memory (PROM), a magnetic memory, a magnetic disk, an optical disk, and the like. Also, the mobile terminal 100 may cooperate with a network storage device that performs a storage function of the memory 160 through a network connection.

The controller 180 generally controls the overall operation of the mobile terminal 100. For example, the controller 180 performs control and processing related to voice calls, data communications, video calls, and the like. In addition, the controller 180 may include a multimedia module 181 for reproducing or playing back multimedia data, and the multimedia module 181 may be constructed within the controller 180 or may be constructed to be separated from the controller 180. The controller 180 may perform a pattern recognition process to recognize a handwriting input or a picture drawing input performed on the touch screen as a character or an image.

The power supply unit 190 receives external power or internal power and provides appropriate power required to operate various elements and components under the control of the controller 180.

The various embodiments described herein may be implemented in a computer-readable medium using, for example, computer software, hardware, or any combination thereof. For a hardware implementation, the embodiments described herein may be implemented using at least one of an Application Specific Integrated Circuit (ASIC), a Digital Signal Processor (DSP), a Digital Signal Processing Device (DSPD), a Programmable Logic Device (PLD), a Field Programmable Gate Array (FPGA), a processor, a controller, a microcontroller, a microprocessor, an electronic unit designed to perform the functions described herein, and in some cases, such embodiments may be implemented in the controller 180. For a software implementation, the implementation such as a process or a function may be implemented with a separate software module that allows performing at least one function or operation. The software codes may be implemented by software applications (or programs) written in any suitable programming language, which may be stored in the memory 160 and executed by the controller 180.

Up to this point, the mobile terminal 100 has been described in terms of its functions. Hereinafter, the slide-type mobile terminal 100 among various types of mobile terminals 100, such as a folder-type, bar-type, swing-type, slide-type mobile terminal 100, and the like, will be described as an example for the sake of brevity. Accordingly, the present invention can be applied to any type of mobile terminal 100, and is not limited to the slide type mobile terminal 100.

The mobile terminal 100 as shown in fig. 1 may be configured to operate with communication systems such as wired and wireless communication systems and satellite-based communication systems that transmit data via frames or packets.

A communication system in which the mobile terminal 100 according to the present invention is capable of operating will now be described with reference to fig. 2.

Such communication systems may use different air interfaces and/or physical layers. For example, the air interface used by the communication system includes, for example, Frequency Division Multiple Access (FDMA), Time Division Multiple Access (TDMA), Code Division Multiple Access (CDMA), and Universal Mobile Telecommunications System (UMTS) (in particular, Long Term Evolution (LTE)), global system for mobile communications (GSM), and the like. By way of non-limiting example, the following description relates to a CDMA communication system, but such teachings are equally applicable to other types of systems.

Referring to fig. 2, the CDMA wireless communication system may include a plurality of mobile terminals 100, a plurality of Base Stations (BSs) 270, Base Station Controllers (BSCs) 275, and a Mobile Switching Center (MSC) 280. The MSC 280 is configured to interface with a Public Switched Telephone Network (PSTN) 290. The MSC 280 is also configured to interface with a BSC275, which may be coupled to the base station 270 via a backhaul. The backhaul may be constructed according to any of several known interfaces including, for example, E1/T1, ATM, IP, PPP, frame Relay, HDSL, ADSL, or xDSL. It will be understood that a system as shown in fig. 2 may include multiple BSCs 275.

Each BS 270 may serve one or more sectors (or regions), each sector covered by a multi-directional antenna or an antenna pointing in a particular direction being radially distant from the BS 270. Alternatively, each partition may be covered by two or more antennas for diversity reception. Each BS 270 may be configured to support multiple frequency allocations, with each frequency allocation having a particular frequency spectrum (e.g., 1.25MHz, 5MHz, etc.).

The intersection of partitions with frequency allocations may be referred to as a CDMA channel. The BS 270 may also be referred to as a Base Transceiver Subsystem (BTS) or other equivalent terminology. In such a case, the term "base station" may be used to generically refer to a single BSC275 and at least one BS 270. The base stations may also be referred to as "cells". Alternatively, each partition of a particular BS 270 may be referred to as a plurality of cell sites.

As shown in fig. 2, a Broadcast Transmitter (BT)295 transmits a broadcast signal to the mobile terminal 100 operating within the system. A broadcast receiving module 111 as shown in fig. 1 is provided at the mobile terminal 100 to receive a broadcast signal transmitted by the BT 295. In fig. 2, several satellites 300 are shown, for example, Global Positioning System (GPS) satellites 300 may be employed. The satellite 300 assists in locating at least one of the plurality of mobile terminals 100.

In fig. 2, a plurality of satellites 300 are depicted, but it is understood that useful positioning information may be obtained with any number of satellites. The GPS module 115 as shown in fig. 1 is generally configured to cooperate with satellites 300 to obtain desired positioning information. Other techniques that can track the location of the mobile terminal 100 may be used instead of or in addition to GPS tracking techniques. In addition, at least one GPS satellite 300 may selectively or additionally process satellite DMB transmission.

As a typical operation of the wireless communication system, the BS 270 receives reverse link signals from various mobile terminals 100. The mobile terminal 100 is generally engaged in conversations, messaging, and other types of communications. Each reverse link signal received by a particular base station 270 is processed within the particular BS 270. The obtained data is forwarded to the associated BSC 275. The BSC provides call resource allocation and mobility management functions including coordination of soft handoff procedures between BSs 270. The BSCs 275 also route the received data to the MSC 280, which provides additional routing services for interfacing with the PSTN 290. Similarly, the PSTN290 interfaces with the MSC 280, the MSC interfaces with the BSCs 275, and the BSCs 275 accordingly control the BS 270 to transmit forward link signals to the mobile terminal 100.

The mobile communication module 112 of the wireless communication unit 110 in the mobile terminal accesses the mobile communication network based on the necessary data (including the user identification information and the authentication information) of the mobile communication network (such as the mobile communication network of 2G/3G/4G, etc.) built in the mobile terminal, so as to transmit the mobile communication data (including the uplink mobile communication data and the downlink mobile communication data) for the services of web browsing, network multimedia playing, etc. of the mobile terminal user.

The wireless internet module 113 of the wireless communication unit 110 implements a function of a wireless hotspot by operating a related protocol function of the wireless hotspot, the wireless hotspot supports access by a plurality of mobile terminals (any mobile terminal other than the mobile terminal), transmits mobile communication data (including uplink mobile communication data and downlink mobile communication data) for mobile terminal user's services such as web browsing, network multimedia playing, etc. by multiplexing the mobile communication connection between the mobile communication module 112 and the mobile communication network, since the mobile terminal essentially multiplexes the mobile communication connection between the mobile terminal and the communication network for transmitting mobile communication data, the traffic of mobile communication data consumed by the mobile terminal is charged to the communication tariff of the mobile terminal by a charging entity on the side of the communication network, thereby consuming the data traffic of the mobile communication data included in the communication tariff contracted for use by the mobile terminal.

Based on the above-mentioned hardware structure of the mobile terminal and the communication system, the following embodiments of the present invention are proposed.

The heat dissipation materials used by the current electronic products such as mobile phones, panels and the like are mainly graphite, copper foil and the like; graphite and copper foil can only diffuse heat rapidly in the horizontal direction, and the heat conduction effect of high-density chips such as CPU and the like in the Z direction is not large. Currently, most of heat conduction materials in the Z direction are heat conduction gel, heat conduction silica gel, organic phase change materials and the like.

In addition, the main heating chip on the current intelligent electronic product (such as a mobile phone) is a CPU, the CPU is generally placed in a metal shielding cover, and the CPU needs to conduct the heat of the CPU to the shielding cover or a middle frame of a front shell through a Thermal Interface Material (Thermal Interface Material) and then disperse so as to avoid heat concentration. Specifically, the main thermal conduction paths are at present: the heat generated by the CPU is conducted to the thermal interface material (thermal silica gel or thermal gel), and then conducted to the shield cover through the thermal interface material to dissipate the generated heat.

However, the thermal conductivity of the current interface thermal conductive material thermal conductive gel is low, and the thermal contact resistance of the thermal conductive silica gel is large. That is, these materials have a disadvantage in that they are poor in heat conduction.

The thermal conductivity of the metal phase change material is 5-10 times that of the existing heat conduction materials, so that if the metal phase change material is used as an interface heat conduction material, the heat conduction effect can be greatly improved. However, the metallic phase change material has thermal and electrical conductivity, that is, it conducts heat and also conducts electricity, so there is leakage after the phase change, which may cause a short circuit of a circuit. Therefore, how to seal the metal phase change material by some structure and process assembly methods is a problem to be solved at present.

Example one

An embodiment of the present invention provides a mobile terminal, and a hardware structure diagram of the mobile terminal is shown in fig. 1.

In this embodiment, as shown in fig. 3, the mobile terminal includes:

PCB 31；

a chip 32 fixed on the PCB31, the chip 32 being capable of generating heat during operation;

a first heat-conducting member 33, the first heat-conducting member 33 being a metal phase-change material;

an insulating second heat-conducting member 34, wherein the second heat-conducting member 34 covers the surface of the first heat-conducting member 33;

a shield can 35 fixed to the PCB31, wherein the chip 32 is located in a space formed by the shield can 35 and the PCB 31; wherein,

the first heat-conducting member 33 and the second heat-conducting member 34 are filled in a space formed by the shield can 35, the PCB31, and the chip 32.

That is, after the shield can 35 is fixed to the PCB31, the shield can 35 completely surrounds the first heat-conducting member 33 coated with the insulating second heat-conducting member 34, the first heat-conducting member 33 is located in the sealed space formed by the second heat-conducting member 34, and the first heat-conducting member 33 coated with the insulating second heat-conducting member 34 is in contact with the chip 32 and the shield can 35.

Specifically, as shown in fig. 3, the lower surface of the first heat-conductive member 33 coated with the insulating second heat-conductive member 34 is in contact with the chip 32, and the upper surface of the first heat-conductive member 33 coated with the insulating second heat-conductive member 34 is in contact with the shield can 35.

Here, in practical applications, in order to increase the heat dissipation speed, the space formed by the shield case 35, the PCB31, and the chip 32 may be filled with the first heat-conducting member 33 and the second heat-conducting member 34. That is, the first heat-conductive member 33 coated with the insulating second heat-conductive member 34 may be completely in contact with the chip 32 and the shield can 35. That is, as shown in fig. 3, the lower surface of the first heat conductive member 33 coated with the insulating second heat conductive member 34 is completely in contact with the chip 32, and the upper surface of the first heat conductive member 33 coated with the insulating second heat conductive member 34 is completely in contact with the shield can 35.

In the mobile terminal according to the embodiment of the present invention, the surface of the first heat conducting member 33 is coated with the second insulating heat conducting member 34, the space formed by the shielding case, the PCB and the chip is filled with the first heat conducting member and the second heat conducting member, and the first heat conducting member 33 coated with the second heat conducting member 34 is located in the sealed space formed by the second insulating heat conducting member 34. When the chip 32 is operating, heat is generated, and the heat transfer path is: the heat generated from the chip 32 is conducted to the first heat-conducting member 33 coated with the insulating second heat-conducting member 34, and then conducted to the shield can 35 through the first heat-conducting member 33 coated with the insulating second heat-conducting member 34. In the heat conduction process, just as the first heat conduction member 33 is placed in the sealed space and is wrapped with the insulating second heat conduction member 34, when the chip 32 generates heat during operation to cause the phase change of the first heat conduction member 33, the first heat conduction member 33 does not generate a leakage problem, so that the problem of circuit short circuit caused by the leakage is avoided.

In practical application, the chip 32 is fixed on the PCB31 by means of a patch. Here, the most commonly used patch methods are: the chip 32 is soldered to the PCB31 using solder bars (wires) or the like.

Accordingly, the shield can 35 may be fixed to the PCB31 by means of a patch.

In practice, the chip 32 may be a CPU or the like.

When the first heat-conductive member 33 is not phase-changed by the heat generated from the chip 32, the first heat-conductive member 33 assumes a solid state, more specifically, a solid state in the form of a block.

In practical applications, the first heat conducting member 33 may be a metal phase change material formed by adding other chemical elements to tin (Sn).

In practical applications, the phase transition point of the metal phase change material is generally less than 100 ℃, so that the melting point of the second heat conduction member 34 is required to be higher than 100 ℃, so that when the metal phase change material undergoes phase transition, the second heat conduction member 34 is still in a solid state, thereby sealing the first heat conduction member 33 and further preventing leakage.

The first heat-conducting member 33 and the second heat-conducting material 34 form a heat-conducting interface material of the mobile terminal.

The shielding case 35 is used for shielding the electric signals which are generated to interfere the operation of the chip 32.

In practical applications, the material of the shielding case 35 may be a high thermal conductivity material (e.g., a material having a thermal conductivity twice as high as that of stainless steel (a shielding case material commonly used at present), such as: cupronickel, etc., so that the heat dispersion speed can be effectively increased.

The shielding case 35 may further include graphite, and heat generated by the chip 32 during operation is conducted to the graphite through the first heat-conducting member 33 covering the second heat-conducting member 34, so that the heat is conducted to the shielding case 35 through the graphite and is dissipated, and thus, the heat can be further rapidly conducted to the shielding case 35, and the heat can be rapidly dissipated through the shielding case 35.

In the mobile terminal provided by the embodiment of the invention, the chip 32 is fixed on the PCB31, and the chip 32 can generate heat when in work; the first heat-conducting member 33 is a metal phase-change material; the second heat-conducting member 34 is coated on the surface of the first heat-conducting member 33; the shielding case 35 is fixed with the PCB31, and the chip 32 is located in a space formed by the shielding case 35 and the PCB 31; in the heat conduction process, the first heat conduction member 33 is placed in the sealed space formed by the second heat conduction member 34 and is coated with the insulating second heat conduction member 34, so that when the chip 32 generates heat during operation to cause the phase change of the first heat conduction member 33, the first heat conduction member 33 does not leak, and the problem of short circuit caused by the leakage is avoided.

In addition, the shielding case 35 is further provided with graphite, and heat generated by the chip 32 during operation is conducted to the graphite through the first heat-conducting member 33 coated with the insulating second heat-conducting member 34, so that the heat is conducted to the shielding case 35 through the graphite and is dissipated, and thus, the heat can be further rapidly conducted to the shielding case 35, and the heat can be rapidly dissipated through the shielding case 35.

Example two

In this embodiment, as shown in fig. 3, the mobile terminal includes:

PCB 31；

a shield can 35 fixed to the PCB31, wherein the chip is located in a space formed by the shield can 35 and the PCB 31; wherein,

Accordingly, the shield can 35 may be fixed to the PCB31 by means of a patch.

In practice, the chip 32 may be a CPU or the like.

In the embodiment of the present invention, the first heat-conductive member 33 coated with the second heat-conductive member 34 needs to surround the chip 32 and be in contact with the chip 32, and in order to realize such a structure, it may be assembled by using the property of the first heat-conductive member 33 to change phase.

In view of this, in the present embodiment, the first heat-conducting member 33 is a sealing film that blocks leakage of the first heat-conducting member 33 due to phase change. Specifically, the material of the second heat-conducting member 34 may be polyethylene terephthalate (PET).

In practical application, the thickness of the sealing film can be 0.01 mm-0.03 mm.

The first heat conduction member 33 is heated to the phase transition point to be in a liquid state, the liquid first heat conduction member 33 is injected into the sealing film, then the sealing film is sealed (sealed), the first heat conduction member 33 covered by the sealing film is placed on the chip 32, and then the shield can 35 is disposed on the PCB 31.

In the mobile terminal provided by the embodiment of the invention, the chip 32 is fixed on the PCB31, and the chip 32 can generate heat when in work; the first heat conducting component is made of metal phase change materials; an insulating second heat-conducting component 34 is coated on the surface of the first heat-conducting component 31; the shielding case 35 is fixed with the PCB31, and the chip 32 is located in a space formed by the shielding case 35 and the PCB 31; in the heat conduction process, the first heat conduction member 33 is placed in the sealed space formed by the second heat conduction member 34 and is coated with the insulating second heat conduction member 34, so that when the chip 32 generates heat during operation to cause the phase change of the first heat conduction member 33, the first heat conduction member 33 does not leak, and the problem of short circuit caused by the leakage is avoided.

EXAMPLE III

Based on the mobile terminal provided by the first embodiment of the present invention, the first embodiment provides a method for sealing a heat conducting member, as shown in fig. 4, the method includes the following steps:

step 401: coating the surface of the first heat-conducting component by using an insulated second heat-conducting component;

here, the first heat conductive member is a metal phase change material.

In practical applications, the first heat conducting component may be a metallic phase change material formed by adding other chemical elements on the basis of tin (Sn).

In practical application, the phase change point of the used metal phase change material is generally less than 100 ℃, so that the melting point of the second heat conduction component is required to be higher than 100 ℃, so that when the metal phase change material undergoes phase change, the second heat conduction component is still in a solid state, and the effect of sealing the first heat conduction component is achieved, and further leakage of the first heat conduction component is prevented.

The first heat conduction component and the second heat conduction material form a heat conduction interface material of the mobile terminal.

Step 402: disposing the first heat-conductive member coated with the second heat-conductive member on a chip fixed on the PCB;

here, the chip can generate heat during operation.

In practical applications, the chip may be a CPU or the like.

In practical application, the chip is fixed on the PCB in a patch mode. Here, the most commonly used patch methods are: the chip is soldered to the PCB using solder bars (wires) or the like.

Step 403: and fixing a shielding cover on the PCB so that the chip is positioned in a space formed by the shielding cover and the PCB.

The first heat conducting component and the second heat conducting component are filled in a space formed by the shielding cover, the PCB and the chip.

That is, after the shield case is fixed to the PCB, the shield case completely surrounds the first heat-conductive member coated with the insulating second heat-conductive member, the first heat-conductive member is located in the sealed space formed by the second heat-conductive member, and the first heat-conductive member coated with the insulating second heat-conductive member is in contact with the chip and the shield case.

Specifically, the lower surface of the first heat-conductive member coated with the insulating second heat-conductive member is in contact with the chip, and the upper surface of the first heat-conductive member coated with the insulating second heat-conductive member is in contact with the shield case.

Here, in practical applications, in order to increase the heat dissipation speed, the space formed by the shield case, the PCB, and the chip may be filled with the first heat-conducting member and the second heat-conducting member. That is, the first heat-conductive member coated with the insulating second heat-conductive member may be in complete contact with the chip and the shield can. That is, the lower surface of the first heat conductive member coated with the insulating second heat conductive member is in full contact with the chip, and the upper surface of the first heat conductive member coated with the insulating second heat conductive member is in full contact with the shield case.

When the first heat-conductive member is not phase-changed by heat generated from the chip, the first heat-conductive member assumes a solid state, more specifically, a solid state in the form of a block.

And the shielding case is used for shielding electric signals which are generated to interfere the work of the chip.

In practical applications, the material of the shielding case may be a high thermal conductivity material (e.g., a material with thermal conductivity twice as high as that of stainless steel (a shielding case material commonly used at present), such as: cupronickel, etc., so that the heat dispersion speed can be effectively increased.

In practical application, the shielding case can be fixed on the PCB in a patch manner.

In an embodiment, before the fixing the shield can on the PCB, the method may further include:

the graphite is arranged on the shielding case, so that heat generated by the chip during operation is conducted to the graphite through the first heat-conducting component wrapping the second heat-conducting component, and is conducted to the shielding case through the graphite and is dispersed, and therefore, the heat can be further rapidly conducted to the shielding case, and the heat can be rapidly dispersed through the shielding case.

According to the scheme provided by the embodiment of the invention, the surface of the first heat-conducting component is coated by the insulated second heat-conducting component; the first heat conducting component is made of a metal phase change material; disposing the first heat-conductive member coated with the second heat-conductive member on a chip fixed on the printed circuit board PCB; the chip can generate heat when in work; fixing a shielding case on the PCB so that the chip is positioned in a space formed by the shielding case and the PCB; the first heat conduction component and the second heat conduction component are filled in a space formed by the shielding cover, the PCB and the chip, and in the heat conduction process, the first heat conduction component is placed in a sealed space formed by the second heat conduction component and is coated with the insulated second heat conduction component, so that when the chip generates heat during working to enable the first heat conduction component to generate phase change, the first heat conduction component cannot generate the leakage problem, and the problem of circuit short circuit caused by the leakage is avoided.

The graphite is arranged on the shielding case, so that heat generated by the chip during operation is conducted to the graphite through the first heat-conducting component wrapping the second heat-conducting component, the heat is conducted to the shielding case through the graphite and is dispersed, the heat can be further rapidly conducted to the shielding case, and the heat can be rapidly dispersed through the shielding case.

Example four

Based on the mobile terminal provided in the second embodiment of the present invention, this embodiment provides a sealing method for a heat conducting member, as shown in fig. 5, the method includes the following steps:

step 501: heating the first heat-conducting component to a phase change point to become liquid; injecting the liquid into a sealing membrane; sealing the sealing film injected with the liquid;

here, after step 501 is completed, an assembly process of coating the surface of the first heat-conducting member with an insulating second heat-conducting member (sealing film) is realized by utilizing the property of phase change of the first heat-conducting member.

The first heat conducting component is made of metal phase change materials.

The sealing film blocks leakage of the first heat-conductive member due to phase change. Specifically, the material of the second heat conduction member may be PET.

Step 502: disposing the first heat-conductive member coated with the second heat-conductive member on a chip fixed on the PCB;

here, the chip can generate heat during operation.

In practical applications, the chip may be a CPU or the like.

Step 503: and fixing a shielding cover on the PCB so that the chip is positioned in a space formed by the shielding cover and the PCB.

From the above description it follows that: in this embodiment, the first heat-conducting member is heated to the phase transition point, and is in a liquid state, the liquid first heat-conducting member is injected into the sealing film, and then the sealing film is sealed (sealed), and the first heat-conducting member covered by the sealing film is placed on the chip, and then the shield case is disposed on the PCB.

According to the scheme provided by the embodiment of the invention, the surface of the first heat-conducting component is coated by the insulated second heat-conducting component; the first heat conducting component is made of a metal phase change material; disposing the first heat-conductive member coated with the second heat-conductive member on a chip fixed on the printed circuit board PCB; the chip can generate heat when in work; fixing a shielding cover on the PCB to enable the chip to be located in a space formed by the shielding cover and the PCB; the first heat conduction component and the second heat conduction component are filled in a space formed by the shielding cover, the PCB and the chip, and in the heat conduction process, the first heat conduction component is placed in a sealed space formed by the second heat conduction component and is coated with the insulated second heat conduction component, so that when the chip generates heat during working to enable the first heat conduction component to generate phase change, the first heat conduction component cannot generate the leakage problem, and the problem of circuit short circuit caused by the leakage is avoided.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that, in various embodiments of the present invention, the sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention. The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

Those of ordinary skill in the art will understand that: all or part of the steps for realizing the method embodiments can be completed by hardware related to program instructions, the program can be stored in a computer readable storage medium, and the program executes the steps comprising the method embodiments when executed; and the aforementioned storage medium includes: various media that can store program codes, such as a removable Memory device, a Read Only Memory (ROM), a magnetic disk, or an optical disk.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims

1. A mobile terminal includes a chip and a Printed Circuit Board (PCB); the chip is fixed on the PCB and can generate heat when in work; characterized in that, the mobile terminal further comprises:

a first heat conducting member that is a metallic phase change material;

the first heat-conducting component and the second heat-conducting component are filled in a space formed by the shielding cover, the PCB and the chip;

the first heat-conducting component and the second heat-conducting component fill the space formed by the shielding cover, the PCB and the chip.

2. The mobile terminal of claim 1, wherein the second thermal conductive member is a sealing film that blocks leakage of the first thermal conductive member due to a phase change.

3. The mobile terminal according to claim 2, wherein the sealing film has a thickness of 0.01mm to 0.03 mm.

4. The mobile terminal of claim 2, wherein the material of the second thermally conductive member is polyethylene terephthalate (PET).

5. The mobile terminal of claim 1, wherein the second thermally conductive member has a melting point greater than 100 ℃.

6. A mobile terminal according to any of claims 1 to 5, wherein the material of the shield is cupronickel.

7. The mobile terminal according to any of claims 1 to 5, wherein the shielding case is provided with graphite, and heat generated by the chip during operation is conducted to the graphite through the first heat-conducting member covering the second heat-conducting member, so that the heat is conducted to the shielding case through the graphite and is dissipated.

8. The mobile terminal of any of claims 1 to 5, wherein the first thermally conductive member assumes a solid state in the form of a block when the first thermally conductive member is not undergoing a phase change due to heat generated by the chip.

9. The mobile terminal according to any of claims 1 to 5, wherein the first heat conducting member is a metallic phase change material formed by adding other chemical elements on the basis of tin.