CN106455426B - A kind of encapsulating method of conducting-heat elements - Google Patents
A kind of encapsulating method of conducting-heat elements Download PDFInfo
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- CN106455426B CN106455426B CN201610865329.3A CN201610865329A CN106455426B CN 106455426 B CN106455426 B CN 106455426B CN 201610865329 A CN201610865329 A CN 201610865329A CN 106455426 B CN106455426 B CN 106455426B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
Abstract
The invention discloses a kind of encapsulating methods of conducting-heat elements, comprising: the chip on printed circuit board (PCB) is coated and fixed using the first insulating element；Conducting-heat elements are surrounded into the chip, and are contacted with the chip；The chip can generate heat at work；The conducting-heat elements are phase change materials；Shielding case is fixed on the pcb, and the conducting-heat elements are surrounded completely, and are contacted with the conducting-heat elements.
Description
Technical field
The present invention relates to electronic technology more particularly to a kind of encapsulating methods of conducting-heat elements.
Background technique
With the development of smart electronics product, the core of central processing unit (CPU, Central Processing Unit)
Number is more and more；Pursuit of the user to large-scale three dimensional (3D) game and HD video, leads to the products such as mobile phone, tablet computer
Calorific value is increasing, has seriously affected user experience.
And in order to solve the heat dissipation problem of these smart electronics products, propose the phase change materials high using thermal conductivity
As heat sink material used in electronic product.However, as heat sink material used in electronic product, phase change materials exist
It can be undergone phase transition in use process, consequently, it is possible to generating leakage problem, and then cause the short circuit of circuit.
Therefore, how to solve the leakage problem of phase change materials is current urgent problem to be solved.
Summary of the invention
In view of this, the embodiment of the present invention be solves the problems, such as it is existing in the prior art at least one and provide one kind it is thermally conductive
The encapsulating method of component.
The technical solution of the embodiment of the present invention is achieved in that
The embodiment of the present invention provides a kind of encapsulating method of conducting-heat elements, which comprises
The chip on printed circuit board (PCB) is coated and fixed using the first insulating element；
Conducting-heat elements are surrounded into the chip, and are contacted with the chip；The chip can generate heat at work；
The conducting-heat elements are phase change materials；
Shielding case is fixed on the pcb, and the conducting-heat elements are surrounded completely, and are contacted with the conducting-heat elements.
In above scheme, the conducting-heat elements and chip and shielding case are completely attached to.
In above scheme, when assembling the conducting-heat elements, which comprises
The conducting-heat elements of liquid are injected into the shielding case and the chip shape by the through-hole on the shielding case
At the first space in, contacted with the chip and shielding case when the conducting-heat elements are in solid-state；
The through-hole is sealed using the second seal member, with the leakage for stopping the conducting-heat elements to generate by phase transformation.
In above scheme, the method also includes:
Through-hole is formed on the shielding case by way of punching press.
In above scheme, the through-hole is located at the center position of the corresponding chip.
In above scheme, first insulating element is insulating cement；
And/or
Second seal member is the seal member of insulation.
In above scheme, the material of the shielding case is foreign white copper.
It is described that shielding case is fixed on the pcb in above scheme, and surround the conducting-heat elements completely, and with institute
Before stating conducting-heat elements contact, the method also includes:
Graphite is set on the shielding case, conducts the heat generated when the chip operation by the conducting-heat elements
It to graphite, conducts the heat to the shielding case by the graphite, and scatters.
It is described that shielding case is fixed on the pcb in above scheme, are as follows:
It is by way of patch that the shielding case is fixed on the pcb.
In above scheme, the method also includes:
It is by way of patch, the chip is fixed on the pcb.
The encapsulating method of conducting-heat elements provided in an embodiment of the present invention is coated and fixed on PCB using the first insulating element
Chip；Conducting-heat elements are surrounded into the chip, and are contacted with the chip；The chip can generate heat at work；
The conducting-heat elements are phase change materials；Shielding case is fixed on the pcb, and the conducting-heat elements are surrounded completely, and
It is contacted with the conducting-heat elements.The pin of the chip is coated with the first insulating element, and conducting-heat elements surround the chip, uses
After shielding case covers, the conducting-heat elements are placed exactly in the chip, PCB and shielding case and are formed by sealing space, in heat
It measures in conductive process, is placed in the space of sealing just because of conducting-heat elements, and the pin of chip is coated with the first insulation division
Part, so the conducting-heat elements will not generate when generation heat makes the conducting-heat elements generate phase transformation when the chip operation
Leakage problem, to also avoid the problem of revealing brought short circuit.
Detailed description of the invention
The hardware structural diagram of Fig. 1 optional mobile terminal 100 of each embodiment to realize the present invention；
Fig. 2 is the wireless communication system schematic diagram of mobile terminal 100 as shown in Figure 1；
Fig. 3 is mobile terminal structure of embodiment of the present invention schematic diagram；
Fig. 4 is the encapsulating method flow diagram of three conducting-heat elements of the embodiment of the present invention；
Fig. 5 is the encapsulating method flow diagram of four conducting-heat elements of the embodiment of the present invention.
Specific embodiment
It should be appreciated that the technical solution that the specific embodiments described herein are merely illustrative of the present invention, is not used to
It limits the scope of protection of the present invention.
The mobile terminal of each embodiment of the present invention is realized in description with reference to the drawings.In subsequent description, use
For indicate element such as " module ", " component " or " unit " suffix only for being conducive to explanation of the invention, itself
There is no specific meanings.Therefore, " module " can be used mixedly with " component ".
Mobile terminal can be implemented in a variety of manners.For example, terminal described in the present invention may include such as moving
It is phone, smart phone, laptop, digit broadcasting receiver, personal digital assistant (PDA), tablet computer (PAD), portable
The fixation of the mobile terminal of formula multimedia player (PMP), navigation device etc. and such as number TV, desktop computer etc.
Terminal.Hereinafter it is assumed that terminal is mobile terminal.However, it will be understood by those skilled in the art that in addition to being used in particular for mobile mesh
Element except, the construction of embodiment according to the present invention can also apply to the terminal of fixed type.
The hardware configuration signal of Fig. 1 mobile terminal 100 of each embodiment to realize the present invention, as shown in Figure 1, it is mobile eventually
End 100 may include wireless communication unit 110, audio/video (A/V) input unit 120, user input unit 130, sensing list
Member 140, output unit 150, memory 160, interface unit 170, controller 180 and power supply unit 190 etc..Fig. 1 is shown
Mobile terminal 100 with various assemblies, it should be understood that being not required for implementing all components shown.It can substitute
Implement more or fewer components in ground.The element of mobile terminal 100 will be discussed in more detail below.
Wireless communication unit 110 generally includes one or more components, allows mobile terminal 100 and wireless communication system
Or the radio communication between network.For example, wireless communication unit 110 may include broadcasting reception module 111, mobile communication mould
At least one of block 112, wireless Internet module 113, short range communication module 114 and location information module 115.
Broadcasting reception module 111 receives broadcast singal and/or broadcast from external broadcast management server via broadcast channel
Relevant information.Broadcast channel may include satellite channel and/or terrestrial channel.Broadcast management server, which can be, to be generated and sent
The broadcast singal and/or broadcast related information generated before the server or reception of broadcast singal and/or broadcast related information
And send it to the server of terminal.Broadcast singal may include TV broadcast singal, radio signals, data broadcasting
Signal etc..Moreover, broadcast singal may further include the broadcast singal combined with TV or radio signals.Broadcast phase
Closing information can also provide via mobile communications network, and in this case, broadcast related information can be by mobile communication mould
Block 112 receives.Broadcast singal can exist in a variety of manners, for example, it can be with the electronics of digital multimedia broadcasting (DMB)
Program guide (EPG), digital video broadcast-handheld (DVB-H) electronic service guidebooks (ESG) etc. form and exist.Broadcast
Receiving module 111 can receive signal broadcast by using various types of broadcast systems.Particularly, broadcasting reception module 111
It can be wide by using such as multimedia broadcasting-ground (DMB-T), digital multimedia broadcasting-satellite (DMB-S), digital video
It broadcasts-holds (DVB-H), forward link media (MediaFLO@) Radio Data System, received terrestrial digital broadcasting integrated service
(ISDB-T) etc. digit broadcasting system receives digital broadcasting.Broadcasting reception module 111, which may be constructed such that, to be adapted to provide for extensively
Broadcast the various broadcast systems and above-mentioned digit broadcasting system of signal.Via the received broadcast singal of broadcasting reception module 111 and/
Or broadcast related information can store in memory 160 (or other types of storage medium).
Mobile communication module 112 sends radio signals to base station (for example, access point, node B etc.), exterior terminal
And at least one of server and/or receive from it radio signal.Such radio signal may include that voice is logical
Talk about signal, video calling signal or according to text and/or Multimedia Message transmission and/or received various types of data.
The Wi-Fi (Wireless Internet Access) of the support mobile terminal 100 of wireless Internet module 113.Wireless Internet module 113 can
To be internally or externally couple to terminal.Wi-Fi (Wireless Internet Access) technology involved in wireless Internet module 113 may include
WLAN (WLAN), Wireless Fidelity (Wi-Fi), WiMAX (Wibro), worldwide interoperability for microwave accesses
(Wimax), high-speed downlink packet access (HSDPA) etc..
Short range communication module 114 is the module for supporting short range communication.Some examples of short-range communication technology include indigo plant
ToothTM, radio frequency identification (RFID), Infrared Data Association (IrDA), ultra wide band (UWB), purple honeybeeTMEtc..
Location information module 115 is the module for checking or obtaining the location information of mobile terminal 100.Location information mould
The typical case of block 115 is global positioning system (GPS) module 115.Location information mould according to current technology, as GPS
Block 115 calculates range information from three or more satellites and correct time information and for the Information application of calculating three
Angle, to according to longitude, latitude and highly accurately calculate three-dimensional current location information.Currently, it is used for calculating position
Method with temporal information is using three satellites and by using the other calculated position of satellite correction and time
The error of information.In addition, as GPS location information module 115 can by Continuous plus current location information in real time come
Calculating speed information.
A/V input unit 120 is for receiving audio or video signal.A/V input unit 120 may include 121 He of camera
Microphone 122, camera 121 is to the static images obtained in video acquisition mode or image capture mode by image capture apparatus
Or the image data of video is handled.Treated, and picture frame may be displayed on display unit 151.It is handled through camera 121
Picture frame afterwards can store in memory 160 (or other storage mediums) or be sent out via wireless communication unit 110
It send, two or more cameras 121 can be provided according to the construction of mobile terminal 100.Microphone 122 can be in telephone relation mould
Sound (audio data) is received via microphone in formula, logging mode, speech recognition mode etc. operational mode, and can be incited somebody to action
Such acoustic processing is audio data.Audio that treated (voice) data can be converted in the case where telephone calling model
For the format output that can be sent to mobile communication base station via mobile communication module 112.Various types can be implemented in microphone 122
Noise eliminate (or inhibit) algorithm with eliminate noise that (or inhibition) generates during sending and receiving audio signal or
Person's interference.
The order that user input unit 130 can be inputted according to user generates key input data to control mobile terminal 100
Various operations.User input unit 130 allows user to input various types of information, and may include keyboard, metal dome,
Touch tablet (for example, the sensitive component of detection due to the variation of resistance, pressure, capacitor etc. caused by being contacted), shakes idler wheel
Bar etc..Particularly, when touch tablet is superimposed upon in the form of layer on display unit 151, touch screen can be formed.
Sensing unit 140 detects the current state of mobile terminal 100, (for example, mobile terminal 100 opens or closes shape
State), the position of mobile terminal 100, user is for the presence or absence of contact (that is, touch input) of mobile terminal 100, mobile terminal
100 orientation, the acceleration or deceleration movement of mobile terminal 100 and direction etc., and generate for controlling mobile terminal 100
The order of operation or signal.For example, sensing unit 140 can sense when mobile terminal 100 is embodied as sliding-type mobile phone
The sliding-type phone is to open or close.In addition, sensing unit 140 be able to detect power supply unit 190 whether provide electric power or
Whether person's interface unit 170 couples with external device (ED).
Interface unit 170 be used as at least one external device (ED) connect with mobile terminal 100 can by interface.For example,
External device (ED) may include wired or wireless headphone port, external power supply (or battery charger) port, wired or nothing
Line data port, memory card port (typical case is general-purpose serial bus USB port), for connecting the dress with identification module
The port set, the port audio input/output (I/O), video i/o port, ear port etc..Identification module can be storage and use
In verifying user using mobile terminal 100 various information and may include subscriber identification module (UIM), client identification module
(SIM), Universal Subscriber identification module (USIM) etc..In addition, the device (hereinafter referred to as " identification device ") with identification module
The form of smart card can be taken, therefore, identification device can connect via port or other attachment devices and mobile terminal 100
It connects.
Interface unit 170 can be used for receiving the input (for example, data information, electric power etc.) from external device (ED) and
By one or more elements that the input received is transferred in mobile terminal 100 or can be used in 100 He of mobile terminal
Data are transmitted between external device (ED).
In addition, when mobile terminal 100 is connect with external base, interface unit 170 may be used as allowing will be electric by it
Power, which is provided from pedestal to the path or may be used as of mobile terminal 100, allows the various command signals inputted from pedestal to pass through it
It is transferred to the path of mobile terminal 100.The various command signals or electric power inputted from pedestal may be used as moving end for identification
Whether end 100 is accurately fitted within the signal on pedestal.
Output unit 150 is configured to provide output signal with vision, audio and/or tactile manner (for example, audio is believed
Number, vision signal, alarm signal, vibration signal etc.).Output unit 150 may include display unit 151, audio output mould
Block 152, alarm unit 153 etc..
Display unit 151 may be displayed on the information handled in mobile terminal 100.For example, when mobile terminal 100 is in electricity
When talking about call mode, display unit 151 can show and converse or other communicate (for example, text messaging, multimedia file
Downloading etc.) relevant user interface (UI) or graphic user interface (GUI).When mobile terminal 100 is in video calling mode
Or when image capture mode, display unit 151 can show captured image and/or received image, show video or figure
Picture and the UI or GUI of correlation function etc..
Meanwhile when display unit 151 and touch tablet in the form of layer it is superposed on one another to form touch screen when, display unit
151 may be used as input unit and output device.Display unit 151 may include liquid crystal display (LCD), thin film transistor (TFT)
In LCD (TFT-LCD), Organic Light Emitting Diode (OLED) display, flexible display, three-dimensional (3D) display etc. at least
It is a kind of.Some in these displays may be constructed such that transparence to allow user to watch from outside, this is properly termed as transparent
Display, typical transparent display can be, for example, TOLED (transparent organic light emitting diode) display etc..According to specific
Desired embodiment, mobile terminal 100 may include two or more display units (or other display devices), for example, moving
Dynamic terminal 100 may include outernal display unit (not shown) and inner display unit (not shown).Touch screen can be used for detecting
Touch input pressure and touch input position and touch input area.
Audio output module 152 can be in call signal reception pattern, call mode, record mould in mobile terminal 100
It is when under the isotypes such as formula, speech recognition mode, broadcast reception mode, wireless communication unit 110 is received or in memory
The audio data transducing audio signal and output stored in 160 is sound.Moreover, audio output module 152 can provide with
The relevant audio output of specific function that mobile terminal 100 executes is (for example, call signal receives sound, message sink sound etc.
Deng).Audio output module 152 may include loudspeaker, buzzer etc..
Alarm unit 153 can provide output notifying event to mobile terminal 100.Typical event can be with
Including calling reception, message sink, key signals input, touch input etc..Other than audio or video output, alarm unit
153 can provide output in different ways with the generation of notification event.For example, alarm unit 153 can be in the form of vibration
Output is provided, when receiving calling, message or some other entrance communications (incoming communication), alarm list
Member 153 can provide tactile output (that is, vibration) to notify to user.By providing such tactile output, even if
When the mobile phone of user is in the pocket of user, user also can recognize that the generation of various events.Alarm unit 153
The output of the generation of notification event can be provided via display unit 151 or audio output module 152.
Memory 160 can store the software program etc. of the processing and control operation that are executed by controller 180, Huo Zheke
Temporarily to store the data that has exported or will export (for example, telephone directory, message, still image, video etc.).And
And memory 160 can store about the vibrations of various modes and audio signal exported when touching and being applied to touch screen
Data.
Memory 160 may include the storage medium of at least one type, and the storage medium includes flash memory, hard disk, more
Media card, card-type memory (for example, SD or DX memory etc.), random access storage device (RAM), static random-access storage
Device (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read only memory
(PROM), magnetic storage, disk, CD etc..Moreover, mobile terminal 100 can execute memory with by network connection
The network storage device of 160 store function cooperates.
The overall operation of the usually control mobile terminal 100 of controller 180.For example, controller 180 execute with voice communication,
The relevant control of data communication, video calling etc. and processing.In addition, controller 180 may include more for reproducing or playing back
The multi-media module 181 of media data, multi-media module 181 can construct in controller 180, or can be structured as and control
Device 180 processed separates.Controller 180 can be with execution pattern identifying processing, by the handwriting input executed on the touchscreen or figure
Piece draws input and is identified as character or image.
Power supply unit 190 receives external power or internal power under the control of controller 180 and provides operation each member
Electric power appropriate needed for part and component.
Various embodiments described herein can be to use the calculating of such as computer software, hardware or any combination thereof
Machine readable medium is implemented.Hardware is implemented, embodiment described herein can be by using application-specific IC
(ASIC), digital signal processor (DSP), digital signal processing device (DSPD), programmable logic device (PLD), scene can
Programming gate array (FPGA), controller, microcontroller, microprocessor, is designed to execute function described herein processor
At least one of electronic unit is implemented, and in some cases, such embodiment can be implemented in controller 180.
For software implementation, the embodiment of such as process or function can with allow to execute the individual of at least one functions or operations
Software module is implemented.Software code can by the software application (or program) write with any programming language appropriate Lai
Implement, software code can store in memory 160 and be executed by controller 180.
So far, mobile terminal 100 is described according to its function.In the following, for the sake of brevity, description is such as folded
Sliding-type in various types of mobile terminals 100 of type, board-type, oscillating-type, slide type mobile terminal 100 etc. is mobile eventually
End 100 is used as example.Therefore, the present invention can be applied to any kind of mobile terminal 100, and it is mobile to be not limited to sliding-type
Terminal 100.
Mobile terminal 100 as shown in Figure 1 may be constructed such that using via frame or grouping send data it is all if any
Line and wireless communication system and satellite-based communication system operate.
Referring now to Fig. 2 description communication system that wherein mobile terminal 100 according to the present invention can operate.
Different air interface and/or physical layer can be used in such communication system.For example, used by communication system
Air interface includes such as frequency division multiple access (FDMA), time division multiple acess (TDMA), CDMA (CDMA) and universal mobile communications system
System (UMTS) (particularly, long term evolution (LTE)), global system for mobile communications (GSM) etc..As non-limiting example, under
The description in face is related to cdma communication system, but such introduction is equally applicable to other types of system.
With reference to Fig. 2, cdma wireless communication system may include multiple mobile terminals 100, multiple base stations (BS) 270, base station
Controller (BSC) 275 and mobile switching centre (MSC) 280.MSC 280 is configured to and Public Switched Telephony Network (PSTN)
290 form interface.MSC 280 is also structured to be formed with the BSC 275 that can be couple to base station 270 via back haul link and connect
Mouthful.Back haul link can be constructed according to any in several known interfaces, the interface include such as E1/T1, ATM,
IP, PPP, frame relay, HDSL, ADSL or xDSL.It will be appreciated that system may include multiple BSC275 as shown in Figure 2.
Each BS 270 can service one or more subregions (or region), by multidirectional antenna or the day of direction specific direction
Each subregion of line covering is radially far from BS 270.Alternatively, each subregion can by two for diversity reception or more
Multiple antennas covering.Each BS 270, which may be constructed such that, supports multiple frequency distribution, and the distribution of each frequency has specific frequency
It composes (for example, 1.25MHz, 5MHz etc.).
What subregion and frequency were distributed, which intersects, can be referred to as CDMA Channel.BS 270 can also be referred to as base station transceiver
System (BTS) or other equivalent terms.In this case, term " base station " can be used for broadly indicating single BSC
275 and at least one BS 270.Base station can also be referred to as " cellular station ".Alternatively, each subregion of specific BS 270 can be claimed
For multiple cellular stations.
As shown in Figure 2, broadcast singal is sent to the mobile terminal operated in system by broadcsting transmitter (BT) 295
100.Broadcasting reception module 111 as shown in Figure 1 is arranged at mobile terminal 100 to receive the broadcast sent by BT295
Signal.In fig. 2 it is shown that several satellites 300, such as global positioning system (GPS) satellite 300 can be used.Satellite 300 is helped
Help at least one of multiple mobile terminals 100 of positioning.
In Fig. 2, multiple satellites 300 are depicted, it is understood that, it is useful to can use any number of satellite acquisition
Location information.It is generally configured to cooperate with satellite 300 to obtain as the location information module 115 of GPS as shown in Figure 1
The location information that must be wanted.It substitutes GPS tracking technique or except GPS tracking technique, can be used can track movement eventually
Other technologies of the position at end 100.In addition, at least one 300 property of can choose of GPS satellite or extraly handle satellite
DMB transmission.
As a typical operation of wireless communication system, BS 270 receives the reverse strand from various mobile terminals 100
Road signal.Mobile terminal 100 usually participates in call, information receiving and transmitting and other types of communication.Certain base station 270 is received each
Reverse link signal is handled in specific BS 270.The data of acquisition are forwarded to relevant BSC 275.BSC is provided
The mobile management function for the resource allocation and the coordination including the soft switching process between BS 270 conversed.BSC275 will also be received
Data be routed to MSC 280, the additional route service for forming interface with PSTN 290 is provided.Similarly, PSTN
290 form interface with MSC 280, and MSC and BSC 275 form interface, and BSC 275 controls BS 270 correspondingly with will be positive
Link signal is sent to mobile terminal 100.
The mobile communication module 112 of wireless communication unit 110 is mobile based on the access built in mobile terminal in mobile terminal
The necessary data (including customer identification information and authentication information) of communication network (such as 2G/3G/4G mobile communications network) accesses
Mobile communications network is that the business such as the web page browsing of mobile terminal user, network multimedia broadcasting transmit mobile data (packet
Include the mobile data of uplink and the mobile data of downlink).
The related protocol function reality that the wireless Internet module 113 of wireless communication unit 110 passes through operation hotspot
The function of existing hotspot, hotspot are supported multiple mobile terminal (any mobile terminal except mobile terminal) accesses, are led to
The webpage that the mobile communication crossed between multiplexing mobile communication module 112 and mobile communications network is connected as mobile terminal user is clear
It lookes at, (movement of mobile data and downlink including uplink is logical for the business transmission mobile data such as network multimedia plays
Letter data), since mobile terminal is substantially the mobile communication connection transmission movement being multiplexed between mobile terminal and communication network
Communication data, therefore the flow of the mobile data of mobile terminal consumption is included in movement by the charging entity of communication network side
The post and telecommunication tariff of terminal, to consume the data flow for the mobile data for including in the post and telecommunication tariff that mobile terminal signing uses
Amount.
Based on above-mentioned mobile terminal hardware configuration and communication system, the following specific embodiment of the present invention is proposed.
The heat sink material that the electronic products such as mobile phone and plate use at present is mainly graphite, copper foil etc.；And graphite and copper foil
It can only be little for the conduction of heat of the superchips such as CPU in z-direction in the horizontal direction rapidly thermal diffusion.At present
Heat Conduction Material using Z-direction is mostly thermally conductive gel, heat conductive silica gel, organic phase change material etc..
In addition, the main euthermic chip on smart electronics product (such as mobile phone) is exactly CPU at present, CPU is generally placed upon metal
Inside screening cover, CPU fever needs to be by heat-conducting interface material (Thermal Interface Material) the heat of CPU
In amount conduction to screening cover or on front housing center, then scatter again, in case heat is concentrated.Specifically, main at present to lead
Hot path is: the heat that CPU is generated is conducted to heat-conducting interface material (heat conductive silica gel or thermally conductive gel), then passes through thermally-conductive interface material
Material conduction is to screening cover, the heat away that will be generated.
But the thermal conductivity of current interface Heat Conduction Material thermally conductive gel is low, heat conductive silica gel thermal contact resistance is big.Namely
It says, these materials all have one disadvantage in that, that is, heat-conducting effect is bad.
The thermal conductivity of metal phase change material is 5-10 times of these existing Heat Conduction Materials, therefore, if by metal phase change
Change material and be used as interface Heat Conduction Material, then can greatly promote heat-conducting effect.However, phase change materials have thermal conductivity and conduction
Property, that is to say, that it also can be conductive while thermally conductive, so there is leakage after phase transformation, this may lead short circuit.Therefore
How by some structures and technology mode assembly method come sealing metal phase-transition material, be current urgent problem to be solved.
Embodiment one
The present invention applies example and proposes a kind of mobile terminal, and a hardware structural diagram of mobile terminal is as shown in Figure 1.
In the present embodiment, as shown in figure 3, the mobile terminal includes:
PCB 31；
Chip 32 is fixed on the PCB 31, and the chip 32 can generate heat at work；The chip 32
Pin is coated with the first insulating element 33；
Conducting-heat elements 34 surround the chip, and contact with the chip；The conducting-heat elements are phase change materials；
Shielding case 35, it is fixed with the PCB 31, and surround the conducting-heat elements 34 completely, and with the conducting-heat elements 34
Contact.
Wherein, after the shielding case 35 surrounds the conducting-heat elements 34, the conducting-heat elements 34 be in the chip 32,
PCB 31 and shielding case 35 are formed by sealing space.
Specifically, as shown in figure 3, the lower surface of the conducting-heat elements 34 is contacted with the chip 32, the heat-conducting part
The upper surface of part 34 is contacted with the shielding case 35.
Here, when practical application, in order to increase radiating rate, the conducting-heat elements 34 can be with the chip 32 and shielding
Cover 35 completely attaches to.That is, as shown in figure 3, the lower surface of the conducting-heat elements 34 and the chip 32 full contact, institute
The upper surface and the shielding case 35 for stating conducting-heat elements 34 completely attach to.
Mobile terminal provided in an embodiment of the present invention, the pin of the chip 32 is coated with the first insulating element 33, and leads
Thermal part 34 surrounds the chip 32, and after being covered with shielding case 35, the conducting-heat elements 34 are placed exactly in the chip 32, PCB
31 and shielding case 35 be formed by sealing space.Heat is generated when the chip 32 work, heat-transfer path is: chip 32 produces
Raw heat is conducted to conducting-heat elements 34, then, then passes through the conduction of conducting-heat elements 34 to shielding case 35.In heat conductive process
In, it is placed in the space of sealing just because of conducting-heat elements 34, and the pin of chip 32 is coated with the first insulating element 33, institute
When so that the conducting-heat elements 34 is generated phase transformation to generate heat when the chip 32 works, the conducting-heat elements 34 will not be generated
Leakage problem, to also avoid the problem of revealing brought short circuit.
Wherein, when practical application, by way of patch, the chip 32 is fixed on the PCB 31.Here, most often
Patch mode is: using soldering tin bar (silk) etc., the chip 32 being welded on the PCB 31.
Correspondingly, the shielding case 35 can also be fixed on the PCB 31 by way of patch.
When practical application, the chip 32 generally can be CPU etc..
First insulating element 33 can be insulating cement, such as red glue or green oil etc..
When the conducting-heat elements 34 do not generate phase transformation because of the heat that chip 32 generates, the conducting-heat elements 34 are preferably in
It is more specifically now the solid-state of bulk form for solid-state.
When practical application, the conducting-heat elements 34 can be some gold that other chemical elements are added on the basis of tin (Sn)
Belong to phase-change material.
Conducting-heat elements 34 are known as the heat-conducting interface material of mobile terminal.
The shielding case 35, for shielding the electric signal for generating and the chip 32 being interfered to work.
When practical application, the material of the shielding case 35 can be high thermal conductivity materials (such as: than stainless steel (at present often
Shielding cover material) material etc. that doubles of thermal conductivity), such as: foreign white copper etc. dissipates in this way, can effectively increase heat
Open speed.
Graphite is also provided on the shielding case 35, the heat that the chip 32 generates when working passes through described thermally conductive
Component 34 is conducted to graphite, conducts the heat to shielding case 35 by the graphite, and scatter, in this way, being further able to
Conduct heat promptly to the shielding case 35, thus by the shielding case 35 quickly by heat away.
Mobile terminal provided in an embodiment of the present invention, chip 32 are fixed on PCB 31, and the chip 32 at work can
Enough generate heat；The pin of the chip 32 is coated with the first insulating element 33；Conducting-heat elements 34 surround the chip 32, and with
The chip 32 contacts；The conducting-heat elements are phase change materials；Shielding case 35 and the PCB 31 are fixed, and surround completely
The conducting-heat elements 34, and contacted with the conducting-heat elements 34.The pin of the chip 32 is coated with the first insulating element 33, and
Conducting-heat elements 34 surround the chip 32, and after being covered with shielding case 35, the conducting-heat elements are placed exactly in the chip 32, PCB
31 and shielding case 35 be formed by sealing space, in heat conductive process, be placed on sealing just because of conducting-heat elements 34
Space in, and the pin of chip 32 is coated with the first insulating element 33, so generating heat when the chip 32 work makes
When the conducting-heat elements 34 generate phase transformation, the conducting-heat elements 34 will not generate leakage problem, to also avoid leakage institute
The problem of bring short circuit.
In addition, being additionally provided with graphite on the shielding case 35, the heat that the chip 32 generates when working is led by described
Thermal part 34 is conducted to graphite, conducts the heat to shielding case 35 by the graphite, and scatter, in this way, being further able to
Conduct heat promptly to the shielding case 35, thus by the shielding case 35 quickly by heat away.
Embodiment two
The present invention applies example and proposes a kind of mobile terminal, and a hardware structural diagram of mobile terminal is as shown in Figure 1.
In the present embodiment, as shown in figure 3, the mobile terminal includes:
PCB 31；
Chip 32 is fixed on the PCB 31, and the chip 32 can generate heat at work；The chip 32
Pin is coated with the first insulating element 33；
Conducting-heat elements 34 surround the chip, and contact with the chip；The conducting-heat elements are phase change materials；
Shielding case 35, it is fixed with the PCB 31, and surround the conducting-heat elements 34 completely, and with the conducting-heat elements 34
Contact.
Wherein, after the shielding case 35 surrounds the conducting-heat elements 34, the conducting-heat elements 34 be in the chip 32,
PCB 31 and shielding case 35 are formed by sealing space.
Specifically, as shown in figure 3, the lower surface of the conducting-heat elements 34 is contacted with the chip 32, the heat-conducting part
The upper surface of part 34 is contacted with the shielding case 35.
Here, when practical application, in order to increase radiating rate, the conducting-heat elements 34 can be with the chip 32 and shielding
Cover 35 completely attaches to.That is, as shown in figure 3, the lower surface of the conducting-heat elements 34 and the chip 32 full contact, institute
The upper surface and the shielding case 35 for stating conducting-heat elements 34 completely attach to.
Mobile terminal provided in an embodiment of the present invention, the pin of the chip 32 is coated with the first insulating element 33, and leads
Thermal part 34 surrounds the chip 32, and after being covered with shielding case 35, the conducting-heat elements 34 are placed exactly in the chip 32, PCB
31 and shielding case 35 be formed by sealing space.Heat is generated when the chip 32 work, heat-transfer path is: chip 32 produces
Raw heat is conducted to conducting-heat elements 34, then, then passes through the conduction of conducting-heat elements 34 to shielding case 35.In heat conductive process
In, it is placed in the space of sealing just because of conducting-heat elements 34, and the pin of chip 32 is coated with the first insulating element 33, institute
When so that the conducting-heat elements 34 is generated phase transformation to generate heat when the chip 32 works, the conducting-heat elements 34 will not be generated
Leakage problem, to also avoid the problem of revealing brought short circuit.
Wherein, when practical application, by way of patch, the chip 32 is fixed on the PCB 31.Here, most often
Patch mode is: using soldering tin bar (silk) etc., the chip 32 being welded on the PCB 31.
Correspondingly, the shielding case 35 can also be fixed on the PCB 31 by way of patch.
When practical application, the chip 32 generally can be CPU etc..
First insulating element can be insulating cement, such as red glue or green oil etc..
When the conducting-heat elements 34 do not generate phase transformation because of the heat that chip 32 generates, the conducting-heat elements 34 are preferably in
It is more specifically now the solid-state of bulk form for solid-state.
When practical application, the conducting-heat elements 34 can be some gold that other chemical elements are added on the basis of tin (Sn)
Belong to phase-change material.
Conducting-heat elements 34 are known as the heat-conducting interface material of mobile terminal.
The shielding case 35, for shielding the electric signal for generating and the chip 32 being interfered to work.
When practical application, the material of the shielding case 35 can be high thermal conductivity materials (such as: than stainless steel (at present often
Shielding cover material) material etc. that doubles of thermal conductivity), such as: foreign white copper etc. dissipates in this way, can effectively increase heat
Open speed.
In embodiments of the present invention, the conducting-heat elements 34 need to surround the chip 32, and contact with the chip 32,
In order to realize this structure, the characteristic of 34 phase transformation of conducting-heat elements can use to assemble.
Based on this, in the present embodiment, as shown in figure 3, through-hole is provided on the shielding case 35, the conducting-heat elements 34
It is injected in the first space that the shielding case 35 is formed with the chip 32 when in liquid by the through-hole, to be led when described
When thermal part 34 is in solid-state, contacted with the chip 32 and shielding case 35；
When the conducting-heat elements 34 inject in first space, it is provided with the second seal member 36 in the through-hole,
With the leakage for stopping the conducting-heat elements to generate by phase transformation.
Here, when practical application, the through-hole can be formed on the shielding case 35 by way of punching press.Through-hole
Diameter can according to need to be arranged, for example be set as 10mm etc..
Second seal member can be the seal member of insulation.It specifically, can be sealant (with sealing surface shape
And deform, it is not easy to trickle, there is the sealing material of certain caking property.Sealant is for filling configuration gap, being made with playing sealing
Adhesive.Have the effects that anti-leak, waterproof, vibration proof and sound insulation, heat-insulated).
When practical application, for the uniformity for contacting the conducting-heat elements 34 with the chip 32 and shielding case 35, institute
State the center position that through-hole can be located at the corresponding chip 32.
In addition, the full contact in order to realize the conducting-heat elements 34 and the chip 32 and shielding case 35, needs liquid
The conducting-heat elements of state fill first space.
Graphite is also provided on the shielding case 35, the heat that the chip 32 generates when working passes through described thermally conductive
Component 34 is conducted to graphite, conducts the heat to shielding case 35 by the graphite, and scatter, in this way, being further able to
Conduct heat promptly to the shielding case 35, thus by the shielding case 35 quickly by heat away.
Mobile terminal provided in an embodiment of the present invention, chip 32 are fixed on PCB 31, and the chip 32 at work can
Enough generate heat；The pin of the chip 32 is coated with the first insulating element 33；Conducting-heat elements 34 surround the chip 32, and with
The chip 32 contacts；The conducting-heat elements are phase change materials；Shielding case 35 and the PCB 31 are fixed, and surround completely
The conducting-heat elements 34, and contacted with the conducting-heat elements 34.The pin of the chip 32 is coated with the first insulating element 33, and
Conducting-heat elements 34 surround the chip 32, after being covered with shielding case 35, the conducting-heat elements 34 be placed exactly in the chip 32,
PCB31 and shielding case 35 are formed by sealing space, in heat conductive process, are placed on just because of conducting-heat elements 34 close
In the space of envelope, and the pin of chip 32 is coated with the first insulating element 33, so generating heat when the chip 32 work
When the conducting-heat elements 34 being made to generate phase transformation, the conducting-heat elements 34 will not generate leakage problem, to also avoid to reveal
The problem of brought short circuit.
In addition, the through-hole can be located at the center position of the corresponding chip 32, when the conducting-heat elements of liquid
34 by the through-hole when being injected into the first space that the shielding case 35 is formed with the chip 32, can be uniformly injected into
Into first space, to ensure that the uniformity that the conducting-heat elements 34 are contacted with the chip 32 and shielding case 35.
In addition to this, graphite is additionally provided on the shielding case 35, the heat that the chip 32 generates when working passes through institute
The conduction of conducting-heat elements 34 is stated to graphite, conducts the heat to shielding case 35 by the graphite, and scatter, in this way, into one
Step can be such that heat promptly conducts to the shielding case 35, thus by the shielding case 35 quickly by heat away.
Embodiment three
Based on the mobile terminal that the embodiment of the present invention one provides, the present embodiment provides a kind of encapsulating method of conducting-heat elements,
As shown in figure 4, method includes the following steps:
Step 401: the chip on PCB being coated and fixed using the first insulating element；
Here, first insulating element can be insulating cement, such as red glue or green oil etc..
When practical application, the chip generally can be CPU etc..
The chip can generate heat at work.
Before executing this step, the method also includes:
It is by way of patch, the chip is fixed on the pcb.
Wherein, when practical application, most common patch mode is: using soldering tin bar (silk), the chip is welded on institute
It states on PCB.
Step 402: conducting-heat elements being surrounded into the chip, and are contacted with the chip；
Here, the conducting-heat elements are phase change materials.It specifically can be and some add other on the basis of tin (Sn)
The phase change materials of chemical element.
When the conducting-heat elements do not generate phase transformation because of the heat that the chip generates, the conducting-heat elements are preferably presented
It is more specifically the solid-state of bulk form for solid-state.
The conducting-heat elements are known as the heat-conducting interface material of mobile terminal.
Step 403: it is shielding case is fixed on the pcb, and surround the conducting-heat elements completely, and with the heat-conducting part
Part contact.
Wherein, after the shielding case surrounds the conducting-heat elements, the conducting-heat elements are in the chip, PCB and shielding
Cover is formed by sealing space.
Specifically, the lower surface of the conducting-heat elements is contacted with the chip, the upper surface of the conducting-heat elements with it is described
Shielding case contact.
It here,, can be complete by conducting-heat elements and the chip and shielding case in order to increase radiating rate when practical application
Contact.That is, the lower surface of the conducting-heat elements and the chip completely attach to, the upper surface of the conducting-heat elements and institute
State shielding case full contact.
It can be fixed on the pcb by the shielding case by way of patch.
The shielding case is used to shield the electric signal for generating and interfering the chip operation.
When practical application, the material of the shielding case can be high thermal conductivity materials (such as: it is (more common at present than stainless steel
Shielding cover material) material etc. that doubles of thermal conductivity), such as: foreign white copper etc., in this way, can effectively increase heat away
Speed.
Before executing this step, this method can also include:
Graphite is set on the shielding case, conducts the heat generated when the chip operation by the conducting-heat elements
It to graphite, conducts the heat to the shielding case by the graphite, and scatters.
The chip on PCB is coated and fixed using the first insulating element for scheme provided in an embodiment of the present invention；By heat-conducting part
Part surrounds the chip, and contacts with the chip；The chip can generate heat at work；The conducting-heat elements are gold
Belong to phase-change material；Shielding case is fixed on the pcb, and the conducting-heat elements are surrounded completely, and are connect with the conducting-heat elements
Touching.The pin of the chip is coated with the first insulating element, and conducting-heat elements surround the chip, after being covered with shielding case, institute
It states conducting-heat elements and is placed exactly in the chip, PCB and shielding case and be formed by sealing space, in heat conductive process, just
It is since conducting-heat elements are placed in the space of sealing, and the pin of chip is coated with the first insulating element, so working as the core
When generating heat when piece works makes the conducting-heat elements generate phase transformation, the conducting-heat elements will not generate leakage problem, thus
Avoid the problem of revealing brought short circuit.
In addition, be additionally provided with graphite on the shielding case, the heat that when chip operation generates passes through the heat-conducting part
Part is conducted to graphite, conducts the heat to shielding case by the graphite, and scatter, in this way, being further able to make heat
It promptly conducts to the shielding case, thus by the shielding case quickly by heat away.
Example IV
Based on mobile terminal provided by Embodiment 2 of the present invention, the present embodiment provides a kind of encapsulating method of conducting-heat elements,
As shown in figure 5, method includes the following steps:
Step 501: the chip on PCB being coated and fixed using the first insulating element；
Here, first insulating element can be insulating cement, such as red glue or green oil etc..
When practical application, the chip generally can be CPU etc..
The chip can generate heat at work.
Before executing this step, the method also includes:
It is by way of patch, the chip is fixed on the pcb.
Wherein, when practical application, most common patch mode is: using soldering tin bar (silk), the chip is welded on institute
It states on PCB.
Step 502: shielding case is fixed on the pcb；
It can be fixed on the pcb by the shielding case by way of patch.
The shielding case is used to shield the electric signal for generating and interfering the chip operation.
When practical application, the material of the shielding case can be high thermal conductivity materials (such as: it is (more common at present than stainless steel
Shielding cover material) material etc. that doubles of thermal conductivity), such as: foreign white copper etc., in this way, can effectively increase heat away
Speed.
Before executing this step, this method can also include:
Graphite is set on the shielding case, conducts the heat generated when the chip operation by the conducting-heat elements
It to graphite, conducts the heat to the shielding case by the graphite, and scatters.
Step 503: the conducting-heat elements of liquid are injected into the shielding case and institute by the through-hole on the shielding case
In the first space for stating chip formation, contacted with the chip and shielding case when the conducting-heat elements are in solid-state；
Here, in embodiments of the present invention, the conducting-heat elements need to surround the chip, and contact with the chip,
In order to realize this structure, the characteristic of the conducting-heat elements phase transformation can use to assemble.
When practical application, the conducting-heat elements first can be heated to phase transition temperature, become liquid, then by the institute of liquid
Conducting-heat elements are stated to inject in first space by the through-hole.
Wherein, in one embodiment, this method can also include:
Through-hole is formed on the shielding case by way of punching press.
Here, the diameter of through-hole can according to need to be arranged, for example be set as 10mm etc..
When practical application, for the uniformity for contacting the conducting-heat elements with the chip and shielding case, the through-hole
The center position of the corresponding chip can be located at.
In addition, the full contact in order to realize the conducting-heat elements and the chip and shielding case, needs leading liquid
Thermal part fills first space.
First space refers to that the shielding case and the chip are formed by a cavity body.
The conducting-heat elements are phase change materials.Specifically can be it is some added on the basis of tin (Sn) other chemistry member
The phase change materials of element.
When the conducting-heat elements do not generate phase transformation because of the heat that the chip generates, the conducting-heat elements are preferably presented
It is more specifically the solid-state of bulk form for solid-state.
The conducting-heat elements are known as the heat-conducting interface material of mobile terminal.
Step 504: being sealed the through-hole using the second seal member, to stop the conducting-heat elements to generate because of phase transformation
Leakage.
Here, second seal member can be the seal member of insulation.It specifically, can be sealant (with sealing
Face shape and deform, be not easy to trickle, there is the sealing material of certain caking property.Sealant is for filling configuration gap, to play
The adhesive of sealing function.Have the effects that anti-leak, waterproof, vibration proof and sound insulation, heat-insulated).
After the completion of step 504, the shielding case surrounds the conducting-heat elements completely, and contacts with the conducting-heat elements.
Wherein, after the shielding case surrounds the conducting-heat elements, the conducting-heat elements are in the chip, PCB and shielding
Cover is formed by sealing space.
Specifically, the lower surface of the conducting-heat elements is contacted with the chip, the upper surface of the conducting-heat elements with it is described
Shielding case contact.
It here,, can be complete by conducting-heat elements and the chip and shielding case in order to increase radiating rate when practical application
Contact.That is, the lower surface of the conducting-heat elements and the chip completely attach to, the upper surface of the conducting-heat elements and institute
State shielding case full contact.
The chip on PCB is coated and fixed using the first insulating element for scheme provided in an embodiment of the present invention；By heat-conducting part
Part surrounds the chip, and contacts with the chip；The chip can generate heat at work；The conducting-heat elements are gold
Belong to phase-change material；Shielding case is fixed on the pcb, and the conducting-heat elements are surrounded completely, and are connect with the conducting-heat elements
Touching.The pin of the chip is coated with the first insulating element, and conducting-heat elements surround the chip, after being covered with shielding case, institute
It states conducting-heat elements and is placed exactly in the chip, PCB and shielding case and be formed by sealing space, in heat conductive process, just
It is since conducting-heat elements are placed in the space of sealing, and the pin of chip is coated with the first insulating element, so working as the core
When generating heat when piece works makes the conducting-heat elements generate phase transformation, the conducting-heat elements will not generate leakage problem, thus
Avoid the problem of revealing brought short circuit.
In addition, the through-hole can be located at the center position of the corresponding chip, when the conducting-heat elements of liquid are logical
When crossing the through-hole and being injected into the first space that the shielding case and the chip are formed, described the can be evenly injected into
In one space, to ensure that the uniformity that the conducting-heat elements are contacted with the chip and shielding case.
In addition to this, it is additionally provided with graphite on the shielding case, the heat that when chip operation generates is led by described
Thermal part is conducted to graphite, conducts the heat to shielding case by the graphite, and scatter, in this way, being further able to make
Heat is promptly conducted to the shielding case, thus by the shielding case quickly by heat away.
It should be understood that " one embodiment " or " embodiment " that specification is mentioned in the whole text mean it is related with embodiment
A particular feature, structure, or characteristic is included at least one embodiment of the present invention.Therefore, occur everywhere in the whole instruction
" in one embodiment " or " in one embodiment " not necessarily refer to identical embodiment.In addition, these specific features, knot
Structure or characteristic can combine in any suitable manner in one or more embodiments.It should be understood that in various implementations of the invention
In example, magnitude of the sequence numbers of the above procedures are not meant that the order of the execution order, the execution sequence Ying Yiqi function of each process
It can determine that the implementation process of the embodiments of the invention shall not be constituted with any limitation with internal logic.The embodiments of the present invention
Serial number is for illustration only, does not represent the advantages or disadvantages of the embodiments.
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or the device that include a series of elements not only include those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or device institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
There is also other identical elements in the process, method of element, article or device.
Those of ordinary skill in the art will appreciate that: realize that all or part of the steps of above method embodiment can pass through
The relevant hardware of program instruction is completed, and program above-mentioned can store in computer-readable storage medium, which exists
When execution, step including the steps of the foregoing method embodiments is executed；And storage medium above-mentioned includes: movable storage device, read-only deposits
The various media that can store program code such as reservoir (Read Only Memory, ROM), magnetic or disk.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (9)
1. a kind of encapsulating method of conducting-heat elements, which is characterized in that the described method includes:
The chip on printing board PCB is coated and fixed using the first insulating element；
Conducting-heat elements are surrounded into the chip, and are contacted with the chip；The chip can generate heat at work；It is described
Conducting-heat elements are phase change materials；
Shielding case is fixed on the pcb, and the conducting-heat elements are surrounded completely, and are contacted with the conducting-heat elements.
The conducting-heat elements and chip and shielding case completely attach to.
2. the method according to claim 1, wherein when assembling the conducting-heat elements, which comprises
The conducting-heat elements of liquid are injected what the shielding case was formed with the chip by the through-hole on the shielding case
In first space, contacted with the chip and shielding case when the conducting-heat elements are in solid-state；
The through-hole is sealed using the second seal member, with the leakage for stopping the conducting-heat elements to generate by phase transformation.
3. according to the method described in claim 2, it is characterized in that, the method also includes:
Through-hole is formed on the shielding case by way of punching press.
4. according to the method described in claim 3, it is characterized in that, the through-hole is located at the center of the corresponding chip
Place.
5. according to the method described in claim 2, it is characterized in that, first insulating element is insulating cement；
And/or
Second seal member is the seal member of insulation.
6. the method according to claim 1, wherein the material of the shielding case is foreign white copper.
7. method according to any one of claims 1 to 6, which is characterized in that described that shielding case is fixed on the PCB
On, and the conducting-heat elements are surrounded completely, and before contacting with the conducting-heat elements, the method also includes:
Graphite is set on the shielding case, conducts the heat generated when the chip operation to stone by the conducting-heat elements
Ink conducts the heat to the shielding case by the graphite, and scatters.
8. method according to any one of claims 1 to 6, which is characterized in that described that shielding case is fixed on the PCB
On, are as follows:
It is by way of patch that the shielding case is fixed on the pcb.
9. method according to any one of claims 1 to 6, which is characterized in that the method also includes:
It is by way of patch, the chip is fixed on the pcb.
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| CN105792620B (en) * | 2016-04-29 | 2019-06-18 | Oppo广东移动通信有限公司 | Chip, circuit board and mobile terminal |
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| CN101557697A (en) * | 2008-04-10 | 2009-10-14 | 元瑞科技股份有限公司 | Heat radiation die set and radiation system applying phase change metal thermal interface material |
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