CN110430692A - A kind of mainboard paster technique of high efficiency and heat radiation - Google Patents
A kind of mainboard paster technique of high efficiency and heat radiation Download PDFInfo
- Publication number
- CN110430692A CN110430692A CN201910728090.9A CN201910728090A CN110430692A CN 110430692 A CN110430692 A CN 110430692A CN 201910728090 A CN201910728090 A CN 201910728090A CN 110430692 A CN110430692 A CN 110430692A
- Authority
- CN
- China
- Prior art keywords
- closing cap
- mainboard
- hole
- injecting glue
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Abstract
The present invention provides a kind of mainboard paster techniques of high efficiency and heat radiation, by the way that closing cap to be fitted tightly on mainboard by viscose glue；Import air-flow to the inside of closing cap along hole for injecting glue, and detect closing cap and mainboard bonding position whether gas leakage；If air tight, along hole for injecting glue to the inside filling heat-conductive material of closing cap；High temperature paster is covered and is fitted closely in hole for injecting glue；Because the size of closing cap be it is controllable, closing cap can be sticked in the designated position on mainboard in this way, achieve the effect that fixed point heat dissipation.
Description
Technical field
The present invention relates to chip production technical fields, in particular to are a kind of mainboard paster technique of high efficiency and heat radiation.
Background technique
Our present mobile phones enter after the intelligent epoch brought intelligent element under high-speed cruising the problem of persistent fever
It annoyings mobile phone thermal design always and to user's bring inconvenience, will especially enter the 5G epoch, intelligent element will
It doubles to heat up during data high-speed processing, fever meeting is so that user experience declines and the decline of hardware performance in this way.
To smear silica gel on pyrotoxin device in existing frequently-used method, on heat transfer to screening cover then mobile phone
Heat dissipation film or other Heat Conduction Material that large area is sticked on shell is connected thermally conductive with screening cover, and increase heat dissipation area allows
Heat dissipates faster；But general heating source is all for CPU, the mainboards patch material such as PMU carries out between multiple Heat Conduction Material
Heat transference efficiency can be reduced greatly；In addition thermally conductive area is also because be only limitted to be greatly reduced right above device thermally conductive
Efficiency；So want mobile phone to will appear local pyrexia when CPU height operates or charges especially severe, and temperature elsewhere
But the phenomenon that increasing very little, causes thermal energy that cannot rapidly scatter.
Summary of the invention
Present invention seek to address that mainboard local temperature excessively high the technical issues of can not effectively radiating, provide a kind of high efficiency and heat radiation
Mainboard paster technique.
The present invention provides a kind of mainboard paster technique of high efficiency and heat radiation in order to solve the technical problem, comprising:
Closing cap is fitted tightly on mainboard by viscose glue upper cover by viscose glue；
Airtight detection, the closing cap are equipped with hole for injecting glue, import gas to the inside of the closing cap along the hole for injecting glue
Stream, and detect the closing cap and the mainboard bonding position whether gas leakage；
Material injection, if air tight, along the hole for injecting glue to the inside filling heat-conductive material of the closing cap；
Molding sealing, high temperature paster is covered and is fitted closely in hole for injecting glue.
Further, the bonding position of the detection closing cap and the mainboard whether gas leakage the step of include:
The bonding position tighten it is closely connected be covered with thin l Water Paper, detect the air parcel whether thin l Water Paper protrusion occurs.
Further, the step of inside filling heat-conductive material to the closing cap along the hole for injecting glue includes:
The closing cap of the injecting glue hole site is equipped with funnelform outreach annulus, and the Heat Conduction Material passes through described
Outreach annulus is directed into the inside of the closing cap.
Further, the step of viscose glue upper cover includes:
Closing cap is fitted tightly on mainboard by black glue.
Further, the material inject the step of include:
Along the hole for injecting glue to the inside filling heat-conductive non-conducting material of the closing cap, the thermally conductive non-conducting material packet
Include silica gel.
The present invention provides the mainboard paster techniques of high efficiency and heat radiation, have the advantages that
By the way that closing cap is fitted tightly on mainboard by viscose glue；Air-flow is imported to the inside of closing cap along hole for injecting glue,
And detect closing cap and mainboard bonding position whether gas leakage；If air tight, led along hole for injecting glue to the injection of the inside of closing cap
Hot material；High temperature paster is covered and is fitted closely in hole for injecting glue；Because the size of closing cap be it is controllable, in this way can be
Designated position on mainboard sticks closing cap, achievees the effect that fixed point heat dissipation.
Detailed description of the invention
Fig. 1 is the flow diagram of mainboard paster technique one embodiment of high efficiency and heat radiation of the present invention；
Fig. 2 is the closing cap of the mainboard paster technique of high efficiency and heat radiation of the present invention and the structural schematic diagram of mainboard.
The embodiments will be further described with reference to the accompanying drawings for realization, functional characteristics and advantage for the purpose of the present invention.
Specific embodiment
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear
Chu is fully described by, it is clear that described embodiment is only a part of the embodiments of the present invention, rather than whole implementation
Example.Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts
Every other embodiment, shall fall within the protection scope of the present invention.
With reference to attached drawing 1 and attached drawing 2, respectively the technique stream of the mainboard paster technique of the high efficiency and heat radiation of one embodiment of the invention
The closing cap of the mainboard paster technique of Cheng Tu and high efficiency and heat radiation and the structural schematic diagram of mainboard.
The present invention proposes a kind of mainboard paster technique of high efficiency and heat radiation, comprising:
Closing cap 2 is fitted tightly on mainboard 1 by S1 viscose glue upper cover by viscose glue；
The airtight detection of S2, closing cap 2 are equipped with hole for injecting glue 5, import air-flow to the inside of closing cap 2 along hole for injecting glue 5, and examine
Survey closing cap 2 and mainboard 1 bonding position whether gas leakage；
S3 material injection, if air tight, along hole for injecting glue 5 to the inside filling heat-conductive material of closing cap 2；
S4 molding sealing, high temperature paster 4 is covered and is fitted closely in hole for injecting glue 5.
Specifically, the viscose glue upper cover of above-mentioned process S1, viscose glue is coated on closing cap 2 and the bonding position of mainboard 1 (is sealed
Close the edge placement of lid 2), viscose glue is specifically coated on 2 edge of closing cap, but is less against edge, can propose closing cap 2 in this way
The degree of adhesion of transverse and longitudinal, such as mobile phone are certain to laterally be held by user/longitudinally hold, by the above-mentioned means, can prevent from closing
Lid 2 is fallen off by external force (such as the whipping of closing cap 2 by strength).
In the specific implementation, the size of closing cap 2 is adjustable, and such closing cap 2 can be mounted on mainboard 1
The local pyrexia of mainboard 1 can be effectively treated in designated position in this way.
In one embodiment, the bonding position of detection closing cap 2 and mainboard 1 whether gas leakage the step of include:
S201, bonding position tighten it is closely connected be covered with thin l Water Paper 3, detect thin l Water Paper 3 whether occur protrusion air parcel.
Specifically, in airtight detection-phase, worker sticks thin wet in the outer of closing cap 2 and 1 bond locations of mainboard
Paper 3, it will be understood that when closing cap 2 is there are when gas leakage, thin l Water Paper 3 will receive the power of the blowout of the air-flow in closing cap 2 to convex
It rises, when worker sees that thin l Water Paper 3 has the air parcel of protrusion, both it can be assumed that the closing cap 2 is gas leakage.
After the airtight detection of worker, thin l Water Paper 3 is taken away.
In one embodiment, include: along the step of inside filling heat-conductive material of the hole for injecting glue 5 to closing cap 2
The closing cap 2 of 5 position of hole for injecting glue is equipped with funnelform outreach annulus, and Heat Conduction Material is directed by outreach annulus
The inside of closing cap 2.
In one embodiment, the step of viscose glue upper cover includes:
Closing cap 2 is fitted tightly on mainboard 1 by black glue.
In one embodiment, material inject the step of include:
Along hole for injecting glue 5 to the inside filling heat-conductive non-conducting material of closing cap 2, thermally conductive non-conducting material includes silica gel.
In conclusion by the way that closing cap 2 is fitted tightly on mainboard 1 by viscose glue；Along hole for injecting glue 5 to closing cap 2
Inside imports air-flow, and detect closing cap 2 and mainboard 1 bonding position whether gas leakage；If air tight, along hole for injecting glue 5 to envelope
Close the inside filling heat-conductive material of lid 2；High temperature paster 4 is covered and is fitted closely in hole for injecting glue 5；Because of the size of closing cap 2
Be it is controllable, closing cap 2 can be sticked in the designated position on mainboard 1 in this way, achieve the effect that fixed point heat dissipation.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (5)
1. a kind of mainboard paster technique of high efficiency and heat radiation characterized by comprising
Closing cap is fitted tightly on mainboard by viscose glue upper cover by viscose glue；
Airtight detection, the closing cap are equipped with hole for injecting glue, import air-flow to the inside of the closing cap along the hole for injecting glue, and
Detect the closing cap and the mainboard bonding position whether gas leakage；
Material injection, if air tight, along the hole for injecting glue to the inside filling heat-conductive material of the closing cap；
Molding sealing, high temperature paster is covered and is fitted closely in hole for injecting glue.
2. the mainboard paster technique of high efficiency and heat radiation according to claim 1, which is characterized in that the detection closing cap
With the bonding position of the mainboard whether gas leakage the step of include:
The bonding position tighten it is closely connected be covered with thin l Water Paper, detect the air parcel whether thin l Water Paper protrusion occurs.
3. the mainboard paster technique of high efficiency and heat radiation according to claim 1, which is characterized in that it is described along the hole for injecting glue to
The step of inside filling heat-conductive material of the closing cap includes:
The closing cap of the injecting glue hole site is equipped with funnelform outreach annulus, and the Heat Conduction Material passes through the outreach
Annulus is directed into the inside of the closing cap.
4. the mainboard paster technique of high efficiency and heat radiation according to claim 1, which is characterized in that the step of the viscose glue upper cover
Include:
Closing cap is fitted tightly on mainboard by black glue.
5. the mainboard paster technique of high efficiency and heat radiation according to claim 1, which is characterized in that the step of material injects
Include:
Along the hole for injecting glue to the inside filling heat-conductive non-conducting material of the closing cap, the thermally conductive non-conducting material includes silicon
Glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910728090.9A CN110430692A (en) | 2019-08-08 | 2019-08-08 | A kind of mainboard paster technique of high efficiency and heat radiation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910728090.9A CN110430692A (en) | 2019-08-08 | 2019-08-08 | A kind of mainboard paster technique of high efficiency and heat radiation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110430692A true CN110430692A (en) | 2019-11-08 |
Family
ID=68414891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910728090.9A Withdrawn CN110430692A (en) | 2019-08-08 | 2019-08-08 | A kind of mainboard paster technique of high efficiency and heat radiation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110430692A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114615791A (en) * | 2020-12-07 | 2022-06-10 | 深圳市万普拉斯科技有限公司 | Circuit board assembly and electronic equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030183909A1 (en) * | 2002-03-27 | 2003-10-02 | Chia-Pin Chiu | Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device |
| CN102110726A (en) * | 2010-11-05 | 2011-06-29 | 苏州快可光伏电子股份有限公司 | Sealed type photovoltaic junction box with rapid heat dissipation |
| CN102711405A (en) * | 2012-06-05 | 2012-10-03 | 哈尔滨工业大学 | Circuit board packaging container and immersion type circuit board secondary packaging method capable of improving reliability |
| CN104716113A (en) * | 2013-12-13 | 2015-06-17 | 华为技术有限公司 | Radiator and cooling system |
| CN106455426A (en) * | 2016-09-29 | 2017-02-22 | 努比亚技术有限公司 | Sealing method of heat conduction part |
| CN106851969A (en) * | 2017-04-01 | 2017-06-13 | 奇酷互联网络科技（深圳）有限公司 | Printed circuit board (PCB) and its processing technology |
| CN109068521A (en) * | 2018-07-24 | 2018-12-21 | 天津深之蓝海洋设备科技有限公司 | Sealing cover, underwater boost motor, control device and its airtight detection method |
-
2019
- 2019-08-08 CN CN201910728090.9A patent/CN110430692A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030183909A1 (en) * | 2002-03-27 | 2003-10-02 | Chia-Pin Chiu | Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device |
| CN102110726A (en) * | 2010-11-05 | 2011-06-29 | 苏州快可光伏电子股份有限公司 | Sealed type photovoltaic junction box with rapid heat dissipation |
| CN102711405A (en) * | 2012-06-05 | 2012-10-03 | 哈尔滨工业大学 | Circuit board packaging container and immersion type circuit board secondary packaging method capable of improving reliability |
| CN104716113A (en) * | 2013-12-13 | 2015-06-17 | 华为技术有限公司 | Radiator and cooling system |
| CN106455426A (en) * | 2016-09-29 | 2017-02-22 | 努比亚技术有限公司 | Sealing method of heat conduction part |
| CN106851969A (en) * | 2017-04-01 | 2017-06-13 | 奇酷互联网络科技（深圳）有限公司 | Printed circuit board (PCB) and its processing technology |
| CN109068521A (en) * | 2018-07-24 | 2018-12-21 | 天津深之蓝海洋设备科技有限公司 | Sealing cover, underwater boost motor, control device and its airtight detection method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114615791A (en) * | 2020-12-07 | 2022-06-10 | 深圳市万普拉斯科技有限公司 | Circuit board assembly and electronic equipment |
| CN114615791B (en) * | 2020-12-07 | 2024-03-12 | 深圳市万普拉斯科技有限公司 | Circuit board assembly and electronic equipment |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20191108 |
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| WW01 | Invention patent application withdrawn after publication |