CN110515435A - Radiator structure and electronic assembly - Google Patents
Radiator structure and electronic assembly Download PDFInfo
- Publication number
- CN110515435A CN110515435A CN201810487887.XA CN201810487887A CN110515435A CN 110515435 A CN110515435 A CN 110515435A CN 201810487887 A CN201810487887 A CN 201810487887A CN 110515435 A CN110515435 A CN 110515435A
- Authority
- CN
- China
- Prior art keywords
- thermal coupling
- socket part
- coupling socket
- electronic component
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
Abstract
It includes fan and heat-conducting piece that the present invention, which provides a kind of radiator structure and electronic assembly, the radiator structure,.Heat-conducting piece thermal coupling wind-receiving fan and the electronic component for being located at fan side.Heat-conducting piece includes the first thermal coupling socket part, the second thermal coupling socket part and electromagnetic shielding portion.First thermal coupling socket part thermal coupling fan.Second thermal coupling socket part connects the first thermal coupling socket part, and thermal coupling electronic component.Electromagnetic shielding portion connects the second thermal coupling socket part, and surround and be set to the second thermal coupling socket part towards on the surface of electronic component.Electromagnetic shielding portion is around electronic component.Therefore, the radiator structure has electro-magnetic screen function and good radiating efficiency.
Description
Technical field
The present invention relates to a kind of radiator structure and electronic assembly more particularly to a kind of heat dissipation knots with electro-magnetic screen function
Structure and the electronic assembly for using this radiator structure.
Background technique
Common electronic device such as notebook computer, tablet computer or smart phone etc., have it is easy to carry and
Immediately the features such as transmitting-receiving, processing information, it has also become the tool of modern's indispensability.By taking laptop as an example, to meet user
Demand, lightening design has become Developing mainstream, and also therefore, the internal body of laptop can be used to that electronic component is arranged
Space be contracted by step by step.For example, the internal body of laptop is typically provided with fan and corresponding to fan
Radiator structure, aforementioned radiator structure is to meet lightening development trend greatly most without electro-magnetic screen function, aforementioned
The heat dissipation area of radiator structure is contracted by step by step.
Summary of the invention
The present invention provides a kind of radiator structure, has electro-magnetic screen function and good radiating efficiency.
The present invention provides a kind of electronic assembly, the ability with good radiating efficiency and electromagnetism interference.
Radiator structure of the invention includes fan and heat-conducting piece.Heat-conducting piece thermal coupling wind-receiving fan and the electricity for being located at fan side
Subcomponent.Heat-conducting piece includes the first thermal coupling socket part, the second thermal coupling socket part and electromagnetic shielding portion.First thermal coupling socket part thermal coupling wind
Fan.Second thermal coupling socket part connects the first thermal coupling socket part, and thermal coupling electronic component.Electromagnetic shielding portion connects the second thermal coupling socket part,
And it surround and is set to the second thermal coupling socket part towards on the surface of electronic component.Electromagnetic shielding portion is around electronic component.
Electronic assembly of the invention includes circuit board, electronic component and radiator structure.Electronic component is set to circuit board
On.Radiator structure includes fan and heat-conducting piece.Fan is set to the side of circuit board.Heat-conducting piece thermal coupling wind-receiving fan be located at wind
Fan the electronic component of side.Heat-conducting piece includes the first thermal coupling socket part, the second thermal coupling socket part and electromagnetic shielding portion.First thermal coupling
Portion's thermal coupling wind-receiving fan.Second thermal coupling socket part connects the first thermal coupling socket part, wherein the second thermal coupling socket part covers the part of circuit board, and
Thermal coupling electronic component.Electromagnetic shielding portion connects the second thermal coupling socket part, and surround and be set to the second thermal coupling socket part towards circuit board
Or on the surface of electronic component.Electromagnetic shielding portion is around electronic component.
Heat-conducting piece thermal coupling electronic component based on above-mentioned, of the invention radiator structure, therefore when can run electronic component
Generated thermal conductivity goes out.On the other hand, the electromagnetic shielding portion of heat-conducting piece is around electronic component, therefore can make electronic component not
It is interfered by extraneous electromagnetic signals.Therefore, not only there is good radiating efficiency using the electronic assembly of radiator structure of the invention,
Also with the ability of good electromagnetism interference.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and it is detailed to cooperate attached drawing to make
Carefully it is described as follows.
Detailed description of the invention
Fig. 1 is the decomposition diagram of the electronic assembly of one embodiment of the invention.
Fig. 2 is the combination diagram of the electronic assembly of Fig. 1.
Fig. 3 is partial cutaway schematic of the electronic assembly along hatching line I-I of Fig. 2.
Symbol description:
100: electronic assembly；
110: circuit board；
111: holding section；
120: electronic component；
130: radiator structure；
131: fan；
131a: fan body；
131b: blower-casting；
131b1: thermal coupling junction；
131b2: the first positioning region；
131c: air intake vent；
131d: air outlet；
132: heat-conducting piece；
132a: the first thermal coupling socket part；
132a1: opening；
132a2: the second positioning region；
132b: the second thermal coupling socket part；
132b1: surface；
132c: electromagnetic shielding portion；
132c1: electromagnetic shielding side wall；
133: thermal interface material layer；
S: space.
Specific embodiment
Fig. 1 is the decomposition diagram of the electronic assembly of one embodiment of the invention.Fig. 2 is that the combination of the electronic assembly of Fig. 1 is shown
It is intended to.Fig. 3 is partial cutaway schematic of the electronic assembly along hatching line I-I of Fig. 2.It indicates for clarity and is convenient for explanation, with void
Line schematically illustrates the heat-conducting piece 132 in Fig. 2.Fig. 1 to Fig. 3 is please referred to, in the present embodiment, electronic assembly 100, which can be, to be set
It is placed in the internal body of laptop, wherein electronic assembly 100 includes circuit board 110, electronic component 120 and radiator structure
130, and electronic component 120 is set on circuit board 110.Electronic component 120 can be central processing unit, drawing chip, north and south
The electronic component that can be generated heat when bridge chip or other operations, the present invention are without restriction to this.
Radiator structure 130 includes fan 131 and heat-conducting piece 132, and wherein fan 131 is set to the side of circuit board 110,
And it can be centrifugal fan.Fan 131 includes fan body 131a and blower-casting 131b, and wherein fan body 131a is rotatable
Ground is set in blower-casting 131b, and generated air-flow can flow into fan from air intake vent 131c when fan body 131a operating
Shell 131b simultaneously flows out blower-casting 131b from air outlet 131d.132 thermal coupling electronic component 120 of heat-conducting piece and fan 131, electricity
Generated heat can be by the conduction of heat-conducting piece 132 to fan 131, finally by the operating of fan 131 when institute when running for subcomponent 120
The air-flow of generation is by hot driving to outside.
Furthermore, heat-conducting piece 132 can be as having made by conductive, magnetic conduction and the material of the performances such as thermally conductive
Plate comprising the first thermal coupling socket part 132a, the second thermal coupling socket part 132b and electromagnetic shielding portion 132c.First thermal coupling socket part
132a thermal coupling wind-receiving fan 131, and contact the thermal coupling junction 131b1 of blower-casting 131b.On the other hand, air intake vent 131c penetration heat
Coupling face 131b1, and the first thermal coupling socket part 132a has opening 132a1, to the exposure discrepancy when contacting thermal coupling junction 131b1
Air port 131c.Second thermal coupling socket part 132b connection the first thermal coupling socket part 132a, wherein the second thermal coupling socket part 132b covers circuit board
110 part, and the surface for being equipped with electronic component 120 with circuit board 110 is kept at a distance.Second thermal coupling socket part 132b thermal coupling electricity
Subcomponent 120, wherein electromagnetic shielding portion 132c connection the second thermal coupling socket part 132b, and around being set to the second thermal coupling socket part 132b
On surface 132b1 towards circuit board 110 or electronic component 120.
In the present embodiment, electromagnetic shielding portion 132c is around electronic component 120, therefore external electromagnetic noise can quilt
Outside electromagnetic shielding portion 132c is barred from, without being interfered to electronic component 120.For example, electronic component 120 and antenna
(not shown) can be respectively arranged at the inside and outside of electromagnetic shielding portion 132c, because electromagnetic shielding portion 132c be barred from electronic component 120 with
Between antenna (not shown), electromagnetic noise caused by electronic component 120 will not interfere antenna (not shown), and antenna
Electromagnetic noise caused by (not shown) will not interfere electronic component 120.Therefore, electronic component is helped to improve
Efficiency when 120 operation and quality when antenna (not shown) receiving and transmitting signal.
There is the first positioning region being located on thermal coupling junction 131b1 please continue to refer to Fig. 1 to Fig. 3, blower-casting 131b
131b2, and the first thermal coupling socket part 132a has the second positioning region 132a2 for corresponding to the first positioning region 131b2 setting.When first
Thermal coupling socket part 132a contact thermal coupling junction 131b1 when, the first positioning region 131b2 fastens with the second positioning region 132a2, with to prevent
Only heat-conducting piece 132 and fan 131, which are separated from, comes, and ensures thermal coupling relationship between the two.In the present embodiment, the first positioning
Portion 131b2 may include one or more positioning columns (schematically illustrating in attached drawing multiple), and the second positioning region 132a2 may include one
A or multiple location holes (being schematically illustrated in attached drawing multiple).The quantity of positioning column can be equal to the quantity of positioning column, and positioning column
It is arranged in location hole, to reach the purpose that the first thermal coupling socket part 132a is fastened on to blower-casting 131b.In other implementations
In example, the first positioning region may include one or more location holes, and the second positioning region may include one or more positioning columns.
On the other hand, radiator structure 130 further includes thermal interface material layer 133, and configuration is to connecting electronic component 120 and the
Two thermal coupling socket part 132b.Therefore, generated heat can be conducted via thermal interface material layer 133 to the when electronic component 120 is run
Two thermal coupling socket part 132b, then passed to the first thermal coupling socket part 132a by the second thermal coupling socket part 132b and conducted to blower-casting
131b, generated air-flow is by hot driving to outside when operating finally by fan body 131a.In the present embodiment, the second heat
Couplings 132b, electromagnetic shielding portion 132c and circuit board 110 define space S, and electronic component 120 is located in space S.Electricity
Generated heat can be such that the temperature of the air in space S increases when the operation of subcomponent 120, when the air contact second in space S
When thermal coupling socket part 132b and electromagnetic shielding portion 132c, the heat of the air in space S can be transferred to the second thermal coupling socket part 132b and electricity
Magnetic screen portion 132c, then conduct via the second thermal coupling socket part 132b to the first thermal coupling socket part 132a and conduct to blower-casting
131b, generated air-flow is by hot driving to outside when operating finally by fan body 131a.That is, heat-conducting piece 132
With biggish heat dissipation area, radiating efficiency is helped to improve.Therefore, electronic assembly 100 not only has good radiating efficiency,
Also with the ability of good electromagnetism interference.
In the present embodiment, electromagnetic shielding portion 132c includes the multiple electromagnetic shielding side wall 132c1 for surrounding setting, and vertical
In the second thermal coupling socket part 132b.On the other hand, circuit board 110 includes multiple holding sections 111, around electronic component 120.
By the way that these electromagnetic shieldings side wall 132c1 is sticked in these holding sections 111 respectively, heat-conducting piece 132 and circuit board can be prevented
110 are separated from, and ensure that electronic component 120 is electromagnetically shielded by the grounding wire portion 132c and surround.
In conclusion radiator structure of the invention includes heat-conducting piece and fan, wherein heat-conducting piece can run electronic component
When generated heat transfer to fan, and by air-flow caused by fan by hot driving to outside.On the other hand, heat-conducting piece
Electromagnetic shielding portion can be such that electronic component is not interfered by extraneous electromagnetic signals around electronic component.Furthermore, electric
Generated heat can be such that the temperature of surrounding air increases when subcomponent operation, when the air thermal contact conductance of surrounding electronic component
When the second thermal coupling socket part of part and electromagnetic shielding portion, the heat of the air of surrounding electronic component can be transferred to the second thermal coupling socket part and electricity
Magnetic screen portion, then conduct via the second thermal coupling socket part to the first thermal coupling socket part of heat-conducting piece and conduct to fan, finally by wind
Generated air-flow is fanned by hot driving to outside.That is, heat-conducting piece of the invention has biggish heat dissipation area, facilitate
Improve radiating efficiency.Therefore, not only there is good radiating efficiency using the electronic assembly of radiator structure of the invention, it may have
The ability of good electromagnetism interference.
Although the present invention is disclosed as above with embodiment, however, it is not to limit the invention, any technical field
Middle technical staff, without departing from the spirit and scope of the present invention, when can make a little change and retouching, therefore protection of the invention
Range is subject to view the attached claims institute defender.
Claims (10)
1. a kind of radiator structure characterized by comprising
Fan；And
Heat-conducting piece, fan described in thermal coupling and the electronic component for being located at the fan side, the heat-conducting piece include:
First thermal coupling socket part, fan described in thermal coupling；
Second thermal coupling socket part connects the first thermal coupling socket part, and electronic component described in thermal coupling；
And
Electromagnetic shielding portion connects the second thermal coupling socket part, and surround and be set to the second thermal coupling socket part towards the electronics
On the surface of element, the electromagnetic shielding portion is around the electronic component.
2. radiator structure according to claim 1, which is characterized in that the fan includes blower-casting, and the fan
Shell has thermal coupling junction and the first positioning region in thermal coupling junction, and the first thermal coupling socket part has the second positioning
Portion, the first thermal coupling socket part contacts the thermal coupling junction, and first positioning region fastens with second positioning region.
3. radiator structure according to claim 2, which is characterized in that first positioning region includes an at least positioning column,
And second positioning region includes that at least a positioning hole, the positioning column is arranged in the location hole.
4. radiator structure according to claim 1, which is characterized in that further include:
Thermal interface material layer is configured to connect the second thermal coupling socket part and the electronic component.
5. radiator structure according to claim 1, which is characterized in that the electromagnetic shielding portion includes surround setting multiple
It is electromagnetically shielded side wall, perpendicular to the second thermal coupling socket part.
6. a kind of electronic assembly characterized by comprising
Circuit board；
Electronic component is set on the circuit board；
Radiator structure, including
Fan is set to the side of the circuit board；And
Heat-conducting piece, electronic component described in thermal coupling, the heat-conducting piece include:
First thermal coupling socket part, fan described in thermal coupling；
Second thermal coupling socket part connects the first thermal coupling socket part, wherein the second thermal coupling socket part covers the office of the circuit board
Portion, and electronic component described in thermal coupling；And
Electromagnetic shielding portion connects the second thermal coupling socket part, and surround and be set to the second thermal coupling socket part towards the circuit
On the surface of plate or the electronic component, electromagnetic shielding portion is around the electronic component.
7. electronic assembly according to claim 6, which is characterized in that the fan includes blower-casting, and the fan
Shell has thermal coupling junction and the first positioning region in thermal coupling junction, and the first thermal coupling socket part has the second positioning
Portion, the first thermal coupling socket part contacts the thermal coupling junction, and first positioning region fastens with second positioning region.
8. electronic assembly according to claim 7, which is characterized in that first positioning region includes an at least positioning column,
And second positioning region includes that at least a positioning hole, the positioning column is arranged in the location hole.
9. electronic assembly according to claim 6, which is characterized in that the radiator structure further include:
Thermal interface material layer is configured to connect the second thermal coupling socket part and the electronic component.
10. electronic assembly according to claim 6, which is characterized in that the electromagnetic shielding portion includes surround setting more
A electromagnetic shielding side wall, perpendicular to the second thermal coupling socket part, the circuit board includes multiple holding sections, around the electronics member
Around part, the multiple electromagnetic shielding side wall is sticked in the multiple holding section respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810487887.XA CN110515435A (en) | 2018-05-21 | 2018-05-21 | Radiator structure and electronic assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810487887.XA CN110515435A (en) | 2018-05-21 | 2018-05-21 | Radiator structure and electronic assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110515435A true CN110515435A (en) | 2019-11-29 |
Family
ID=68621984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810487887.XA Pending CN110515435A (en) | 2018-05-21 | 2018-05-21 | Radiator structure and electronic assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110515435A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201499419U (en) * | 2009-04-29 | 2010-06-02 | 环旭电子股份有限公司 | Electromagnetic shielding device with conducting and heat radiating functions |
| CN101754667A (en) * | 2008-12-22 | 2010-06-23 | 永硕联合国际股份有限公司 | Electromagnetic shielding device with heat dissipation function |
| US20100157544A1 (en) * | 2008-12-22 | 2010-06-24 | Wei-Chun Tsao | Electromagnetic shielding device with heat dissipating function |
| CN104582459A (en) * | 2013-10-25 | 2015-04-29 | 纬创资通股份有限公司 | Electronic device and electromagnetic wave shielding module thereof |
| TWM500284U (en) * | 2014-11-25 | 2015-05-01 | Acer Inc | Portable electronic device |
| US20170098592A1 (en) * | 2014-03-18 | 2017-04-06 | Huawei Device Co., Ltd. | Heat dissipation assembly and electronic device |
-
2018
- 2018-05-21 CN CN201810487887.XA patent/CN110515435A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101754667A (en) * | 2008-12-22 | 2010-06-23 | 永硕联合国际股份有限公司 | Electromagnetic shielding device with heat dissipation function |
| US20100157544A1 (en) * | 2008-12-22 | 2010-06-24 | Wei-Chun Tsao | Electromagnetic shielding device with heat dissipating function |
| CN201499419U (en) * | 2009-04-29 | 2010-06-02 | 环旭电子股份有限公司 | Electromagnetic shielding device with conducting and heat radiating functions |
| CN104582459A (en) * | 2013-10-25 | 2015-04-29 | 纬创资通股份有限公司 | Electronic device and electromagnetic wave shielding module thereof |
| US20170098592A1 (en) * | 2014-03-18 | 2017-04-06 | Huawei Device Co., Ltd. | Heat dissipation assembly and electronic device |
| TWM500284U (en) * | 2014-11-25 | 2015-05-01 | Acer Inc | Portable electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191129 |
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| RJ01 | Rejection of invention patent application after publication |