CN109327997A - The connection of the heat pipe and metal shell of electronic apparatus constructs - Google Patents
The connection of the heat pipe and metal shell of electronic apparatus constructs Download PDFInfo
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- CN109327997A CN109327997A CN201710649381.XA CN201710649381A CN109327997A CN 109327997 A CN109327997 A CN 109327997A CN 201710649381 A CN201710649381 A CN 201710649381A CN 109327997 A CN109327997 A CN 109327997A
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- Prior art keywords
- heat pipe
- metal shell
- groove
- face
- plastic layer
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- 239000002184 metal Substances 0.000 title claims abstract description 49
- 239000004033 plastic Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 6
- 210000002421 cell wall Anatomy 0.000 claims abstract description 4
- 238000012545 processing Methods 0.000 claims description 8
- 238000001746 injection moulding Methods 0.000 claims description 7
- 238000005253 cladding Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 239000000945 filler Substances 0.000 description 9
- 238000000465 moulding Methods 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000011469 building brick Substances 0.000 description 5
- 238000010276 construction Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 208000030208 low-grade fever Diseases 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- 238000007254 oxidation reaction Methods 0.000 description 2
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- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920007019 PC/ABS Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012510 hollow fiber Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- -1 triazine thiol Chemical class 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Abstract
The connection of the heat pipe and metal shell of a kind of electronic apparatus constructs, including a metal shell, which is provided with a sleeve configuration groove, and left and right two side of groove defines a groove width；One heat pipe, it is made of heat-conducting metal, with a flat ontology, and its thickness is less than 1mm, the tube body width of left and right two side of heat pipe is less than the accommodating width of groove, when heat pipe is set in groove, a gap is formed between the cell wall of groove, and heat pipe and metal shell are positioned in a manner of dispensing；And a plastic layer, it is formed in gap (d) with jetting process in a mould, the heterogeneous combination structure that metal shell and two metalwork of heat pipe are linked；Whereby, have and combine effect firm, that tool is thinned and thermal diffusivity is good.
Description
Technical field
The present invention be heat pipe and metal shell in relation to a kind of electronic apparatus connection construction, espespecially a kind of plastic cement with
The heterogeneous combination structure that metal shell and two metalwork of heat pipe are linked by (insert molding) is projected in mould.
Background technique
Electronic apparatus more in frivolous multitask, and due to electronic building brick density improve, working frequency speed, through length
Time is will lead to after in locally there is superheating phenomenon, this phenomenon is that consumer brings the bad use of the excessively high sense of touch of temperature
Impression；In other words, the chip of usual electronic apparatus or battery are main heating source at work, are radiated not only for reduction
Chip or battery itself temperature are to guarantee that it can be worked normally within the temperature range of requiring, while also to take into account heat dissipation when cannot
Shell hot-spot is caused, that is, generates hot spot (Hot Spot), causes bad usage experience to consumer, at present mobile electron
The radiating mode of device, mainly in the way of simple aperture, heat transfer, heat radiation etc., but those radiating modes can not
Satisfaction solves the problem of thermal energy caused by high-effect chip now therefore has overheat, and thermal energy can not be dispersed evenly to shell,
The radiating efficiency inside electronic apparatus is caused to reduce；And then lead to the instruction frequency reducing or excessively slow crash of mobile phone central processor
The phenomenon that also happen occasionally, to solve the problem above-mentioned, high-order mobile phone machine is based on electrographite piece at present, but with audio-visual
It is required that higher, the problem of not can solve overheat gradually；Therefore existing micro heat pipe is applied to commercial smartphone, uses low-grade fever
Pipe is as heat exchanger assembly.
Secondary person is the novel M496156 patent of TaiWan, China, a kind of electronic apparatus of the patent diselosesll shown in Fig. 1
Radiator structure comprising a front housing bracket 41, LCD MODULE 42 and a rear cover 46 and the slim micro heat pipe 45, the liquid crystal
Show that 42 side of module is equipped with a substrate 44, an at least electronic building brick 441 is provided on the substrate 44, which has an accommodating
Space 461,42 side of LCD MODULE are sticked a center 33, which is embedded on the center 43, the slim low-grade fever
Pipe 45 is set between the electronic building brick 441 and rear cover 46, and slim 45 side of micro heat pipe is corresponding to contact the electronic building brick
441, the other side is corresponding to contact the rear cover 46, and with unification cooling fin 451；So as to helping the thermal energy of the electronic building brick 421 equal
Even distribution does not generate accumulated heat.
But look into, the slim micro heat pipe 45 be it is a kind of with tubular body made by copper or aluminum material, due to copper or aluminium
Material is thermally conductive good conductor, therefore is widely used as directly contacting the heat-conductive assembly to conduct heat with heat source, but
Its need to again by tin cream or welding manner by the slim bonding of micro heat pipe 45 in the accommodating space 461, but because heat pipe be copper or
Aluminium material, itself material property are binded by tin cream or are fixed by solder bond, easily cause thermal resistance problem, shell not variable
Thin and environmental issue.
It presses again, is Fig. 2A, Fig. 2 B, No. 544204 patents of TaiWan, China invention I shown in Fig. 2 C, the patent diselosesll is a kind of
Heat pipe fixed structure a, comprising: heat pipe 52, a supporting body 51, two fixing pieces 53,54；The heat pipe 52 has an ontology and has
One first side and a second side；The supporting body 51 has a groove 511, which has an open sides and a closed side, should
Heat pipe 52 is set in the groove 51, and respectively corresponds the open sides and the closed side by the first side and a second side；Two is solid
Determine 53,54 its outboard end 54b of part and is set to the heat pipe 53,54 and 51 top of supporting body, its inner end of fixing piece 54a
(free end) corresponding first side contacts " compress or be clamped " with the heat pipe 52, provide a kind of fixed structure of heat pipe, Jin Ergai
It is apt to the existing missing that heat pipe is welded and fixed.But it looks into, this to be combined 52 pipe of heat with supporting body 51 by way of close-fitting, close-fitting
Mode though the two can be fixed, have part close-fitting structure that need to apply pressure to the heat pipe and enable its deformation, and when opposite heat tube is applied
The capillary structure that inside heat pipe can be destroyed when plus-pressure makes heat pipe heat conduction efficiency be greatly reduced or even disable, so reduce or
Lose the effect of heat pipe heat biography.
It presses again, is Fig. 3 A, Fig. 3 B, the novel M522552 patent of TaiWan, China shown in Fig. 3 C, the patent diselosesll is a kind of
Hand-hold communication device 60 and its slimming radiator 70, this slimming radiator 70 includes one first heat-conducting plate 71, a heat pipe 72
And one second heat-conducting plate 73, the first heat-conducting plate 71 are equipped with a wears groove 711；Heat pipe 72 is set in wears groove 711；Second heat-conducting plate 73
Corresponding first heat-conducting plate 71 and heat pipe 72 are overlapped or are amplexiformed.Whereby, the even heat that heat generating component 63 generates is directed at heat pipe
72 and heat-conducting plate 71 on, avoid accumulation of heat around heat generating component 63 or shell 61, to reach the function of improving heat radiation efficiency
Effect.But it looks into, heat pipe 72 is combined by the second heat-conducting plate 73 with heat-conducting plate 71, but in the heat pipe of such thickness, the smaller efficiency of thickness
It is poorer, and its handling process still can because of vibration facter caused by loosen and decompose the problems such as.
Therefore the missing of the above-mentioned prior art is to be familiar with the to be improvedd primary goal of the personage of this skill.
Summary of the invention
Technical problem underlying to be solved by this invention is, overcomes drawbacks described above of the existing technology, and provides one
The connection of the heat pipe and metal shell of kind electronic apparatus constructs, and there is combination to consolidate, have slimming and thermal diffusivity is good
Effect.
The technical solution adopted by the present invention to solve the technical problems is:
The connection of the heat pipe and metal shell of a kind of electronic apparatus constructs, comprising: a metal shell, including moved for one
It moves frame shell, rear cover body or a thermally conductive plate body in one on electronic device to be constituted, which is equipped with a sleeve configuration
Groove, and left and right two side of the groove defines a groove width (S)；One heat pipe, is made of heat-conducting metal, flat with one
The ontology of shape, thickness are less than 1mm, which has first face and opposite corresponding second face upward, and the heat pipe
The tube body width (W) of left and right two side is less than the accommodating width (S) of the groove, when the heat pipe is set in the groove, the heat pipe
A gap (d) is formed between left and right two side and the cell wall of the groove, and the heat pipe and the metal shell are determined in a manner of dispensing
Position；And a plastic layer, it is formed in the gap (d) with projecting (insert molding) processing procedure in a mould, by the injection molding
Molding plastic layer is linked the metal shell and two metalwork of heat pipe, and the plastic layer be coated on the heat pipe a left side,
Right two sides make the first face and one second face of the heat pipe, are presented without the exposed radiating surface of plastic layer cladding.
According to feature is before taken off, in the first embodiment, which can be frame shell or a rear cover body in one, the groove
Can include: the closed side with an open sides upward and a bottom, the first face of the heat pipe are located relatively at the open sides, and second
Face is located relatively at the closed side.
Again in a second embodiment, which can be a thermally conductive plate body, the groove include: with one upward and a court
Under upper and lower open sides, the first face of the heat pipe is located relatively at open sides on this, and the second face is located relatively at the lower open sides.
According to feature is before taken off, the contact surface of groove and the heat pipe and the plastic layer on the metal shell may include that processing makes
Micropore rough surface is presented in it, and the C-shaped clamping shape of the plastic layer is coated on the arranged on left and right sides of the heat pipe.
By technical characteristic is above taken off, the present invention is constructed compared to traditional heat pipe combination,
The present invention, by tin cream bonding or the fixed heat pipe of solder bond, easily causes thermal resistance problem and environmental protection to ask without tradition
Topic.Also it without tradition in such a way that " compress or be clamped " is this by close-fitting, easily causes heat pipe to apply pressure and deform, loses
The problem of heat pipe heat passes.It by overlap joint or is amplexiformed in conjunction with fixed heat pipe without tradition, easily causes handling process because of vibration facter
Cause the problems such as loosening and decomposing.Therefore the present invention has solved the disadvantages mentioned above of prior art, to project (insert in mould
The metal shell is linked heterogeneous by molding) means by the plastic layer of the injection molding with two metalwork of heat pipe
Integrated structure has and combines effect firm, that tool is thinned and thermal diffusivity is good.
The invention has the advantages that it, which has, combines effect firm, that tool is thinned and thermal diffusivity is good.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is novel No. M496156 exploded perspective view in existing Taiwan.
Fig. 2A to Fig. 2 C is the exploded perspective view of No. 544204 patents of existing TaiWan, China invention I, constitutional diagram perspective view
And structure sectional view.
Fig. 3 A to Fig. 3 C is the exploded perspective view of the novel M522552 patent of existing TaiWan, China, combination stereogram figure
And structure sectional view.
Fig. 4 is molding flow chart of the invention.
Fig. 5 A to Fig. 5 D is the exploded perspective view, combination stereogram and structure sectional view of first embodiment of the invention.
Fig. 5 E is the exploded perspective view of second embodiment of the invention.
Fig. 6 A to Fig. 6 D is the exploded perspective view of third embodiment of the invention, combination stereogram figure and structure sectional view.
Fig. 7 is main construction enlarged cross-sectional view of the invention.
Figure label explanation:
10 metal shells
Frame shell in 10a
10b rear cover body
The thermally conductive plate body of 10c
11 grooves
12 micropore rough surfaces
111 open sides
112 closed sides
Open sides on 113
114 lower open sides
20 heat pipes
21 first faces
22 second faces
23 micropore rough surfaces
30 plastic layers
31 dispensings
Specific embodiment
Firstly, please referring to shown in Fig. 4~Fig. 7, the connection of the heat pipe and metal shell of electronic apparatus of the present invention is constructed,
It include: a metal shell 10, including for frame shell 10a, a rear cover body 10b or a heat-conducting plate in one on an electronic apparatus
Body 10c is constituted, which is equipped with the groove 11 of a sleeve configuration, and left and right two side of groove 11 defines a ditch
Groove width (S)；In the present embodiment, the material of the metal shell 10 may include copper, aluminium, titanium, stainless steel, silver or its metal alloy,
Or Metals composite more than any the two or both is constituted.
One heat pipe 20, is made of heat-conducting metal, has a flat ontology, and thickness is less than 1mm, ontology tool
There is first face 21 and opposite corresponding second face 22 upward, and enables the tube body width (W) of left and right two side of the heat pipe small
In the accommodating width (S) of the groove, when the heat pipe 20 is set in the groove 11, left and right two side of heat pipe 20 and the groove
A gap (d) is formed between 11 cell wall, and the heat pipe 20 is positioned in a manner of dispensing 31 with the metal shell 10；The present embodiment
In, the dispensing 31 can include: thermoplastic resin, thermosetting resin or silicone resin is any is constituted.
One plastic layer 30 is formed in the gap (d) with injection (insert molding) processing procedure in a mould, by
The plastic layer 30 of the injection molding is linked 20 liang of metalworks of the metal shell 10 and the heat pipe, and the plastic layer 30 coats
In the arranged on left and right sides of the heat pipe 20, make the first face 21 and one second face 22 of the heat pipe 20, is presented without the cladding of plastic layer 30
Exposed radiating surface.In the present embodiment, the material of the plastic layer 30 can include: PBT, PC, ABS, PC/ABS, PPS, PA6, PA66,
PA66/PA6, PBT/filler, PC/filler, PC/ABC/filler, PPS/filler, PA6/filler, PA66/
Filler, PA66/PA6/filler, filler therein can be fiber or inorganic filler, and fiber therein can be carbon fiber
Dimension, graphite fibre, carbon nanotube, graphene fiber, glass fibre, macromolecular fibre, polymeric hollow fiber or nanometer metal
Line；Filler therein can be calcium carbonate, barium sulfate, aluminium oxide, silicon carbide, mica, boron nitride, aluminium nitride, titanium dioxide, oxygen
Change zinc, magnesia, carbon ball, graphite, graphene and nanometer carbon materials etc..
As shown in Fig. 5 A- Fig. 5 D, in the present embodiment, which is the construction of frame shell 10a in one, ditch
Slot 11 includes: the closed side 112 with an open sides upward and 111 1 bottoms, and the first face 21 of the heat pipe 20 is located relatively at
The open sides 111, the second face 22 are located relatively at the closed side 112.That is to say, in the present embodiment, the ditch of frame shell 10a in this
The bottom of slot 11 has closed side 112, rather than the structure of through hole.
As shown in fig. 5e, another possible embodiments of the metal shell 10 are the construction of a rear cover body 10b, groove 11
Bottom also has a closed side 112, therefore works as the combined structure that the heat pipe 20 is set to injection molding in the groove 11, is identical to
Shown in Fig. 5 D, therefore holds and do not repeat.
As shown in Fig. 6 A- Fig. 6 D, in another possible embodiments, which is the construction of a thermally conductive plate body 10c,
The groove 11 of the thermally conductive plate body 10c include: with one upward and a upper and lower open sides 113,114 directed downwardly, the of the heat pipe 20
It is located at open sides 113 on this with respect to 21 on one side, the second face phase 21 is to positioned at the lower open sides 114.That is to say, in the present embodiment
In, the bottom of the groove 11 of the thermally conductive plate body 10c does not have a closed side, but the structure of through hole.
Therefore the present invention projects (insert molding) in mould, it should by the plastic layer 30 of the injection molding
Metal shell 10 is linked with 20 liang of metalworks of the heat pipe, is applicable to include frame shell 10a, rear cover body 10b among the above
And the embodiments such as thermally conductive plate body 10c.
Further, as shown in fig. 7, the contact surface of groove 11 and the heat pipe 20 and the plastic layer 30 on the metal shell 10
More it can make it that micropore rough surface 12,23 be presented by processing, the C-shaped clamping shape of the plastic layer is coated on left and right the two of the heat pipe
Side.More complete to allow the metal shell 10 of plastic layer 30 to be engaged with 20 liang of metals of heat pipe in the present embodiment, contact surface uses one
As C or T or HK or E or PMH or TRI processing or ECIM processed.Make the metal shell by above-mentioned working process whereby
10 surfaces form nanoscale micropore rough surface 12,23, are engaged the resin of the plastic layer 30 with metal, form " anchor bolt
Effect " belongs to nanoscale physical engagement, resin and metal can be made to be firmly combined, and pass through above-mentioned processing, as the aluminium of TRI processing closes
Aurification forms the oxidation film of a layer thickness 70-1500nm, can again may be used with resin reaction in oxidation film containing triazine thiol etc.
With the substance with metal bonding, chemical reaction chain engagement is generated at high temperature under high pressure, resin and metal is firmly combined.
By technical characteristic is above taken off, system of the present invention constructs compared to traditional heat pipe combination, needs again with following effect
It illustrates:
The one, present invention easily causes thermal resistance problem, shell not variable without traditional tin cream bonding or the fixed heat pipe of solder bond
Thin and environmental issue.
The two, present invention are this by way of close-fitting without traditional " compress or be clamped ", easily cause heat pipe application pressure and
Deformation loses the problem of heat pipe heat passes.
The three, present invention are without tradition overlap joint or amplexiform in conjunction with fixed heat pipe, easily cause handling process because of vibration facter caused by
The problems such as loosening and decomposing.
The four, present invention can not increase the original thickness of structure, also can more be thinned.
Therefore the present invention has overcome and has solved the disadvantages mentioned above of prior art, to project (insert molding) in mould
Means construct the connection of the heat pipe 20 and metal shell 10 by the plastic layer 30 of the injection molding, have and combine firm, tool
Slimming and the good effect of thermal diffusivity.
The above described is only a preferred embodiment of the present invention, be not intended to limit the present invention in any form, it is all
It is any simple modification, equivalent change and modification to the above embodiments according to the technical essence of the invention, still falls within
In the range of technical solution of the present invention.
In conclusion the present invention designs, in structure using on practicability and cost-effectiveness, complying fully with industry development institute
It needs, and revealed structure is also to have unprecedented innovative structure, there is novelty, creativeness, practicability, meet related
The regulation of invention patent requirement, therefore lift application in accordance with the law.
Claims (4)
1. the connection of the heat pipe and metal shell of a kind of electronic apparatus constructs characterized by comprising
One metal shell, including being made of frame shell, a rear cover body or a thermally conductive plate body in one on an electronic apparatus,
The metal shell is equipped with the groove of a sleeve configuration, and left and right two side of the groove defines a groove width (S)；
One heat pipe, is made of heat-conducting metal, has a flat ontology, and thickness is less than 1mm, which has one upward
The first face and opposite corresponding second face, and the tube body width (W) of left and right two side of the heat pipe be less than the groove accommodating
Width (S) forms a gap between left and right two side of the heat pipe and the cell wall of the groove when the heat pipe is set in the groove
(d), and the heat pipe is positioned in a manner of dispensing with the metal shell；And
One plastic layer is formed in the gap (d) with jetting process in a mould, by the plastic layer of the injection molding by the metal
Shell is linked with two metalwork of heat pipe, and the plastic layer is coated on the arranged on left and right sides of the heat pipe, makes the first of the heat pipe
Face and one second face are presented without the exposed radiating surface of plastic layer cladding.
2. the connection of the heat pipe and metal shell of a kind of electronic apparatus according to claim 1 constructs, feature exists
In the metal shell is frame shell or a rear cover body in one, which has the closing of an open sides upward and a bottom
Side, the first face of the heat pipe are located relatively at the open sides, and the second face is located relatively at the closed side.
3. the connection of the heat pipe and metal shell of a kind of electronic apparatus according to claim 1 constructs, feature exists
It is a thermally conductive plate body in, the metal shell, which has one upward and a upper and lower open sides directed downwardly, and the of the heat pipe
It is located relatively at open sides on this on one side, the second face is located relatively at the lower open sides.
4. the connection of the heat pipe and metal shell of a kind of electronic apparatus according to claim 2 or 3 constructs, feature
It is, the contact surface of groove and the heat pipe and the plastic layer on the metal shell further includes that processing keeps its presentation micropore coarse
Face, and the C-shaped clamping shape of the plastic layer is coated on the arranged on left and right sides of the heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710649381.XA CN109327997A (en) | 2017-08-01 | 2017-08-01 | The connection of the heat pipe and metal shell of electronic apparatus constructs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110856417A (en) * | 2019-11-20 | 2020-02-28 | 华为技术有限公司 | Heat pipe, heat dissipation module and terminal equipment |
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