CN206024368U - Flat thin membrane type heat abstractor - Google Patents
Flat thin membrane type heat abstractor Download PDFInfo
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- CN206024368U CN206024368U CN201620794951.5U CN201620794951U CN206024368U CN 206024368 U CN206024368 U CN 206024368U CN 201620794951 U CN201620794951 U CN 201620794951U CN 206024368 U CN206024368 U CN 206024368U
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- pipe
- radiating layer
- metallic radiating
- thin membrane
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Abstract
A kind of flat thin membrane type heat abstractor, including：One upper strata metallic radiating layer, in platysome, and its thickness is 0.01～0.20mm；One lower floor's metallic radiating layer, in platysome, and its thickness is 0.01～0.20mm, and corresponding with upper strata metallic radiating layer；And a resin bed, it is located between upper strata metallic radiating layer and lower metal heat dissipating layer, and it is set as a film micro-pipe with heat pipe pattern, and make the upper face and lower face of film micro-pipe be combined with each other with the upper surface of the lower surface and lower metal heat dissipating layer of upper strata metallic radiating layer respectively, and a heat dissipating fluid can be stored in film micro-pipe, to constitute the flat thin membrane type heat abstractor of a micro heat pipe and fin composite molding.
Description
Technical field
The utility model is a kind of relevant flat thin membrane type heat abstractor, and which is with micro heat pipe and fin composite molding institute structure
Into implementing the efficient heat abstractor for actively being combined with passive type combined with fin by slim micro heat pipe and design.
Background technology
Electronic apparatus more in frivolous multitask, and due to electronic building brick density improve, frequency speed through long-time
Local being resulted in after use and superheating phenomenon occurs, this phenomenon is not only the bad use that consumer brings the too high sense of touch of temperature
Impression, in other words, the chip of usual electronic apparatus is operationally main heating source, radiates not only for reduction chip certainly
Body temperature with ensure its can within the temperature range of requiring normal work, while can not cause when will also take into account radiating housing local
Overheated, cause bad experience, the radiating mode of current electronic apparatus to mainly use and simply open to consumer
The modes such as hole, heat transfer, thermal convection current, but those radiating modes cannot meet heat energy now produced by high-effect chip, because
This has an overheated problem, heat energy cannot uniformly dispersing, cause the radiating efficiency inside electronic apparatus to reduce；And then cause
Mobile phone instruction frequency reducing or the excessively slow phenomenon for crashing also happen occasionally, and are to solve the problems, such as above-mentioned, and current high-order machine is with artificial stone
Based on ink sheet, but as audio-visual requirement is higher, it is overheated gradually to have solved the problems, such as；Adjoint, existing micro heat pipe is applied to
Commercial intelligent mobile phone, uses micro heat pipe as heat exchanger assembly.
As shown in figure 1, which is a kind of existing round micro heat pipe 15A, it is to be constituted with the closed container made by a metal,
A working fluid can be stored in the closed container, and there is one group of capillary structure, not yet added with arc welding in the closed container
During sealing, and filling operation fluid is carried out using the capillary structure and be used, though round micro heat pipe 15A can provide mobile electron dress
Put and radiated, but as the development of electronic apparatus is more frivolous for designer trends, therefore, the round micro heat pipe 15A is not
Apply and use, and round micro heat pipe 15A flattenings are modified to a slim micro heat pipe 15B further, as shown in Figure 2.But look into, should
Round micro heat pipe 15A is flattened in the process of a slim micro heat pipe 15B, easily causes flexural deformation or became uneven, or even
It is damaged capillary structure, and then reduces the reliability of product.
Secondary person, the slim micro heat pipe 15B are to be applied to the new M496156 patents of TaiWan, China, the patent diselosesll one
Kind of electronic apparatus radiator structure, which includes a fore shell support 11, LCD MODULE 12 and a bonnet 16 and this is slim micro-
Heat pipe 15B, 12 side of LCD MODULE are provided with a substrate 14, are provided with an at least electronic building brick 141 on the substrate 14, should
There is bonnet 16 accommodation space 161,12 side of LCD MODULE to be sticked a center 13, and the substrate 14 is embedded at the center
On 13, the slim micro heat pipe 15B is arranged between the electronic building brick 141 and bonnet 16, and the slim micro heat pipe 15B sides are corresponding
The electronic building brick 141 is contacted, opposite side correspondingly contacts the bonnet 16, and with unification fin 151；So as to helping the electronics
The uniform thermal power of component 121 spreads and does not produce accumulated heat.
But look into, though the slim micro heat pipe 15B is have the advantages that being thinned, and should shaping, radiating inequality and cooperation is made
Fin 151, with problem below：
(1). when flattening into the slim micro heat pipe 15B due to the round micro heat pipe 15A, when shaping is made, and it is also easy to produce
Deformation, in addition, the slim micro heat pipe 15B not Homogeneouslly-radiatings, so that radiating effect is not obvious, make electronic apparatus heat
The heat that source distributes cannot uniformly dispersing in whole cavity, have with respect to the electronic building brick 141 and organism temperature and persistently raise, make
Into body hot or work as machine problem, can only be passive by software reduce core efficiency in the way of, cause consumer to cause bad making
With experience.
(2). due to the slim micro heat pipe 15B Homogeneouslly-radiating effect on driving birds is not good, therefore the fin 151 need to be coordinated, but this is slim
Micro heat pipe 15B was two stand-alone assemblies with the fin 151 originally, caused radiating effect to disperse, when the cavity of electronic apparatus
Instantaneous temperature is rushed cruelly, then cause the electronic building brick 141 cannot load instantaneous temperature rush cruelly, easily cause the electronic building brick 141 and damage,
And the reliability of electronic apparatus cannot be lifted.
(3). due to type body (U-shaped or snake channel type, L-type etc.) the area A of the slim micro heat pipe 15B1With the fin 151
Area of plane A2It is difference towards forming the thermal convection current in two different paths, also result in the mutual swash of wave, allow electronic apparatus
Hot unrest degree in cavity is raised, and cannot effectively be excluded heat to outside the cavity of electronic apparatus.
(4). after need to manufacturing respectively with the fin 151 due to the slim micro heat pipe 15B, then it is separately assembled to mobile electron
In the cavity of device, manufacturing cost is not only improved, also waste built-up time, it is impossible to lifted and manufacture convenient and assembling yield.Therefore
The present inventor conceives a kind of flat thin membrane type heat abstractor, the class to be solved by the utility model in view of problem points are above taken off
Topic.
Utility model content
Technical problem underlying to be solved in the utility model is, overcomes the drawbacks described above of prior art presence, and carry
For a kind of flat thin membrane type heat abstractor, its with micro heat pipe and fin composite molding, in order to solve the slim low-grade fever of prior art
The problem points deformed with radiating inequality of pipe, and then there is lifting forming stability and the uniform function of reinforcing radiating；Which is with micro-
Heat pipe and fin composite molding, in order to solve the problem points of the slim micro heat pipe of prior art and the Homogeneouslly-radiating of fin, enter
And there is the reliability that can keep electronic apparatus；Its with micro heat pipe and fin composite molding, in order to solve previous skill
Art heat pipe type bulk area different from the fin area of plane towards problem points, and then with reduce electronic apparatus chamber
Internal hot unrest degree, and heat is effectively excluded to outside the cavity of electronic apparatus；Its with micro heat pipe and fin composite molding,
In order to solve the problem points of the slim micro heat pipe of prior art, the manufacturing cost of fin, built-up time, and then there is lifting manufacture
Effect of convenient and assembling yield.
The utility model solves the technical scheme adopted by its technical problem：
A kind of flat thin membrane type heat abstractor, including：One upper strata metallic radiating layer, in platysome, and its thickness is 0.01
～0.20mm；One lower floor's metallic radiating layer, in platysome, and its thickness be 0.01～0.20mm, and with the upper strata heat dissipation metal
Layer is corresponding；And a resin bed, between the upper strata metallic radiating layer and the lower metal heat dissipating layer, and it is set as one and has
The film micro-pipe of heat pipe pattern, and make the upper face and lower face of film micro-pipe following table respectively with the upper strata metallic radiating layer
The upper surface of face and lower metal heat dissipating layer be combined with each other, and in the film micro-pipe can store a heat dissipating fluid, to constitute one
Micro heat pipe and the flat thin membrane type heat abstractor of fin composite molding.
According to front feature is taken off, the film micro-pipe can be parallel geometry, U-shaped geometry, snake channel type geometry, L
One of type geometry, grid geometry or starlike geometry are constituted.
According to front taking off feature, the upper strata metallic radiating layer and lower metal heat dissipating layer can be gold, silver, copper, titanium, aluminium, stainless
One of alloy of the metal of steel, the alloy of the metal or multiple metallic combinations is constituted.
According to front feature is taken off, the upper strata metallic radiating layer and lower metal heat dissipating layer can be carborundum, aluminum oxide, silicon wafer
One of circle, Graphene, pbz polymer samming or thermal dispersant coatings are constituted.
According to front feature is taken off, the resin bed can be Reactive hot melt adhesive, a liquid type macromolecule resin or two-liquid type macromolecule
One of resin is constituted.
According to front feature is taken off, a capillary structure is may also include, in the film micro-pipe.
In another embodiment, the technological means adopted by the utility model includes：One upper strata metallic radiating layer, be in
Platysome, and its thickness is 0.01～0.20mm；One lower floor's metallic radiating layer, in platysome, and its thickness be 0.01～
0.20mm, and corresponding with the upper strata metallic radiating layer；And a resin bed, it is made up of Reactive hot melt adhesive, and which is reacted
Functional group of the group selected from epoxy radicals, alcohol radical, carboxylic acid group, isocyanate group or amino, assumes glue after reactedization, and can point
Glue and makes the upper face and lower face difference of the film micro-pipe into a film micro-pipe with heat pipe pattern after crosslinked solidification
It is combined with each other with the upper table of the lower surface and lower metal heat dissipating layer of the upper strata metallic radiating layer, and can in the film micro-pipe
A heat dissipating fluid is stored, to constitute the flat thin membrane type heat abstractor of a micro heat pipe and fin composite molding.
In a further preferred embodiment, the technological means adopted by the utility model includes：One upper strata metallic radiating layer, be in
Platysome, and its thickness is 0.01～0.20mm；One lower floor's metallic radiating layer, in platysome, and its thickness be 0.01～
0.20mm, and corresponding with the upper strata metallic radiating layer；And a resin bed, by the one of a liquid type or two-liquid type macromolecule resin
Constituted, and its exposed terminated groups is crosslinked through part selected from the functional group of epoxy radicals, alcohol radical, carboxylic acid group, isocyanate group or amino
Present after change gluey, and can dispensing into a film micro-pipe with heat pipe pattern, after crosslinked solidification, and make the film micro-pipe
Upper face and lower face are be combined with each other with the upper surface of the lower surface and lower metal heat dissipating layer of the upper strata metallic radiating layer respectively,
And a heat dissipating fluid can be stored in the film micro-pipe, dissipated with the flat thin membrane type of fin composite molding with constituting a micro heat pipe
Thermal.
By above taking off technological means, the utility model implement efficiently active that slimming micro-pipe combined with fin with
Passive type combine heat abstractor design, and in order to solve the problems, such as the slim micro heat pipe of prior art itself and cooperation fin
Point, can not only lift forming stability and reinforcing radiating is uniform, it is also possible to keep the reliability of electronic apparatus and effectively arrange
Heat extraction can be more lifted and manufacture convenient and assembling yield to outer.
The beneficial effects of the utility model are which is with micro heat pipe and fin composite molding, thin in order to solve prior art
The problem points deformed with radiating inequality of type micro heat pipe, and then there is lifting forming stability and the uniform function of reinforcing radiating；
Its with micro heat pipe and fin composite molding, in order to solve the problems, such as the Homogeneouslly-radiating of the slim micro heat pipe of prior art and fin
Point, and then with the reliability of electronic apparatus can be kept；Its with micro heat pipe and fin composite molding, in order to solve elder generation
Front technology heat pipe type bulk area different from the fin area of plane towards problem points, and then have reduce electronic apparatus
Cavity in hot unrest degree, and effectively exclude hot to outside the cavity of electronic apparatus；Which is combined with fin with micro heat pipe
Shaping, in order to solve the problem points of the slim micro heat pipe of prior art, the manufacturing cost of fin, built-up time, and then has and carries
Rise and manufacture convenient and assembling yield effect.
Description of the drawings
With reference to the accompanying drawings and examples the utility model is further illustrated.
The schematic diagram of Figure 1A existing round micro heat pipes enough.
Figure 1B is the schematic diagram of existing slim micro heat pipe.
Fig. 2A is a kind of exploded perspective view of existing electronic apparatus radiator structure.
Fig. 2 B are a kind of combination stereograms of existing electronic apparatus radiator structure.
Fig. 2 C are the cross-section cutaway views of 2C-2C in Fig. 2 B.
Fig. 2 D are the enlarged drawings in Fig. 2 C shown in 2D.
Fig. 3 is exploded perspective view of the present utility model.
Fig. 4 is combination stereogram of the present utility model.
Fig. 5 is the top view that the utility model film micro-pipe is U-shaped geometry.
Fig. 6 is the cross-section cutaway view of 6-6 in Fig. 5.
Fig. 7 is the top view that the utility model film micro-pipe is snake channel type geometry.
Fig. 8 is the top view that the utility model film micro-pipe is L-type geometry.
Fig. 9 is use state figure of the present utility model.
Label declaration in figure：
20 flat thin membrane type heat abstractors
21 upper strata metallic radiating layers
211 lower surfaces
22 lower metal heat dissipating layers
221 upper surfaces
23 resin beds
24 film micro-pipes
Face on 241
242 times faces
25 heat dissipating fluids
30 capillary structures
Specific embodiment
First, refer to shown in Fig. 3～Fig. 9, a kind of preferable enforcement of flat thin membrane type heat abstractor 20 of the utility model
Example includes：One upper strata metallic radiating layer 21, in platysome, and its thickness is 0.01～0.20mm；One lower floor's metallic radiating layer 22,
It is in platysome, and its thickness is 0.01～0.20mm, and corresponding with the upper strata metallic radiating layer 21, in the present embodiment, on this
Layer metallic radiating layer 21 and lower metal heat dissipating layer 22 be gold, silver, copper, titanium, aluminium, stainless metal, the alloy of the metal or
One of alloy of multiple metallic combinations is constituted, and in another embodiment, the upper strata metallic radiating layer 21 and lower metal radiate
Layer 22 is constituted by the one of carborundum, aluminum oxide, Silicon Wafer, Graphene, pbz polymer samming or thermal dispersant coatings, but is not limited to
This.
One resin bed 23, between the upper strata metallic radiating layer 21 and the lower metal heat dissipating layer 22, and is set as a tool
Have a film micro-pipe 24 of heat pipe pattern, and make the upper face 241 and lower face 242 of the film micro-pipe 24 respectively with the upper strata metal
The upper surface 221 of the lower surface 211 and lower metal heat dissipating layer 22 of heat dissipating layer 21 be combined with each other, and can in the film micro-pipe 24
A heat dissipating fluid 25 is stored, to constitute the flat thin membrane type heat abstractor 20 of a micro heat pipe and fin composite molding, this enforcement
In example, the type body of the film micro-pipe 24 coordinates the upper strata metallic radiating layer 21 and lower metal heat dissipating layer 22, and integrates previous skill
The difference constituted by the U-shaped area of the slim micro heat pipe and the area of plane of fin mentioned by art is towards however, the film is micro-
Pipe 24 can change shape according to the opened up louvre of the housing of electronic apparatus, as shown in figure 5, the film micro-pipe 24 is U-shaped
Geometry, or as shown in fig. 7, the film micro-pipe 24 is for snake channel type geometry or as shown in figure 8, the film micro-pipe 24 is L
The area of plane of the type bulk area of the slim micro heat pipe mentioned by prior art and fin can all be constituted by type geometry
Difference towards be integrated into same towards integration area A, formed a path thermal convection current, it is to avoid cause the mutual swash of wave, drop
Hot unrest degree in the cavity of low electronic apparatus, and heat can be effectively excluded to outside the cavity of electronic apparatus, but do not limit
Schedule this.Additionally, coordinating shown in Fig. 6, it is also the cross-section cutaway view of 6-6 in Fig. 5, not only assumes the flat thin membrane type heat abstractor
20 inside, also assumes a capillary structure 30, and in the film micro-pipe 231, but the capillary structure 30 is not essential, does not affect
The function of the flat thin membrane type heat abstractor 20.
The resin bed 23 is further illustrated for Reactive hot melt adhesive, a liquid type macromolecule resin or two-liquid type macromolecule resin
One of constituted, and the material of the Reactive hot melt adhesive or macromolecule glue can be epoxy resin, polyamine alcohol resin, polyureas ester tree
Fat, polyurethane, polyacrylic resin or above-mentioned modified resin, consequently, it is possible to reactive group or exposed terminated groupses can be epoxy
The functional group of base, alcohol radical, carboxylic acid group, isocyanate group or amino, therefore, with wire mark, coating, dispensing, ink-jet printer, three
Wanted heat pipe pattern is applied to the upper strata metallic radiating layer 21 and lower metal dissipates by dimension printer or the film forming mode such as stamp again
Thermosphere 22, and from mating needed for application end in terms of structure end, make the Reactive hot melt adhesive, a liquid type macromolecule resin or two liquid
Type macromolecule resin, in the centre of the flat thin membrane type heat abstractor 20, it is sandwich to make the flat thin membrane type heat abstractor 20
Structure, forms the resin bed 23 for the offer heat pipe pattern and the combination of upper strata and lower metal heat dissipating layer 21,22.
Hold, in possible embodiments, the resin bed 23 is made up of Reactive hot melt adhesive, and its reactive group is selected from
The functional group of epoxy radicals, alcohol radical, carboxylic acid group, isocyanate group or amino, present after reactedization gluey, and can dispensing into the tool
There is the film micro-pipe 24 of heat pipe pattern, after crosslinked solidification, and make 242 points of the upper face 241 and lower face of the film micro-pipe 24
It does not be combined with each other with the upper surface 221 of the lower surface 211 and lower metal heat dissipating layer 22 of the upper strata metallic radiating layer 21, or another
In possible embodiments, the resin bed 23 is made up of one of a liquid type or two-liquid type macromolecule resin, also can be heat curing-type, and its
Functional group of the exposed terminated groupses selected from epoxy radicals, alcohol radical, carboxylic acid group, isocyanate group or amino, assumes glue after part Cross-linked
Shape, and can dispensing the film micro-pipe 24 that there is heat pipe pattern into this, after crosslinked solidification, and make the upper face of the film micro-pipe 24
241 and the upper surface respectively with the lower surface 211 and lower metal heat dissipating layer 22 of the upper strata metallic radiating layer 21 of lower face 242
221 be combined with each other, in addition, macromolecular material or add part functional filler shape macromolecule composite wood need to via heat or
The crosslinking method such as moisture or oxygen solidifies, but is not limited to this.
Based on above-mentioned composition, during 20 replacement of the flat thin membrane type heat abstractor slim micro heat pipe and fin are applied to
The new M496156 patents in state Taiwan, use state figure as shown in Figure 9, it include a fore shell support 11, liquid crystal display mode
Block 12 and a bonnet 16 and the upper strata metallic radiating layer 21, lower metal heat dissipating layer 22, resin bed 23, film micro-pipe 24 are constituted
Flat thin membrane type heat abstractor 20,12 side of LCD MODULE is provided with a substrate 14, is provided with least on the substrate 14
There is an accommodation space 161,12 side of LCD MODULE to be sticked a center 13 for one electronic building brick 141, the bonnet 16, the base
Plate 14 is embedded on the center 13, the flat thin membrane type heat abstractor 20 be arranged at the electronic building brick 141 and bonnet 16 it
Between, 20 side of flat thin membrane type heat abstractor correspondingly contacts the electronic building brick 141, and opposite side correspondingly contacts the bonnet
16, together solve slim micro heat pipe itself and coordinate the problem points of fin, forming stability, the uniform system of reinforcing radiating can be lifted
Convenient and assembling yield is made, meanwhile, keep the reliability of electronic apparatus and heat is effectively excluded to outer, allow user in low temperature
Under electronic apparatus can also experience the efficient process speed of electronic apparatus.
The above, is only preferred embodiment of the present utility model, not the utility model is made any formal
Restriction, every any simple modification that above example is made according to technical spirit of the present utility model, equivalent variations with
Modification, still falls within the range of technical solutions of the utility model.
In sum, the utility model complies fully with industry development in structure design, using in practicality and cost benefit
Required and disclosed structure is also that with novelty, creativeness, practicality, meeting has with unprecedented innovative structure
The regulation of utility model patent important document is closed, therefore lifts application in accordance with the law.
Claims (10)
1. a kind of flat thin membrane type heat abstractor, it is characterised in that include：
One upper strata metallic radiating layer, in platysome, and its thickness is 0.01～0.20mm；
One lower floor's metallic radiating layer, in platysome, and its thickness is 0.01～0.20mm, and relative with the upper strata metallic radiating layer
Should；And a resin bed, between the upper strata metallic radiating layer and the lower metal heat dissipating layer, and it is set as one there is heat pipe figure
The film micro-pipe of case, and make the upper face and lower face of the film micro-pipe respectively with the lower surface of the upper strata metallic radiating layer and under
The upper surface of layer metallic radiating layer be combined with each other, and in the film micro-pipe can store a heat dissipating fluid, to constitute a micro heat pipe
Flat thin membrane type heat abstractor with fin composite molding.
2. flat thin membrane type heat abstractor according to claim 1, it is characterised in that the film micro-pipe is parallel geometry
One of structure, U-shaped geometry, snake channel type geometry, L-type geometry, grid geometry or starlike geometry institute
Constitute.
3. flat thin membrane type heat abstractor according to claim 1, it is characterised in that the upper strata metallic radiating layer and under
Alloy of the layer metallic radiating layer for gold, silver, copper, titanium, aluminium, stainless metal, the alloy of the metal or multiple metallic combinations
One of constituted.
4. flat thin membrane type heat abstractor according to claim 1, it is characterised in that the upper strata metallic radiating layer and under
Layer metallic radiating layer is made up of one of carborundum, aluminum oxide, Silicon Wafer, Graphene, pbz polymer samming or thermal dispersant coatings.
5. flat thin membrane type heat abstractor according to claim 1, it is characterised in that the resin bed is reaction type hot-fusible
The one of glue, a liquid type macromolecule resin or two-liquid type macromolecule resin is constituted.
6. flat thin membrane type heat abstractor according to claim 1, it is characterised in that also include a capillary structure, be located at
In the film micro-pipe.
7. a kind of flat thin membrane type heat abstractor, it is characterised in that include：
One upper strata metallic radiating layer, in platysome, and its thickness is 0.01～0.20mm；
One lower floor's metallic radiating layer, in platysome, and its thickness is 0.01～0.20mm, and relative with the upper strata metallic radiating layer
Should；And
One resin bed, is made up of Reactive hot melt adhesive, and its reactive group is selected from epoxy radicals, alcohol radical, carboxylic acid group, isocyanate group
Or the functional group of amino, present after reactedization gluey, and can dispensing into a film micro-pipe with heat pipe pattern, crosslinked
After solidification, and make the upper face and lower face of film micro-pipe lower surface and lower metal respectively with the upper strata metallic radiating layer
The upper surface of heat dissipating layer be combined with each other, and in the film micro-pipe can store a heat dissipating fluid, to constitute a micro heat pipe and radiating
The flat thin membrane type heat abstractor of piece composite molding.
8. flat thin membrane type heat abstractor according to claim 7, it is characterised in that also include a capillary structure, be located at
In the film micro-pipe.
9. a kind of flat thin membrane type heat abstractor, it is characterised in that include：
One upper strata metallic radiating layer, in platysome, and its thickness is 0.01～0.20mm；
One lower floor's metallic radiating layer, in platysome, and its thickness is 0.01～0.20mm, and relative with the upper strata metallic radiating layer
Should；And
One resin bed, is made up of a liquid type or two-liquid type macromolecule resin, and its exposed terminated groups is selected from epoxy radicals, alcohol radical, carboxylic
The functional group of acidic group, isocyanate group or amino, present after part Cross-linked gluey, and can dispensing there is heat pipe pattern into one
Film micro-pipe, after crosslinked solidification, and make the upper face and lower face of the film micro-pipe respectively with the upper strata metallic radiating layer
Lower surface and the upper surface of lower metal heat dissipating layer be combined with each other, and a heat dissipating fluid can be stored in the film micro-pipe, with
Constitute the flat thin membrane type heat abstractor of a micro heat pipe and fin composite molding.
10. flat thin membrane type heat abstractor according to claim 9, it is characterised in that also include a capillary structure, be located at
In the film micro-pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620794951.5U CN206024368U (en) | 2016-07-26 | 2016-07-26 | Flat thin membrane type heat abstractor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620794951.5U CN206024368U (en) | 2016-07-26 | 2016-07-26 | Flat thin membrane type heat abstractor |
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ID=58245961
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660099A (en) * | 2016-07-26 | 2018-02-02 | 东莞爵士先进电子应用材料有限公司 | Flat thin membrane type heat abstractor |
| CN109327997A (en) * | 2017-08-01 | 2019-02-12 | 东莞市普威玛精密工业有限公司 | The connection of the heat pipe and metal shell of electronic apparatus constructs |
-
2016
- 2016-07-26 CN CN201620794951.5U patent/CN206024368U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660099A (en) * | 2016-07-26 | 2018-02-02 | 东莞爵士先进电子应用材料有限公司 | Flat thin membrane type heat abstractor |
| CN109327997A (en) * | 2017-08-01 | 2019-02-12 | 东莞市普威玛精密工业有限公司 | The connection of the heat pipe and metal shell of electronic apparatus constructs |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181210 Address after: 523421 No. 19 Foling Road, Fuzhushan Village, Laobu Town, Dongguan City, Guangdong Province Patentee after: DONGGUAN QIANFENG SPECIAL ADHESIVE PRODUCTS CO., LTD. Address before: 523421 No. 51 Fulai Road, Liuwuxiang Village, Liaobu Town, Dongguan City, Guangdong Province Patentee before: Dongguan Jazz advanced electronic application material Co., Ltd. |
|
| TR01 | Transfer of patent right |