CN104902727B - The center and mobile terminal of a kind of mobile terminal - Google Patents
The center and mobile terminal of a kind of mobile terminal Download PDFInfo
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- CN104902727B CN104902727B CN201510275653.5A CN201510275653A CN104902727B CN 104902727 B CN104902727 B CN 104902727B CN 201510275653 A CN201510275653 A CN 201510275653A CN 104902727 B CN104902727 B CN 104902727B
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Abstract
The present invention relates to the technical fields of mobile communication, disclose the center and mobile terminal of a kind of mobile terminal.The center includes：Center framework, the radiator for radiating to device is inlaid in center framework, and the thickness of radiator is not more than the thickness of center framework, wherein, the heat dissipation solution includes two heat sinks that are opposite and putting, it is arranged between heat sink and is designed with capillary pipe structure and steam passage structure, and capillary pipe structure connects to form gas-liquid circuit with steam passage structure, phase-change working substance is filled in capillary pipe structure, in the above-mentioned technical solutions, it radiates by using radiator is inlayed in center framework to device, the radiator is spliced using heat sink, and form capillary pipe structure between two heat sinks, the thickness of entire radiator can be effectively reduced, so that the thickness of radiator is not more than the thickness of center, be conducive to the slimming development of mobile terminal.
Description
Technical field
The present invention relates to the technical field of mobile communication more particularly to a kind of center of mobile terminal and movement eventually
End.
Background technology
Smart mobile phone SP (Smart Phone) is integrating traditional function mobile phone FP (Feature Phone), notebook NB
(Notebook), the function and business of PDA, camera, projecting apparatus, walkman (Walkman), MP3 etc., as shown in Figure 1.Phase therewith
Corresponding, 2013SP mobile phones application processor (CPU) hardware configuration (Zhu Pin ＆CPU check figures) rapidly develops, more than 2010 notebooks
NB CPU hardware configuration levels, and fan radiator can not be used.Following 3 years (2014-2016) due to the rapid proliferation of LTE,
The rapid growth that mobile Internet and the multimedia application of fine definition, high-performance will bring data service, was predicted in 2016
Data service will be 5 times in 2013.By taking certain PXX SP mobile phone as an example, battery size is constant, if not taking any measure,
Severe user model is by from 0.9X days of 2013 become 2016 0.2X days, and best user experience is one day.As it can be seen that
Mobile terminal device power problems are deteriorating rapidly, and thermal design in a limited space becomes the following challenge constantly deteriorated.
In order to improve the situation of mobile terminal device power consumption, center dies are reduced by thermal component in the prior art
Heat and then attenuating energy consumption, to achieve these goals, a kind of scheme used in the prior art is using patch graphite sheet mode
It radiates for Primary Component：Graphite flake is pasted at positions such as shielding case, center, rear covers, solves the problems, such as hot localised points.But the technical side
In case, when mobile phone runs high power consumptions (Qmax_DP such as point (CPU are at full capacity) in operation peace rabbit rabbit>10W) adstante febre under software, application
Graphite radiating, CPU heat dissipation effects cannot be met the requirements.And under the scenes such as game, LTE data transmissions, heat pipe problem is more convex
It is aobvious.Another technical solution is：Using thin type heat pipe scheme, there are two types of application modes altogether.Such as：It is embedded after heat pipe welding copper foil
In (bonding) center (Huawei, Samsung, oppo)；Or：Heat pipe is welded/is bonded in above center：Sony Z2/3/ and NEC
mediasX.But above two scheme has the following problems：1) industry heat pipe thickness limit is 0.4mm at present, and is increased
0.1mm centers use, and entire phase transformation module thickness is 0.5mm, therefore are only capable of support center thickness in the application more than 0.5mm's
Mobile phone application.2) Qmax≤4W of 0.4mm heat pipes, ultrathin heat pipe scheme cannot meet requirement.
Therefore, in the prior art, technical solution is preferably solved for the heat dissipation neither one of mobile terminal.
Invention content
The present invention provides the center and mobile terminal of a kind of mobile terminal, to be suitable for the slimming of mobile terminal hair
Exhibition.
In a first aspect, providing a kind of center of mobile terminal, which includes：Center framework, in the center framework
The radiator for radiating to device is inlaid with, and the thickness of the radiator is not more than the thickness of the center framework,
Wherein, the radiator includes two heat sinks that are opposite and putting, the capillary pipe structure being arranged between the heat sink and
Steam passage structure, and the capillary pipe structure connects to form gas-liquid circuit with the steam passage structure, the capillary knot
Phase-change working substance is filled in structure.
With reference to above-mentioned first aspect, in the first possible implementation, the capillary pipe structure and the steam lead to
Road structure setting one of which heat sink.
It is described in second of possible realization method with reference to the first possible realization method of above-mentioned first aspect
Capillary pipe structure and steam passage structure are formed in the heat sink by micro-channel manufacturing process.
It is described in the third possible realization method with reference to the first possible realization method of above-mentioned first aspect
The thickness of two heat sinks is different, and the capillary pipe structure and steam passage structure are arranged on the thicker heat sink of thickness.
With reference to above-mentioned first aspect, in the 4th kind of possible realization method, the heat sink for copper foil plate, aluminum slice,
Magnesium alloy thin slice or stainless steel thin slice.
Second of possibility of the first possible realization method, first aspect with reference to above-mentioned first aspect, first aspect
Realization method, the third possible realization method of first aspect, first aspect the 4th kind of possible realization method,
In five kinds of possible realization methods, in described two heat sinks, the heat dissipation of the side of device is set in the center framework
Plate is structure as a whole with the center framework.
It is described in the 6th kind of possible realization method with reference to the 5th kind of possible realization method of above-mentioned first aspect
Capillary pipe structure and the steam passage structure are arranged on the heat sink that the center framework is structure as a whole.
With reference to the 5th kind of possible realization method of above-mentioned first aspect, in the 7th kind of possible realization method, also wrap
Include the shielding case being arranged on the heat sink and for fixing the device.
With reference to above-mentioned in a first aspect, in the 8th kind of possible realization method, the phase-change working substance is water, refrigerant or
Ammonia.
Second aspect provides a kind of mobile terminal, which is included in mobile terminal described in any one of the above embodiments
Frame.
According to the center for the mobile terminal that first aspect provides, the mobile terminal that second aspect provides, in the present embodiment,
It radiates by using radiator is inlayed in center framework to device, radiator is spliced using heat sink, and two
Capillary pipe structure is formed between a heat sink, the thickness of entire radiator can be effectively reduced so that the thickness of radiator
Degree is not more than the thickness of center, and radiator is arranged on by the way of inlaying in center, is greatly reduced heat dissipation dress
The space occupied is put, is conducive to the slimming development of mobile terminal.
Description of the drawings
Fig. 1 is the sectional view of the center of mobile terminal provided in an embodiment of the present invention；
Fig. 2 is the vertical view of the center of mobile terminal provided in an embodiment of the present invention；
Fig. 3 is the vertical view of the center of mobile terminal that another embodiment of the present invention provides；
Fig. 4 is the sectional view of the center of mobile terminal that another embodiment of the present invention provides；
Fig. 5 is the sectional view of the center of mobile terminal that another embodiment of the present invention provides；
Fig. 6 is the sectional view of the center of mobile terminal that another embodiment of the present invention provides；
Fig. 7 is the capillary pipe structure and steam passage structure for the center of mobile terminal that another embodiment of the present invention provides
Schematic diagram.
Reference numeral：
10- center framework 11- groove 20- radiators
21- the first heat sink 22- the second heat sink 23- capillary pipe structures
24- steam passage structure 25- heat sink 30- shielding cases
40- devices
Specific embodiment
Specific embodiments of the present invention are described in detail below in conjunction with attached drawing.It is it should be understood that described herein
Specific embodiment be merely to illustrate and explain the present invention, be not intended to restrict the invention.
As shown in Figure 1, Fig. 1 shows a kind of structure of the center of mobile terminal provided in an embodiment of the present invention.
An embodiment of the present invention provides a kind of center of mobile terminal, which includes：Center framework 10, center framework 10
On be inlaid with radiator 20 for radiating to device 40, and the thickness of radiator 20 is not more than the thickness of center framework 10
Degree, wherein, radiator 20 includes two heat sinks that are opposite and putting, the capillary pipe structure 23 being arranged between heat sink and steaming
Vapour channel design 24, and capillary pipe structure 23 connects to form gas-liquid circuit with steam passage structure 24, is filled out in capillary pipe structure 23
Filled with phase-change working substance.
In the above-mentioned technical solutions, device 40 is dissipated by using inlaying radiator 20 in center framework 10
Heat, wherein thermal component are formed, and form capillary between two heat sinks using two heat sink assembly being oppositely arranged
Pipe structure 23 and steam passage structure 24, and the filling phase-change working substance in capillary pipe structure 23, heat sink absorb the heat of device 40
After amount, phase-change working substance is passed it to, phase-change working substance forms gaseous state, and when flowing through steam passage structure 24, by heat transfer
To being distributed on the heat sink far from device 40, forming liquid after gaseous phase-change working substance cooling is flowed into capillary pipe structure 23
In continue cycling through, so that the heat that device 40 gives out be distributed, effectively reduce the temperature of device 40, and use
During above structure, radiator 20 is integral using two pieces of heat sink welding or bonding, and forms hair between two heat sinks
Capillary structure 23 can effectively reduce the thickness of entire radiator 20 so that the thickness of radiator 20 is not more than center
Thickness, and radiator 20 is arranged on by the way of inlaying in center, is greatly reduced the occupancy of radiator 20
Space is conducive to the slimming development of mobile terminal.
For convenience to the understanding of the structure of center provided in an embodiment of the present invention, with reference to specific attached drawing and reality
Example is applied its structure and working principle is described in detail.
First refering to fig. 2 and Fig. 3, wherein Fig. 2 and Fig. 3 respectively illustrate different radiators 20 and are arranged on center framework
Schematic diagram on 10.The planform of radiator 20 provided in this embodiment does not limit it can be seen from Fig. 2 and Fig. 3, can be with
Depending on the installation position of the device 40 in center framework 10, and the shape of radiator 20 is not limited to above-mentioned specific device
The installation position of part 40, can be equal by the higher position of temperature in center framework 10 by detecting the temperature in center framework 10
Radiator 20 provided in this embodiment in setting, as shown in Figures 2 and 3, radiator 20 is embedded in center framework 10
Plan view shape afterwards can be " L " font as shown in Figure 2, can also as shown in Figure 3 it is T-shaped, but it is to be understood that,
The outer shape for the radiator 20 that embodiment provides is not limited only to above-mentioned Fig. 2 and shape shown in Fig. 3, can also be other
Meaning can reduce the shape of 10 framework temperature of center framework.
In addition to the outer shape of above-mentioned radiator 20 and installation position, radiator 20 provided in this embodiment it is specific
Structure can also use different forms, be illustrated with reference to specific attached drawing.
As shown in Fig. 1 and Fig. 4, Fig. 1 and Fig. 4 show the radiator of two kinds of different structures provided in an embodiment of the present invention
20。
Wherein, as shown in Figure 1, the heat sink that radiator 20 is put relatively including two, respectively the first heat sink 21
With the second heat sink 22, in specific setting, different Heat Conduction Materials may be used in the first heat sink 21 and the second heat sink 22
It makes, such as copper foil plate, aluminum slice, magnesium alloy thin slice or stainless steel thin slice, preferably, the first heat sink 21 and the second heat sink
22 be the copper foil plate made of copper foil material.Capillary pipe structure 23 and steam passage structure in above-described embodiment are respectively provided with
On the first heat sink 21 or the second heat sink 22.In specific setting, the first heat sink 21 and the second heat sink 22 be not using
Same thickness, and capillary pipe structure 23 and steam passage structure 24 are arranged on a thicker heat sink of thickness.On specifically,
It states the first heat sink 21 and is arranged on the one side that device 40 is set in center framework 10, is i.e. device 40 is set up directly on the first heat sink
It is fixedly connected on 21 or by other connectors with the first heat sink 21.Second heat sink 22 is arranged in center framework 10
Away from the one side of setting device 40.In specific setting, Fig. 1 and the structure shown in Fig. 4, in Fig. 1, the thickness of the first heat sink 21
Degree is thicker than the thickness of the second heat sink 22, at this point, capillary pipe structure 23 and steam channel are arranged on the first heat sink 21.Fig. 4
Show that the thickness of the second heat sink 22 is thicker than the thickness of the first heat sink 21, at this point, capillary pipe structure 23 and steam channel knot
Structure 24 is arranged on the second heat sink 22.
Wherein, above-mentioned capillary pipe structure 23 and steam passage structure 24 are formed in heat sink by micro-channel manufacturing process.
Specifically, using laser engraving, erosion carving or other micro-channel manufacturing process in the first heat sink 21 or the second heat sink 22
Upper formation capillary pipe structure 23 and steam passage structure 24.
In specific setting, first by forming slot on above-mentioned micro-channel manufacturing process one of which heat sink
Road, and mill out in center framework 10 groove body of a hollow out, for fixing the first heat sink 21 and the second heat sink 22, two
Therefrom the both sides of circle body 10 are embedded on the groove body of the hollow out a heat sink, and are spliced to form radiator structure respectively, and are being inlayed
In embedding process, phase-change working substance is filled in conduit.Conduit between two heat sinks formed above-mentioned capillary pipe structure 23 and
Steam channel.Phase-change working substance therein is water, refrigerant or ammonia.Or using other any liquid objects that can be used for heat dissipation
Matter.
In addition, as a preferred solution.Wherein, in two heat sinks, device 40 is set in center framework 10
The heat sink of side be structure as a whole with center framework 10.
Specifically, as shown in Figures 5 and 6, Fig. 5 and Fig. 6 show other two kinds of structures of center provided in this embodiment
Form.
In this scheme, i.e., a part for center framework 10 is as the first heat sink 21 or the second heat sink 22.Specifically,
When making, center framework 10 is milled out into a groove 11, the groove 11 is for fixing another heat sink 25, and groove 11
Bottom wall forms the radiator 20 in above-described embodiment with another heat sink 25.
In setting, the setting direction of the groove 11 is the one side away from 40 setting direction of device in center framework 10.And
In specific setting, the installation position of capillary pipe structure 23 and steam channel can be selected, as shown in figure 5, center shown in fig. 5
In structure, the thickness of the bottom wall of groove 11 is more than the depth of groove 11, the i.e. thickness more than heat sink 25, at this point, by above-mentioned
In micro-channel manufacturing process form conduit on the bottom wall of groove 11.And heat sink 25 is in docking so that the conduit is formed
Capillary pipe structure 23 and steam channel in above-described embodiment, and before the docking of heat sink 25, fill in conduit and mutually exchange work
Matter in structure shown in Fig. 5, that is, uses capillary pipe structure 23 and steam passage structure 24 is arranged on center framework 10 as one
On the heat sink of body structure.
Alternatively, using structure as shown in Figure 6, in structure shown in Fig. 6, the thickness of the bottom wall of groove 11 is less than heat dissipation
The thickness of plate 25, at this point, above-mentioned capillary pipe structure 23 and the conduit of steam passage structure 24 are arranged on heat sink 25, specifically
As shown in fig. 6, at this point, the thickness of the bottom wall of groove 11 is less than the thickness of heat sink 25, above-mentioned conduit is arranged at heat sink 25
On, and pass through micro-channel manufacturing process and form conduit on a metal plate, later, phase-change working substance is filled in conduit, and will heat dissipation
Plate 25 is fixed in groove 11, and capillary pipe structure 23 and steam passage structure 24 are formed between the bottom wall and conduit of groove 11.
In the above-described embodiments, no matter using structure shown in fig. 5 or structure shown in fig. 6 is used, the device on center
Part 40 is arranged at the one side away from heat sink, i.e. device 40 is arranged on the one side for deviating from groove body on the bottom wall of groove 11.
When device 40 is specifically set, it is arranged on heat sink and for immobilising device 40 preferably, center further includes
Shielding case 30.Device 40 and center framework 10 are connected by shielding case 30, avoid radiator structure and center framework 10
Device 40 is interfered.
For the steam passage structure 24 and capillary pipe structure 23 provided in above-mentioned specific embodiment, passing through micro-channel system
When making technique formation, structure can be as shown in fig. 7, Fig. 7 shows the structure of the conduit to be formed, as seen from Figure 7, to form
Steam passage structure 24 and capillary pipe structure 23 between connect to form gas-liquid circuit, so as to which phase-change working substance be facilitated to be changed
Heat.
For convenience to middle frame structure provided in this embodiment there are one getting information about, the heat dissipation provided in the present embodiment
The size of device can be made：0.2mm (0.1mm conduits and steam channel)+0.1mm copper foils (wall surface, fixation)=0.3mm (in
Frame thickness).And at present, ultrathin heat pipe is most thin can accomplish 0.4mm+0.1mm copper foils (fixation)=0.5mm (most thin center thickness), because
This, the slimming that can be conducive to mobile terminal using middle frame structure provided in this embodiment is developed.In addition, the present embodiment provides
The radiator 20 that uses of cooperation center limited in width, turning radius equidimension it is small.And steam inside and liquid return
Flow completely separable, internal flow resistance is small.Compared with radiator structure of the prior art, MLHP heat-transfer paths width can be according to core
Piece package dimension designs, if M7 chip packages are 15*15, therefore the width for designing MLHP lower floors paillon is just 15mm, and it is thin
The maximum width that the current 0.4mm of type heat pipe can accomplish is 6.15mm.But radiator structure provided in this embodiment, whole thickness
No more than the thickness of center framework 10, therefore, the thickness of entire mobile terminal will not be impacted.
The embodiment of the present invention can utilize phase-change heat transfer principle on the slim center of mobile phone, solve the problems, such as hot localised points.Industry
The current industry thickness limit of common general heat pipe+copper foil scheme is 0.55mm, and the invention can be on the center of 0.3/0.35mm
Using phase-change heat transfer, hot localised points are solved the problems, such as.Emulation：PX mobile phones are verified it is found that 5 DEG C of chip temperature reduction, phone housing temperature
Degree reduces by 2~3 DEG C.
(2) this design is not influenced by angle of turn, because the realization of structure corner thus is realized by punching press/welding, therefore
Design the size of upper angle, the diversity of heat-transfer path (fire end, a plurality of condensation branch) can be achieved.It is and most thin at present
Heat pipe (0.4mm) performance after bending significantly fail.
(3) in the invention, phase-change heat transfer path width can accomplish it is wide as the upper surface of device 40, chip outflow
Most of heat is transferred to low-temperature region by the path.And the heat pipe thickness 0.4mm of current limit ultrathin, the heat pipe that can be done
Diameter is up to 4mm heat pipes, because with the increase of heat pipe caliber, the heat pipe sealing difficulty of thin pipe wall increases, therefore heat pipe is wide
Degree is limited, and the heat taken away from chip is also limited.And the present invention and there is no the above problem.
The embodiment of the present invention additionally provides a kind of mobile terminal, which includes the mobile terminal of any of the above-described
Center.
In the above-mentioned technical solutions, device 40 is dissipated by using inlaying radiator 20 in center framework 10
Heat, wherein thermal component are formed, and form capillary between two heat sinks using two heat sink assembly being oppositely arranged
Pipe structure 23 and steam passage structure 24, and the filling phase-change working substance in capillary pipe structure 23, heat sink absorb the heat of device 40
After amount, phase-change working substance is passed it to, phase-change working substance forms gaseous state, and when flowing through steam passage structure 24, by heat transfer
To being distributed on the heat sink far from device 40, forming liquid after gaseous phase-change working substance cooling is flowed into capillary pipe structure 23
In continue cycling through, so that the heat that device 40 gives out be distributed, effectively reduce the temperature of device 40, and use
During above structure, radiator 20 is spliced using heat sink, and capillary pipe structure 23, Ke Yiyou is formed between two heat sinks
The thickness of the entire radiator 20 of reduction of effect so that the thickness of radiator 20 is not more than the thickness of center, and the dress that radiates
It puts 20 to be arranged in center by the way of inlaying, is greatly reduced 20 the space occupied of radiator, be conducive to mobile whole
The slimming development at end.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
God and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (9)
1. a kind of center of mobile terminal, which is characterized in that including center framework, be inlaid in the center framework for device
The radiator of part heat dissipation, and the thickness of the radiator is not more than the thickness of the center framework, wherein,
The radiator includes the first heat sink and the second heat sink that are oppositely arranged, and first heat sink is towards described the
The surface of two heat sinks is respectively equipped with capillary pipe structure and steam passage structure, and the capillary pipe structure and the steam channel
Fabric connectivity forms gas-liquid circuit, and phase-change working substance is filled in the capillary pipe structure；
Or the surface of second heat sink towards first heat sink is respectively equipped with capillary pipe structure and steam passage structure,
And the capillary pipe structure connects to form gas-liquid circuit with the steam passage structure, and phase transformation is filled in the capillary pipe structure
Working medium.
2. the center of mobile terminal as described in claim 1, which is characterized in that the capillary pipe structure and steam passage structure
The heat sink is formed in by micro-channel manufacturing process.
3. the center of mobile terminal as described in claim 1, which is characterized in that the thickness of described two heat sinks is different, and
The capillary pipe structure and steam passage structure are arranged on the thicker heat sink of thickness.
4. the center of mobile terminal as described in claim 1, which is characterized in that the heat sink is copper foil plate, aluminum slice, magnesium
Alloy sheet or stainless steel thin slice.
5. such as the center of Claims 1 to 4 any one of them mobile terminal, which is characterized in that in described two heat sinks, position
Heat sink in the side that device is set in the center framework is structure as a whole with the center framework.
6. the center of mobile terminal as claimed in claim 5, which is characterized in that the capillary pipe structure and the steam channel
The heat sink that structure setting is structure as a whole in the center framework.
7. the center of mobile terminal as claimed in claim 5, which is characterized in that further include to be arranged on the heat sink and be used in combination
In the shielding case of the fixation device.
8. the center of mobile terminal as described in claim 1, which is characterized in that the phase-change working substance is water, refrigerant or ammonia.
9. a kind of mobile terminal, which is characterized in that include the center of such as claim 1~8 any one of them mobile terminal.
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| CN201510275653.5A CN104902727B (en) | 2015-05-26 | 2015-05-26 | The center and mobile terminal of a kind of mobile terminal |
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| CN201510275653.5A CN104902727B (en) | 2015-05-26 | 2015-05-26 | The center and mobile terminal of a kind of mobile terminal |
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| CN104902727B true CN104902727B (en) | 2018-06-19 |
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| CN101052290A (en) * | 2007-05-11 | 2007-10-10 | 华南理工大学 | High efficiency heat radiation cool plate for electronic device |
| CN101059323A (en) * | 2007-06-08 | 2007-10-24 | 株洲南车时代电气股份有限公司 | Plate type integral structure heat-irradiation method and device suitable for large power high efficiency heat pipe heat-radiator |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI234063B (en) * | 2002-05-15 | 2005-06-11 | Matsushita Electric Ind Co Ltd | Cooling apparatus for electronic equipment |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101052290A (en) * | 2007-05-11 | 2007-10-10 | 华南理工大学 | High efficiency heat radiation cool plate for electronic device |
| CN101059323A (en) * | 2007-06-08 | 2007-10-24 | 株洲南车时代电气股份有限公司 | Plate type integral structure heat-irradiation method and device suitable for large power high efficiency heat pipe heat-radiator |
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| CN104902727A (en) | 2015-09-09 |
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