CN101052290A - High efficiency heat radiation cool plate for electronic device - Google Patents
High efficiency heat radiation cool plate for electronic device Download PDFInfo
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- CN101052290A CN101052290A CN 200710027970 CN200710027970A CN101052290A CN 101052290 A CN101052290 A CN 101052290A CN 200710027970 CN200710027970 CN 200710027970 CN 200710027970 A CN200710027970 A CN 200710027970A CN 101052290 A CN101052290 A CN 101052290A
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Abstract
The invention comprises: a cold plate with 3D saw tooth-like fins and a surface evaporation plate with multi holes whose bottoms are connected each other with micro channels; the cold plate with 3D saw tooth-like fins is welded with the surface evaporation plate to form a sealed room filled out with working materials. The 3D saw tooth -like fins triggers the turbulent motion of gas and enhances the condensation process; the multi holes structure improves the heat conduction efficiency.
Description
Technical field
The present invention relates to the heat dissipation technology of electronic device, specifically is a kind of high efficiency heat radiation cool plate for electronic device.
Background technology
Electronic device and chip need be worked under the uniform temperature condition, and simultaneously, electronic device will produce certain heat when work, make its temperature constantly raise.The normal operating temperature range of electronic device is generally-5～+ 65 ℃, and the maximum working temperature that allows is at 100～120 ℃.Too high or too low temperature all can reduce the performance of electronic device, even causes components from being damaged.Control electronic product and in certain temperature range, work, just must preheating also dispel the heat for too high chip or the too high device surface of temperature of some temperature.Along with electronic technology develops rapidly, the intensive and miniaturization of the high frequency of electronic device, high speed and large scale integrated circuit makes the caloric value of unit volume electronic device increase fast.With the microelectronic chip is example, has generally reached 60～90W/cm at present
2, be up to 200W/cm
2More than, the dissipation from electronic devices technology more and more becomes technology very crucial in electronic product exploitation, the development, and the quality of dissipation from electronic devices performance directly has influence on electronic product reliability and service behaviour.Result of study shows that temperature of electronic component reduces by 1 ℃, and its failure rate can reduce 4%; If increase by 10～20 ℃, then failure rate improves 100%.Yet the heat convection method of traditional dependence monophasic fluid and air blast cooling method are difficult to satisfy the heat radiation requirement of many electronic devices.
The dissipation from electronic devices technology mainly contains air-cooled technology and liquid cools technology two big classes at present.Air-cooled technology is present most widely used electronics cooling technology, comprises free convection air-cooled technology and forced convertion air-cooled technology.The free convection air-cooled technology is mainly used in the less electronic device of volume heating power.For the bigger electronic device of volume heating power, reach 7W as single device power consumption, when plate level power consumption surpasses 300W, generally then adopt the forced convertion air-cooled technology.At present, generally using of forced air-cooling radiator in conjunction with hot pipe technique, can strengthen the cooling capacity of air cooling technique, but still there are between the little and radiator of effective heat transfer area problems such as the low and densification poor performance of bigger, the single heat transfer efficiency of thermal resistance in heat pipe, has influenced its application in the high power electronic device.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, the high efficiency heat radiation cool plate for electronic device that a kind of compactness is integrated, stable, heat exchange efficiency is high is provided.
Realize that technical scheme of the present invention is: a kind of high efficiency heat radiation cool plate for electronic device, comprise three-dimensional saw tooth fin cold plate and surface evaporation plate, the surface of surface evaporation plate has porous, and the bottom, hole is connected to each other with capillary channel; Three-dimensional saw tooth fin cold plate and surface evaporation plate are fitted welding and are formed closed cavity, are filled with operation material in cavity.
The preferred porose and capillary channel of roughly filling full surface evaporation plate of the operation material that is filled, the operation material preferred water, ethanol or the cold-producing medium that fill in the cavity.
High efficiency heat radiation cool plate for electronic device of the present invention, its operation principle is, carburation by evaporation after working media absorbs heat from high temperature heat source by evaporation plate, under the driving of pressure reduction, move to cold plate, cool off after the low-temperature heat source heat release at coldplate gas and to condense, condensate liquid relies on the capillary force of porous surface to return evaporation plate, and evaporation constantly circulates with condensation process, finishes the transmission of heat from high temperature to low temperature.
High efficiency heat radiation cool plate for electronic device of the present invention utilizes the evaporative condenser process of working media, has strengthened the transmittance process of heat.Three-dimensional saw tooth fin structural deterioration the gas heat-transfer boundary layer, excited the turbulence of gas, strengthened condensation process; The machining surface loose structure provides more gasification cores, has promoted internal liquid to flow, and has strengthened boiling heat transfer, thereby improves rate of heat transfer.High efficiency heat radiation cool plate and existing electronic radiation device are integrated simple, and contact area increases, and makes the device densification, to save the space, save material and to improve the stability of running.The present invention can be widely used in the heat dissipation equipment of all kinds of high power electronic devices such as graphics acceleration card, CPU.
The present invention compared with prior art has the following advantages and effect:
1. high efficiency heat radiation cool plate for electronic device of the present invention, compact conformation, processing is simple, can solve heating power at 100W/cm
2Above dissipation from electronic devices.
2. high efficiency heat radiation cool plate for electronic device of the present invention utilizes the evaporative condenser process of working media, has strengthened the transmittance process of heat.Three-dimensional saw tooth fin structural deterioration the gas heat-transfer boundary layer, excited the turbulence of gas, strengthened condensation process; The machining surface loose structure provides more gasification cores, has promoted internal liquid to flow, and has strengthened boiling heat transfer, thereby improves rate of heat transfer.
3. high efficiency heat radiation cool plate for electronic device of the present invention, stable, dependable performance, long service life.
Description of drawings
Fig. 1 is apparatus of the present invention structural representation.
Fig. 2 is the cutaway view of Fig. 1.
Fig. 3 is the cold plate structural representation among Fig. 2.
Fig. 4 is the evaporation plate structural representation among Fig. 2.
Among the figure: 1 cold plate, 2 evaporation plate, 3 applying solders side, the three-dimensional saw tooth fin of 4 cold plates, the porous surface structure of 5 evaporation plate.
Embodiment
The present invention is described in further detail below in conjunction with accompanying drawing.
As shown in Figure 1, 2, high efficiency heat radiation cool plate for electronic device of the present invention comprises three-dimensional saw tooth fin cold plate 1 and surface evaporation plate 2, and among Fig. 4, the surface of surface evaporation plate has porous, and the bottom, hole is connected to each other with capillary channel; Shown in Figure 2, three-dimensional saw tooth fin cold plate (structure as shown in Figure 3) is fitted welding and is formed closed cavity with surface evaporation plate, is filled with operation material in cavity.
As depicted in figs. 1 and 2, high efficiency heat radiation cool plate for electronic device, length and width thickness is respectively 80mm, 80mm and 8mm, and being fitted by cold plate 1 and evaporation plate 2 is welded.Described cold plate 1 is to be on the smooth red copper substrate surface of 3mm at thickness, and the machining process of cutting extruding by plough forms fine and closely woven three-dimensional saw tooth fin 4.Described evaporation plate 2 is to be on the smooth red copper substrate surface of 3mm at thickness, and the machining process of cutting extruding by plough forms the bottom with the interconnected porous surface structure 5 of capillary channel.The evaporating surface and the electronic device chip of high efficiency heat radiation cool plate are close to, and cryosurface and forced convertion electronic radiation device are close to.High efficiency heat radiation cool plate adopts pure water as working media, the pure water volume that is filled approximates the volume differences of processing front and back evaporation plate, pure water, moves to cold plate under the driving of pressure reduction from the porous surface carburation by evaporation of high temperature heat source chip surface heat absorption back in evaporation plate by evaporation plate.On the cold plate surface, water vapour cools off after the Cryogenic air heat release of forcing by radiator and condenses, condensed water relies on the capillary force of porous surface to return evaporation plate, and evaporation constantly circulates with condensation process, finishes the transmission of heat from the high temperature chip to Cryogenic air.Can solve heating power is 120W/cm
2The heat dissipation problem of electronic device chip, the chip surface temperature is 70-80 ℃.
As depicted in figs. 1 and 2, high efficiency heat radiation cool plate for electronic device, length and width thickness is respectively 60mm, 60mm and 7mm, and being fitted by cold plate 1 and evaporation plate 2 is welded.Described cold plate 1 is to be on the smooth red copper substrate surface of 2.5cm at thickness, and the machining process of cutting extruding by plough forms fine and closely woven three-dimensional saw tooth fin 4.Described evaporation plate 2 is to be on the smooth red copper substrate surface of 2.5mm at thickness, and the machining process of cutting extruding by plough forms the bottom with the interconnected porous surface structure 5 of capillary channel.The evaporating surface and the electronic device chip of high efficiency heat radiation cool plate are close to, and the cryosurface of high efficiency heat radiation cool plate and forced convertion electronic radiation device are close to.High efficiency heat radiation cool plate adopts ethanol as working media, the volume of the ethanol that is filled approximates the volume differences of processing front and back evaporation plate, ethanol, moves to cold plate under the driving of pressure reduction from the porous surface carburation by evaporation of high temperature heat source chip surface heat absorption back in evaporation plate by evaporation plate.On the cold plate surface, alcohol vapour cools off after the Cryogenic air heat release of forcing by radiator and condenses, condensate liquid relies on the capillary force of porous surface to return evaporation plate, and evaporation constantly circulates with condensation process, finishes the transmission of heat from the high temperature chip to Cryogenic air.Can solve heating power is 80W/cm
2The heat dissipation problem of electronic device chip, the chip surface temperature is 60-70 ℃.
As depicted in figs. 1 and 2, high efficiency heat radiation cool plate for electronic device, length and width thickness is respectively 50mm, 50mm and 6mm, and being fitted by cold plate 1 and evaporation plate 2 is welded.Described cold plate 1 is to be on the smooth red copper substrate surface of 2cm at thickness, and the machining process of cutting extruding by plough forms fine and closely woven three-dimensional saw tooth fin 4.Described evaporation plate 2 is to be on the smooth red copper substrate surface of 2mm at thickness, and the machining process of cutting extruding by plough forms the bottom with the interconnected porous surface structure 5 of capillary channel.The evaporating surface and the electronic device chip of high efficiency heat radiation cool plate are close to, and cryosurface and forced convertion electronic radiation device are close to.High efficiency heat radiation cool plate adopts cold-producing medium FC-72 as working media, the volume of the cold-producing medium FC-72 that is filled approximates the volume differences of processing front and back evaporation plate, cold-producing medium FC-72, moves to cold plate under the driving of pressure reduction from the porous surface carburation by evaporation of high temperature heat source chip surface heat absorption back in evaporation plate by evaporation plate.On the cold plate surface, cold-producing medium FC-72 steam cools off after the Cryogenic air heat release of forcing by radiator and condenses, condensate liquid relies on the capillary force of porous surface to return evaporation plate, and evaporation constantly circulates with condensation process, finishes the transmission of heat from the high temperature chip to Cryogenic air.Can solve heating power is 60-80W/cm
2The heat dissipation problem of electronic device chip, the chip surface temperature is 50-60 ℃.
Claims (3)
1, a kind of high efficiency heat radiation cool plate for electronic device is characterized in that comprising three-dimensional saw tooth fin cold plate and surface evaporation plate, and the surface of surface evaporation plate has porous, and the bottom, hole is connected to each other with capillary channel; Three-dimensional saw tooth fin cold plate and surface evaporation plate are fitted welding and are formed closed cavity, are filled with operation material in cavity.
2, high efficiency heat radiation cool plate for electronic device according to claim 1, it is characterized in that: the operation material that is filled is roughly filled the porose and capillary channel of full surface evaporation plate.
3, high efficiency heat radiation cool plate for electronic device according to claim 1 and 2 is characterized in that: the operation material that fills in the cavity is water, ethanol or cold-producing medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710027970 CN101052290A (en) | 2007-05-11 | 2007-05-11 | High efficiency heat radiation cool plate for electronic device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200710027970 CN101052290A (en) | 2007-05-11 | 2007-05-11 | High efficiency heat radiation cool plate for electronic device |
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| CN101052290A true CN101052290A (en) | 2007-10-10 |
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| CN 200710027970 Pending CN101052290A (en) | 2007-05-11 | 2007-05-11 | High efficiency heat radiation cool plate for electronic device |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102446879A (en) * | 2010-10-11 | 2012-05-09 | 哈米尔顿森德斯特兰德空间系统国际有限公司 | Monolithic cold plate configuration |
| CN103415185A (en) * | 2013-07-23 | 2013-11-27 | 昆山维金五金制品有限公司 | Aluminum radiating fin |
| CN104614963A (en) * | 2013-11-01 | 2015-05-13 | 东友科技股份有限公司 | Roller and fixation device provided with roller |
| CN104902727A (en) * | 2015-05-26 | 2015-09-09 | 华为技术有限公司 | Middle frame of mobile terminal and mobile terminal |
| CN105764300A (en) * | 2014-12-19 | 2016-07-13 | 富葵精密组件(深圳)有限公司 | Temperature-uniforming plate and manufacturing method thereof |
| CN105792613A (en) * | 2016-04-22 | 2016-07-20 | 华南理工大学 | Ultra-thin vapor chamber by using staggered plowing-extruding method for realizing vertical staggered fin structure and processing method thereof |
| CN107275319A (en) * | 2017-08-01 | 2017-10-20 | 厦门大学 | A kind of LED chip flat-plate heat pipe integrated encapsulation structure and preparation method thereof |
| CN107863330A (en) * | 2017-10-27 | 2018-03-30 | 西安交通大学 | A kind of grade micro-channel liquid cooling plate |
| CN109764737A (en) * | 2018-12-27 | 2019-05-17 | 西安交通大学 | The composite structure surface of refrigerant closed cycle flash boiling spray cooling reinforcing heat exchange |
| CN110391197A (en) * | 2019-06-13 | 2019-10-29 | 中国船舶重工集团公司第七二四研究所 | A kind of naval vessel radar radiator low thermal resistance enhanced heat exchange cold plate structure |
| CN111642116A (en) * | 2020-06-12 | 2020-09-08 | 中国船舶重工集团公司第七二四研究所 | Reinforced single-phase heat exchange cold plate based on electron beam surface modeling method and process method |
| CN112203476A (en) * | 2020-10-12 | 2021-01-08 | 上海海事大学 | Porous medium liquid film small channel cooling device |
| CN112212591A (en) * | 2019-07-12 | 2021-01-12 | 三星电子株式会社 | Device comprising a housing with a heat-dissipating structure and housing for a device |
| CN112802810A (en) * | 2019-11-13 | 2021-05-14 | 华为技术有限公司 | Temperature-uniforming plate and manufacturing method thereof |
| CN113340138A (en) * | 2021-07-02 | 2021-09-03 | 珠海德标光电科技有限公司 | Vapor chamber based on evaporation-boiling conversion and preparation method |
-
2007
- 2007-05-11 CN CN 200710027970 patent/CN101052290A/en active Pending
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102446879A (en) * | 2010-10-11 | 2012-05-09 | 哈米尔顿森德斯特兰德空间系统国际有限公司 | Monolithic cold plate configuration |
| CN103415185A (en) * | 2013-07-23 | 2013-11-27 | 昆山维金五金制品有限公司 | Aluminum radiating fin |
| CN104614963A (en) * | 2013-11-01 | 2015-05-13 | 东友科技股份有限公司 | Roller and fixation device provided with roller |
| CN105764300A (en) * | 2014-12-19 | 2016-07-13 | 富葵精密组件(深圳)有限公司 | Temperature-uniforming plate and manufacturing method thereof |
| CN104902727A (en) * | 2015-05-26 | 2015-09-09 | 华为技术有限公司 | Middle frame of mobile terminal and mobile terminal |
| CN104902727B (en) * | 2015-05-26 | 2018-06-19 | 华为技术有限公司 | The center and mobile terminal of a kind of mobile terminal |
| CN105792613A (en) * | 2016-04-22 | 2016-07-20 | 华南理工大学 | Ultra-thin vapor chamber by using staggered plowing-extruding method for realizing vertical staggered fin structure and processing method thereof |
| CN107275319B (en) * | 2017-08-01 | 2023-03-24 | 厦门大学 | LED chip flat heat pipe integrated packaging structure and preparation method thereof |
| CN107275319A (en) * | 2017-08-01 | 2017-10-20 | 厦门大学 | A kind of LED chip flat-plate heat pipe integrated encapsulation structure and preparation method thereof |
| CN107863330A (en) * | 2017-10-27 | 2018-03-30 | 西安交通大学 | A kind of grade micro-channel liquid cooling plate |
| CN107863330B (en) * | 2017-10-27 | 2019-03-01 | 西安交通大学 | A kind of grade micro-channel liquid cooling plate |
| CN109764737A (en) * | 2018-12-27 | 2019-05-17 | 西安交通大学 | The composite structure surface of refrigerant closed cycle flash boiling spray cooling reinforcing heat exchange |
| CN109764737B (en) * | 2018-12-27 | 2020-07-28 | 西安交通大学 | Composite structure surface for enhancing heat exchange of refrigerant closed circulation flash evaporation spray cooling |
| CN110391197A (en) * | 2019-06-13 | 2019-10-29 | 中国船舶重工集团公司第七二四研究所 | A kind of naval vessel radar radiator low thermal resistance enhanced heat exchange cold plate structure |
| CN112212591A (en) * | 2019-07-12 | 2021-01-12 | 三星电子株式会社 | Device comprising a housing with a heat-dissipating structure and housing for a device |
| US11839057B2 (en) | 2019-07-12 | 2023-12-05 | Samsung Electronics Co., Ltd | Apparatus with housing having structure for radiating heat |
| CN112802810A (en) * | 2019-11-13 | 2021-05-14 | 华为技术有限公司 | Temperature-uniforming plate and manufacturing method thereof |
| CN112802810B (en) * | 2019-11-13 | 2023-06-20 | 华为技术有限公司 | Uniform temperature plate and manufacturing method thereof |
| CN111642116A (en) * | 2020-06-12 | 2020-09-08 | 中国船舶重工集团公司第七二四研究所 | Reinforced single-phase heat exchange cold plate based on electron beam surface modeling method and process method |
| CN112203476A (en) * | 2020-10-12 | 2021-01-08 | 上海海事大学 | Porous medium liquid film small channel cooling device |
| CN113340138A (en) * | 2021-07-02 | 2021-09-03 | 珠海德标光电科技有限公司 | Vapor chamber based on evaporation-boiling conversion and preparation method |
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