CN104902727A - Middle frame of mobile terminal and mobile terminal - Google Patents
Middle frame of mobile terminal and mobile terminal Download PDFInfo
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- CN104902727A CN104902727A CN201510275653.5A CN201510275653A CN104902727A CN 104902727 A CN104902727 A CN 104902727A CN 201510275653 A CN201510275653 A CN 201510275653A CN 104902727 A CN104902727 A CN 104902727A
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Abstract
The invention relates to the technical field of mobile communication, and discloses a middle frame of a mobile terminal and the mobile terminal. The middle frame comprises a middle frame body, a heat radiation apparatus for radiating heat of devices is inlaid in the middle frame, and the thickness of the heat radiation apparatus is no greater than the thickness of the middle frame body. The heat radiation solution comprises two heat sinks oppositely arranged, and a capillary structure and a steam channel structure arranged between the heat sinks, and the capillary structure and the steam channel structure communicate with each other to form a gas-liquid loop. The capillary structure is filled with phase-changing working substances. The heat radiation apparatus for radiating heat of devices is inlaid in the middle frame, the heat radiation apparatus employs spliced heat sinks, and a capillary structure is formed between the two heat sinks. The thickness of the entire heat radiation apparatus is effectively reduced, and the thickness of the heat radiation apparatus is no greater than the thickness of the middle frame. Such a structure allows a mobile terminal to be designed thinner.
Description
Technical field
The present invention relates to the technical field of mobile communication, refer more particularly to a kind of center and mobile terminal of mobile terminal
Background technology
Smart mobile phone SP (Smart Phone) just integrated traditional function mobile phone FP (Feature Phone), notebook NB (Notebook), PDA, camera, projecting apparatus, walkman (Walkman), the function of MP3 etc. and business, as shown in Figure 1.Correspond, 2013SP mobile phone application processor (CPU) hardware configuration (dominant frequency & CPU check figure) develops rapidly, more than 2010 notebook NB CPU hardware configuration levels, and cannot use fan radiator.Following 3 years (2014-2016) is universal rapidly due to LTE's, and mobile Internet and high definition, the multimedia application of high-performance will bring the quick growth of data service, predict that in 2016 annual data business will be 5 times of 2013.For certain PXX SP mobile phone, battery size is constant, if do not take any measure, severe user model is by from the 0.2X days becoming 2016 for 0.9X days of 2013, and the Consumer's Experience of the best is one day.Visible, mobile terminal device power problems is in rapid deterioration, and the thermal design in the confined space becomes the following challenge constantly worsened.
In order to improve the situation of mobile terminal device power consumption, reduce the heat of center dies by thermal component in prior art and then lower energy consumption, to achieve these goals, a kind of scheme adopted in prior art is for adopting subsides graphite flake mode to be Primary Component heat radiation: namely paste graphite flake at positions such as radome, center, bonnets, solve hot localised points problem.But in this technical scheme, the heating under mobile phone peace rabbit rabbit runs point (CPU at full capacity) contour power consumption (Qmax_DP>10W), using mineral carbon dispels the heat, and CPU radiating effect can not meet the demands.And under the scenes such as game, LTE transfer of data, heat pipe problem highlights more.Another technical scheme is: adopt thin type heat pipe scheme, have two kinds of application modes.As: embed in (bonding) center (Huawei, Samsung, oppo) after heat pipe welding Copper Foil; Or: heat pipe welds/is bonded in above center: Sony Z2/3/ and NEC mediasX.But above-mentioned two schemes all exists following problem: 1) industry heat pipe thickness limit is 0.4mm at present, and increase the use of 0.1mm center, whole phase transformation module thickness is 0.5mm, therefore only can support the mobile phone application that center thickness is greater than 0.5mm in the application.2) Qmax≤4W of 0.4mm heat pipe, ultrathin heat pipe scheme can not meet instructions for use.
Therefore, in prior art, the good technical solution scheme of the heat radiation neither one for mobile terminal.
Summary of the invention
The invention provides a kind of center and mobile terminal of mobile terminal, in order to be applicable to the slimming development of mobile terminal.
First aspect, provide a kind of center of mobile terminal, this center comprises: center framework, described center framework is inlaid with the heat abstractor for dispelling the heat to device, and the thickness of described heat abstractor is not more than the thickness of described center framework, wherein, described heat abstractor comprises two heating panels put relatively, be arranged on the capillary pipe structure between described heating panel and steam passage structure, and described capillary pipe structure is communicated with described steam passage structure and forms gas-liquid loop, in described capillary pipe structure, be filled with phase-change working substance.
In conjunction with above-mentioned first aspect, in the implementation that the first is possible, described capillary pipe structure and described steam passage structure are arranged on one of them heating panel.
In conjunction with the first possible implementation of above-mentioned first aspect, in the implementation that the second is possible, described capillary pipe structure and steam passage structure are formed in described heating panel by micro-channel manufacturing process.
In conjunction with the first possible implementation of above-mentioned first aspect, in the implementation that the third is possible, the thickness of described two heating panels is different, and described capillary pipe structure and steam passage structure are arranged on the thicker heating panel of thickness.
In conjunction with above-mentioned first aspect, in the 4th kind of possible implementation, described heating panel is copper foil plate, aluminum slice, magnesium alloy thin slice or stainless steel thin slice.
In conjunction with implementation, the third possible implementation of first aspect, the 4th kind of possible implementation of first aspect that the second of the first possible implementation of above-mentioned first aspect, first aspect, first aspect is possible, in the 5th kind of possible implementation, in described two heating panels, be positioned at the heating panel that described center framework arranged the side of device and described center framework is structure as a whole.
In conjunction with the 5th kind of possible implementation of above-mentioned first aspect, in the 6th kind of possible implementation, described capillary pipe structure and described steam passage structure are arranged on the heating panel that described center framework is structure as a whole.
In conjunction with the 5th kind of possible implementation of above-mentioned first aspect, in the 7th kind of possible implementation, also comprise and to be arranged on described heating panel and for the radome of fixing described device.
In conjunction with above-mentioned first aspect, in the 8th kind of possible implementation, described phase-change working substance is water, cold-producing medium or ammonia.
Second aspect provides a kind of mobile terminal, and this mobile terminal comprises the center of the mobile terminal described in above-mentioned any one.
According to the center of the mobile terminal that first aspect provides, the mobile terminal that second aspect provides, in the present embodiment, in center framework, inlay heat abstractor by employing to dispel the heat to device, heat abstractor adopts heating panel splicing, and capillary pipe structure is formed between two heating panels, the thickness of whole heat abstractor can be effectively reduced, the thickness of heat abstractor is made to be not more than the thickness of center, and heat abstractor adopts the mode of inlaying to be arranged in center, reduce the space that heat abstractor takies greatly, be conducive to the slimming development of mobile terminal.
Accompanying drawing explanation
The cutaway view of the center of the mobile terminal that Fig. 1 provides for the embodiment of the present invention;
The vertical view of the center of the mobile terminal that Fig. 2 provides for the embodiment of the present invention;
The vertical view of the center of the mobile terminal that Fig. 3 provides for another embodiment of the present invention;
The cutaway view of the center of the mobile terminal that Fig. 4 provides for another embodiment of the present invention;
The cutaway view of the center of the mobile terminal that Fig. 5 provides for another embodiment of the present invention;
The cutaway view of the center of the mobile terminal that Fig. 6 provides for another embodiment of the present invention;
The capillary pipe structure of center of the mobile terminal that Fig. 7 provides for another embodiment of the present invention and the schematic diagram of steam passage structure.
Reference numeral:
10-center framework 11-groove 20-heat abstractor
21-first heating panel 22-second heating panel 23-capillary pipe structure
24-steam passage structure 25-heating panel 30-radome
40-device
Embodiment
Below in conjunction with accompanying drawing, specific embodiments of the invention are described in detail.Should be understood that, embodiment described herein, only for instruction and explanation of the present invention, is not limited to the present invention.
As shown in Figure 1, Fig. 1 shows a kind of structure of the center of the mobile terminal that the embodiment of the present invention provides.
Embodiments provide a kind of center of mobile terminal, this center comprises: center framework 10, center framework 10 is inlaid with the heat abstractor 20 for dispelling the heat to device 40, and the thickness of heat abstractor 20 is not more than the thickness of center framework 10, wherein, heat abstractor 20 comprises two heating panels put relatively, be arranged on the capillary pipe structure 23 between heating panel and steam passage structure 24, and capillary pipe structure 23 is communicated with steam passage structure 24 and forms gas-liquid loop, in capillary pipe structure 23, be filled with phase-change working substance.
In technique scheme, in center framework 10, inlay heat abstractor 20 pairs of devices 40 by employing to dispel the heat, wherein thermal component adopts two assembled formation of the heating panel be oppositely arranged, and define capillary pipe structure 23 and steam passage structure 24 between two heating panels, and phase-change working substance is filled in capillary pipe structure 23, after heating panel absorbs the heat of device 40, passed to phase-change working substance, phase-change working substance forms gaseous state, and when flowing through steam passage structure 24, transfer heat on the heating panel away from device 40 and distribute, form liquid after the phase-change working substance cooling of gaseous state and flow into continuation circulation in capillary pipe structure 23, thus the heat that device 40 gives out is distributed, effectively reduce the temperature of device 40, and when adopting said structure, heat abstractor 20 adopts two pieces of heating panel welding or bonding integral, and capillary pipe structure 23 is formed between two heating panels, the thickness of whole heat abstractor 20 can be effectively reduced, the thickness of heat abstractor 20 is made to be not more than the thickness of center, and heat abstractor 20 adopts the mode of inlaying to be arranged in center, reduce the space that heat abstractor 20 takies greatly, be conducive to the slimming development of mobile terminal.
Conveniently to the understanding of the structure of the center that the embodiment of the present invention provides, below in conjunction with concrete accompanying drawing and embodiment, its structure and working principle is described in detail.
First with reference to figure 2 and Fig. 3, wherein Fig. 2 and Fig. 3 respectively illustrates different heat abstractors 20 and is arranged on schematic diagram in center framework 10.As can be seen from Fig. 2 and Fig. 3, the planform of the heat abstractor 20 that the present embodiment provides does not limit, can determine according to the setting position of the device 40 in center framework 10, and the shape of heat abstractor 20 is not limited to the setting position of above-mentioned concrete device 40, can by detecting the temperature in center framework 10, position higher for temperature in center framework 10 is all arranged the heat abstractor 20 that upper the present embodiment provides, as shown in Figures 2 and 3, the plan view shape after in center framework 10 that is embedded in of heat abstractor 20 can for " L " font as shown in Figure 2, also can as shown in Figure 3 T-shaped, but should be understood that, the outer shape of the heat abstractor 20 that the present embodiment provides is not limited only to the shape shown in above-mentioned Fig. 2 and Fig. 3, can also be that other can reduce arbitrarily the shape of center framework 10 framework temperature.
Except the outer shape of above-mentioned heat abstractor 20 and setting position, the concrete structure of the heat abstractor 20 that the present embodiment provides also can adopt different forms, is described below in conjunction with concrete accompanying drawing.
As shown in Fig. 1 and Fig. 4, Fig. 1 and Fig. 4 shows the heat abstractor 20 of two kinds of different structures that the embodiment of the present invention provides.
Wherein, as shown in Figure 1, heat abstractor 20 comprises two heating panels relatively put, be respectively the first heating panel 21 and the second heating panel 22, when specifically arranging, the first heating panel 21 and the second heating panel 22 can adopt different Heat Conduction Materials to make, as copper foil plate, aluminum slice, magnesium alloy thin slice or stainless steel thin slice etc., preferably, the first heating panel 21 and the second heating panel 22 are the copper foil plate adopting copper foil material to make.Capillary pipe structure 23 in above-described embodiment and steam passage structure are all arranged on the first heating panel 21 or the second heating panel 22.When specifically arranging, the first heating panel 21 and the second heating panel 22 adopt different thickness.And capillary pipe structure 23 and steam passage structure 24 are arranged on a thicker heating panel of thickness.Concrete, above-mentioned first heating panel 21 is arranged on one side center framework 10 being arranged device 40, and namely device 40 is set directly on the first heating panel 21, or is fixedly connected with the first heating panel 21 by other connectors.Second heating panel 22 is arranged on one side center framework 10 deviating from and arranges device 40.When specifically arranging, the structure shown in Fig. 1 and Fig. 4.In FIG, the thickness of the first heating panel 21 is thicker than the thickness of the second heating panel 22, and now, capillary pipe structure 23 and steam channel are arranged on the first heating panel 21.The thickness that Fig. 4 shows the second heating panel 22 is thicker than the thickness of the first heating panel 21, and now, capillary pipe structure 23 and steam passage structure 24 are arranged on the second heating panel 22.
Wherein, above-mentioned capillary pipe structure 23 and steam passage structure 24 are formed in heating panel by micro-channel manufacturing process.Concrete, adopt laser engraving, erosion carving or other micro-channel manufacturing process to form capillary pipe structure 23 and steam passage structure 24 on the first heating panel 21 or the second heating panel 22.
When specifically arranging, first by an above-mentioned micro-channel manufacturing process heating panel wherein forms conduit, and in center framework 10, mill out the cell body of a hollow out, for fixing the first heating panel 21 and the second heating panel 22, two heating panels respectively therefrom the both sides of circle body 10 be embedded on the cell body of this hollow out, and be spliced to form radiator structure, and in the process of inlaying, in conduit, fill phase-change working substance.Conduit between two heating panels forms above-mentioned capillary pipe structure 23 and steam channel.Phase-change working substance is wherein water, cold-producing medium or ammonia.Or adopt other any liquids that may be used for dispelling the heat.
In addition, as the preferred scheme of one.Wherein, in two heating panels, the heating panel and the center framework 10 that are positioned at side center framework 10 being arranged device 40 are structure as a whole.
Concrete, as shown in Figures 5 and 6, Fig. 5 and Fig. 6 shows other two kinds of versions of the center that the present embodiment provides.
In this scheme, namely a part for center framework 10 is as the first heating panel 21 or the second heating panel 22.Concrete, when making, center framework 10 is milled out a groove 11, this groove 11 is for fixing another heating panel 25, and the diapire of groove 11 and another heating panel 25 form the heat abstractor 20 in above-described embodiment.
When arranging, the setting direction of this groove 11 is center framework 10 deviates from the one side of device 40 setting direction.And when specifically arranging, the setting position of capillary pipe structure 23 and steam channel can be selected, as shown in Figure 5, in middle frame structure shown in Fig. 5, the thickness of the diapire of groove 11 is greater than the degree of depth of groove 11, namely be greater than the thickness of heating panel 25, now, on the diapire of groove 11, form conduit by the micro-channel manufacturing process in above-mentioned.And heating panel 25 is when docking, this conduit is made to form capillary pipe structure 23 in above-described embodiment and steam channel, and before heating panel 25 docks, phase-change working substance is filled in conduit, in the structure shown in Fig. 5, namely employing capillary pipe structure 23 and steam passage structure 24 are arranged on heating panel 25 this kind of structure that center framework 10 is structure as a whole.
Or, adopt structure as shown in Figure 6, in the structure shown in Fig. 6, the thickness of the diapire of groove 11 is less than the thickness of heating panel 25, now, the conduit of above-mentioned capillary pipe structure 23 and steam passage structure 24 is arranged on heating panel 25, specifically as shown in Figure 6, now, the thickness of the diapire of groove 11 is less than the thickness of heating panel 25, above-mentioned conduit is all arranged on heating panel 25, and form conduit on a metal plate by micro-channel manufacturing process, afterwards, phase-change working substance is filled in conduit, and heating panel 25 is fixed in groove 11, capillary pipe structure 23 and steam passage structure 24 is formed between the diapire of groove 11 and conduit.
In the above-described embodiments, no matter adopt the structure shown in Fig. 5, or adopt the structure shown in Fig. 6, the device 40 on center is all arranged on the one side deviating from heating panel, the diapire that namely device 40 is arranged on groove 11 deviates from the one side of cell body.
When device 40 is specifically arranged, preferably, center also comprises and to be arranged on heating panel and for the radome 30 of immobilising device 40.Namely by radome 30, device 40 and center framework 10 are coupled together, avoid radiator structure and center framework 10 pairs of devices 40 to cause interference.
For the steam passage structure 24 provided in above-mentioned specific embodiment and capillary pipe structure 23, when being formed by micro-channel manufacturing process, its structure can be as shown in Figure 7, Fig. 7 shows the structure of the conduit of formation, as seen from Figure 7, the steam passage structure 24 formed be communicated with between capillary pipe structure 23 to form gas-liquid loop, thus facilitate phase-change working substance to carry out heat exchange.
The middle frame structure conveniently provided the present embodiment has one to get information about, and the size that device is strengthened in the heat radiation provided in the present embodiment can be made: 0.2mm (0.1mm conduit and steam channel)+0.1mm Copper Foil (wall, fixing)=0.3mm (center thickness).And current the thinnest 0.4mm+0.1mm Copper Foil (the fixing)=0.5mm (the thinnest center thickness) that can accomplish of ultrathin heat pipe, therefore, the middle frame structure adopting the present embodiment to provide can be conducive to the slimming development of mobile terminal.In addition, the heat abstractor 20 that the cooperation center that the present embodiment provides uses limits little in width, radius of turn equidimension.And steam inside and liquid backflow separate completely, internal flow resistance is little.Compared with radiator structure of the prior art, MLHP heat-transfer path width can design according to chip package size, if M7 chip package is 15*15, the width therefore designing MLHP lower floor paillon foil is just 15mm, and the Breadth Maximum that the current 0.4mm of thin type heat pipe can accomplish is 6.15mm.But the radiator structure that the present embodiment provides, the thickness of its entirety is not more than the thickness of center framework 10, therefore, can not impact the thickness of whole mobile terminal.
The embodiment of the present invention can utilize phase-change heat transfer principle on the slim center of mobile phone, solves hot localised points problem.It is 0.55mm that industry commonly uses the current industry thickness limit of general heat pipe+Copper Foil scheme, and this invention can apply phase-change heat transfer on the center of 0.3/0.35mm, solves hot localised points problem.Emulation: the checking of PX mobile phone is known, and chip temperature reduces by 5 DEG C, phone housing temperature reduces by 2 ~ 3 DEG C.
(2) this design does not affect by angle of turn, because the realization of structure corner is for this reason realized by punching press/welding, therefore designs the size of upper angle, the diversity (fire end, many condensation branch roads) of heat-transfer path all can realize.And at present the thinnest heat pipe (0.4mm) performance after bending significantly fails.
(3), in this invention, phase-change heat transfer path width can be accomplished the same with the upper surface of device 40 wide, and most of heat that chip spreads out of is passed to low-temperature region by this path.And the heat pipe thickness 0.4mm of current limit ultrathin, the heat pipe largest diameter that can do is 4mm heat pipe, because along with the increase of heat pipe caliber, the heat pipe sealing difficulty of thin pipe wall strengthens, and therefore heat pipe restricted width, the heat taken away from chip is also limited.And there are not the problems referred to above in the present invention.
The embodiment of the present invention additionally provides a kind of mobile terminal, and this mobile terminal comprises the center of the mobile terminal of above-mentioned any one.
In technique scheme, in center framework 10, inlay heat abstractor 20 pairs of devices 40 by employing to dispel the heat, wherein thermal component adopts two assembled formation of the heating panel be oppositely arranged, and define capillary pipe structure 23 and steam passage structure 24 between two heating panels, and phase-change working substance is filled in capillary pipe structure 23, after heating panel absorbs the heat of device 40, passed to phase-change working substance, phase-change working substance forms gaseous state, and when flowing through steam passage structure 24, transfer heat on the heating panel away from device 40 and distribute, form liquid after the phase-change working substance cooling of gaseous state and flow into continuation circulation in capillary pipe structure 23, thus the heat that device 40 gives out is distributed, effectively reduce the temperature of device 40, and when adopting said structure, heat abstractor 20 adopts heating panel to splice, and capillary pipe structure 23 is formed between two heating panels, the thickness of whole heat abstractor 20 can be effectively reduced, the thickness of heat abstractor 20 is made to be not more than the thickness of center, and heat abstractor 20 adopts the mode of inlaying to be arranged in center, reduce the space that heat abstractor 20 takies greatly, be conducive to the slimming development of mobile terminal.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (10)
1. the center of a mobile terminal, it is characterized in that, comprise center framework, described center framework is inlaid with the heat abstractor for dispelling the heat to device, and the thickness of described heat abstractor is not more than the thickness of described center framework, wherein, described heat abstractor comprises two heating panels put relatively, be arranged on the capillary pipe structure between described heating panel and steam passage structure, and described capillary pipe structure is communicated with described steam passage structure and forms gas-liquid loop, in described capillary pipe structure, be filled with phase-change working substance.
2. the center of mobile terminal as claimed in claim 1, it is characterized in that, described capillary pipe structure and described steam passage structure are arranged on one of them heating panel.
3. the center of mobile terminal as claimed in claim 2, it is characterized in that, described capillary pipe structure and steam passage structure are formed in described heating panel by micro-channel manufacturing process.
4. the center of mobile terminal as claimed in claim 2, is characterized in that, the thickness of described two heating panels is different, and described capillary pipe structure and steam passage structure are arranged on the thicker heating panel of thickness.
5. the center of mobile terminal as claimed in claim 1, it is characterized in that, described heating panel is copper foil plate, aluminum slice, magnesium alloy thin slice or stainless steel thin slice.
6. the center of the mobile terminal as described in any one of Claims 1 to 5, is characterized in that, in described two heating panels, is positioned at the heating panel that described center framework arranged the side of device and described center framework is structure as a whole.
7. the center of mobile terminal as claimed in claim 6, it is characterized in that, described capillary pipe structure and described steam passage structure are arranged on the heating panel that described center framework is structure as a whole.
8. the center of mobile terminal as claimed in claim 6, is characterized in that, also comprises being arranged on described heating panel and for the radome of fixing described device.
9. the center of mobile terminal as claimed in claim 1, it is characterized in that, described phase-change working substance is water, cold-producing medium or ammonia.
10. a mobile terminal, is characterized in that, comprises the center of the mobile terminal as described in any one of claim 1 ~ 9.
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| CN201510275653.5A CN104902727B (en) | 2015-05-26 | 2015-05-26 | The center and mobile terminal of a kind of mobile terminal |
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