CN110708925A

CN110708925A - Heat conduction device and terminal equipment

Info

Publication number: CN110708925A
Application number: CN201910819109.0A
Authority: CN
Inventors: 张军; 靳林芳; 杨杰; 施健
Original assignee: Huawei Technologies Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2019-08-30
Filing date: 2019-08-30
Publication date: 2020-01-17
Also published as: CN113950232B; WO2021036701A1; CN113950232A

Abstract

The application provides a heat-conducting device and terminal equipment. Relates to the field of heat dissipation. The heat conduction device comprises a shell and a capillary structure arranged inside the shell, wherein: the capillary structure is clamped in the shell and adsorbs the liquid working medium to form a liquid circulation channel, the capillary structure divides the inner space of the shell into a plurality of sections, and the plurality of sections can be used as gas circulation channels of the heat conduction device; the liquid circulation channel is communicated with the gas circulation channel, so that the liquid working medium is evaporated into gas which can enter the gas circulation channel, and the gas is condensed into liquid which can enter the liquid circulation channel, thereby forming a vapor-liquid coexisting bidirectional circulation system in the shell, and realizing the conduction and the diffusion of heat generated by the heating element in the terminal equipment by the heat conduction device.

Description

Heat conduction device and terminal equipment

Technical Field

The application relates to the technical field of heat dissipation equipment, in particular to a heat conduction device and terminal equipment.

Background

Along with the increasing of the intelligent degree of the mobile phone, the upgrading of the main frequency generates more heat, and the excessive heat causes the overhigh temperature rise of the mobile phone, so that the heat dissipation is influenced. In order to solve the heat dissipation problem of the mobile phone, a heat pipe is usually disposed in the mobile phone.

The heat pipe technology belongs to the two-phase heat radiation technology, the heat pipe structure mainly comprises a pipe shell, a liquid absorption core and a working medium, and is functionally divided into an evaporation section, a heat insulation section and a condensation section, and the working principle is as follows: when the evaporation section of the heat pipe is heated, the liquid in the capillary core in the area is evaporated and vaporized, a large amount of heat is taken away, steam flows to the condensation section under the micro pressure difference, the steam is condensed into liquid after the heat is released in the condensation section, and the liquid returns to the evaporation section under the action of capillary force generated by the liquid absorption core, so that a heat conduction cycle is completed, and a bidirectional circulation system with the coexistence of the steam and the liquid is formed.

At present, when a heat pipe is manufactured, the manufacturing process of the heat pipe is multiple, and multiple high-temperature processes such as capillary sintering, reduction and the like are needed, so that the overall strength of the heat pipe is poor, and the product is poor easily in the whole production process and the turnover process of each process.

Disclosure of Invention

The technical scheme provides a heat conduction device and terminal equipment to improve heat conduction device's product yield.

In a first aspect, the present application technical scheme provides a heat conduction device, and this heat conduction device includes the casing, is provided with the capillary structure in the casing, and wherein, the inner wall extrusion capillary structure of casing to realize the fixed of capillary structure. The fixing of the capillary structure is realized through an extrusion mode, and the hot processing procedure of the heat conduction device in the processing process can be effectively avoided, so that the structure of the heat conduction device is more reliable.

In addition, the capillary structure can absorb the liquid working medium and make the liquid working medium flow under the action of the capillary force to form a liquid circulation channel; in the interior of the housing, in addition to the space for arranging the capillary structure, other spaces may be used as gas flow channels. It will be appreciated that the liquid flow path is in communication with the gas flow path such that liquid working substance is evaporated to a gas which can enter the gas flow path and the gas is condensed to a liquid which enters the liquid flow path. When the heat conduction device is applied to terminal equipment, the heat dissipation of a heating element in the terminal equipment can be realized through vapor-liquid circulation of a liquid working medium in a liquid circulation channel and a gas circulation channel.

In a second aspect, the present technical solution also provides a terminal device, where the terminal device includes a display screen, a support structure, a rear housing, a printed circuit board, and a heat conduction device of the first aspect, where: the printed circuit board and the display screen are positioned on two sides of the supporting structure; and the heating element is arranged on the printed circuit board. In addition, the heating element cover is provided with a shielding cover, the heating element is contacted with the shielding cover through a thermal interface material, the shielding cover is contacted with the supporting structure through the thermal interface material, and the rear shell is positioned on one side of the printed circuit board. When the heat conduction device is specifically arranged on the terminal equipment, an accommodating groove can be formed in the supporting structure, an opening of the accommodating groove faces the rear shell, so that the heat conduction device can be accommodated in the accommodating groove, and the heat conduction device can be fixed by arranging the adhesive in the accommodating groove.

In this application technical scheme, the heat that terminal equipment's heating element produced can conduct to the shield cover through hot interface material, then conducts to heat-transfer device through the hot interface material between shield cover and the heat-transfer device, and the heat-transfer device scatters the heat in bearing structure. Then, the heat can be conducted to the rear shell through the convection radiation of the supporting structure, and the heat is conducted to the display screen after being transferred to the high heat conduction material layer through the convection radiation of the supporting structure; and finally, the heat is dissipated to the outside of the terminal equipment through the rear shell and the display screen.

Drawings

Fig. 1 is a schematic structural diagram of a terminal device according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a terminal device according to another embodiment of the present application;

fig. 3 is a schematic structural diagram of a terminal device according to another embodiment of the present application;

fig. 4 is a schematic structural diagram of a terminal device according to another embodiment of the present application;

FIG. 5 is a flow chart illustrating a process for fabricating a heat conducting device according to an embodiment of the present disclosure;

fig. 6 is a schematic diagram illustrating a process of forming a capillary structure according to an embodiment of the present disclosure;

FIG. 7 is a view of the auxiliary fixture in FIG. 6 from direction A;

fig. 8 is a schematic structural diagram of a heat conducting device according to an embodiment of the present application;

fig. 9 is a schematic structural diagram of a heat conducting device according to another embodiment of the present application;

fig. 10 is a schematic cross-sectional view illustrating a heat conducting device according to an embodiment of the present application;

fig. 11 is a schematic cross-sectional view illustrating a heat transfer device according to another embodiment of the present application;

FIG. 12 is a flow chart illustrating a process for fabricating a heat transfer device according to another embodiment of the present application;

FIG. 13 is a flow chart illustrating a process for fabricating a heat transfer device according to another embodiment of the present application;

FIG. 14 is a cross-sectional view of a heat transfer device according to another embodiment of the present application;

FIG. 15 is a cross-sectional view of a heat transfer device according to another embodiment of the present application;

FIG. 16 is a cross-sectional view of a heat transfer device according to another embodiment of the present application;

fig. 17 is a schematic cross-sectional view illustrating a heat transfer device according to another embodiment of the present application;

fig. 18 is a schematic cross-sectional view illustrating a heat transfer device according to another embodiment of the present application;

FIG. 19 is a cross-sectional view of a heat transfer device according to another embodiment of the present application;

FIG. 20 is a cross-sectional view of a heat transfer device according to another embodiment of the present application;

fig. 21 is a schematic cross-sectional view illustrating a heat transfer device according to another embodiment of the present application;

FIG. 22 is a cross-sectional view of a heat transfer device according to another embodiment of the present application;

fig. 23 is a schematic view illustrating an internal structure of a housing of a heat conduction device according to an embodiment of the present application.

Reference numerals:

1-a display screen; 2-a support structure; 201-a receiving groove; 3-rear shell; 4-PCB; 5-heat conducting means; 6-CPU;

7-a thermal interface material; 8-a shielding case; 9-a pipe material; 10-a capillary structure; 11-auxiliary tools; 12-the active end; 13-inactive end;

14-a housing; 15-gas flow-through channels; 16-projection.

Detailed Description

To facilitate understanding of the heat conduction device provided in the embodiment of the present application, an application scenario of the heat conduction device provided in the embodiment of the present application is first described below, where the heat conduction device may be disposed in a terminal device such as a mobile phone, a tablet computer, and a Personal Digital Assistant (PDA), and may disperse heat generated by a heat generating element such as a chip in the terminal device. The heating element includes, but is not limited to, a Central Processing Unit (CPU), an Artificial Intelligence (AI) processor, a system on chip (SoC), a power management unit, or other devices requiring heat dissipation. The following describes a specific arrangement manner of the heat conducting device in the terminal device in detail with reference to the accompanying drawings, so as to facilitate understanding of the process of conducting heat from the heat conducting device to the heating element.

Referring to fig. 1, in one embodiment of the present application, a terminal device may include a display screen 1, a support structure 2, a rear case 3, a printed circuit board (PCB 4), and a heat conducting device 5. The supporting structure 2 can be used to carry the PCB4 and the display screen 1, the display screen 1 and the PCB4 are located on two sides of the supporting structure 2, the rear housing 3 is located on one side of the PCB4, the heating element (for convenience of description, the heating element is taken as an example to be explained below) is disposed on the PCB4 and located between the PCB4 and the supporting structure 2, the CPU 6 is in contact with the supporting structure 2, the heat conducting device 5 is disposed on the supporting structure 2, and the heat conducting device 5 is disposed opposite to the CPU 6. In this way, heat generated by the CPU 6 can be conducted to the support structure 2 and then via the support structure 2 to the heat conducting means 5, by which the heat is dissipated 5. In addition, the heat can also be transferred to the rear shell 3 and the display screen 1 through convection radiation of the supporting structure 2, and is dissipated to the outside of the terminal equipment through the rear shell 3 and the display screen 1.

Referring to fig. 1, when the heat conducting device 5 is specifically disposed in the terminal device, a receiving groove 201 may be formed in the supporting structure 2, the receiving groove 201 being opposite to the heating element, and an opening of the receiving groove 201 faces the display screen 1, so that the heat conducting device 5 may be disposed in the receiving groove 201. The heat conducting device 5 may be bonded to the bottom of the accommodating groove 201 by adhesives such as adhesive, which may be but not limited to double-sided adhesive, or the heat conducting device 5 may be clipped into the accommodating groove 201, so that the heat conducting device 5 may be fixed to the supporting structure 2, and the connection thereof is reliable. It will be appreciated that the fixing of the heat conducting means 5 to the support structure 2 may be achieved by welding or the like, in addition to the above-mentioned connection means.

With continued reference to fig. 1, to improve the efficiency of the conduction of heat generated by the heat generating element, a Thermal Interface Material 7 may be disposed between the CPU 6 and the support structure 2, through which Thermal Interface Material 7 the CPU 6 is in contact with the support structure 2, wherein the Thermal Interface Material 7 may be a Tim Material (Thermal Interface Material). In addition, a layer (not shown) of high thermal conductivity material such as graphite film may be disposed between the support structure 2 and the display panel 1, wherein the layer of high thermal conductivity material may be bonded to the thermal conductor 5 and the support structure 2 by a double-sided adhesive tape. Referring to fig. 1, the heat generated by the CPU 6 will be described by taking as an example a terminal device provided with the above-described thermal interface material 7. The heat generated by the CPU 6 can be conducted in the direction indicated by the dotted line with an arrow in fig. 1, and the conducting path can be: heat generated by the CPU 6 is conducted to the support structure 2 through the thermal interface material 7; and then conducted to the heat conducting device 5 through the support structure 2, wherein the heat of the portion (hot end) of the heat conducting device 5 facing the CPU 6 is concentrated, and then the heat is conducted to the condensing end of the heat conducting device 5, thereby dispersing the heat in the support structure 2. Heat can be transferred to the rear shell 3 and the display screen 1 through convection radiation of the supporting structure 2; finally, the heat is dissipated to the outside of the terminal equipment through the rear shell 3 and the display screen 1.

Referring to fig. 2, in one possible embodiment, there is also provided a terminal device which, in comparison with the terminal device shown in fig. 1, differs in the way in which the heat conducting means 5 are arranged in the terminal device.

When the heat conducting device 5 is specifically disposed on the supporting structure 2 in the terminal device, an accommodating groove 201 may be formed on the supporting structure 2, an opening of the accommodating groove 201 faces the rear housing 3, and the heat conducting device 5 is accommodated in the accommodating groove 201. In this embodiment, a thermal interface material 7 may also be provided between the CPU 6 and the heat conducting means 5, the thermal interface material 7 being in contact with the CPU 6 and the heat conducting means 5. In addition, a layer of high thermal conductivity material such as a graphite film may be attached to the support structure 2, wherein the layer of high thermal conductivity material is disposed between the display screen 1 and the support structure 2. Since the conduction path of the heat generated by the CPU 6 in this embodiment is similar to that in the previous embodiment, it is not described here again.

Referring to fig. 3, in another possible embodiment, there is also provided a terminal device, in which a shield can 8 may be covered outside the CPU 6, and the shield can 8 may be connected to the ground copper of the PCB 4. Wherein the CPU 6 may be in contact with the shield can 8 through the thermal interface material 7 and the shield can 8 may also be in contact with the support structure 2 through the thermal interface material 7.

In this embodiment, among other things, the heat generated by the CPU 6 may be conducted through the thermal interface material 7 to the shield can 8, then through the thermal interface material 7 between the shield can 8 and the support structure 2 to the support structure 2, and then through the support structure 2 to the heat conducting means 5, after which the heat conducting means 5 spreads the heat out in the support structure 2. Heat can be conducted to the rear housing 3 and the display screen 1 by convection radiation of the support structure 2; finally, the heat is dissipated to the outside of the terminal equipment through the rear shell 3 and the display screen 1.

Referring to fig. 4, in another possible embodiment, a terminal device is further provided, which is different from the above embodiments in that a heat conducting device 5 is disposed on the rear case 3, the PCB4 is disposed on the supporting structure 2, a heating element (for convenience of description, the heating element is taken as an example as the CPU 6) is disposed on the PCB4 and located between the PCB4 and the rear case 3, and the CPU 6 is in contact with the heat conducting device 5 through a thermal interface material 7.

With reference to fig. 4, when the heat conducting device 5 is disposed on the rear housing 3, a receiving groove 201 may be disposed in the rear housing 3, an opening of the receiving groove 201 is disposed toward the supporting structure 2, and the heat conducting device 5 is received in the receiving groove 201. For example, the heat conducting device 5 may be directly inserted into the receiving groove 201 as shown in fig. 4 and be clamped with the groove wall of the receiving groove 201, or may be adhered to the groove bottom of the receiving groove 201 by an adhesive such as an adhesive, so that the heat conducting device 5 can be fixed to the rear housing 3, and the connection is reliable.

Thus, the heat generated by the CPU 6 can be conducted to the heat conducting device 5, dissipated by the heat conducting device 5, conducted to the rear case 3, and dissipated to the outside of the terminal device through the rear case 3. In addition, the heat can also be conducted to the supporting structure 2 through the PCB4, and then the heat is conducted to the rear case 3 and the display screen 1 through convection radiation of the supporting structure 2, and is dissipated to the outside of the terminal device through the rear case 3 and the display screen 1.

In order to understand the process of the heat conducting device 5 conducting heat to the heating element, besides the way of disposing the heat conducting device 5 in the terminal device shown in the above embodiments, it is necessary to understand the structure and the manufacturing process of the heat conducting device 5, and the following describes the manufacturing process of the heat conducting device 5 and the structure of the manufactured heat conducting device 5 in detail with reference to the drawings.

Referring to fig. 5, fig. 5 shows a manufacturing process flow of the heat conducting device 5 according to a possible embodiment, specifically:

step 001: and (4) pre-flattening the pipe. The tube may be a metal tube, and the specific material of the metal tube may be, but is not limited to, copper, aluminum, alloy steel, stainless steel, carbon steel, or the like. In addition, the cross-sectional shape of the tube may be a regular shape, for example: circular, square, etc., and may also be irregular, such as wavy, etc. After the tube is subjected to the pre-flattening process, the height of the cross section of the tube can reach 0.5mm (in the application, the process flow is described by taking the pre-flattened height of the tube as 0.5mm as an example), and the cross section of the tube can be flat by pre-flattening the tube, so that the subsequent filling of a capillary structure is facilitated.

Step 002: and cleaning the pipe subjected to pre-flattening. The cleaning process may determine which cleaning scheme is adopted according to the surface condition of the pipe, for example, but not limited to, a manner of pickling and ultrasonic water washing.

In addition, the materials are put into use as soon as possible after the cleaning is finished so as to prevent the surface of the pipe from being oxidized with oxygen after being placed in the air for a long time; if the pipe material needs to be placed for a long time, the pipe material can be placed in the nitrogen box body for storage.

Step 003: and the capillary structure is penetrated. The capillary structure can be formed by conventionally weaving copper wires, the wire diameter D is 0.03/D0.05mm, the number of the copper wires is different, and dozens to hundreds of the copper wires are available, and the capillary structure can be selected according to requirements. In addition, the capillary structure may also be a sintered strip structure of powder (e.g., metal powder).

When specifically wearing to locate capillary structure 10 in the tubular product 9 of flattening in advance, can accomplish with the help of supplementary tool 11, wherein, supplementary tool 11 can include two clamping parts 111 of relative setting, and capillary structure 10 can set up in the draw-in groove between two clamping parts 111. Specifically, referring to fig. 6, first, the capillary structure 10 is placed in the clamping groove of the auxiliary fixture 11; then, simultaneously placing the auxiliary jig 11 and the capillary structure 10 into the pipe 9 which is subjected to the pre-flattening, and inserting the auxiliary jig and the capillary structure to the specified depth of the pipe 9; then, flattening the pipe 9 for the second time to the design specification (for example, 0.4mm), and clamping the capillary structure 10 on the inner wall of the pipe 9; finally, the auxiliary fixture 11 is taken out to realize the penetration of the capillary structure 10. It should be noted that, when the auxiliary fixture 11 is selected, the auxiliary fixture 11 may be a metal or a non-metal, such as stainless steel, graphite, etc. Referring to fig. 7, fig. 7 is a view of the auxiliary fixture 11 provided with the capillary structure 10 in fig. 6, and as can be seen from fig. 7, the width d1 of the auxiliary fixture 11 is slightly smaller than the width d2 of the capillary structure 10. Referring to fig. 6 and 7 together, when the capillary structure 10 is placed in the tube 9 along with the auxiliary tool 11, the tube 9 may be hit along the direction B shown in fig. 7, so that the tube 9 extrudes the capillary structure 10, and the capillary structure 10 is clamped in the tube 9. Because the width d1 of the auxiliary fixture 11 is smaller than the width d2 of the capillary structure 10, the auxiliary fixture 11 will not be stuck on the inner wall of the tube 9 when the tube 9 is hit, so that the auxiliary fixture 11 can be easily pulled out after the capillary structure 10 is stuck on the tube 9.

Step 004: and sealing the effective end. In the subsequent manufacturing process, the capillary structure needs to be filled with liquid (working medium), so that a liquid filling port needs to be reserved at the end part of the pipe, and the liquid filling port needs to occupy part of the boundary space for plugging, so that referring to fig. 8, one end for filling liquid can be called an invalid end 13, and the other end can be called an effective end 12. When sealing the active end 12, the end may be pressed and then sealed using gas welding, arc welding (e.g., argon arc welding), resistance welding, laser welding, induction welding, and the like. Because the sealing structure formed by pressing the jig is simple, and the length L1 of the seal in the extending direction of the pipe is smaller, the sealing effect can be good by pressing and welding, the reliability of the cavity closure is ensured, and the length L1 of the seal in the extending direction of the pipe can be controlled within 1mm by adopting the mode, so that the heat-conducting property of the heat-conducting device can be effectively improved.

Step 005: and (4) reducing the pipe. Since the tube is in contact with air in the above steps, an oxide layer is formed on the surface of the tube. Taking a pipe as an example of a copper pipe, cuprous oxide is formed on the surface of the copper pipe when the copper pipe is placed in the air, and the wettability of a working medium is poor on the surface of the cuprous oxide, so that the overall performance of the formed heat conduction device is poor. Therefore, the copper pipe formed with cuprous oxide can be placed in a high-temperature environment, nitrogen-hydrogen mixed gas is introduced, and hydrogen and the cuprous oxide inside the pipe are subjected to reduction reaction, so that copper is completely replaced by pure copper, and the heat conductivity of the formed heat conducting device is promoted.

Step 006: injecting liquid into the pipe and vacuumizing. The injected liquid (i.e. working medium) is related to the material of the pipe, and is mainly the problem of compatibility, and if the working medium and the pipe generate chemical reaction to generate non-condensable gas, the performance of the heat conduction device is degraded until the heat conduction device fails. At present, a common pipe is copper or copper alloy, a working medium compatible with the common pipe can be water, the water is the most economic working medium, and certainly, the working medium can also be freon, ammonia, acetone, methanol, ethanol or the like. After the working medium is injected into the pipe, the working medium can flow under the action of the capillary force of the capillary structure.

In addition, when the interior of the pipe is vacuumized, air in the pipe can be pumped out of the pipe through vacuumized equipment, so that the interior of the pipe is in a vacuum environment, and the heat conducting performance of a heat conducting device formed by the pipe is prevented from being influenced.

Step 007: and (4) sealing the invalid end. With continued reference to fig. 8, conventionally, before the high-temperature sintering or reduction process, when the sealing of the ineffective end 13 of the pipe is performed, a pipe shrinking operation is performed on the end, so that an ineffective area with a length of L2 is formed at the end, and since the ineffective area cannot conduct heat, the smaller the ineffective area, the better the heat conductivity of the formed heat conduction device. In order to solve the above problem, in the present embodiment, after the invalid end 13 is sealed, a part of the invalid region may be cut off to make the invalid region of the invalid end 13 smaller; in addition, the sealing of the invalid end 13 can be realized by pressing the invalid end 13 and then welding the invalid end, so that the boundary section occupied by the invalid area of the invalid end 13 is further reduced. Referring to fig. 9, the length L2 of the seal of the invalid end 13 along the extending direction of the tube can be controlled within 0-5 mm, even within 1mm, by pressing and welding, so as to complete the sealing of the tube, and obtain the heat conduction device with the cross-sectional shape as shown in fig. 10, in which the capillary structure 10 is clamped inside the tube under the squeezing action of the tube wall.

In addition, before the liquid injection end of the pipe is sealed, the residual air in the pipe can be pushed out to the outside of the pipe by the steam generated by boiling the working medium through heating the pipe, so that the vacuum degree in the pipe is improved.

At the end of the manufacturing process of the heat conduction device in this embodiment, the sealed tube may be bent and flattened to fix the capillary structure according to the specific application scenario of the heat conduction device, so as to obtain the heat conduction device 5 shown in fig. 11.

In the manufacturing process of the heat conduction device of the embodiment, since the sintering process of the capillary structure is cancelled, the manufacturing cost of the heat conduction device is lower, the production yield is higher, and the structural stability of the heat conduction device is better; in addition, because when sealing the effective end and the ineffective end of the pipe, the pressing and welding modes can be adopted, so that the length of the sealing at the two ends along the extending direction of the pipe is smaller, and the integral temperature uniformity of the heat conduction device is effectively improved.

Referring to fig. 12, a flow of a manufacturing process of a heat conducting apparatus according to another possible embodiment of the present application is different from the above embodiment in that a step of reducing a pipe material, i.e., step 005 of the above embodiment, is further eliminated.

In this embodiment, by eliminating the step of reducing the pipe, the manufacturing cost of the heat transfer device can be further reduced; in addition, because the whole manufacturing process of the heat conduction device in the embodiment does not involve a high-temperature process, the problem of high-temperature softening of the pipe does not exist, so that the manufactured heat conduction device has better overall structural stability and higher production yield.

Referring to fig. 13, a flow of a manufacturing process of a heat conduction device according to another possible embodiment of the present application is different from the embodiment shown in fig. 8 in that a step of reducing a pipe material (i.e., step 005) in the flow of the manufacturing process shown in fig. 8 is replaced with a heat treatment.

Heat treatment differs from reducing pipes in that: a dense oxide layer can be formed on the metal surface by heat treatment. Taking a strip structure formed by weaving a pipe material with copper and a capillary structure with copper wires as an example, copper and oxygen can generate copper oxide in a high-temperature environment, and cuprous oxide can be generated in a normal-temperature environment. Therefore, the tube can be placed in a high-temperature environment, air or oxygen is introduced, so that copper and oxygen are subjected to oxidation reaction, and a copper oxide micro-nano structure layer is generated on the inner wall of the tube and the surface of the capillary structure. Because the surface wettability of the copper oxide micro-nano structure layer is better, the capillary force provided by the capillary structure is stronger, and the temperature uniformity and the heat conduction capability of the heat conduction device are stronger.

Referring to fig. 14, the heat conduction device according to an embodiment of the present application is obtained through the manufacturing process of the heat conduction device according to the above embodiment, and the heat conduction device mainly includes a housing 14 and a capillary structure 10 disposed inside the housing 14, wherein the capillary structure 10 is clamped on an inner wall of the housing 14, that is, the inner wall of the housing 14 presses the capillary structure 10, so that the capillary structure 10 is fixed to the housing 14. In the shell 14 of the heat conducting device, the capillary structure 10 divides the inner space of the shell 14 into a plurality of sections, the capillary structure 10 adsorbs the liquid working medium to form a liquid flow channel, and the sections except the liquid flow channel form a gas flow channel 15, and it can be understood that the liquid flow channel is communicated with the gas flow channel 15.

When the capillary structure 10 is disposed in the housing 14, with reference to fig. 14, fig. 14 is a cross-sectional view of the heat conduction device of this embodiment, and it can be seen from this figure that the housing 14 of the heat conduction device has a flat cross-section, and in addition, the cross-sectional shape of the capillary structure may be various, such as a rounded rectangle in fig. 14, or an ellipse in fig. 19, or an irregular shape, etc. In the present application, the extending direction of the longer side of the cross section of the housing 14 may be referred to as the width direction of the housing 14, and the extending direction of the shorter side may be referred to as the height direction of the housing 14. The capillary structure 10 may be, but not limited to, disposed in a middle area of the flat housing 14 in the width direction, and by disposing the capillary structure 10 in the middle area of the housing 14, the capillary structure can support two wall surfaces of the housing 14 opposite to each other in the height direction, so as to facilitate improvement of the structural stability of the heat conducting device.

In addition, in order to improve the reliability of the engagement between the capillary structure 10 and the inner wall of the housing 15, with reference to fig. 14, a protrusion 16 may be provided on the inner wall of the housing 14 so that the protrusion 16 can limit the capillary structure 10. When the limiting of the protrusion 16 to the capillary structure 10 is realized, specifically: firstly, the pipe is flattened into a flat shape, then the capillary structure 10 is plugged into the pipe, and finally the pipe is flattened to a set thickness specification in a flattening mode, so that the capillary structure 10 can be correctly clamped between the bulges 16.

In particular, when the protrusions 16 are provided, referring to fig. 14, two protrusions 16 may be provided in the housing 14, the two protrusions 16 are provided on the same side of the wall surface and are spaced apart from each other, and the capillary structure 10 is clamped between the two protrusions 16, so that the movement of the capillary structure 10 along the width direction of the housing 14 is limited (the movement of the capillary structure 10 along the height direction of the housing 14 is limited by the wall surface of the housing 14). In addition, with reference to fig. 14, the bottom of the protrusion 16 is fixed to the inner wall of one side of the housing, and a certain distance is provided between the top of the protrusion 16 and the inner wall opposite to the top of the protrusion, so that the material consumption of the protrusion 16 can be reduced on the basis of limiting the capillary structure 10, thereby facilitating the realization of the light and thin design of the heat conducting device.

In addition, referring to fig. 15, two protrusions 16 may be respectively disposed on two opposite wall surfaces of the housing 14 in the height direction, and the two protrusions 16 may be alternately disposed so that the capillary structure 10 can be caught between the two protrusions 16. In order to further improve the reliability of the engagement between the capillary structure 10 and the inner wall of the housing 14, referring to fig. 16, two protrusions 16 may be respectively disposed on two opposite wall surfaces of the housing 14 along the height direction, so that the capillary structure 10 can be simultaneously engaged between the four protrusions 16.

The protrusions are disposed at the corners of the capillary structure 10 to limit the capillary structure 10. In addition to the above arrangement of the protrusion 16, referring to fig. 17, in the embodiment shown in fig. 17, the protrusion 16 may be arranged on one inner wall surface of the housing 14 in the height direction, and at this time, the movement of the capillary structure 10 in the width direction of the housing 14 may be limited by merely snapping the protrusion 16 into the capillary structure 10. Of course, referring to fig. 18, one protrusion 16 is disposed on each of two opposite wall surfaces of the housing 14 in the height direction, and each protrusion 16 is engaged with the capillary structure 10 to limit the capillary structure 10.

In addition, the capillary structure 10 may be disposed at an end portion of the housing 14 in the width direction, in this case, referring to fig. 19, the protrusion 16 may be disposed only on one side of the capillary structure 10, the number of the protrusions 16 may be two referring to fig. 19, or only one protrusion may be disposed, and the protrusion 16 and the wall surface of the housing 14 may simultaneously limit the movement of the capillary structure 10 in the width direction of the housing 14.

In the above embodiments, only one capillary structure 10 is disposed in the housing 14 of the heat conduction device, and in other possible embodiments of the present application, the number of the capillary structures 10 may be selected according to the structure of the housing 14 of the heat conduction device, so as to improve the utilization rate of the internal space of the housing 14 and effectively improve the heat conduction performance of the heat conduction device. For example, referring to fig. 20 to 22, a plurality of capillary structures 10 may be disposed in the housing 14 at the same time, and the arrangement form, the arrangement position, and the arrangement of the protrusions 16 of the capillary structures 10 may refer to fig. 20 to 22, which is similar to the arrangement form of only one capillary structure 10, and will not be described again here.

The protrusion 16 may be formed in various ways, for example, when the tube forming the housing 14 is processed, the protrusion 16 and the tube may be integrally formed. Specifically, referring to fig. 23, since the tube is processed by extrusion, the extrusion die can be designed to have a corresponding shape, so that various structures of the protrusion 16 can be processed when the tube is formed. Therefore, the processing technology of the heat conduction device can be simplified, and the structural stability of the heat conduction device is improved.

[ examples ] A method for producing a compound

1. The utility model provides a heat-conducting device which characterized in that, includes the casing to and wear to locate the inside capillary structure of casing, wherein:

the capillary structure is clamped on the shell and adsorbs a liquid working medium to form a liquid circulation channel, and the capillary structure divides the inner space of the shell into a plurality of gas circulation channels;

the liquid circulation channel is communicated with the gas circulation channel, the liquid working medium is evaporated into gas to enter the gas circulation channel, and the gas is condensed into liquid to enter the liquid circulation channel.

2. The heat transfer device according to embodiment 1, wherein the housing has a flat cross-section, and the capillary structure is disposed in a middle region of the housing; or, the capillary structure is arranged at the end part of the width direction of the shell.

3. The heat transfer device according to embodiment 1 or 2, wherein the capillary structure has a cross-sectional shape of a rounded rectangle, an ellipse, or an irregular shape.

4. The heat transfer device according to any one of embodiments 1 to 3, wherein the capillary structure is a single capillary structure or a plurality of capillary structures arranged side by side.

5. The heat transfer device of any one of embodiments 1 to 4, wherein the liquid working medium is water, freon, ammonia, acetone, methanol, or ethanol.

6. The heat conduction device according to any one of embodiments 1 to 5, further comprising a protrusion disposed on an inner wall of the housing, wherein the protrusion is used for limiting the capillary structure.

7. The heat transfer device according to embodiment 6, wherein the cross-sectional shape of the protrusion is a triangle, a semicircle, a rectangle, or an irregular shape.

8. The heat transfer device according to

embodiment

6 or 7, wherein the number of the projections is one, and the one projection is caught in the capillary structure.

9. The heat transfer device according to

embodiment

6 or 7, wherein the number of the protrusions is at least two, the at least two protrusions are respectively disposed on two opposite inner walls of the housing, and the capillary structure is disposed in an interval defined by the at least two protrusions; or, the at least two projections are both snapped into the capillary structure.

10. The heat transfer device of any of embodiments 7-9, wherein the protrusion and the housing are integrally formed.

11. The heat transfer device according to any one of embodiments 1 to 10, wherein the capillary structure is formed by weaving a plurality of metal wires; or the capillary structure is formed by sintering powder.

12. The heat transfer device according to any one of embodiments 1 to 11, wherein the inner wall surface of the housing and the surface of the capillary structure have micro-nanostructure layers.

13. The heat transfer device according to any one of embodiments 1 to 12, wherein a seal is provided at an end of the heat transfer device in an extending direction, and a length of the seal in the extending direction of the heat transfer device is 0 to 2 mm.

14. A terminal device comprising a display screen, a support structure, a rear housing, a printed circuit board and the heat transfer device of any of embodiments 1-13, wherein:

the printed circuit board and the display screen are positioned on two sides of the supporting structure;

the heating element is arranged on the printed circuit board, the heating element is covered with a shielding case, the heating element is in contact with the shielding case through a thermal interface material, the shielding case is in contact with the heat conduction device through the thermal interface material, and the rear shell is positioned on one side of the printed circuit board;

the heat conduction device is arranged on the supporting structure.

15. The terminal device of embodiment 14, wherein the supporting structure has an accommodating groove, an opening of the accommodating groove faces the rear shell, and the heat conducting device is accommodated in the accommodating groove.

16. The terminal device according to

embodiment

14 or 15, wherein the heat conducting means is adhered to the bottom of the accommodating groove by an adhesive.

17. The terminal device of any of embodiments 14-16, wherein a layer of high thermal conductivity material is attached to the support structure, and the layer of high thermal conductivity material is disposed between the display screen and the support structure.

18. A terminal device comprising a display screen, a support structure, a rear housing, a printed circuit board and the heat transfer device of any of embodiments 1-13, wherein:

the heating element is arranged on the printed circuit board, the heating element is in contact with the supporting structure through a thermal interface material, and the rear shell is positioned on one side of the printed circuit board;

the heat conduction device is arranged on the supporting structure, the supporting structure is provided with an accommodating groove, an opening of the accommodating groove faces the display screen, and the heat conduction device is accommodated in the accommodating groove.

19. A terminal device comprising a display screen, a support structure, a rear housing, a printed circuit board and the heat transfer device of any of embodiments 1-13, wherein:

the heating element is arranged on the printed circuit board, the heating element is in contact with the heat conduction device through a thermal interface material, and the rear shell is positioned on one side of the printed circuit board;

the heat conducting device is arranged on the supporting structure, the supporting structure is provided with an accommodating groove, an opening of the accommodating groove faces the rear shell, and the heat conducting device is accommodated in the accommodating groove.

20. A terminal device comprising a display screen, a support structure, a rear housing, a printed circuit board and the heat transfer device of any of embodiments 1-13, wherein:

the heating element is arranged between the printed circuit board and the rear shell and is in contact with the heat conduction device through a thermal interface material;

the heat conduction device is arranged on the rear shell, an accommodating groove is formed in the rear shell, an opening of the accommodating groove faces the display screen, and the heat conduction device is accommodated in the accommodating groove.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A heat transfer device comprising a housing and a capillary structure disposed within the housing, wherein:

the capillary structure is clamped on the shell and adsorbs a liquid working medium to form a liquid circulation channel, and the capillary structure divides the inner space of the shell into at least one gas circulation channel;

2. The heat transfer device of claim 1, wherein the housing has a flat cross-section, and the capillary structure is disposed in a middle region of the housing; or, the capillary structure is arranged at the end part of the width direction of the shell.

3. The heat transfer device according to claim 1 or 2, wherein the capillary structure is a strip or a plurality of strips arranged side by side.

4. The heat transfer device according to any one of claims 1 to 3, further comprising a protrusion disposed on an inner wall of the housing, wherein the protrusion is used for limiting the capillary structure.

5. The heat transfer device of claim 4, wherein the protrusion is one, and the one protrusion is engaged with the capillary structure.

6. The heat transfer device of claim 4, wherein the number of the protrusions is at least two, the at least two protrusions are disposed on two opposite inner walls of the housing, and the capillary structure is disposed in a region defined by the at least two protrusions; or, the at least two projections are both snapped into the capillary structure.

7. The heat conduction device as claimed in any one of claims 1 to 6, wherein the inner wall surface of the housing and the surface of the capillary structure have micro-nano structure layers.

8. The heat transfer device according to any one of claims 1 to 7, wherein the end of the heat transfer device in the extending direction has a seal, and the length of the seal in the extending direction of the heat transfer device is 0 to 5 mm.

9. A terminal device comprising a display screen, a support structure, a rear housing, a printed circuit board and a heat transfer device according to any one of claims 1 to 8, wherein:

the heat conduction device is arranged on the supporting structure.

10. The terminal apparatus according to claim 9, wherein the supporting structure defines a receiving slot, an opening of the receiving slot faces the rear housing, and the heat conducting device is received in the receiving slot.