CN214592626U - Electronic equipment and conductive soaking device - Google Patents

Abstract

The application discloses electronic equipment and electrically conductive soaking device, wherein, electrically conductive soaking device includes conducting layer and soaking layer, and the conducting layer includes substrate layer, insulating layer and electrically conductive metal layer, and the insulating layer superpose is in the first side of substrate layer, and the at least part of electrically conductive metal layer is located within the insulating layer, and the soaking layer includes basal portion, capillary structure portion and working medium, and the basal portion superpose is in the second side of substrate layer, and the basal portion is equipped with sealed chamber, and working medium and capillary structure portion are located within the sealed chamber. Make electrically conductive soaking device both possess the electricity connection function through setting up even hot layer and conducting layer in this application, possess soaking heat dissipation function again, even hot layer and conducting layer structure as an organic whole simultaneously to make electrically conductive soaking device's thickness thinner.

Description

Electronic equipment and conductive soaking device

Technical Field

The application belongs to the technical field of communication equipment, and particularly relates to electronic equipment and a conductive soaking device.

Background

Along with the functions of electronic equipment are more and more abundant and the performance is more and more powerful, the heat dissipation requirement of electronic equipment is also continuously improved, and the soaking plate is adopted by more and more electronic equipment as a heat dissipation device with excellent heat dissipation performance.

In the related art, the soaking plate and the battery of the electronic device are both arranged in the electronic device, and the flexible circuit board is arranged between the soaking plate and the battery. Specifically, the soaking plate needs to be provided with an accommodating groove, so that part of the area of the flexible circuit board is bonded in the accommodating groove. Obviously, this kind of structure needs the soaking plate to set up the recess, that is to say, the face of soaking plate sets up the recess, and then can lead to the soaking plate to become the surface and have the special-shaped structure of segment difference, and it is very obvious, this makes the heat dispersion of soaking plate receive the influence, and the manufacturing degree of difficulty that special-shaped structure also can lead to the soaking plate increases in addition.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application aims to provide an electronic device and a conductive soaking device, and the problems that in the related technology, a special-shaped soaking plate is poor in heat dissipation performance and large in manufacturing difficulty can be solved.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, the utility model discloses an electrically conductive soaking device, include: conducting layer and soaking layer, the conducting layer includes substrate layer, insulating layer and conductive metal layer, the insulating layer superpose is in the first side of substrate layer, just at least part of conductive metal layer is located within the insulating layer, the soaking layer includes basal portion, capillary structure portion and working medium, the basal portion superpose is in the second side of substrate layer, the basal portion is equipped with sealed chamber, working medium with capillary structure portion locates within the sealed chamber.

In a second aspect, the present invention discloses an electronic device comprising the above conductive soaking device.

Compared with the prior art, in the conductive soaking device disclosed in the embodiment of the application, the base layer in the conductive layer is directly superposed on the base part in the soaking layer, so that the conductive layer and the soaking layer are of an integrated structure, the structural integrity of the conductive soaking device is better, and the thickness of the conductive soaking device is thinner. The conductive metal layer is arranged in the conductive layer, so that the conductive layer has an electric connection function, the capillary structure part and the working medium are arranged in the sealing cavity in the heat equalizing layer, the heat equalizing layer can absorb heat of an external heat source and uniformly distribute the heat to all positions of the heat equalizing layer, and the conductive soaking device has the electric connection function and the soaking and heat dissipation function. Meanwhile, grooves for arranging the conducting layers are not required to be formed in the heat equalizing layer, and heat dissipation performance is not affected. Meanwhile, the special-shaped surface with the segment difference can not be generated, and the manufacturing difficulty can be further reduced.

Drawings

Fig. 1 is a schematic cross-sectional view of an electrically conductive soaking device in one direction according to an embodiment of the present application;

fig. 2 is a schematic cross-sectional view of another direction of an electrically conductive heat spreader as disclosed in an embodiment of the present application;

fig. 3 is a schematic cross-sectional view of a thermal spreader in an electrically conductive thermal spreader according to an embodiment of the present disclosure;

fig. 4 is a schematic view illustrating a conductive layer disposed on two sides of a soaking layer in a thickness direction of the conductive soaking layer in the conductive soaking device according to the embodiment of the present disclosure;

FIG. 5 is a schematic diagram of an electronic device disclosed in an embodiment of the present application;

fig. 6 is a schematic diagram illustrating a connection between a conductive soaking device and a main circuit board in an electronic apparatus according to an embodiment of the present disclosure;

fig. 7 is an exploded view of an electronic device according to an embodiment of the disclosure;

fig. 8 is a schematic view illustrating a conductive heating device disposed in a frame in an electronic apparatus according to an embodiment of the disclosure.

Description of reference numerals:

100-soaking layer, 110-base, 111-sealed chamber, 112-first shell, 113-second shell, 114-support column, 120-capillary structure,

100 a-a body region, 100 b-an epitaxial region,

200-a conductive layer, 210-a substrate layer, 220-an insulating layer, 230-a conductive metal layer, 240-a tie glue layer, 250-a ground electrical connection layer, 260-a first flexible electrical connection, 270-a second flexible electrical connection,

300-main circuit board, 310-heat source device,

400-the sub-circuit board,

500-the battery pack of the battery pack,

600-housing, 610-frame.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings.

Referring to fig. 1 to 8, an embodiment of the present application discloses an electrically conductive heat spreader including a heat spreader layer 100 and an electrically conductive layer 200, which can be applied to an electronic device.

The soaking layer 100 is a heat dissipating member that absorbs heat generated from the heat generating component when it is in contact with the heat generating component and diffuses the heat into a region of the soaking layer 100 in a lower temperature environment, thereby preventing heat concentration. The soaking layer 100 can provide a mounting base for the conductive layer 200 such that the conductive layer 200 is connected to the soaking layer 100, the conductive layer 200 can be communicatively connected to a plurality of components of the electronic device, and the conductive layer 200 is used to communicatively connect the various electrical components of the electronic device to each other.

The conductive layer 200 includes a substrate layer 210, an insulating layer 220, and a conductive metal layer 230, the insulating layer 220 being stacked on a first side of the substrate layer 210. Specifically, the substrate layer 210 and the insulating layer 220 may be stacked in a thickness direction of both. The substrate layer 210 can provide a mounting base for the insulating layer 220, and the substrate layer 210 may be a polyimide film, or may be another polymer material, which is not limited in this application. At least a portion of the conductive metal layer 230 is disposed in the insulating layer 220, the conductive metal layer 230 is disposed between the substrate layer 210 and the insulating layer 220, and the conductive metal layer 230 enables the conductive layer 200 to have an electrical connection function. The insulating layer 220 covers the conductive metal layer 230, so that the conductive metal layer 230 is not exposed, thereby achieving the purpose of protecting the conductive metal layer 230, and enabling the conductive metal layer 230 to have better electrical connection performance. The insulating layer 220 and the substrate layer 210 may be connected by a connection adhesive layer 240, and the conductive metal layer 230 may be disposed in the connection adhesive layer 240.

The soaking layer 100 includes a base 110, a capillary structure portion 120 and a working medium, wherein the base 110 is stacked on a second side of the substrate layer 210, the first side and the second side are opposite sides of the substrate layer 210, and specifically, the base 110 and the substrate layer 210 may also be stacked along a thickness direction of the two. The base 110 is stacked on the substrate layer 210, so that the uniform heating layer 100 is stacked on the conductive layer 200, and the conductive layer 200 and the uniform heating layer 100 are integrated, so that the conductive uniform heating device disclosed by the embodiment of the application has better integration and thinner thickness.

The base 110 has a sealed cavity 111 therein, so that the inside of the base 110 is in a sealed environment, external gas cannot enter the sealed cavity 111, gas in the sealed cavity 111 cannot leak, the capillary structure 120 is disposed in the sealed cavity 111, and the working medium is filled in the sealed cavity 111. The sealed cavity 111 includes a first region and a second region, the first portion of the capillary structure portion 120 is located in the first region, the second portion of the capillary structure portion 120 is located in the second region, one of the first region and the second region is an evaporation region, and the other is a condensation region, so that a phase change circulation system is formed inside the soaking layer 100. The soaking heat dissipation process of the soaking layer 100 is also a two-phase soaking heat dissipation process in which the working medium changes between gas phase and liquid phase.

It should be understood that the capillary structure 120 may be a porous medium based on copper, such as copper mesh, sintered copper powder, or foamed copper, and may be formed by weaving copper mesh, wire drawing, etching, electroplating, chemical deposition, or the like. The working medium may be pure water, ethanol, or a refrigerant, or a mixture of the above three, which is not limited in this application. The copper material has good heat-conducting property, the copper material capillary structure is easy to prepare, and the copper material capillary structure does not produce chemical reaction with water.

In the conductive soaking device disclosed in the embodiment of the present application, the substrate layer 210 in the conductive layer 200 is directly stacked on the base 110 in the soaking layer 100, so that the conductive layer 200 and the soaking layer 100 are of an integrated structure, and the conductive soaking device has better structural integrity and thinner thickness. The conductive metal layer 230 is disposed in the conductive layer 200, so that the conductive layer 200 has an electrical connection function, and the soaking layer 100 is provided with the capillary structure part 120 and the working medium in the sealed cavity 111, so that the soaking layer 100 can absorb and uniformly distribute heat of an external heat source to each position of the soaking layer 100, and thus the conductive soaking device has both an electrical connection function and a soaking and heat dissipation function. Meanwhile, a groove for arranging the conductive layer 200 is not required to be formed in the uniform heat layer 100, so that the uniform heat radiation performance of the uniform heat layer 100 is not affected. Meanwhile, the uniform heating layer 100 does not generate a special-shaped surface with a step difference, so that the manufacturing difficulty can be reduced.

Optionally, the base 110 includes a first housing 112 and a second housing 113, the first housing 112 is disposed on the second side of the substrate layer 210, the first housing 112 is an etched structural member, the second housing 113 is hermetically abutted to the first housing 112, and the first housing 112 and the second housing 113 form a sealed cavity 111. The first casing 112 and the second casing 113 may be made of metal materials such as copper, copper alloy, stainless steel, titanium alloy, etc., so that the first casing 112 and the second casing 113 have better structural strength, and further the heat equalizing layer 100 has better structural strength, and the first casing 112 and the second casing 113 may be connected in a welding manner. Specifically, a first inner cavity may be disposed in the first casing 112, a second inner cavity may be disposed in the second casing 113, and the first inner cavity and the second inner cavity may also be butted to form the sealed cavity 111 when the first casing 112 and the second casing 113 are in sealed butt joint. The arrangement of the first housing 112 and the second housing 113 can also facilitate the arrangement of the capillary structure 120 and the working medium in the sealed chamber 111.

Optionally, the first housing 112 may be disposed on the second layer of the substrate layer 210 in an electroplating manner, so that structural integrity between the first housing 112 and the substrate layer 210 is better in the electroplating manner, and an additional bonding structure does not need to be disposed between the substrate layer 210 and the first housing 112, thereby effectively reducing the overall thickness of the conductive soaking device disclosed in the embodiment of the present application. Meanwhile, the connection stability between the first housing 112 and the base material layer 210 can be better by the electroplating method, and further the connection stability between the conductive layer 200 and the soaking layer 100 is better.

An etching groove can be formed on the side, opposite to the base material layer 210, of the first housing 112 through an etching method, the etching groove can form a first inner cavity of the first housing 112, the second housing 113 can also form a second inner cavity on the side, facing the first housing 112, of the second housing 113 through an etching method, and the second housing 113 covers the notch of the etching groove, so that the second housing 113 and the etching groove form a sealing groove in a surrounding manner. Alternatively, the second housing 113 is a plate-shaped structural member.

Optionally, the sealing cavity 111 in the base 110 may be configured as a negative pressure cavity, so that the external air pressure can also seal the sealing cavity 111, thereby improving the sealing effect of the sealing cavity 111, preventing the working medium from flowing away, and the negative pressure cavity can also play a certain deformation-resistant role, so that the structural strength of the base 110 is improved.

Have relative first inner wall and second inner wall in the sealed chamber 111, capillary structure portion 120 sets up on the second inner wall, be provided with support column 114 in the sealed chamber 111, the first inner wall at sealed chamber 111 is fixed to the one end of support column 114, the other end of support column 114 contradicts with capillary structure portion 120 in the sealed chamber 111, and is specific, the direction of first inner wall towards the second inner wall can be the thickness direction of basal portion 110, of course, the direction of first inner wall towards the second inner wall also can be the length direction or the width direction of basal portion 110, to this, this application does not do not make the restriction. The supporting columns 114 can support the base 110 in the base 110, so that the structural strength of the base 110 is better, deformation of the base 110 caused by external air pressure extruding the base 110 after the sealing cavity 111 is set as a negative pressure cavity is avoided, and deformation of the base 110 caused by expansion with heat and contraction with cold can also be avoided. In order to provide better supporting effect for the supporting column 114, a plurality of supporting columns 114 may be provided, and a plurality of supporting columns 114 may be distributed at intervals in the sealed cavity 111.

The supporting column 114 abutting against the capillary structure portion 120 can also fix and position the capillary structure portion 120, so as to prevent the capillary structure portion 120 from moving in the sealed cavity 111 to generate abnormal sound. The end of the supporting column 114 opposite to the first inner wall can also contact with the second inner wall of the sealed cavity 111 through the capillary structure part 120, so that the supporting effect of the supporting column 114 is better.

When first casing 112 adopts the etching structure, electroplate first casing 112 to the second side of substrate layer 210 after, the accessible sets up a plurality of spaced etching groove and makes the arch between the adjacent etching groove constitute support column 114, can make support column 114 and first casing 112 be integrated into one piece structure like this to make support column 114 better with the stability of being connected of base 110, also can reduce the technology degree of difficulty of base 110 simultaneously.

Optionally, the soaking layer 100 has a first surface and a second surface, the first surface and the second surface are two surfaces of the soaking layer 100 opposite to each other, the conductive layers 200 are two, one substrate layer 210 of the two conductive layers 200 is disposed on the first surface, and the other substrate layer 210 of the two conductive layers 200 is disposed on the second surface, so that the two conductive layers 200 are disposed on two sides of the soaking layer 100. The conductive soaking device disclosed in the embodiment of the present application can have more conductive metal layers 230 by providing two conductive layers 200, so that the conductive soaking device has better electrical connection performance. Specifically, the first surface and the second surface may be both sides of the thermal uniforming layer 100 in the thickness direction, so that the first surface is a side surface of the first case 112 connected to the base material layer 210, and the second surface is a side of the second case 113 facing away from the first case 112.

Based on the conductive soaking device, the embodiment of the application also provides electronic equipment which comprises the conductive soaking device.

Optionally, the electronic device further includes a main circuit board 300 and a heat source device 310, the heat source device 310 is disposed on the first board surface of the main circuit board 300, specifically, the heat source device 310 includes a processor chip, a display chip, a power supply chip, and the like, and the heat source device 310 generates a large amount of heat during the working process. The region of the conductive soaking device opposite to the soaking layer 100 is a soaking region, the soaking region includes a main region 100a and an epitaxial region 100b, the epitaxial region 100b is connected with the main region 100a, the epitaxial region 100b is an extension of the main region 100a, the epitaxial region 100b extends to a position opposite to the heat source device 310, and the epitaxial region 100b is in contact with the heat source device 310, so that heat generated by the heat source device 310 can be conducted to the epitaxial region 100b, the epitaxial region 100b conducts the heat to the main region 100a, so that the heat can be uniformly distributed at each position of the main region 100a, further the heat of the heat source device 310 can be uniformly distributed in each region of the electronic device, the heat is prevented from being concentrated at a certain position, and finally the heat can be rapidly dissipated out of the electronic device.

The conductive soaking device further comprises a first flexible electric connection part 260, one end of the first flexible electric connection part 260 is connected with the soaking region, the other end of the first flexible electric connection part 260 is bent to the second board surface of the main circuit board 300 and is electrically connected with the main circuit board 300, and the second board surface is opposite to the first board surface. Specifically, the first flexible electrical connection portion 260 is connected with the conductive layer 200, specifically, the first flexible electrical connection portion 260 and the conductive layer 200 can be of an integral structure, and the first flexible electrical connection portion 260 is an extension of the conductive layer 200, so that the substrate layer 210, the insulating layer 220 and the conductive metal layer 230 in the conductive layer 200 can be made of flexible materials, and the first flexible electrical connection portion 260 can be bent. Of course, the first flexible electrical connection portion 260 and the conductive layer 200 may be detachably connected, and the application is not limited thereto.

The second board surface of the main circuit board 300 may be provided with an interface matched with the first flexible electrical connection portion 260, so that the first flexible electrical connection portion 260 is electrically connected with the main circuit board 300, and meanwhile, the interface is provided on the second board surface, so that the first board surface also has a larger area where a heat source device can be arranged, and the first flexible electrical connection portion 260 can be prevented from shielding the heat source device 310 covering the first board surface, so that the heat of the heat source device 310 is more easily guided into the extension area 100 b.

Optionally, the electronic device further includes a secondary circuit board 400 and a battery 500, and the secondary circuit board 400 can also mount the heat source device 310, where the battery 500 is disposed between the main circuit board 300 and the secondary circuit board 400, specifically, the main circuit board 300 and the secondary circuit board 400 can be located at two sides of the battery 500 in the length direction or the width direction, the main region 100a is stacked at one side of the battery 500, the extension region 100b is in contact with the main circuit board 300 and can conduct heat of the heat source device 310 to the main region 100a, and during operation of the electronic device, the temperature at the battery 500 is lower than the temperatures of the main circuit board 300 and the secondary circuit board 400, so that the heat can be distributed in the main region 100a more quickly, and thus the heat dissipation efficiency of the electronic device is higher.

It is to be noted that when the amount of heat generation of the sub circuit board 400 is also large, the extension region 100b may also be disposed in contact with the heat source device 310 on the sub circuit board 400, so that the heat of the sub circuit board 400 is also more easily conducted to the main body region 100 a.

The conductive soaking device further comprises a second flexible electric connection portion 270, one end of the second flexible electric connection portion 270 is connected with the soaking region, the other end of the second flexible electric connection portion 270 is connected with the auxiliary circuit board 400, and specifically, when the heat source device 310 is arranged on the auxiliary circuit board 400, the second flexible electric connection portion 270 can be connected with one side, back to the heat source device 310, of the auxiliary circuit board 400.

Optionally, the electronic device further includes a housing 600, the housing 600 is a basic component of the electronic device, the housing 600 may provide an installation foundation for other components of the electronic device, the housing includes a frame 610, a hollowed area is provided in the frame 610, at least a part of the soaking area is located in the hollowed area, so that at least a part of the soaking area can be clamped in the hollowed area, and thus the conductive soaking device can be fixed in the electronic device. The soaking region is in contact with the frame body 610, so that the heat of the heat source device 310 can be uniformly distributed to the soaking region, and then the heat can be quickly introduced into the frame body 610, and further the heat can be more efficiently dissipated to the outside of the electronic equipment, so that the electronic equipment has a good heat dissipation effect.

Meanwhile, since the soaking region is disposed corresponding to the battery 500, the soaking region has a relatively large surface area, and thus, the surface area of the soaking layer 100 is large, and accordingly, the width and length dimensions of the conductive layer 200 may be set to be larger, so that the conductive layer 200 can have better conductivity.

Optionally, the electronic device includes a ground structure, the conductive metal layer 230 includes a ground electrical connection layer 250, and the soaking layer 100 is electrically connected to the ground structure through the ground electrical connection layer 250, so that the soaking layer 100 can be grounded, and correspondingly, it is not necessary to set a conductive double-sided tape between the soaking layer 100 and the conductive layer 200 to ground the soaking layer 100, so that the thickness of the conductive heat dissipation apparatus disclosed in the embodiment of the present application can be reduced, and correspondingly, the thickness of the electronic device can also be reduced.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. The utility model provides a conductive soaking device, its characterized in that includes conducting layer and soaking layer, the conducting layer includes substrate layer, insulating layer and conductive metal layer, the insulating layer superpose is in the first side of substrate layer, just at least part of conductive metal layer is located within the insulating layer, soaking layer includes basal portion, capillary structure portion and working medium, the basal portion superpose is in the second side of substrate layer, the basal portion is equipped with sealed chamber, working medium with capillary structure portion locates within the sealed chamber.

2. The electrically conductive heat spreader of claim 1, wherein the base comprises a first housing and a second housing, the first housing being disposed on the second side of the substrate layer, the first housing being an etched structure, the second housing being fixedly attached to the first housing, and the second housing and the first housing forming the sealed cavity.

3. The conductive soaking device according to claim 2, wherein the first casing is plated on the second side of the substrate layer, and an etching groove is provided on a side of the first casing facing away from the substrate layer, the second casing covers a notch of the etching groove, and the second casing and the etching groove enclose the sealed cavity.

4. The electrically conductive heat soaking device according to claim 1, wherein the sealed chamber is a negative pressure chamber, the base portion comprises a plurality of support pillars arranged at intervals, a first end of each support pillar is fixed to a first inner wall of the sealed chamber, a second end of each support pillar abuts against the capillary structure portion, the capillary structure portion is provided to a second inner wall of the sealed chamber, and the first inner wall is opposite to the second inner wall.

5. The electrically conductive soaking device according to claim 1, wherein the number of the electrically conductive layers is two, the substrate layers of the two electrically conductive layers are disposed opposite to each other, the first surface of the thermally uniform layer is connected to the substrate layer of one of the electrically conductive layers, the second surface of the thermally uniform layer is connected to the substrate layer of the other electrically conductive layer, and the first surface and the second surface are respectively two surfaces of the thermally uniform layer opposite to each other.

6. An electronic apparatus characterized by comprising the conductive heat soaking device according to any one of claims 1 to 5.

7. The electronic apparatus according to claim 6, further comprising a main circuit board and a heat source device, the heat source device is arranged on the first board surface of the main circuit board, the conductive soaking device comprises a first flexible electric connection part, the region of the conductive soaking device opposite to the soaking layer is a soaking region which comprises a main body region and an epitaxial region, the epitaxial region is connected with the main body region, and the epitaxial region extends to a position opposite to the heat source device and is in contact with the heat source device, the first end of the first flexible electric connection part is connected with the soaking region, the second end of the first flexible electric connection part is bent to the second board surface of the main circuit board and is electrically connected with the second board surface, and the first board surface and the second board surface are back to back.

8. The electronic device of claim 7, further comprising a secondary circuit board and a battery disposed between the secondary circuit board and the primary circuit board, wherein the conductive heat spreader further comprises a second flexible electrical connection, a first end of the second flexible electrical connection being connected to the heat spreader region, a second end of the second flexible electrical connection being electrically connected to the secondary circuit board, and the main body region being stacked on one side of the battery.

9. The electronic device of claim 7, wherein the electronic device comprises a housing comprising a frame defining a hollowed-out area, wherein at least a portion of the soaking area is located within the hollowed-out area.

10. The electronic device of claim 6, wherein the conductive metal layer comprises a ground electrical connection layer, and wherein the electronic device comprises a ground structure, and wherein the thermal spreader is electrically connected to the ground structure through the ground electrical connection layer.

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