JP2000230790A - Flat type heat pipe - Google Patents

Flat type heat pipe

Info

Publication number
JP2000230790A
JP2000230790A JP11029497A JP2949799A JP2000230790A JP 2000230790 A JP2000230790 A JP 2000230790A JP 11029497 A JP11029497 A JP 11029497A JP 2949799 A JP2949799 A JP 2949799A JP 2000230790 A JP2000230790 A JP 2000230790A
Authority
JP
Japan
Prior art keywords
heat pipe
plate
adhesive
wick
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP11029497A
Other languages
Japanese (ja)
Inventor
Takuo Ito
卓雄 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP11029497A priority Critical patent/JP2000230790A/en
Publication of JP2000230790A publication Critical patent/JP2000230790A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a flat type heat pipe wherein a heat receiving plate and a radiation plate can be easily bonded to each other and a wick can be easily mounted to the plates. SOLUTION: In the heat pipe, a plurality of wire mesh bodies 3 are arranged between a heat receiving plate 1 and a radiation plate 2 so as to be spaced apart from one another by predetermined intervals. An adhesive is impregnated into each body 3 to form an interval holding spacer between the plate 1 and the plate 2. The plate 1 can be easily bonded to the plate 2 so as to be spaced from each other trough the wire mesh bodies 3 each of which is impregnated with adhesives, and a wick can be easily disposed in fluid passages for working liquid formed between regularly spaced apart bodies 3.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、パソコンのCPU
(演算ユニット)、半導体デバイスを組み込んだマルチ
チップモジュール等の電子機器筐体内の発熱部品の冷却
に適した平坦型ヒートパイプの構造に関するものであ
る。
TECHNICAL FIELD The present invention relates to a personal computer CPU.
The present invention relates to a structure of a flat heat pipe suitable for cooling a heat-generating component in an electronic device housing such as a multi-chip module incorporating a semiconductor device.

【0002】[0002]

【従来の技術】電子機器における冷却体としてのヒート
パイプの利用は、従来管状のヒートパイプに受熱板と放
熱板とを取り付け、発熱部と放熱部の位置に合わせてヒ
ートパイプを引き回す方法が一般的であった。近年、電
子機器の高密度化に伴い発熱密度も上がり、より熱輸送
量の大きい平坦型ヒートパイプが多く用いられるように
なった。平坦型ヒートパイプは、熱輸送量が増加するこ
とに加えて、仮に発熱体の位置が平坦型ヒートパイプの
平端面領域において変わっても対応でき、電子機器筐体
内での設計自由度が増すという利点がある。
2. Description of the Related Art Generally, a heat pipe is used as a cooling body in an electronic device by attaching a heat receiving plate and a heat radiating plate to a conventional tubular heat pipe, and routing the heat pipe in accordance with the position of the heat generating portion and the heat radiating portion. It was a target. In recent years, the heat generation density has increased with the increase in the density of electronic devices, and flat heat pipes having a larger heat transport amount have been used in many cases. In addition to the increased heat transport, flat heat pipes can respond even if the position of the heating element changes in the flat end surface area of the flat heat pipe, increasing the degree of freedom in design within the housing of electronic equipment. There are advantages.

【0003】平坦型ヒートパイプの構造としては、例え
ば図9及び図10に示すように、断面矩形のハニカム構
造のアルミ押し出し材21を使用し、ハニカム構造をな
す多数の流路24に作動液を注入後その開放端を封止部
材23により封止して構成したタイプがある。図中25
はウイックであり、それ自体の毛細管の作用によって作
動液の循環を促進するものである。
As a structure of a flat heat pipe, for example, as shown in FIGS. 9 and 10, an aluminum extruded material 21 having a honeycomb structure having a rectangular cross section is used, and a hydraulic fluid is supplied to a large number of flow paths 24 having a honeycomb structure. There is a type in which the open end is sealed with a sealing member 23 after injection. 25 in the figure
Is a wick, which promotes the circulation of hydraulic fluid by the action of its own capillary.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、上記従
来の技術には、次に示すような問題点があった。押し出
し材21を用いた平坦型ヒートパイプでは、一つ一つの
流路24が狭く、ウイック25を各流路24の適正な位
置に挿入しづらいために充分な冷却性能を発揮できない
恐れがあった。又押し出し成形なので素材が限られ、例
えばアルミニウム等によって作動液もその素材との関連
でフロン、炭化水素等に制限されるなどの問題があっ
た。本発明の目的は、上記の課題を解決するため、受熱
板と放熱板とを容易に接着できかつウイックの装着を容
易にさせた平坦型ヒートパイプを提供することにある。
However, the above-mentioned prior art has the following problems. In the flat type heat pipe using the extruded material 21, each of the flow paths 24 is narrow, and it is difficult to insert the wick 25 into an appropriate position of each of the flow paths 24. . In addition, since extrusion molding is used, the material is limited. For example, there is a problem in that the working fluid is limited to fluorocarbon, hydrocarbon, and the like in relation to the material by aluminum or the like. SUMMARY OF THE INVENTION An object of the present invention is to provide a flat heat pipe capable of easily adhering a heat receiving plate and a heat radiating plate and facilitating mounting of a wick in order to solve the above-mentioned problems.

【0005】[0005]

【課題を解決するための手段】本発明に係る平坦型ヒー
トパイプは、 受熱板と放熱板との間に複数の金網体を
所定間隔あけて配置し、これら金網体内に接着剤を含浸
させて形成してなる前記2枚の平板間隔保持スぺーサを
具備している。かかるヒートパイプによれば、複数の金
網体に含浸させた接着剤によって受熱板と放熱板とを金
網自体の大きさによる間隔をあけて金網体自体を介して
容易に接着でき、かつ、所定間隔あけて配置した金網体
間に形成されるところの作動液の流路に容易にウイック
を配置させることができる。また、金網体の周辺部に接
着剤が含浸していない部分を残すことは、その部分の金
網体が厚さ方向のウイックとしての作用させる点で望ま
しい。
A flat heat pipe according to the present invention comprises a plurality of wire meshes arranged at a predetermined interval between a heat receiving plate and a heat radiating plate, and the wire meshes are impregnated with an adhesive. The two flat plate spacing spacers formed are provided. According to such a heat pipe, the heat receiving plate and the heat radiating plate can be easily adhered to each other through the wire mesh body at intervals according to the size of the wire mesh itself by the adhesive impregnated into the plurality of wire mesh bodies, and at a predetermined interval. The wick can be easily arranged in the flow path of the hydraulic fluid formed between the metal mesh bodies arranged apart. In addition, it is desirable to leave a portion that is not impregnated with the adhesive in the peripheral portion of the wire netting in that the wire netting in that portion acts as a wick in the thickness direction.

【0006】上記金網体は、スぺーサを構成しうる強度
を持つものであればその素材は問われないが、望ましく
は熱伝導率がよい銅系の金属材料あるいはステンレス等
の金属でできた金網体が望ましい。また金網体の網目の
大きさも、接着剤を含浸させかつ金網体外に流れ出さな
い大きさであれば特に限定されないが、網目開口部の寸
法が縦、横ともに0.05mmないし0.40mm(約50
メッシュないし300メッシュ相当)のものが望まし
い。接着剤は、スペーサ、ウイックの空隙部に保持さ
れ、金網体から流れ出さない粘度を持つ接着剤であれば
その素材を限定されないが、特にエポキシ系、ウレタン
系が望ましい。
The wire mesh is not particularly limited as long as it has a strength capable of forming a spacer, but is preferably made of a copper-based metal material having a high thermal conductivity or a metal such as stainless steel. Wire mesh is preferred. The size of the mesh of the wire mesh is not particularly limited as long as the mesh is impregnated with the adhesive and does not flow out of the wire mesh. 50
Mesh or 300 mesh). The material of the adhesive is not limited as long as the adhesive is held in the space between the spacer and the wick and has a viscosity that does not flow out of the wire netting, but an epoxy-based or urethane-based adhesive is particularly desirable.

【0007】本発明に係る平坦型ヒートパイプは、 受
熱板と放熱板との間に網目状隙間を持つ焼結体を複数所
定間隔あけて配置し、これら 焼結体内に接着剤を含浸
させて形成してなる前記2枚の平板間隔保持スぺーサを
具備している。かかるヒートパイプによれば、焼結体に
含浸させた接着剤によって受熱板と放熱板とを焼結体自
体の大きさによる間隔をあけて焼結体自体を介して容易
に接着でき、かつ、所定間隔あけて配置した焼結体間に
形成されるところの作動液の流路に容易にウイックを配
置させることができる。
In the flat heat pipe according to the present invention, a plurality of sintered bodies having a mesh-like gap are arranged at predetermined intervals between a heat receiving plate and a heat radiating plate, and these sintered bodies are impregnated with an adhesive. The two flat plate spacing spacers formed are provided. According to such a heat pipe, the heat receiving plate and the heat radiating plate can be easily bonded via the sintered body itself at intervals according to the size of the sintered body itself by the adhesive impregnated in the sintered body, and The wick can be easily arranged in the working fluid flow path formed between the sintered bodies arranged at a predetermined interval.

【0008】上記焼結体は、スぺーサを構成しうる強度
を持ち、望ましくは熱伝導性に優れた金属製のものが望
ましい。またこの網目状隙間も、接着剤を含浸させかつ
焼結体外に流れ出さないのであれば特に隙間のサイズ、
数等は限定されないが、隙間の平均的ギャップが0.0
5mmないし0.1mm、隙間の数は強度を保ちうる範囲に
おいてできるだけ多いものが望ましい。接着剤は、焼結
体から流れ出さない粘度を持つ接着剤であればその素材
を限定されないが、上述の接着剤の例が望ましい。
The above-mentioned sintered body has a strength capable of forming a spacer, and is preferably made of a metal having excellent heat conductivity. In addition, the size of the mesh-shaped gap is also particularly so long as it is impregnated with the adhesive and does not flow out of the sintered body,
Although the number is not limited, the average gap is 0.0
It is desirable that the number of gaps is 5 mm to 0.1 mm and the number of gaps is as large as possible as long as strength can be maintained. The material of the adhesive is not limited as long as the adhesive has a viscosity that does not flow out of the sintered body, but the above-described example of the adhesive is preferable.

【0009】[0009]

【発明の実施の形態】以下、本発明の平坦型ヒートパイ
プの第一の実施形態を図1ないし図4を参照して説明す
る。基板1、2は金属の薄板であり、基板1の上にシー
ト状の金網ウィック5を介してスペーサ3を配置してい
る。本例ではスペーサ3として目の粗い、厚手の金網を
採用している。スペーサ3は有効流路内部に適当な間隔
で配置される。4はスペーサ3内部の接着剤の硬化した
層を示す。外部シール部6は作動液の図示を省略した注
入口となる部分を残して基板1、2の外周に配置され
る。基板1、2の間のスペーサ3、外部シール部6に囲
まれた空間には作動液が注入されていて、上述の図示を
省略した注入口は封止剤によって封止されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of a flat heat pipe according to the present invention will be described with reference to FIGS. The substrates 1 and 2 are metal thin plates, and a spacer 3 is disposed on the substrate 1 via a sheet-like wire mesh wick 5. In this example, a coarse and thick wire mesh is used as the spacer 3. The spacers 3 are arranged at appropriate intervals inside the effective flow path. Reference numeral 4 denotes a cured layer of the adhesive inside the spacer 3. The external seal portion 6 is arranged on the outer periphery of the substrates 1 and 2 except for a portion serving as an injection port (not shown) of the hydraulic fluid. A working fluid is injected into a space surrounded by the spacer 3 and the external seal portion 6 between the substrates 1 and 2, and the above-described injection port, not shown, is sealed with a sealing agent.

【0010】かかる平坦型ヒートパイプの大きさは、長
手方向及び短手方向の寸法が200mm及び50mmであ
り、高さ方向の寸法が1mmである。基板1、2の厚さ寸
法は0.3mm 、スぺーサ3の厚さ寸法は0.3mm、ス
ぺーサ3の横断面の縦*横の寸法は3mm *3mm であ
る。スペーサ3の金網としては70メッシュを用いた。
接着剤は、90000cpsの粘度を持つエポキシ系接着
剤を使用し、接着剤の硬化した層4の径が2mm 位であ
る。ウィック5の金網としては 300メッシュ、厚さ
0.1mmの燐青銅金網を用いた。基板1、2としては厚
さ0.3mmの銅板を用い、作動液は水を用いた。上述の
平坦型ヒートパイプにおいては、スペーサ3の接着剤の
充填されていない部分が作動液に対して縦方向の毛細管
作用を有し、ウイックとしても作用するので、横方向の
毛細管作用を有するウィック5との協同作用により冷却
性能の向上が見られた。
[0010] The size of such a flat heat pipe is 200 mm and 50 mm in the longitudinal and transverse directions, and 1 mm in the height direction. The thickness dimensions of the substrates 1 and 2 are 0.3 mm, the thickness dimension of the spacer 3 is 0.3 mm, and the length * width dimension of the cross section of the spacer 3 is 3 mm * 3 mm. 70 mesh was used as the wire mesh of the spacer 3.
As the adhesive, an epoxy-based adhesive having a viscosity of 90000 cps is used, and the diameter of the cured layer 4 of the adhesive is about 2 mm. As the wire mesh of the wick 5, a 300-mesh, 0.1 mm-thick phosphor bronze wire mesh was used. A copper plate having a thickness of 0.3 mm was used as the substrates 1 and 2, and water was used as a working fluid. In the flat heat pipe described above, the portion of the spacer 3 which is not filled with the adhesive has a vertical capillary action on the working fluid and also acts as a wick, so that the wick having a horizontal capillary action is provided. 5, the cooling performance was improved.

【0011】次に上述の平坦型ヒートパイプの製造方法
を説明する。基板1の上にウィック5を敷いてその上に
スペーサ3を置き、スペーサー3の上から適当な粘度の
接着剤を塗布する。その後基板2を上から押し付けるこ
とにより、接着剤はウィック5を通して基板1まで浸透
すると同時に、スペーサ3の空間部に保持され、基板
1、2を接着する。スペーサ3の配置は、ヒートパイプ
使用時の圧力に耐えるという条件から必要なピッチを算
出し、決定する。最後に注入口より作動液を注入して注
入口を封止する。
Next, a method for manufacturing the above-mentioned flat heat pipe will be described. A wick 5 is laid on the substrate 1, the spacer 3 is placed thereon, and an adhesive having an appropriate viscosity is applied from above the spacer 3. Thereafter, by pressing the substrate 2 from above, the adhesive penetrates to the substrate 1 through the wick 5 and is held in the space of the spacer 3 to bond the substrates 1 and 2 together. The arrangement of the spacers 3 is determined by calculating the required pitch from the condition that the pressure withstands when the heat pipe is used. Finally, the working fluid is injected from the injection port to seal the injection port.

【0012】本発明の平坦型ヒートパイプの第二の実施
形態を図5ないし図8を参照して説明する。この形態に
係る平坦型ヒートパイプは、第一の実施形態に比べスペ
ーサの部材を変えたものであり、図1ないし図4に示し
た部材と同一部材には同一符号を付し、その説明を省略
する。基板1の上にシート状の金網ウィック5を介して
多孔体のスペーサ13を配置している。スペーサ13は
有効流路内部に適当な間隔で配置される。14はスペー
サ13内部の接着剤の硬化した層を示す。基板1、2の
間のスペーサ13、外部シール部6に囲まれた空間には
作動液が注入されていて、上述の図示を省略した注入口
は封止剤によって封止されている。
A second embodiment of the flat heat pipe according to the present invention will be described with reference to FIGS. In the flat heat pipe according to this embodiment, the members of the spacer are changed as compared with the first embodiment, and the same members as those shown in FIGS. Omitted. A porous spacer 13 is arranged on a substrate 1 via a sheet-like wire mesh wick 5. The spacers 13 are arranged at appropriate intervals inside the effective flow path. Reference numeral 14 denotes a cured layer of the adhesive inside the spacer 13. The working fluid is injected into a space surrounded by the spacer 13 between the substrates 1 and 2 and the external seal portion 6, and the above-described injection port, not shown, is sealed with a sealing agent.

【0013】スぺーサ13は、ブロンズ素材の焼結体か
らなり、その厚さ寸法が0.3mm、スぺーサ13の横断
面の縦*横の寸法が3mm *3mm である。スペーサ13
の焼結体としては、ブロンズの球状塊(径が約0.1m
m)を焼結した焼結金属を採用した。その隙間の平均的
ギャップは約0.05mm である。接着剤は、第一の実
施の形態と同じエポキシ系樹脂を使用し、ペーサ13に
おいて接着剤の硬化した層14の径が2mm位である。
The spacer 13 is made of a sintered body of a bronze material, has a thickness of 0.3 mm, and a horizontal cross section of the spacer 13 has a length * width of 3 mm * 3 mm. Spacer 13
As a sintered body, a bronze spherical lump (having a diameter of about 0.1 m
m) was used. The average gap is about 0.05 mm. As the adhesive, the same epoxy resin as that of the first embodiment is used, and the diameter of the layer 14 where the adhesive is cured in the pacer 13 is about 2 mm.

【0014】上述の各実施の形態の平坦型ヒートパイプ
において各部材の材質は、作動液に対して安定であるも
のという条件から選定できる。基板1、2は熱伝導率の
よい銅、アルミ等が一般的である。スペーサ3、13及
びウィック5は、熱伝導率がよいことと共に、作動時の
圧力に対する強度保持の条件を考慮し、銅系の材料ある
いはステンレスなどから選択できる。接着剤はエポキシ
系接着剤等が使用できるが、用いたウィック5、スペー
サ3、13の空隙部に保持され、周囲へ流れ出さず、基
板1、2を接着できる粘度と硬化時間のものを選択すれ
ばよい。外周シール部6は一部に開口部を残しておき、
その開口部から作動液を所定の量注入する。作動液は、
水、パーフルオロカーボン、エタノール等が用いられ
る。
In the flat heat pipe of each of the above embodiments, the material of each member can be selected from the condition that it is stable with respect to the working fluid. The substrates 1 and 2 are generally made of copper, aluminum or the like having good thermal conductivity. The spacers 3, 13 and the wick 5 can be selected from a copper-based material, stainless steel, or the like in consideration of good thermal conductivity and the condition of maintaining strength against pressure during operation. As the adhesive, an epoxy-based adhesive or the like can be used, but a material having a viscosity and a curing time that can be bonded to the substrates 1 and 2 while being held in the gaps of the used wick 5 and the spacers 3 and 13 and not flowing out to the surroundings can be used. do it. The outer peripheral seal part 6 leaves an opening partly,
A predetermined amount of hydraulic fluid is injected from the opening. The hydraulic fluid is
Water, perfluorocarbon, ethanol and the like are used.

【0015】[0015]

【発明の効果】以上、詳細に説明したように、本発明の
平坦型ヒートパイプは、受熱板と放熱板との間に複数の
金網体を所定間隔あけて配置し、これら金網体内に接着
剤を含浸させて形成してなる2枚の平板間隔保持スぺー
サを具備している。かかるヒートパイプによれば、複数
の金網体に含浸させた接着剤によって受熱板と放熱板と
を金網体自体の大きさによる間隔をあけて金網体自体を
介して容易に接着でき、かつ、所定間隔あけて配置した
金網体間に形成されるところの作動液の流路に容易にウ
イックを配置させることができる。
As described in detail above, in the flat heat pipe of the present invention, a plurality of wire meshes are arranged at a predetermined interval between a heat receiving plate and a heat radiating plate, and an adhesive is provided in these wire meshes. And two plate-spacing spacers formed by impregnation. According to such a heat pipe, the heat receiving plate and the heat radiating plate can be easily adhered to each other through the wire mesh body at intervals according to the size of the wire mesh body by the adhesive impregnated in the wire mesh body, and The wick can be easily arranged in the flow path of the working fluid formed between the metal nets arranged at intervals.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の平坦型ヒートパイプの第一の実施の形
態の斜視図である。
FIG. 1 is a perspective view of a flat heat pipe according to a first embodiment of the present invention.

【図2】図1に示した平坦型ヒートパイプの2−2線拡
大断面図である。
FIG. 2 is an enlarged sectional view taken along line 2-2 of the flat heat pipe shown in FIG.

【図3】図1に示した平坦型ヒートパイプの要部拡大平
面図である。
FIG. 3 is an enlarged plan view of a main part of the flat heat pipe shown in FIG. 1;

【図4】図3に示した平坦型ヒートパイプ要部の4−4
線断面図である。
FIG. 4 is a view showing a main part of the flat heat pipe shown in FIG.
It is a line sectional view.

【図5】本発明の平坦型ヒートパイプの第二の実施の形
態の斜視図である。
FIG. 5 is a perspective view of a flat heat pipe according to a second embodiment of the present invention.

【図6】図5に示した平坦型ヒートパイプの6−6線拡
大断面図である。
FIG. 6 is an enlarged sectional view taken along line 6-6 of the flat heat pipe shown in FIG.

【図7】図5に示した平坦型ヒートパイプの要部拡大平
面図である。
7 is an enlarged plan view of a main part of the flat heat pipe shown in FIG. 5;

【図8】図7に示した平坦型ヒートパイプ要部の8−8
線断面図である。
FIG. 8-8 of the essential part of the flat heat pipe shown in FIG. 7;
It is a line sectional view.

【図9】従来の押し出し法により製作されたヒートパイ
プの斜視図である。
FIG. 9 is a perspective view of a heat pipe manufactured by a conventional extrusion method.

【図10】図7に示したヒートパイプの10−10線拡
大断面図である。
FIG. 10 is an enlarged sectional view taken along line 10-10 of the heat pipe shown in FIG. 7;

【符号の説明】[Explanation of symbols]

1、 2 基板 3、13 スペーサ 4、14 接着剤が硬化した層 5 ウィック 1, 2 substrate 3, 13 spacer 4, 14 layer with cured adhesive 5 wick

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 受熱板と放熱板との間に複数の金網体を
所定間隔あけて配置し、これら金網体内に接着剤を含浸
させて形成してなる前記2枚の平板間隔保持スぺーサを
具備したことを特徴とする平坦型ヒートパイプ。
1. A two-plate spacing maintaining spacer formed by arranging a plurality of wire meshes at a predetermined interval between a heat receiving plate and a heat radiating plate, and impregnating the wire mesh with an adhesive. A flat type heat pipe comprising:
【請求項2】 受熱板と放熱板との間に網目状隙間を持
つ焼結体を複数所定間隔あけて配置し、これら焼結体内
に接着剤を含浸させて形成してなる前記2枚の平板間隔
保持スぺーサを具備したことを特徴とする平坦型ヒート
パイプ。
2. A method according to claim 1, wherein a plurality of sintered bodies having a mesh-like gap are arranged at predetermined intervals between the heat receiving plate and the heat radiating plate, and the sintered bodies are formed by impregnating an adhesive. A flat heat pipe comprising a flat plate spacing spacer.
JP11029497A 1999-02-08 1999-02-08 Flat type heat pipe Withdrawn JP2000230790A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11029497A JP2000230790A (en) 1999-02-08 1999-02-08 Flat type heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11029497A JP2000230790A (en) 1999-02-08 1999-02-08 Flat type heat pipe

Publications (1)

Publication Number Publication Date
JP2000230790A true JP2000230790A (en) 2000-08-22

Family

ID=12277725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11029497A Withdrawn JP2000230790A (en) 1999-02-08 1999-02-08 Flat type heat pipe

Country Status (1)

Country Link
JP (1) JP2000230790A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004036644A1 (en) * 2002-10-16 2004-04-29 Lg Cable Ltd. Flat plate heat transferring apparatus and manufacturing method thereof
KR100486710B1 (en) * 2001-05-15 2005-05-03 삼성전자주식회사 Evaporator of CPL cooling apparatus having a fine wick structure
JP2009115346A (en) * 2007-11-02 2009-05-28 Fujikura Ltd Heat pipe
CN107228585A (en) * 2017-07-27 2017-10-03 中国科学院长春光学精密机械与物理研究所 A kind of cavity body structure of spoke cold drawing
KR20210157696A (en) * 2020-06-22 2021-12-29 주식회사 씨지아이 A heating medium absorber and vapor chamber having the same and method for manufacturing the same
US11566851B2 (en) * 2018-11-16 2023-01-31 Murata Manufacturing Co., Ltd. Vapor chamber and method of manufacturing vapor chamber

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100486710B1 (en) * 2001-05-15 2005-05-03 삼성전자주식회사 Evaporator of CPL cooling apparatus having a fine wick structure
WO2004036644A1 (en) * 2002-10-16 2004-04-29 Lg Cable Ltd. Flat plate heat transferring apparatus and manufacturing method thereof
CN100346475C (en) * 2002-10-16 2007-10-31 Lg电线有限公司 Flat plate heat transferring apparatus and manufacturing method thereof
JP2009115346A (en) * 2007-11-02 2009-05-28 Fujikura Ltd Heat pipe
CN107228585A (en) * 2017-07-27 2017-10-03 中国科学院长春光学精密机械与物理研究所 A kind of cavity body structure of spoke cold drawing
US11566851B2 (en) * 2018-11-16 2023-01-31 Murata Manufacturing Co., Ltd. Vapor chamber and method of manufacturing vapor chamber
KR20210157696A (en) * 2020-06-22 2021-12-29 주식회사 씨지아이 A heating medium absorber and vapor chamber having the same and method for manufacturing the same
KR102390671B1 (en) * 2020-06-22 2022-04-26 주식회사 씨지아이 A heating medium absorber and vapor chamber having the same and method for manufacturing the same

Similar Documents

Publication Publication Date Title
US7859846B2 (en) Low thermal resistance power module assembly
KR100495699B1 (en) Flat plate heat transferring apparatus and manufacturing method thereof
JP3241270B2 (en) Thermoelectric converter
JP3472550B2 (en) Thermoelectric conversion device and method of manufacturing the same
KR101801823B1 (en) Polymer-based pulsating heat pipe and manufacturing method thereof
US7804048B2 (en) Structure for cooling a surface
CN211261893U (en) Vapor chamber, heat dissipation device, and electronic device
JP4466644B2 (en) heatsink
WO2022033289A1 (en) Flat plate heat pipe and manufacturing method therefor, and heat exchanger
JPS61187351A (en) Semiconductor module for power integrating heat pipe
JP2007507685A (en) Plate heat transfer device
CN107421364B (en) Temperature equalizing plate structure and manufacturing method thereof
WO2007026833A1 (en) Heat pipe and method of manufacturing the same
CN110364501B (en) Micro-channel heat dissipation structure, manufacturing method and electronic device
CN211429852U (en) Heat dissipation plate and electronic device with same
US20220022339A1 (en) Heat dissipation device
JP2008198860A (en) Cooling method of small portable terminal equipment
WO2022257963A1 (en) Heat dissipation member and electronic device
JP2000230790A (en) Flat type heat pipe
JPH03186195A (en) Radiator with heat pipe and manufacture thereof
CN113950232B (en) Manufacturing method of heat conduction device, heat conduction device and terminal equipment
JPS6225905Y2 (en)
CN214592626U (en) Electronic equipment and conductive soaking device
US7498672B2 (en) Micropin heat exchanger
JPH0582686A (en) Semiconductor heat sink structure

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20060509