CN217686783U

CN217686783U - Temperature equalizing plate

Info

Publication number: CN217686783U
Application number: CN202221045554.XU
Authority: CN
Inventors: 林俊宏
Original assignee: MICROLOOPS CORP; Huizhou Huiliqin Electronic Technology Co ltd
Current assignee: MICROLOOPS CORP; Huizhou Huiliqin Electronic Technology Co ltd
Priority date: 2022-05-05
Filing date: 2022-05-05
Publication date: 2022-10-28
Anticipated expiration: 2032-05-05

Abstract

The utility model relates to a temperature-uniforming plate, which comprises a first shell, a support column, a capillary structure, a second shell, a fixing layer and a working fluid, wherein the first shell is provided with an inner surface; the supporting columns are arranged on the inner surface of the first shell and provided with end faces; the capillary structure is laid on the inner surface of the first shell; the second shell is sealed corresponding to the first shell and forms a containing cavity together; the fixing layer is formed between the inner surface of the first shell and the end surface of the support column; the working fluid is disposed in the cavity. Therefore, the positions of the support pillars can be rapidly changed according to the actual heat dissipation requirement, and the time required by the manufacturing process is further greatly shortened.

Description

Temperature equalizing plate

Technical Field

The present invention relates to a heat sink, and more particularly to a temperature equalization plate.

Background

With the vigorous development and application of network technology, the user's requirements for the computer booting speed, the software reading speed, and the playing speed of photos and videos are continuously increased, so as to effectively save time and become one of the conditions for the consumer to select products.

Along with the improvement of performance and reading speed, the heat productivity and temperature of electronic components are also increasing, and the high temperature not only makes most of electronic components easily and rapidly aged, but also reduces the reading and writing speed of electronic components such as solid state disk, so how to maintain the working temperature becomes the subject of the present application.

In order to solve the Heat dissipation problem of the electronic components, heat pipes (Heat pipes) and Vapor chambers (Vapor chambers) have been developed, wherein the Vapor chambers cover a wide range, have short thermal conduction paths, and have better Heat dissipation performance than the Heat pipes.

However, in the manufacturing process, in addition to the need of forming a large number of dies for punching, blanking, folding and the like, the manufacturing difficulty of the uniform temperature plate with the supporting column is higher than that of the uniform temperature plate with the supporting column. And various electronic heating sources have special heat-clearing schemes, and can not be universally and widely applied. The existing temperature-equalizing plate and the manufacturing method thereof can obviously not meet the use requirements at the present stage.

SUMMERY OF THE UTILITY MODEL

The main objective of the present invention is to provide a vapor chamber, which can rapidly change the positions of the supporting pillars in response to the actual heat dissipation requirement, thereby greatly shortening the time required for the manufacturing process.

In order to achieve the above object, the present invention provides a vapor chamber, comprising a first housing, a plurality of support pillars, a capillary structure, a second housing, a fixing layer and a working fluid, wherein the first housing has an inner surface; each supporting column is arranged on the inner surface of the first shell, and each supporting column is provided with an end face; the capillary structure is laid on the inner surface of the first shell; the second shell is sealed corresponding to the first shell and forms a containing cavity together; the fixing layer is formed between the inner surface of the first shell and the end surface of each supporting column; the working fluid is arranged in the cavity.

Optionally, the second housing has an inner surface, each of the supporting pillars has another end surface, and the another fixing layer is formed between the inner surface of the second housing and the another end surface of each of the supporting pillars.

Optionally, a further capillary structure is further included, the further capillary structure being laid on the inner surface of the second housing.

Optionally, the other capillary structure is provided with a plurality of through holes, and each through hole is sleeved corresponding to each supporting column.

Optionally, the anchor layer is a cured copper paste.

Optionally, the temperature equalization plate has a main heat-releasing region and a secondary heat-releasing region, and the arrangement density of each support pillar in the main heat-releasing region is greater than that in the secondary heat-releasing region.

Optionally, the capillary structure is provided with a plurality of through holes, and each through hole is sleeved with each supporting column correspondingly.

Optionally, each of the support posts further comprises a capillary tissue coated on the periphery thereof.

Optionally, the temperature equalization plate has a main heat release region, and the support pillars are arranged in the main heat release region.

Optionally, each of the supporting pillars is a hollow body, and each of the hollow bodies is formed by extending from the second housing.

Therefore, the positions of the support pillars can be rapidly changed according to the actual heat dissipation requirement, and the time required by the manufacturing process is greatly shortened.

Drawings

FIG. 1 is a block flow chart of the manufacturing method of the vapor chamber of the present invention.

Fig. 2 is an exploded view of the first housing and the support posts of the present invention.

Fig. 3 is a schematic view of the capillary structure of the present invention combined with the first housing.

Fig. 4 is a schematic view of the second housing of the present invention combined with the first housing.

Fig. 5 is a combined cross-sectional view of the vapor chamber of the present invention.

Fig. 6 is a top view of the vapor chamber of the present invention.

Fig. 7 is a schematic view illustrating a capillary structure combined with a first housing according to another embodiment of the present invention.

Fig. 8 is a schematic view illustrating each supporting pillar of another embodiment of the present invention combined with the first housing.

Fig. 9 is a schematic view illustrating a second housing combined with a first housing according to another embodiment of the present invention.

Fig. 10 is a combined cross-sectional view of another embodiment of the present invention.

Fig. 11 is a cross-sectional view of another embodiment of the support post of the present invention.

In the figure:

1, a temperature-equalizing plate; 10: a first housing; 11, an inner surface; 20. 20A, 20B are supporting columns; 21, end face; 22, the other end surface; 23, capillary tissue; 30, a capillary structure; 30A, another capillary structure; 31. 31A, perforating; 40, a second shell; 41, an inner surface; 50, a fixing layer; 50A, another fixing layer; 60 working fluid; a is adhesive paste; b, another adhesive paste; c, a containing cavity; h1, a main heat-release area; h2 is a secondary antipyretic zone; a to e, steps.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.

Referring to fig. 1 to 6, the method for manufacturing a vapor chamber of the present invention includes the steps of:

a) Providing a first housing 10, a plurality (more than two) of supporting pillars 20, a capillary structure 30 and a second housing 40, wherein the first housing 10 has an inner surface 11, and each supporting pillar 20 has an end surface 21;

referring to fig. 2 and 6, the first casing 10 may have a geometric shape or an irregular shape according to the environment of various electronic heat sources (not shown), and may be made of a material with good thermal conductivity such as copper, aluminum, magnesium or an alloy thereof, and the first casing 10 has an inner surface 11.

The support posts 20 may also be made of a material with good thermal conductivity such as copper, aluminum, magnesium or alloys thereof, and may be a solid cylinder with one end surface 21 at the bottom of each support post 20 and another end surface 22 at the top of each support post 20.

Referring to fig. 3, the capillary structure 30 may be made of a material with good capillary adsorption capacity, such as a metal mesh, porous sintered powder, or fiber bundle, and the shape of the capillary structure is substantially similar to the shape of the first housing 10, so as to cover the inner surface 11 of the first housing 10 completely; a through hole 31 is formed at a position of the capillary structure 30 corresponding to each of the support pillars 20.

The second housing 40 is also made of copper, aluminum, magnesium or their alloys with good thermal conductivity, and its shape matches the shape of the first housing 10, and the second housing 10 also has an inner surface 41 (as shown in fig. 5).

b) Providing an adhesive paste A, coating the adhesive paste A on the inner surface 11 of the first shell 10 and one of the end surfaces 21 of each supporting pillar 20, and combining to form a fixing layer 50; referring to fig. 2 and 3, the adhesive paste a is a copper paste made of a copper powder substrate mixed with an adhesive, and the adhesive paste a may be coated on the inner surface 11 of the first shell 10 at a predetermined position corresponding to each of the supporting pillars 20, or coated on the end surface 21 of each of the supporting pillars 20, or both. Then, the end face 21 of each supporting post 20 is erected on the predetermined position of the inner surface 11 of the first housing 10, and the adhesive paste a is formed into an adhesive layer 50 through a heating and pressing bonding process.

c) Laying the capillary structure 30 on the inner surface 11 of the first housing 10 and bonding; referring to fig. 3 again, in this step, the through holes 31 of the capillary structure 30 are respectively sleeved corresponding to the supporting pillars 20, so that the capillary structure 30 can be entirely covered on the inner surface 11 of the first housing 10, and the capillary structure 30 is fixed on the inner surface 11 of the first housing 10 through a thermal diffusion welding process.

d) The second shell 40 is sealed corresponding to the first shell 10 and forms a containing cavity C together; referring to fig. 4, in this step, the second casing 40 is covered corresponding to the first casing 10, and an edge sealing and welding process is performed at the joint of the first casing 10 and the second casing 40, so as to form a cavity C (as shown in fig. 5) between the first casing 10 and the second casing 40.

e) Providing a working fluid 60, injecting the working fluid 60 into the chamber C, and performing a degassing sealing process. Referring to fig. 5, in this step, a working fluid 60 such as pure water is injected into the cavity C, and a degassing sealing process is performed to form the cavity C as a vacuum chamber.

Referring to fig. 5, the vapor chamber manufactured by the above method mainly includes a first housing 10, a plurality of support pillars 20, a capillary structure 30, a second housing 40, a fixing layer 50, and a working fluid 60, wherein the first housing 10 has an inner surface 11; the supporting pillars 20 are arranged on the inner surface 11 of the first shell 10, and each supporting pillar 20 is provided with an end surface 21; the capillary structure 30 is laid on the inner surface 11 of the first housing 10; the second shell 40 is sealed corresponding to the first shell 10 and forms a containing cavity C together; the anchor layer 50 is formed between the inner surface 11 of the first housing 10 and the end surface 21 of each support column 20; the working fluid 60 is disposed in the cavity C.

Referring to fig. 6, in addition to the arrangement of the support pillars 20, the temperature equalizing plate may be arranged in an equidistant manner, and the temperature equalizing plate has a main heat releasing area H1 (within a range of a dotted line region) and a primary heat releasing area H2 (outside the range of the dotted line region), wherein the main heat releasing area H1 is configured corresponding to each electronic heat source, the secondary heat releasing area H2 is formed around the outer periphery of each electronic heat source, and the arrangement density of the support pillars 20 in the main heat releasing area H1 is greater than the arrangement density of the support pillars 20 in the secondary heat releasing area H2 of the temperature equalizing plate.

In one embodiment, the method for manufacturing a vapor chamber further includes a step d 0), in which the step d 0) provides another adhesive paste B, the second housing 40 has an inner surface 41, each of the supporting pillars 20 has another end surface 22, the another adhesive paste B is applied to one of the inner surface 41 of the second housing 40 and the another end surface 22 of each of the supporting pillars 20, and is combined to form another fixing layer 50A. Referring to fig. 4, in this step, another adhesive paste B is coated on the inner surface 41 of the second shell 40 at a predetermined position corresponding to each supporting pillar 20, or another adhesive paste B is coated on the other end surface 22 of each supporting pillar 20, or both of the above two forms. Then, the second casing 40 is covered corresponding to the first casing 10, and another adhesive paste B is formed into another adhesive layer 50A through a heating and pressing bonding process.

In one embodiment, the step d 0) is performed before the step d).

In one embodiment, the step d 0) is performed simultaneously with the step d).

Referring to fig. 7 to 9, the manufacturing method of the vapor chamber of the present invention can be implemented before the step b) in addition to the above-mentioned embodiments. It should be noted that the adhesive paste a of the present embodiment is only coated under the end surface 21 of each supporting pillar 20 (as shown in fig. 8), and the other adhesive paste B is only coated over the other end surface 22 of each supporting pillar 20 (as shown in fig. 9).

Referring to fig. 10, the second housing 40 and the supporting pillars of the vapor chamber of the present invention can be separated from each other as in the above embodiments, wherein each supporting pillar 20A can also be directly punched from the second housing 40, and each supporting pillar 20A is a hollow body.

Referring to fig. 11, in addition to the above embodiments, each supporting pillar 20B of the temperature equalizing plate of the present invention further includes a capillary structure 23 covering the circumference of the supporting pillar 20, and the capillary structure 23 may be made of porous sintered powder or fiber bundle with good capillary adsorption. Which is mainly arranged in the main heat-releasing zone H1.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.

Claims

1. A vapor chamber, comprising:

a first housing having an inner surface;

a plurality of supporting columns, which are arranged on the inner surface of the first shell, and each supporting column is provided with an end surface;

the capillary structure is laid on the inner surface of the first shell;

the second shell is sealed corresponding to the first shell and forms a containing cavity together;

a fixing layer formed between the inner surface of the first shell and the end surface of each supporting column; and

and the working fluid is arranged in the cavity.

2. The vapor-deposition plate of claim 1, further comprising another fixing layer, wherein the second housing has an inner surface, each of the supporting pillars has another end surface, and the another fixing layer is formed between the inner surface of the second housing and the another end surface of each of the supporting pillars.

3. The vapor chamber of claim 2, further comprising an additional capillary structure disposed on the inner surface of the second housing.

4. The vapor-deposition plate of claim 3, wherein the other capillary structure has a plurality of through holes, and each through hole is sleeved with each supporting pillar.

5. The vapor-deposition plate of claim 1, wherein the anchor layer is a cured copper paste.

6. The temperature equalization plate of claim 1, wherein the temperature equalization plate has a main heat dissipation area and a secondary heat dissipation area, and the arrangement density of the support pillars in the main heat dissipation area is greater than that of the support pillars in the secondary heat dissipation area.

7. The vapor chamber of claim 1, wherein the capillary structure has a plurality of through holes, and each through hole is sleeved with each supporting column.

8. The vapor chamber of claim 1, wherein each support pillar further comprises a capillary structure surrounding the support pillar.

9. The temperature-equalizing plate of claim 8, wherein the temperature-equalizing plate has a main heat-releasing region, and the supporting pillars are arranged in the main heat-releasing region.

10. The vapor chamber of claim 1, wherein each of the plurality of support posts is a hollow body, each hollow body extending from the second housing.