CN117053606A - Uniform temperature plate and manufacturing method thereof - Google Patents

Uniform temperature plate and manufacturing method thereof Download PDF

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Publication number
CN117053606A
CN117053606A CN202210478950.XA CN202210478950A CN117053606A CN 117053606 A CN117053606 A CN 117053606A CN 202210478950 A CN202210478950 A CN 202210478950A CN 117053606 A CN117053606 A CN 117053606A
Authority
CN
China
Prior art keywords
support column
housing
shell
capillary structure
isopipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210478950.XA
Other languages
Chinese (zh)
Inventor
林俊宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MICROLOOPS CORP
Huizhou Huiliqin Electronic Technology Co ltd
Original Assignee
MICROLOOPS CORP
Huizhou Huiliqin Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MICROLOOPS CORP, Huizhou Huiliqin Electronic Technology Co ltd filed Critical MICROLOOPS CORP
Priority to CN202210478950.XA priority Critical patent/CN117053606A/en
Publication of CN117053606A publication Critical patent/CN117053606A/en
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/005—Other auxiliary members within casings, e.g. internal filling means or sealing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
    • F28F9/262—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators for radiators
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The application relates to a temperature equalizing plate and a manufacturing method thereof, wherein the temperature equalizing plate comprises a first shell, a support column, a capillary structure, a second shell, a fixing layer and working fluid, wherein the first shell is provided with an inner surface; the support columns are arranged on the inner surface of the first shell and are provided with end faces; the capillary structure is laid on the inner surface of the first shell; the second shell is sealed corresponding to the first shell and forms a containing cavity together; the fixing layer is formed between the inner surface of the first shell and the end surface of the support column; the working fluid is arranged in the cavity. Therefore, the positions of the support columns can be quickly changed according to the actual heat dissipation requirement, and the time required by the manufacturing process is greatly shortened.

Description

Uniform temperature plate and manufacturing method thereof
Technical Field
The present application relates to a heat sink, and more particularly to a temperature equalizing plate and a manufacturing method thereof.
Background
With the rapid development and application of network technology, the requirement of users for the starting-up speed of computers, the reading speed of software and the playing speed of photos and films is continuously improved, so that the time can be effectively saved as one of conditions when consumers select products.
With the improvement of efficiency and reading speed, the heat productivity and temperature of the electronic components are continuously increased, and the high temperature can not only make most of the electronic components easy to be aged rapidly, but also reduce the reading and writing speed of the electronic components such as solid state disk, so how to maintain the working temperature becomes the research subject of the application.
In order to solve the Heat dissipation problem of the electronic device, high-performance Heat conducting and dissipating members such as Heat Pipe (Heat Pipe) and Vapor Chamber (Vapor Chamber) have been developed in the industry, wherein the Vapor Chamber covers a wide range, has a short Heat conducting path, and has Heat conducting and dissipating performance superior to that of the Heat Pipe, and is a main stream member for dissipating Heat of the electronic device.
However, in the manufacturing process, a large number of dies are required to be arranged for punching, blanking, edge folding and other processes, and the manufacturing difficulty of the temperature equalization plate with the support columns is higher than that of the temperature equalization plate with the support columns. And various different electronic heating sources have special heat-relieving schemes and cannot be widely and widely applied. The existing temperature equalizing plate and the manufacturing method thereof obviously cannot meet the use requirement at the present stage.
Disclosure of Invention
The main objective of the present application is to provide a temperature equalizing plate and a manufacturing method thereof, which can rapidly change the position of each support column according to the actual heat dissipation requirement, thereby greatly shortening the time required by the manufacturing process.
In order to achieve the above-mentioned objective, the present application provides a temperature equalization plate, comprising a first housing, a plurality of support columns, a capillary structure, a second housing, a fixing layer and a working fluid, wherein the first housing has an inner surface; each supporting column is arranged on the inner surface of the first shell, and each supporting column is provided with an end face; the capillary structure is laid on the inner surface of the first shell; the second shell is sealed corresponding to the first shell and forms a containing cavity together; the fixing layer is formed between the inner surface of the first shell and the end surface of each supporting column; the working fluid is arranged in the cavity.
Optionally, the second housing further includes a further fixing layer, the second housing has an inner surface, each support column has a further end surface, and the further fixing layer is formed between the inner surface of the second housing and the further end surface of each support column.
Optionally, a further capillary structure is further included, the further capillary structure being laid on the inner surface of the second housing.
Optionally, the other capillary structure is provided with a plurality of through holes, and each through hole is sleeved with each support column.
Optionally, the anchor layer is a cured copper paste.
Optionally, the soaking plate has a main heat release area and a primary heat release area, and the arrangement density of the support columns in the main heat release area is greater than that of the support columns in the secondary heat release area.
Optionally, the capillary structure is provided with a plurality of through holes, and each through hole is sleeved with each support column.
Optionally, each of the support columns further includes a capillary structure coated on a peripheral surface thereof.
Optionally, the temperature equalization plate has a main heat release area, and each support column is arranged in the main heat release area.
Optionally, each of the support columns is a hollow body, and each hollow body is formed by extending from the second housing.
In order to achieve the above-mentioned object, the present application also provides a method for manufacturing a temperature equalization plate, comprising the steps of a) providing a first housing, a plurality of support columns, a capillary structure and a second housing, wherein the first housing has an inner surface, and each support column has an end surface; step b) providing an adhesive paste, coating the adhesive paste on one of the inner surface of the first shell and the end surface of each supporting column, and combining the adhesive paste to form a fixing layer; step c) paving the capillary structure on the inner surface of the first shell and combining the capillary structure; step d), sealing the second shell corresponding to the first shell and jointly forming a containing cavity; and e) providing a working fluid, injecting the working fluid into the cavity, and processing the working fluid through a degassing seal.
Optionally, the step c) is performed before the step b).
Optionally, the method further includes a step d 0), wherein the step d 0) provides another adhesive paste, the second housing has an inner surface, each support column has another end surface, and the another adhesive paste is coated on one of the inner surface of the second housing and the other end surface of each support column, and is combined to form another fixing layer.
Optionally, the step d 0) is performed before the step d).
Optionally, the step d 0) is performed simultaneously with the step d).
Optionally, in the step b), the inner surface of the first housing and the end surface of each support column are subjected to a heat and pressure bonding process.
Optionally, in the step c), the capillary structure and the inner surface of the first housing are subjected to a thermal diffusion bonding process.
Therefore, the position of each support column can be quickly changed according to the actual heat dissipation requirement, and the time required by the manufacturing process is greatly shortened.
Drawings
FIG. 1 is a block flow chart of a method for manufacturing a temperature equalization plate according to the present application.
Fig. 2 is an exploded view of the first housing and support columns of the present application.
Fig. 3 is a schematic view showing the capillary structure of the present application combined with the first housing.
Fig. 4 is a schematic diagram of the second housing combined with the first housing.
FIG. 5 is a sectional view of the temperature equalization plate assembly of the present application.
FIG. 6 is a top view of the isopipe of the present application.
Fig. 7 is a schematic view showing a capillary structure combined with a first housing according to another embodiment of the present application.
Fig. 8 is a schematic view illustrating that support columns are combined with the first housing according to another embodiment of the present application.
Fig. 9 is a schematic diagram of a second housing combined with a first housing according to another embodiment of the present application.
Fig. 10 is a combined cross-sectional view of yet another embodiment of the present application.
FIG. 11 is a cross-sectional view of another embodiment of a support column of the present application.
In the figure:
1, a temperature equalizing plate; 10, a first shell; 11, inner surface; 20. 20A and 20B, supporting columns; 21, end face; 22, the other end face; 23, capillary tissue; 30, capillary structure; 30A, another capillary structure; 31. 31A, perforating; 40, a second shell; 41 an inner surface; 50, fixing layer; 50A, another anchoring layer; 60, working fluid; a, adhesive paste; another adhesive paste; c, a containing cavity; h1, a main solution zone; h2, secondary fever zone; a to e, the steps are as follows.
Detailed Description
The present application will be further described with reference to the accompanying drawings and specific examples, which are not intended to limit the application, so that those skilled in the art may better understand the application and practice it.
Referring to fig. 1 to 6, the present application provides a method for manufacturing a temperature equalization plate, which includes the following steps:
a) Providing a first housing 10, a plurality (more than two) of support columns 20, a capillary structure 30 and a second housing 40, wherein the first housing 10 has an inner surface 11, and each support column 20 has an end surface 21;
referring to fig. 2 and 6, the first housing 10 may be geometrically or irregularly shaped according to the environment of various electronic heat sources (not shown), and may be made of a material with good thermal conductivity, such as copper, aluminum, magnesium or alloys thereof, and the first housing 10 has an inner surface 11.
The support columns 20 may also be made of a material with good thermal conductivity, such as copper, aluminum, magnesium, or alloys thereof, and may be a solid cylinder with one end surface 21 at the bottom of each support column 20 and another end surface 22 at the top of each support column 20.
Referring to fig. 3, the capillary structure 30 may be made of a material with good capillary adsorption force, such as a metal woven mesh, porous sintered powder, fiber bundles, etc., and has a shape substantially similar to that of the first housing 10, so as to cover the inner surface 11 of the first housing 10 comprehensively; a through hole 31 is disposed at a position of the capillary structure 30 corresponding to each of the support columns 20.
The second housing 40 is also made of a material with good thermal conductivity, such as copper, aluminum, magnesium or an alloy thereof, and has a shape matching that of the first housing 10, and the second housing 10 also has an inner surface 41 (as shown in fig. 5).
b) Providing an adhesive paste A, coating the adhesive paste A on one of the inner surface 11 of the first shell 10 and the end surface 21 of each supporting column 20, and combining to form a fixing layer 50; referring to fig. 2 and 3, the adhesive paste a is a copper paste made by mixing materials such as copper powder base material and adhesive, and in this step, the adhesive paste a may be applied to the inner surface 11 of the first housing 10 at a predetermined position corresponding to each support column 20, or the adhesive paste a may be applied to the end face 21 of each support column 20, or both of the above forms. Then, the end face 21 of each support column 20 is erected on a predetermined position of the inner surface 11 of the first housing 10, and the adhesive paste a is formed into a fixing layer 50 by a heat and pressure bonding process.
c) Laying the capillary structure 30 on the inner surface 11 of the first housing 10 and bonding; referring to fig. 3 again, in this step, each through hole 31 of the capillary structure 30 is sleeved with each support column 20, so that the capillary structure 30 can fully cover the inner surface 11 of the first housing 10, and the capillary structure 30 is fixed on the inner surface 11 of the first housing 10 through a thermal diffusion welding process.
d) Sealing the second housing 40 corresponding to the first housing 10 and forming a cavity C together; referring to fig. 4, in this step, the second housing 40 is covered corresponding to the first housing 10, and a sealing welding process is performed at the joint between the first housing 10 and the second housing 40, so as to form a cavity C (as shown in fig. 5) between the first housing 10 and the second housing 40.
e) A working fluid 60 is provided, and the working fluid 60 is injected into the cavity C and is processed through a degassing seal. Referring to fig. 5, in this step, a working fluid 60 such as pure water is injected into the chamber C, and a degassing seal process is performed, so that the chamber C is formed as a vacuum chamber.
Referring to fig. 5 again, the temperature equalizing plate manufactured by the above manufacturing method mainly includes a first housing 10, a plurality of support columns 20, a capillary structure 30, a second housing 40, a fixing layer 50 and a working fluid 60, wherein the first housing 10 has an inner surface 11; each support column 20 is arranged on the inner surface 11 of the first shell 10, and each support column 20 is provided with an end surface 21; the capillary structure 30 is laid on the inner surface 11 of the first housing 10; the second housing 40 is sealed corresponding to the first housing 10 and forms a cavity C together; the anchor layer 50 is formed between the inner surface 11 of the first housing 10 and the end face 21 of each support column 20; the working fluid 60 is disposed in the chamber C.
Referring to fig. 6, the support columns 20 are arranged in an equidistant manner, and the temperature equalizing plate has a main heat-dissipating area H1 (within the range of the dotted line area) and a primary heat-dissipating area H2 (outside the range of the dotted line area), wherein the main heat-dissipating area H1 corresponds to each electron heat source, the secondary heat-dissipating area H2 is formed around each electron heat source, and the arrangement density of the support columns 20 in the main heat-dissipating area H1 is greater than the arrangement density of the support columns 20 in the secondary heat-dissipating area H2 of the temperature equalizing plate.
In an embodiment, the method for manufacturing a temperature uniformity plate of the present application further includes a step d 0), wherein the step d 0) provides another adhesive paste B, the second housing 40 has an inner surface 41, each support column 20 has another end surface 22, and the another adhesive paste B is applied to one of the inner surface 41 of the second housing 40 and the other end surface 22 of each support column 20, and is combined to form a another fixing layer 50A. Referring to fig. 4, in this step, another adhesive paste B is applied to the inner surface 41 of the second housing 40 at a predetermined position corresponding to each support column 20, or another adhesive paste B is applied to the other end surface 22 of each support column 20, or both of the above forms may be used. Then, the second case 40 is covered corresponding to the first case 10, and another adhesive paste B is formed into another fixing layer 50A through a heat and pressure bonding process.
In one embodiment, the step d 0) is performed before the step d).
In one embodiment, the step d 0) is performed simultaneously with the step d).
Referring to fig. 7 to 9, the method for manufacturing a temperature equalization plate according to the present application may be performed by arranging the step c) before the step b) in addition to the above-mentioned embodiments. It should be noted that the adhesive paste a of the present embodiment is only applied below the end face 21 of each support column 20 (as shown in fig. 8), and the other adhesive paste B is only applied above the other end face 22 of each support column 20 (as shown in fig. 9).
Referring to fig. 10, in addition to the above embodiments, the second housing 40 and the support columns of the temperature equalizing plate of the present application can be separately provided, wherein each support column 20A can be directly punched from the second housing 40, and each support column 20A is a hollow body.
Referring to fig. 11, in addition to the above embodiments, each support column 20B of the temperature equalization plate of the present application further includes a capillary structure 23 coated on the peripheral surface of the support column 20, where the capillary structure 23 may be made of porous sintered powder or fiber bundles with good capillary adsorption force. Which is mainly disposed in the main heat solving area H1.
The above-described embodiments are merely preferred embodiments for fully explaining the present application, and the scope of the present application is not limited thereto. Equivalent substitutions and modifications will occur to those skilled in the art based on the present application, and are intended to be within the scope of the present application. The protection scope of the application is subject to the claims.

Claims (17)

1. A temperature equalization plate, comprising:
a first housing having an inner surface;
a plurality of support columns arranged on the inner surface of the first shell, wherein each support column is provided with an end face;
a capillary structure laid on the inner surface of the first shell;
the second shell is sealed corresponding to the first shell and jointly forms a containing cavity;
a fixing layer formed between the inner surface of the first housing and the end surface of each support column; and
a working fluid is arranged in the cavity.
2. The isopipe of claim 1 further comprising a further anchor layer, the second housing having an inner surface, each support column having a further end surface, the further anchor layer being formed between the inner surface of the second housing and the further end surface of each support column.
3. The isopipe of claim 2, further comprising a further capillary structure laid down on the inner surface of the second housing.
4. The temperature equalization plate of claim 3, wherein the other capillary structure is provided with a plurality of perforations, each perforation being sleeved with a corresponding support column.
5. The isopipe of claim 1 wherein the anchor layer is a cured copper paste.
6. The isopipe of claim 1 wherein the isopipe has a primary and a secondary heat release zone, the support column arrangement density within the primary heat release zone being greater than the support column arrangement density of the secondary heat release zone.
7. The temperature equalization plate of claim 1, wherein the capillary structure is provided with a plurality of perforations, each perforation being sleeved with a corresponding support column.
8. The isopipe of claim 1 wherein each support column further comprises a capillary structure coating the perimeter surface.
9. The isopipe of claim 8 wherein the isopipe has a main solution zone where each of the support columns is arranged.
10. The isopipe of claim 1 wherein each support column comprises a hollow body, each hollow body extending from the second housing.
11. The manufacturing method of the temperature equalization plate is characterized by comprising the following steps:
step a) providing a first shell, a plurality of support columns, a capillary structure and a second shell, wherein the first shell is provided with an inner surface, and each support column is provided with an end face;
step b) providing an adhesive paste, coating the adhesive paste on one of the inner surface of the first shell and the end surface of each supporting column, and combining the adhesive paste to form a fixing layer;
step c) paving the capillary structure on the inner surface of the first shell and combining the capillary structure;
step d), sealing the second shell corresponding to the first shell and jointly forming a containing cavity; and
step e) providing a working fluid, injecting the working fluid into the cavity, and processing the working fluid through a degassing seal.
12. The method of claim 11, wherein step c) is performed before step b).
13. The method of claim 11, further comprising a step d 0), wherein the step d 0) provides another adhesive paste, the second housing has an inner surface, each support column has another end surface, and the another adhesive paste is coated on one of the inner surface of the second housing and the other end surface of each support column and combined to form another fixing layer.
14. The method of claim 13, wherein step d 0) is performed before step d).
15. The method of claim 13, wherein the step d 0) is performed simultaneously with the step d).
16. The method of claim 11, wherein in the step b), the inner surface of the first housing and the end surface of each support column are subjected to a thermal pressing bonding process.
17. The method of claim 11, wherein in the step c), the capillary structure and the inner surface of the first housing are subjected to a thermal diffusion bonding process.
CN202210478950.XA 2022-05-05 2022-05-05 Uniform temperature plate and manufacturing method thereof Pending CN117053606A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210478950.XA CN117053606A (en) 2022-05-05 2022-05-05 Uniform temperature plate and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210478950.XA CN117053606A (en) 2022-05-05 2022-05-05 Uniform temperature plate and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN117053606A true CN117053606A (en) 2023-11-14

Family

ID=88667862

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210478950.XA Pending CN117053606A (en) 2022-05-05 2022-05-05 Uniform temperature plate and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN117053606A (en)

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