CN112944965B - High-heat-conductivity vapor chamber and preparation method thereof - Google Patents
High-heat-conductivity vapor chamber and preparation method thereof Download PDFInfo
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- CN112944965B CN112944965B CN202110192655.3A CN202110192655A CN112944965B CN 112944965 B CN112944965 B CN 112944965B CN 202110192655 A CN202110192655 A CN 202110192655A CN 112944965 B CN112944965 B CN 112944965B
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- 238000002360 preparation method Methods 0.000 title claims description 7
- 239000007788 liquid Substances 0.000 claims abstract description 85
- 230000017525 heat dissipation Effects 0.000 claims abstract description 39
- 238000011049 filling Methods 0.000 claims abstract description 22
- 239000011248 coating agent Substances 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 229910003460 diamond Inorganic materials 0.000 claims description 27
- 239000010432 diamond Substances 0.000 claims description 27
- 238000005245 sintering Methods 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 239000000843 powder Substances 0.000 claims description 23
- 238000012546 transfer Methods 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 239000002131 composite material Substances 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 8
- 238000010521 absorption reaction Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000009835 boiling Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000004321 preservation Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 244000137852 Petrea volubilis Species 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 abstract description 5
- 230000008020 evaporation Effects 0.000 abstract description 5
- 238000002791 soaking Methods 0.000 description 11
- 230000009471 action Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 238000010992 reflux Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- -1 greasy dirt Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of electronic component heat dissipation, in particular to a high-heat-conductivity vapor chamber. The high-heat-conductivity vapor chamber comprises an upper cover plate and a lower cover plate, wherein a sealed cavity is formed between the upper cover plate and the lower cover plate, a liquid suction core with a plurality of columnar bulges is fixedly arranged on the bottom surface of the upper cover plate, and the columnar bulges are positioned in the cavity; the upper surface of the lower cover plate is provided with a groove, and the side surface of the lower cover plate is also provided with a liquid filling pipe communicated with the cavity. The liquid working medium is arranged on the liquid suction core, and the liquid working medium flows out of the liquid suction core through the liquid suction core; the working medium finally flows through the evaporation surface of the lower cover plate, and as the lower cover plate is provided with the grooves, the surface area of the lower cover plate is increased, the total capillary pressure of the vapor chamber is improved, the flow of the working medium is accelerated, and the overall heat dissipation performance of the vapor chamber is also improved.
Description
Technical Field
The invention relates to the technical field of electronic component heat dissipation, in particular to a high-heat-conductivity vapor chamber and a preparation method thereof.
Background
With the rapid development of information society, miniaturization and high integration of electronic products have become the mainstream development trend. However, along with miniaturization and integration of electronic products, there are problems that the effective heat dissipation area is greatly reduced and the heat flux density is rapidly increased. According to the current big data statistics, in the operation faults of all electronic equipment, the faults caused by the overhigh temperature are up to more than 55 percent. With the improvement of the heat dissipation requirement of people on equipment, the heat dissipation device is required to have certain capacity of bearing thermal deformation and has the function of effectively dissipating heat in the environment with small volume and high heat flux. The conventional heat dissipation technology of attaching the aluminum heat dissipation fins to the electronic components has been difficult to meet the modern heat dissipation requirements. The vapor chamber has the characteristics of high heat dissipation efficiency, uniform heat conduction, simple appearance and the like, and has important application values in the application industries of high-speed transmission hard disk heat dissipation, high-performance micro-processing unit heat dissipation (such as CPU, display card and the like), 5G chip base station heat dissipation, high-power laser emitter heat dissipation and the like.
At present, the wick of the vapor chamber is generally divided into a sintering type wick and a groove type wick. However, the wick prepared by the sintering type vapor chamber generally requires a larger cavity space, so that the vapor chamber is not in accordance with the current development trend of light, thin and short electronic components in terms of volume and mass; the grooved soaking plate has optimized overall volume and mass relative to the sintered type, but the capillary pressure of the grooved soaking plate wick is lower than that of the sintered type hot plate wick. Chinese patent application, publication No.: CN102595861B discloses a soaking plate with inner sintering structure supporting columns, an upper cover plate sintering capillary core and a lower cover plate sintering capillary core are arranged in a cavity between an upper cover plate and a lower cover plate, a plurality of supporting columns and stress absorbing rings with concave structures are distributed on the inner bottom surface of the lower cover plate, and a plurality of supporting column mounting holes for the supporting columns to pass through are formed on the upper cover plate sintering capillary core and the lower cover plate sintering capillary core; the lower surface of the lower cover plate sintering capillary core is distributed with a plurality of bosses which are naturally formed during sintering and are correspondingly matched with the concave parts of the stress absorbing ring. The disclosed solution also has the problem that the wick has a low capillary pressure, which results in a low heat transfer efficiency.
Disclosure of Invention
The invention provides a high-heat-conductivity vapor chamber for solving the problem of low heat conduction efficiency of vapor chamber in the prior art.
In order to solve the technical problems, the invention adopts the following technical scheme: the high-heat-conductivity vapor chamber comprises an upper cover plate and a lower cover plate, wherein a sealed cavity is formed between the upper cover plate and the lower cover plate, a liquid suction core with a plurality of columnar bulges is fixedly arranged on the bottom surface of the upper cover plate, and the columnar bulges are positioned in the cavity; the upper surface of the lower cover plate is provided with a groove, and the side surface of the lower cover plate is also provided with a liquid filling pipe communicated with the cavity.
In the technical scheme, a heat source at the bottom of the lower cover plate heats, heat is rapidly transferred to a working medium through the lower cover plate, and the working medium in the cavity is heated and evaporated from a liquid state to a gaseous state to a condensation surface of the liquid absorption core and absorbs the heat in the process; the gaseous working medium is liquefied after being collected on the surface of the liquid suction core, and heat is transferred to the upper cover plate; the liquid suction core is provided with the columnar bulges, so that the soaking plate can be prevented from being thermally deformed, the integral rigidity of the soaking plate is improved, more reflux channels can be provided for working media, the integral capillary pressure of the soaking plate is increased, the flowing efficiency and the heat transfer efficiency of the liquid working media are greatly improved under the combined action of gravity and the capillary pressure of the liquid suction core on the liquid suction core, and the heat transfer speed of the lower cover plate is increased; the working medium finally flows through the evaporation surface of the lower cover plate, and as the lower cover plate is provided with the grooves, the surface area of the lower cover plate is increased, the total capillary pressure of the vapor chamber is improved, the flow of the working medium is accelerated, and the overall heat dissipation performance of the vapor chamber is also improved.
Preferably, the grooves are crisscrossed on the upper surface of the lower cover plate.
Preferably, the depth of the groove ranges from 100um to 300um, and the width ranges from 50 um to 100um.
Preferably, the columnar projections are uniformly arranged on the mounting plate of the liquid suction core.
Preferably, the upper cover plate is of a metal structure with high heat conductivity, a first heat dissipation coating is arranged on the upper surface of the upper cover plate, and a second heat dissipation coating is arranged on the first heat dissipation coating.
Preferably, the first heat dissipation coating is a metal powder coating with high heat conductivity, and the second heat dissipation coating is a diamond powder coating.
Preferably, the liquid suction core is prepared by sintering copper powder, and the liquid suction core is sintered on the lower bottom surface of the upper cover plate.
Preferably, the lower cover plate is prepared by sintering copper and a diamond composite material, and the lower bottom surface of the lower cover plate is provided with a metal plating layer with high heat conductivity.
Preferably, a hollow frame is arranged between the upper cover plate and the lower cover plate, the upper cover plate, the hollow frame and the lower cover plate form the cavity, the liquid suction core is arranged in the hollow frame and positioned in the cavity, the liquid filling pipe is arranged on the hollow frame and communicated with the cavity, and the hollow frame is of a metal structure with high heat conductivity.
The invention also discloses a preparation method of the high-heat-conductivity vapor chamber, which comprises the following steps:
s1: preparing an upper cover plate, namely polishing an unprocessed copper-clad plate by using sand paper, and cleaning the unprocessed copper-clad plate after polishing; preparing a liquid absorption core, namely cleaning copper powder, drying, pouring the copper powder into a liquid absorption core die, jolt-ramming the copper powder, reversely buckling an upper cover plate on the die, putting the upper cover plate into a sintering furnace for sintering, and taking out the die after heat preservation to obtain the upper cover plate with the liquid absorption core;
processing an upper cover plate, namely plating a high-heat-conductivity metal powder layer which can be effectively combined with diamond on the upper surface of the upper cover plate, and plating a layer of diamond powder;
preparing a hollow frame, namely processing the hollow frame with the external outline shape identical to the external outline shapes of the upper cover plate and the lower cover plate and the internal outline slightly larger than the whole size of the liquid suction core; processing a through hole for installing a liquid filling pipe on one wall surface of the hollow frame, and repeatedly cleaning after the processing is finished;
preparing a lower cover plate, namely fully mixing copper powder and diamond powder, pouring the mixture into a die, and performing ultrahigh-temperature high-pressure sintering after jolt ramming; after the copper and diamond composite material is obtained, etching a groove on the upper surface, wherein the depth of the groove is 100-300um, the width of the groove is 50-100um, and then plating a high heat conduction metal powder layer on the lower surface of the lower cover plate;
s2: smearing low-temperature solder paste on the upper and lower surfaces of the hollow frame processed in the step S1 and the contact part of the liquid filling pipe and the hollow frame; combining the upper cover plate, the liquid suction core, the lower cover plate and the liquid filling pipe with the hollow frame, and fixing by using a fastening clamp;
s3: placing the fixed vapor chamber into a muffle furnace for heating to fully melt the solder paste, so that an upper cover plate, a lower cover plate, a liquid filling pipe and a hollow frame of the vapor chamber are combined and packaged;
s4: and taking out the sample from the horse boiling furnace, and then sequentially performing the working procedures of cooling, vacuumizing, liquid injection, sealing and the like to finally obtain the efficient heat transfer type vapor chamber.
Compared with the prior art, the invention has the beneficial effects that: in the invention, as the liquid suction core is provided with the columnar bulges, the capillary pressure action of the liquid suction core is increased, the flow efficiency and the heat transfer efficiency are greatly improved under the combined action of gravity and the capillary pressure of the liquid suction core, and the heat transfer speed of the lower cover plate is increased; the working medium finally flows through the evaporation surface of the lower cover plate, and as the lower cover plate is provided with the grooves, the surface area of the lower cover plate is increased, the total capillary pressure of the vapor chamber is improved, the flow of the working medium is accelerated, and the overall heat dissipation performance of the vapor chamber is also improved.
Drawings
FIG. 1 is an exploded view of a high thermal conductivity vapor chamber of the present invention;
fig. 2 is a schematic structural view of an upper cover plate in the high thermal conductivity soaking plate of the present invention;
fig. 3 is a schematic structural view of a wick in a high thermal conductivity vapor chamber of the present invention;
FIG. 4 is a schematic structural view of an intermediate frame in the high thermal conductivity vapor chamber of the present invention;
fig. 5 is a schematic structural view of a lower cover plate in the high heat conduction soaking plate of the present invention.
In the accompanying drawings: 1. an upper cover plate; 2. a lower cover plate; 3. a wick; 4. columnar bulges; 5. a groove; 6. a liquid filling pipe; 7. a first heat-dissipating coating; 8. a second heat-dissipating coating; 9. a metal plating layer; 10. a hollow frame; 11. a through hole; 12. and (3) mounting a plate.
Detailed Description
The drawings are for illustrative purposes only and are not to be construed as limiting the present patent; for the purpose of better illustrating the embodiments, certain elements of the drawings may be omitted, enlarged or reduced and do not represent the actual product dimensions; it will be appreciated by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted. The positional relationship depicted in the drawings is for illustrative purposes only and is not to be construed as limiting the present patent.
The same or similar reference numbers in the drawings of embodiments of the invention correspond to the same or similar components; in the description of the present invention, it should be understood that, if there are orientations or positional relationships indicated by terms "upper", "lower", "left", "right", "long", "short", etc., based on the orientations or positional relationships shown in the drawings, this is merely for convenience in describing the present invention and simplifying the description, and is not an indication or suggestion that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so that the terms describing the positional relationships in the drawings are merely for exemplary illustration and are not to be construed as limitations of the present patent, and that it is possible for those of ordinary skill in the art to understand the specific meaning of the terms described above according to specific circumstances.
The technical scheme of the invention is further specifically described by the following specific embodiments with reference to the accompanying drawings:
example 1
As shown in fig. 1 to 5, a high heat conduction vapor chamber comprises an upper cover plate 1 and a lower cover plate 2, wherein a sealed cavity is formed between the upper cover plate 1 and the lower cover plate 2, a liquid suction core 3 with a plurality of columnar bulges 4 is fixedly arranged on the bottom surface of the upper cover plate 1, and the columnar bulges 4 are positioned in the cavity; the upper surface of the lower cover plate 2 is provided with a groove 5, and the side surface of the lower cover plate 2 is also provided with a liquid filling pipe 6 communicated with the cavity. The working medium can be water, methanol or ethanol, and is injected into the cavity through the liquid filling pipe 6. In the embodiment, the heat source at the bottom of the lower cover plate 2 heats, the heat is rapidly transferred to the working medium through the lower cover plate 2, and the working medium in the cavity is heated and evaporated from liquid state to gas state to the condensation surface of the liquid suction core 3 and absorbs the heat in the process; the gaseous working medium is liquefied after being collected on the surface of the liquid suction core 3, and heat is transferred to the upper cover plate 1; the liquid suction core 3 is provided with the columnar bulges 4, so that the capillary pressure action of the liquid suction core 3 is increased, the flow efficiency and the heat transfer efficiency are greatly improved under the combined action of the gravity and the capillary pressure of the liquid suction core 3 on the liquid suction core 3, and the heat transfer speed of the lower cover plate 2 is increased; the working medium finally flows through the evaporation surface of the lower cover plate 2, and as the lower cover plate 2 is provided with the grooves 5, the surface area of the lower cover plate 2 is increased, the total capillary pressure of the vapor chamber is improved, the flow of the working medium is accelerated, and the overall heat dissipation performance of the vapor chamber is also improved.
The grooves 5 are arranged on the upper surface of the lower cover plate 2 in a crisscross manner, the depth range of the grooves 5 is 100-300um, and the width range is 50-100um. The arrangement increases the area of the upper surface of the lower cover plate 2, thereby providing more irregular shapes, improving the total capillary pressure of the vapor chamber and accelerating the flow of working media.
In addition, a plurality of columnar projections 4 are uniformly provided on the mounting plate 12 of the wick 3. This allows a more uniform capillary pressure distribution of the wick 3 to the working medium. Specifically, the liquid absorbing core 3 comprises a mounting plate 12 and a plurality of columnar bulges 4 arranged on the mounting plate 12, the mounting plate 12 and the columnar bulges 4 are integrally formed, and the mounting plate 12 is fixedly connected with the bottom surface of the upper cover plate 1.
The upper cover plate 1 is a metal structure with high heat conductivity, so that the heat dissipation capability of the upper cover plate 1 can be increased. The upper surface of the upper cover plate 1 is provided with a first heat dissipation coating 7, and the first heat dissipation coating 7 is provided with a second heat dissipation coating 8, so that the heat dissipation capability of the upper cover plate 1 can be further increased, and it should be noted that the first heat dissipation coating 7 should have the characteristic of being effectively combined with diamond.
The first heat dissipation coating 7 is a metal powder coating of high thermal conductivity, and the second heat dissipation coating 8 is a diamond powder coating. It should be noted that, the first heat dissipation coating 7 is tungsten powder and aluminum powder, which can be effectively combined with the diamond powder coating of the second heat dissipation coating 8 on one hand, and can improve the heat transfer efficiency of the upper cover plate 1 on the other hand.
The liquid suction core 3 is prepared by sintering copper powder, and the liquid suction core 3 is sintered on the lower bottom surface of the upper cover plate 1. This can make the wick 3 and the upper cover plate 1 as a whole, and improve the heat conduction capability of the vapor chamber.
In addition, the lower cover plate 2 is made of copper and diamond composite material through sintering, and the lower bottom surface of the lower cover plate 2 is provided with a metal plating layer 9 made of high-heat-conductivity material, so that the heat conduction capacity of the lower cover plate 2 can be increased.
Wherein, be provided with cavity frame 10 between upper cover plate 1 and the lower cover plate 2, cavity that upper cover plate 1, cavity frame 10 and lower cover plate 2 constitute, the wick 3 is installed in cavity frame 10 and is located the cavity, and liquid filling pipe 6 sets up on cavity frame 10 and communicates with the cavity. The upper surface of the hollow frame 10 is hermetically connected to the lower bottom surface of the upper cover plate 1, and the lower surface of the hollow frame 10 is hermetically connected to the upper surface of the lower cover plate 2. The hollow frame 10 has a through hole 11 formed in one side thereof, and the filling tube 6 is hermetically connected to the through hole 11.
The hollow frame 10 is a metal structure made of a high heat conductivity material.
The working principle of the high-heat-conductivity vapor chamber is as follows:
(1) The heat source at the bottom of the lower cover plate 2 heats, and the heat is rapidly transferred to the working medium after passing through the metal plating layer 9 of the high heat conductivity material of the lower cover plate 2 and the copper and diamond composite material with high heat conductivity, and the working medium in the cavity is heated and evaporated from liquid state to gas state to the condensation surface of the uniform liquid suction core 3 and absorbs the heat in the process;
(2) The gaseous working medium is liquefied after being collected on the surface of the liquid suction core 3 and transfers heat to the upper cover plate 1, and as the upper cover plate 1 is prepared by a metal structure made of high-heat-conductivity materials, the upper surface of the upper cover plate is provided with a metal powder coating and a diamond powder coating which have high heat-conductivity, and the three have extremely high heat transfer efficiency, the overall heat transfer efficiency and the heat dissipation efficiency of the upper surface of the upper cover plate 1 are greatly improved;
(3) The liquid working medium is acted on the liquid suction core 3 under the combined action of gravity and capillary pressure of the liquid suction core 3, so that the flow efficiency and the heat transfer efficiency are greatly improved, and the heat conduction speed of the lower cover plate 2 is increased;
(4) The working medium finally flows through the evaporation surface of the lower cover plate 2, and as the lower cover plate 2 is prepared by sintering copper and diamond composite materials, criss-cross grooves 5 are formed in the lower cover plate 2, the surface of the lower cover plate 2 is provided with the protrusions of diamond particles sintered by the copper and diamond composite materials and the criss-cross grooves 5, so that the surface area of the upper surface of the lower cover plate 2 is increased, more irregular morphology is provided, the total capillary pressure of the vapor chamber is improved, and the flow of the working medium is accelerated. In the working flows of (1), (2), (3) and (4), the reflux speed of the vapor chamber is effectively optimized, and the reflux efficiency of working media is improved overall, so that the overall heat dissipation performance of the vapor chamber is also improved.
Example 2
The preparation method of the high-heat-conductivity vapor chamber comprises the following steps of:
s1: and (3) preparing the upper cover plate 1, sequentially polishing the unprocessed copper-clad plate by using abrasive paper with 500, 800 and 1000 meshes, putting the polished copper-clad plate into ultrasonic cleaning equipment after polishing, and sequentially cleaning the copper-clad plate for 20 minutes by using distilled water, ethanol and acetone solution to remove various impurities such as greasy dirt, dust and the like attached to the copper-clad plate.
Preparing the liquid suction core 3, namely cleaning copper powder, drying, pouring the copper powder into a liquid suction core 3 die, jolt the copper powder, reversely buckling the upper cover plate 1 on the die, putting the die into a sintering furnace, sintering the die at the temperature of about 850 ℃, and taking out the die after heat preservation for 30 minutes to obtain the upper cover plate 1 with the liquid suction core 3. The columnar protrusions on the sintered liquid suction core 3 can prevent the soaking plate from thermal deformation, improve the integral rigidity of the soaking plate, provide more reflux channels for working media and increase the integral capillary pressure of the soaking plate.
The upper cover plate 1 is processed, and a layer of high heat conduction metal powder layer (such as tungsten powder, aluminum powder and the like) which can be effectively combined with diamond is firstly plated on the upper surface of the upper cover plate 1 by utilizing a CVD technology, so that the heat transfer efficiency of the upper cover plate 1 is improved; a further layer of diamond powder is plated, which, although having extremely high heat transfer efficiency, is less compatible with some metals, so the metallic material of the first layer should have properties that allow for efficient bonding with diamond.
Preparing a hollow frame 10, and machining the hollow frame 10 with the external outline shape identical to the external outline shape of the upper cover plate 2 and the lower cover plate 2 by using a milling process, wherein the internal outline is slightly larger than the whole size of the liquid suction core 3; through holes with the diameter slightly larger than the outer diameter of the liquid filling pipe 6 are machined in the center of one wall surface of the hollow frame 10 by using a drilling process, and the cleaning process is repeated after the machining is finished.
Preparing a lower cover plate 2, namely fully mixing copper powder (or copper composite powder) with a certain particle size and diamond powder (or diamond composite powder) with the volume ratio of 50%, pouring the mixture into a mould, and performing ultrahigh-temperature high-pressure sintering after jolt ramming; after the copper/diamond composite material is obtained, etching micro channels on the upper surface by utilizing a laser etching process, wherein the depth of the micro channels is 100-300um, the width of the micro channels is 50-100um, and the micro channels are crisscrossed in a certain angle; and plating a high-heat-conductivity metal powder layer on the lower surface by using a CVD technology so as to further improve the overall heat conductivity of the vapor chamber.
S2: uniformly and smoothly applying low-temperature solder paste on the upper and lower surfaces of the hollow frame 10 processed in the step S1 and the contact part of the liquid filling pipe 6 and the hollow frame 10; combining the upper cover plate 1, the liquid suction core 3, the lower cover plate 2 and the liquid filling pipe 6 of the vapor chamber with the hollow frame 10, and temporarily fixing the vapor chamber by using a fastening clamp;
s3: the fixed vapor chamber is placed into a muffle furnace for heating, so that the soldering paste is fully melted, and the upper cover plate 1, the lower cover plate 2 and the liquid filling pipe 6 of the vapor chamber are combined with the hollow frame 10 for packaging;
s4: and taking out the sample from the horse boiling furnace, and then sequentially performing the working procedures of cooling, vacuumizing, liquid injection, sealing and the like to finally obtain the efficient heat transfer type vapor chamber.
It is to be understood that the above examples of the present invention are provided by way of illustration only and not by way of limitation of the embodiments of the present invention. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.
Claims (10)
1. The preparation method of the high-heat-conductivity vapor chamber is characterized by comprising the following steps of:
s1: preparing an upper cover plate (1), polishing an unprocessed red copper plate by using sand paper, and cleaning the polished red copper plate after polishing;
preparing a liquid absorption core (3), namely cleaning copper powder, drying, pouring the copper powder into a liquid absorption core mould, jolt the copper powder, reversely buckling an upper cover plate (1) on the mould, putting the mould into a sintering furnace, sintering the mould, and taking out the mould after heat preservation to obtain the upper cover plate (1) with the liquid absorption core (3);
the upper cover plate (1) is processed, a layer of metal powder plating layer which can be effectively combined with diamond and is made of high heat conductivity material is plated on the upper surface of the upper cover plate (1), and then a layer of diamond powder is plated;
preparing a hollow frame (10), and processing the hollow frame (10) with the external outline shape being the same as the external outline shape of the upper cover plate (1) and the lower cover plate (2) and the internal outline being slightly larger than the whole size of the liquid suction core (3); processing a through hole for installing a liquid filling pipe (6) on one wall surface of the hollow frame (10), and cleaning after processing;
preparing a lower cover plate (2), fully mixing copper powder and diamond powder, pouring the mixture into a die, and performing ultrahigh-temperature high-pressure sintering after jolt ramming; after the copper and diamond composite material is obtained, etching a groove (5) on the upper surface, wherein the depth of the groove (5) is 100-300um, the width of the groove is 50-100um, and then plating a high heat conduction metal powder layer on the lower surface of the lower cover plate (2);
s2: coating low-temperature solder paste on the upper and lower surfaces of the hollow frame (10) processed in the step S1 and the contact part of the liquid filling pipe (6) and the hollow frame (10); combining the upper cover plate (1), the liquid suction core (3), the lower cover plate (2) and the liquid filling pipe (6) with the hollow frame (10) and fixing the two by using a fastening clamp;
s3: placing the fixed vapor chamber into a muffle furnace for heating to enable solder paste to be sufficiently melted, and combining and packaging an upper cover plate (1), a lower cover plate (2) and a liquid filling pipe (6) of the vapor chamber with a hollow frame (10);
s4: and taking out the sample from the horse boiling furnace, and then sequentially performing the working procedures of cooling, vacuumizing, liquid injection and sealing to finally obtain the efficient heat transfer type vapor chamber.
2. A high thermal conductivity vapor chamber obtained based on the preparation method of claim 1, characterized in that: the liquid suction device comprises an upper cover plate (1) and a lower cover plate (2), wherein a sealed cavity is formed between the upper cover plate (1) and the lower cover plate (2), a liquid suction core (3) with a plurality of columnar bulges (4) is fixedly arranged on the bottom surface of the upper cover plate (1), and the columnar bulges (4) are positioned in the cavity; the upper surface of lower apron (2) is provided with slot (5), lower apron (2) side still is provided with intercommunication liquid filling pipe (6) of cavity.
3. The high thermal conductivity vapor chamber of claim 2, wherein: the grooves (5) are arranged on the upper surface of the lower cover plate (2) in a crisscross mode.
4. A high thermal conductivity vapor chamber as defined in claim 3 wherein: the depth of the groove (5) is 100-300um, and the width is 50-100um.
5. The high thermal conductivity vapor chamber according to any one of claims 2 to 4, wherein: the columnar bulges (4) are uniformly arranged on the mounting plate (12) of the liquid suction core (3).
6. The high thermal conductivity vapor chamber of claim 5, wherein: the upper cover plate (1) is of a metal structure with high heat conductivity, a first heat dissipation coating (7) is arranged on the upper surface of the upper cover plate (1), and a second heat dissipation coating (8) is arranged on the first heat dissipation coating (7).
7. The high thermal conductivity vapor chamber of claim 6, wherein: the first heat dissipation coating (7) is a metal powder coating with high heat conductivity, and the second heat dissipation coating (8) is a diamond powder coating.
8. The high thermal conductivity vapor chamber of claim 2, wherein: the liquid suction core (3) is prepared by sintering copper powder, and the liquid suction core (3) is sintered on the lower bottom surface of the upper cover plate (1).
9. The high thermal conductivity vapor chamber of claim 2, wherein: the lower cover plate (2) is prepared by sintering copper and a diamond composite material, and a metal coating (9) with high heat conductivity is arranged on the lower bottom surface of the lower cover plate (2).
10. The high thermal conductivity vapor chamber of claim 2, wherein: the liquid suction device is characterized in that a hollow frame (10) is arranged between the upper cover plate (1) and the lower cover plate (2), the cavity is formed by the upper cover plate (1), the hollow frame (10) and the lower cover plate (2), the liquid suction core (3) is arranged in the hollow frame (10) and positioned in the cavity, the liquid filling pipe (6) is arranged on the hollow frame (10) and communicated with the cavity, and the hollow frame (10) is of a metal structure made of high-heat-conductivity materials.
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| CN113758327B (en) * | 2021-08-13 | 2022-06-17 | 中南大学 | Composite VC radiator containing copper/diamond sintered liquid absorption cores and preparation method thereof |
| CN113758325B (en) * | 2021-08-13 | 2023-06-30 | 中南大学 | VC radiator with built-in copper/diamond sintered liquid suction core and preparation method thereof |
| CN113758328B (en) * | 2021-08-13 | 2022-06-17 | 中南大学 | Composite VC radiator containing copper/diamond composite-configuration liquid absorption cores and preparation method thereof |
| CN113758326B (en) * | 2021-08-13 | 2023-03-14 | 中南大学 | VC radiator with built-in copper/diamond composite-configuration liquid absorption core and preparation method thereof |
| CN114828546B (en) * | 2022-02-25 | 2023-11-03 | 苏州浪潮智能科技有限公司 | Heat radiation module and heat radiation assembly thereof |
| CN114935272B (en) * | 2022-05-24 | 2023-08-04 | 中国电子科技集团公司第十研究所 | Integrated molding samming board based on additive manufacturing |
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