TWM635520U - Vapor chamber with composite support columns - Google Patents
Vapor chamber with composite support columns Download PDFInfo
- Publication number
- TWM635520U TWM635520U TW111210020U TW111210020U TWM635520U TW M635520 U TWM635520 U TW M635520U TW 111210020 U TW111210020 U TW 111210020U TW 111210020 U TW111210020 U TW 111210020U TW M635520 U TWM635520 U TW M635520U
- Authority
- TW
- Taiwan
- Prior art keywords
- metal shell
- support columns
- composite
- composite material
- metal
- Prior art date
Links
Images
Abstract
本新型係關於一種具有複合材支撐柱的均溫板,包括第一金屬殼、複合材支撐柱、毛細結構、第二金屬殼、固著層及工作流體,第一金屬殼具有內表面;複合材支撐柱佈設在第一金屬的內表面上且其包括金屬芯及披覆層,且複合材支撐柱具有端面,其中金屬芯和第一金屬殼為不同材質;毛細結構鋪設於第一金屬的內表面上;第二金屬殼對應第一金屬殼封合並共同形成有容腔;固著層形成在第一金屬的內表面和支撐柱的端面之間;工作流體設於容腔中。藉此,具有良好的支撐性和優異的抗變形能力外,且材料成本低廉。The present invention relates to a vapor chamber with a composite material support column, including a first metal shell, a composite material support column, a capillary structure, a second metal shell, an anchor layer and a working fluid, the first metal shell has an inner surface; the composite The material support column is arranged on the inner surface of the first metal and it includes a metal core and a cladding layer, and the composite material support column has an end surface, wherein the metal core and the first metal shell are made of different materials; the capillary structure is laid on the first metal On the inner surface; the second metal shell is sealed corresponding to the first metal shell and jointly forms a cavity; the fixing layer is formed between the inner surface of the first metal and the end surface of the support column; the working fluid is arranged in the cavity. In this way, it not only has good support and excellent deformation resistance, but also has low material cost.
Description
本新型係有關一種散熱器的技術,尤指一種具有複合材支撐柱的均溫板。The present invention relates to the technology of a radiator, especially a uniform temperature plate with a support column of composite material.
隨著網路科技的蓬勃發展和應用,使用者對於電腦的開機速度、軟體的讀取速度,以及照片、影片的播放速度的要求不斷的提高,然而隨著前述效能及讀取速度的提升,電子元件運作的發熱量及溫度也不斷提高,高溫除了會讓大多數電子元件易快速老化外,更會讓如固態硬碟的電子元件讀取與寫入速度降低,因此如何維持工作溫度成為本申請的研究課題。With the vigorous development and application of network technology, users' requirements for computer startup speed, software reading speed, and photo and video playback speed are constantly increasing. However, with the aforementioned performance and reading speed improvement, The calorific value and temperature of electronic components are also increasing continuously. High temperature will not only cause rapid aging of most electronic components, but also reduce the reading and writing speed of electronic components such as solid-state hard disks. Therefore, how to maintain the working temperature becomes a key issue The applied research topic.
為了解決前述電子元件之散熱問題,業界已陸續開發出熱管(Heat Pipe)和均溫板(Vapor Chamber)等高效能的導散熱構件,其中均溫板所覆蓋的範圍廣,且熱傳導路徑短,導散熱效能更優於熱管,是以其已逐步成為電子元件之散熱的主流構件。In order to solve the heat dissipation problem of the aforementioned electronic components, the industry has successively developed high-efficiency heat dissipation components such as heat pipes and vapor chambers. Among them, the vapor chamber covers a wide area and has a short heat conduction path. The heat conduction performance is better than that of the heat pipe, so it has gradually become the mainstream component of the heat dissipation of electronic components.
惟,其用來作為均溫板之內部支撐的元件,大都是採用銅柱來進行施作,此等銅柱相較於其它金屬構件而言,其不僅質地較軟外,且其材料價格的波動變化亦相當的大,因此其存在有支撐性不佳和抗變形能力差之外,且其造價亦相當的昂貴等相關問題。However, most of the components used as the internal support of the chamber are made of copper pillars. Compared with other metal components, these copper pillars are not only softer in texture, but also the price of their materials is lower. The fluctuations are also quite large, so there are related problems such as poor support and poor deformation resistance, and its cost is also quite expensive.
有鑑於此,本新型創作人遂針對上述現有技術的缺失,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本新型創作人改良之目標。In view of this, the inventor of the present invention aimed at the deficiency of the above-mentioned prior art, devoted himself to research and cooperated with the application of theories, and tried his best to solve the above-mentioned problems, which became the goal of the inventor of the present invention to improve.
本新型之一目的,在於提供一種具有複合材支撐柱的均溫板,其不僅具有良好的支撐性和優異的抗變形能力外,且材料成本低廉。One purpose of the present invention is to provide a vapor chamber with a composite support column, which not only has good support and excellent deformation resistance, but also has low material cost.
為了達成上述之目的,本新型提供一種具有複合材支撐柱的均溫板,包括一第一金屬殼、複數複合材支撐柱、一毛細結構、一第二金屬殼、一固著層及一工作流體,該第一金屬殼具有一內表面;各該複合材支撐柱佈設在該第一金屬殼之該內表面上,每一該複合材支撐柱包括一金屬芯及鍍著在該金屬芯的一披覆層,且每一該複合材支撐柱具有一端面,其中各該金屬芯和該第一金屬殼為不同材質;該毛細結構鋪設於該第一金屬殼之該內表面上;該第二金屬殼對應該第一金屬殼封合並共同形成有一容腔;該固著層形成在該第一金屬殼的該內表面和每一該支撐柱的該端面之間;該工作流體設於該容腔中。In order to achieve the above purpose, the present invention provides a vapor chamber with a composite material support column, including a first metal shell, a plurality of composite material support columns, a capillary structure, a second metal shell, an anchor layer and a working Fluid, the first metal shell has an inner surface; each of the composite material support columns is arranged on the inner surface of the first metal shell, and each of the composite material support columns includes a metal core and metal plated on the metal core A cladding layer, and each of the composite support columns has an end surface, wherein each of the metal cores and the first metal shell are made of different materials; the capillary structure is laid on the inner surface of the first metal shell; the second Two metal shells are sealed corresponding to the first metal shell and jointly form a cavity; the fixing layer is formed between the inner surface of the first metal shell and the end surface of each support column; the working fluid is provided in the In the cavity.
本新型還具有以下功效,其通過各固著層與各金屬殼和各複合材支撐柱作結合,從而大幅度地簡化整體的製作流程和製造成本。利用在不同解熱區分別配置有不等密度的複合材支撐柱,使得造價和解熱都能得到最佳化的安排。The present invention also has the following effects, which greatly simplifies the overall manufacturing process and manufacturing cost through the combination of each fixing layer with each metal shell and each composite support column. Composite support columns with different densities are arranged in different heat dissipation areas, so that both the cost and heat dissipation can be optimally arranged.
有關本新型之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本新型加以限制者。The detailed description and technical content of the new model are described below with the accompanying drawings, but the attached drawings are only for reference and illustration, and are not used to limit the new model.
請參閱圖1至圖4所示,本新型提供一種具有複合材支撐柱的均溫板1,其主要包括一第一金屬殼10、複數複合材支撐柱20、一毛細結構30、一第二金屬殼40、一固著層50及一工作流體60。Please refer to Fig. 1 to Fig. 4, the present invention provides a
第一金屬殼10可因應各種不同電子發熱源(圖未示出)所處的環境而呈幾何形狀或不規則形狀,且其可為銅、鋁、鎂或其合金等導熱性良好材料所製成,第一金屬殼10具有一內表面11。The
各複合材支撐柱20是間隔佈設在第一金屬殼10之內表面11上,每一複合材支撐柱20主要包括一金屬芯21及鍍著在金屬芯21外表面的一披覆層22,且每一複合材支撐柱20的底部具有一端面201,在每一複合材支撐柱20的頂部具有一另一端面202,其中各金屬芯21和第一金屬殼10為不同材質。在一實施例中,金屬芯21的材質為一不銹鋼,披覆層22為一金屬層,其為銅或其合金等導熱性良好材料所製成,各披覆層22與前述第一金屬殼10為相同材質。Each composite
毛細結構30可為金屬編織網、多孔性燒結粉末、纖維束等毛細吸附力良好材料所製成,其形狀大致與第一金屬殼10的形狀相近;在毛細結構30對應於前述每一複合材支撐柱20的位置分別設有一穿孔31。製作時,將毛細結構30的各穿孔31分別對應於各複合材支撐柱20做套接,從而使毛細結構30能夠全面性覆蓋在第一金屬殼10的內表面11上,並且經由一熱擴散焊接加工,而使毛細結構30固著於第一金屬殼10的內表面11上。The
第二金屬殼40亦為銅、鋁、鎂或其合金等導熱性良好材料所製成,其形狀與第一金屬殼10之形狀相配合,第二金屬殼40亦具有一內表面41(如圖4所示)。製作時,將第二金屬殼40對應於第一金屬殼10覆蓋,並於第一金屬殼10和第二金屬殼40的接合處施以一封邊焊接加工,以在第一金屬殼10和第二金屬殼40內部形成有一容腔C(如圖4所示)。The
固著層50形成在第一金屬殼10的內表面11和每一複合材支撐柱20的端面201之間;製作時,將一黏著膏A塗布於第一金屬殼10的內表面11和每一複合材支撐柱20之端面201,並經結合而形成一固著層50。The
其中黏著膏A為銅粉基材混合黏著劑等材料所製成的一銅膏,其可以將黏著膏A塗布於第一金屬殼10之內表面11對應於各複合材支撐柱20的預定位置上,或是將黏著膏A塗布於每一複合材支撐柱20之端面201上,也可以是前述兩者兼具之型態。接著將各複合材支撐柱20之端面201立設在第一金屬殼10之內表面11的預定位置上,並且經由一加溫加壓結合加工,而使黏著膏A形成為一固著層50。Wherein the adhesive paste A is a copper paste made of copper powder base material mixed with adhesive and other materials, which can apply the adhesive paste A on the
工作流體60可為一純水,將其注入前述容腔C中,並且施以一除氣封口加工,從而使容腔C形成為一真空腔室。The working
在一實施例中,本新型具有複合材支撐柱的均溫板1還包括一另一固著層50A,第二金屬殼40具有一內表面41;製作時,將另一黏著膏B塗布於第二金屬殼40之內表面41對應於各複合材支撐柱20的預定位置上,或是將另一黏著膏B塗布於每一複合材支撐柱20之另一端面202上,也可以是前述兩者兼具之型態。接著將第二金屬殼40對應於第一金屬殼10覆蓋,且各複合材支撐柱20之另一端面202分別抵接在第二金屬殼40的內表面41,並且經由一加溫加壓結合加工,而使另一黏著膏B形成為另一固著層50A。In one embodiment, the
請再參閱圖5所示,其中各複合材支撐柱20的佈設除了可以等間距方式進行排列外,本新型具有複合材支撐柱的均溫板1具有一主解熱區H1(虛線區域範圍內)和一次解熱區H2(虛線區域範圍外),其中主解熱區H1對應於各電子發熱源配置,次解熱區H2則形成在各電子發熱源的外周圍,主解熱區H1的各複合材支撐柱20排列密度大於次解熱區H2之各複合材支撐柱20排列密度。Please refer to Fig. 5 again, in which the layout of the
請參閱圖6所示,本新型具有複合材支撐柱的均溫板1之各複合材支撐柱除了可如上述實施例外,其中每一複合材支撐柱20A還包括覆蓋在前述披覆層22之周面的一毛細組織23,此毛細組織23可為多孔性燒結粉末或纖維束等毛細吸附力良好材料所製成,且各複合材支撐柱20A是佈設在前述主解熱區H1內。Please refer to FIG. 6 , except that the composite support columns of the
綜上所述,本新型具有複合材支撐柱的均溫板,確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合新型專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障新型創作人之權利。To sum up, this new type of chamber with composite material support columns can indeed achieve the expected purpose of use, and solve the lack of conventional knowledge, and because of its novelty and progress, it fully meets the requirements for new patent applications. The application of the Patent Law, please check carefully and grant the patent of this case, so as to protect the rights of new creators.
1:具有複合材支撐柱的均溫板
10:第一金屬殼
11:內表面
20、20A:複合材支撐柱
201:端面
202:另一端面
21:金屬芯
22:披覆層
23:毛細組織
30:毛細結構
30A:另一毛細結構
31、31A:穿孔
40:第二金屬殼
41:內表面
50:固著層
50A:另一固著層
60:工作流體
A:黏著膏
B:另一黏著膏
C:容腔
H1:主解熱區
H2:次解熱區
1: Vapor chamber with composite support columns
10: The first metal shell
11:
圖1 係本新型之第一金屬殼和各支撐柱分解剖視圖。Fig. 1 is an exploded cross-sectional view of the first metal shell and each support column of the present invention.
圖2 係本新型之毛細結構結合於第一金屬殼示意圖。Fig. 2 is a schematic diagram of the capillary structure of the present invention combined with the first metal shell.
圖3 係本新型之第二金屬殼結合於第一金屬殼示意圖。Fig. 3 is a schematic diagram of the combination of the second metal shell and the first metal shell of the present invention.
圖4 係本新型具有複合材支撐柱的均溫板組合剖視圖。Figure 4 is a sectional view of the combination of the new type of chamber with composite support columns.
圖5 係本新型具有複合材支撐柱的均溫板俯視圖。Fig. 5 is a top view of the new type of chamber with composite supporting columns.
圖6 係本新型之複合材支撐柱另一實施例剖視圖。Fig. 6 is a sectional view of another embodiment of the composite support column of the present invention.
1:具有複合材支撐柱的均溫板 1: Vapor chamber with composite support columns
10:第一金屬殼 10: The first metal shell
11:內表面 11: Inner surface
20:複合材支撐柱 20: Composite support column
201:端面 201: end face
202:另一端面 202: the other end face
21:金屬芯 21: metal core
22:披覆層 22: coating layer
30:毛細結構 30: capillary structure
30A:另一毛細結構 30A: another capillary structure
40:第二金屬殼 40: Second metal shell
41:內表面 41: inner surface
50:固著層 50: fixation layer
50A:另一固著層 50A: another anchor layer
60:工作流體 60: working fluid
C:容腔 C: cavity
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111210020U TWM635520U (en) | 2022-09-14 | 2022-09-14 | Vapor chamber with composite support columns |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111210020U TWM635520U (en) | 2022-09-14 | 2022-09-14 | Vapor chamber with composite support columns |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM635520U true TWM635520U (en) | 2022-12-11 |
Family
ID=85786642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111210020U TWM635520U (en) | 2022-09-14 | 2022-09-14 | Vapor chamber with composite support columns |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM635520U (en) |
-
2022
- 2022-09-14 TW TW111210020U patent/TWM635520U/en unknown
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2021109175A1 (en) | Thin temperature-equalizing plate | |
TW202037871A (en) | Flexible vapor chamber | |
TWI601933B (en) | Heat-conducting structure | |
TWM627557U (en) | Immersion-cooled porous heat-dissipation substrate structure | |
TWI542850B (en) | Flat plate heat pipe structure and manufacturing method thereof | |
CN112118711A (en) | Vapor chamber, manufacturing method thereof and electronic equipment | |
TWM630294U (en) | Heat sink with improved surface structure for liquid immersion cooling heat source | |
TWM635520U (en) | Vapor chamber with composite support columns | |
TWI810908B (en) | Vapor chamber and method thereof | |
CN213244730U (en) | Vapor chamber and electronic apparatus | |
TWM631865U (en) | Combined structure of vapor chamber and heat pipe | |
TWM597381U (en) | Improved structure of vapor chamber | |
TWI700471B (en) | Heat dissipation unit with axial capillary structure | |
CN217686783U (en) | Temperature equalizing plate | |
TWI682144B (en) | Integrated vapor chamber and method thereof | |
TWM633311U (en) | Vapor chamber | |
CN218723416U (en) | Temperature-uniforming plate with composite material support pillar | |
TWI813270B (en) | Vapor chamber and heat pipe assembly structure | |
TWM560615U (en) | Heat dissipating device | |
CN117781748A (en) | Temperature equalizing plate with composite material supporting column | |
TWM630373U (en) | Heat dissipation module | |
CN103839837B (en) | Ultrathin temperature-uniforming plate manufacture method and the ultrathin temperature-uniforming plate made thereof | |
TWI799247B (en) | Vapor chamber and heat pipe combined structure | |
TWM624816U (en) | Reinforced structure of vapor chamber | |
TWM635535U (en) | Combined structure of vapor chamber and heat pipe |