TWM597381U - Improved structure of vapor chamber - Google Patents
Improved structure of vapor chamber Download PDFInfo
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- TWM597381U TWM597381U TW109201866U TW109201866U TWM597381U TW M597381 U TWM597381 U TW M597381U TW 109201866 U TW109201866 U TW 109201866U TW 109201866 U TW109201866 U TW 109201866U TW M597381 U TWM597381 U TW M597381U
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- plate
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- 239000010410 layer Substances 0.000 claims abstract description 26
- 239000002131 composite material Substances 0.000 claims abstract description 20
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 14
- 239000010959 steel Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 239000011247 coating layer Substances 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims 1
- 241001391944 Commicarpus scandens Species 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 238000005253 cladding Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
一種均溫板結構改良,包括一內呈中空狀的薄板殼體、以及一設於薄板殼體內之複合材毛細層;其中,複合材毛細層係為一金屬編織網,並由複數金屬絲編織而構成,且複合材毛細層之各金屬絲係為鋼絲並於其外設有一披覆層。俾藉由鋼材於抽拉成線狀時,可獲得的線徑較細且不易斷裂,即可用於編織成網狀而獲得網目更細的編織網,進而能設置於更加薄化的均溫板內。An improved temperature-regulating plate structure includes a hollow thin-plate shell and a composite capillary layer provided in the thin-plate shell; wherein the composite capillary layer is a metal braided mesh and is woven by a plurality of metal wires In the structure, each metal wire of the capillary layer of the composite material is a steel wire and a coating layer is provided on the outside. If the steel is drawn into a linear shape, the diameter of the wire obtained is thin and not easy to break. It can be used to weave into a mesh to obtain a woven mesh with a finer mesh, which can be installed on a thinner temperature plate Inside.
Description
本創作係與一種真空熱傳元件有關,尤指一種均溫板結構改良。This creation is related to a vacuum heat transfer element, especially a kind of temperature-adjusting plate structure improvement.
按,由於各式電子產品的運算能力不斷加強,同時帶隨著散熱問題的產生。故現今不論是均溫板或稱之為板式熱管,皆為不可或缺的散熱元件。According to the press, the computing power of all kinds of electronic products is continuously strengthened, and at the same time, the problem of heat dissipation occurs. Therefore, whether it is a temperature equalizing plate or a plate heat pipe, they are all indispensable heat dissipation components.
然而,由於電子產品也朝向輕薄之設計,均溫板或板式熱管也勢必更加薄化。但在繼續的薄化下,已影響其內部的毛細組織所能發揮的毛細作用,如無法再尋求更加薄化的材料作為毛細組織,即難以達到更加薄化的需求,致始均溫板或板式熱管無法適應電子產品的薄化趨勢。However, since electronic products are also designed to be thinner and lighter, the temperature equalizing plate or the plate type heat pipe is bound to be thinner. However, under the continued thinning, it has affected the capillary function of the internal capillary structure. If it is no longer possible to find a thinner material as the capillary structure, it is difficult to achieve the need for thinner. Plate heat pipes cannot adapt to the thinning trend of electronic products.
有鑑於此,本創作人係為改善並解決上述之缺失,乃特潛心研究並配合學理之運用,終於提出一種設計合理且有效改善上述缺失之本創作。In view of this, in order to improve and solve the above-mentioned deficiencies, the author is dedicated to research and cooperate with the application of the theory, and finally proposes a reasonable design and effectively improves the above-mentioned deficiencies.
本創作之主要目的,在於可提供一種均溫板結構改良,其係以鋼絲構成均溫板內之毛細結構,俾藉由鋼材於抽拉成線狀時,可獲得的線徑較細且不易斷裂,即可用於編織成網狀而獲得網目更細的編織網,進而能設置於更加薄化的均溫板內。The main purpose of this creation is to provide an improved temperature equalizing plate structure, which is composed of steel wires to form the capillary structure in the temperature equalizing plate. When the steel is drawn into a linear shape, the wire diameter obtained is thinner and not easy When it is broken, it can be used to weave into a net shape to obtain a finer woven mesh, which can be installed in a thinner temperature-equalizing plate.
本創作之另一目的,在於可提供一種均溫板結構改良,其係於所述鋼絲外以鍍膜設有一披覆層,藉以提供鋼絲設於均溫板內不受工作流體之影響而腐蝕。Another purpose of this creation is to provide an improved temperature equalizing plate structure, which is provided with a coating layer on the outer surface of the steel wire with a coating film, so as to provide that the steel wire is set in the temperature equalizing plate without being corroded by the working fluid.
為了達成上述之目的,本創作係提供一種均溫板結構改良,包括一內呈中空狀的薄板殼體、以及一設於薄板殼體內之複合材毛細層;其中,複合材毛細層係為一金屬編織網,並由複數金屬絲編織而構成,且複合材毛細層之各金屬絲係為鋼絲並於其外設有一披覆層。In order to achieve the above purpose, the present invention provides an improvement of the structure of the temperature equalizing plate, which includes a hollow thin-plate shell and a composite capillary layer provided in the thin-plate shell; wherein the composite capillary layer is a The metal woven mesh is composed of a plurality of metal wires, and each metal wire of the capillary layer of the composite material is a steel wire and a coating layer is provided on the outside.
為了使 貴審查委員能更進一步瞭解本創作之特徵及技術內容,請參閱以下有關本創作之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本創作加以限制者。In order to enable your reviewer to further understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings of this creation, but the drawings are only for reference and explanation, not for limiting this creation. .
請參閱圖1及圖2,係分別為本創作第一實施例之立體分解示意圖、以及局部剖面組合示意圖。本創作係提供一種均溫板結構改良,包括一薄板殼體1、以及一設於該薄板殼體1內的複合材毛細層2;其中:Please refer to FIG. 1 and FIG. 2, which are a three-dimensional exploded schematic diagram and a partial sectional combination schematic diagram of the first embodiment of the creation, respectively. This creative department provides an improved temperature-averaged plate structure, which includes a thin-
該薄板殼體1內部係呈中空狀,並可由如銅或鋁等材質構成,且該薄板殼體1可由一第一板件10與一第二板件11相互蓋合所構成。而在本創作所舉之第一實施例中,該第一板件10係具有形成於其周緣且連續構成的第一密封緣100,並由該第一板件10與第一密封緣100包圍而形成的第一凹入空間101,再由該第二板件11蓋設於第一密封緣100上以封閉所述第一凹入空間101,藉以構成一所述薄板殼體1。此外,所述第一凹入空間101係可透過如蝕刻等方式,將該第一板件10一表面向內凹入而蝕刻形成所述第一凹入空間101,並可於該第一凹入空間101內預留未蝕刻的部分而形成複數第一支撐部102,以供該第二板件11封閉所述第一凹入空間101而疊置於該第一板件10上時,可透過該等第一支撐部102抵頂於該第二板件11內面而作為支撐結構。The interior of the thin-
該複合材毛細層2係設於上述薄板殼體1內;而在本創作所舉之第一實施例中,該複合材毛細層2即係設於所述第一凹入空間101內。本創作主要在於該複合材毛細層2係為一金屬編織網,且由複數金屬絲編織而構成;其中複合材毛細層2之各金屬絲係為鋼絲並於其外設有一披覆層21,而藉由鋼材於抽拉成線狀時,可獲得的線徑較細且不易斷裂,即可用於編織成網狀而獲得網目更細的編織網,進而能設置於更加薄化的該薄板殼體1內,同時維持該複合材毛細層2應具有的毛細力。此外,所述鋼絲外的披覆層21可透過鍍膜的方式形成,所述鍍膜的材質可為鈦,並可於各鋼絲在編織成編織網的毛細層2之前,先鍍上所述披覆層21;亦或於各鋼絲在編織成編織網的毛細層2後,再於該毛細層2外鍍上所述披覆層21。以確保由鋼絲所構成的該複合材毛細層2在提供其毛細力的同時,亦不會受工作流體所腐蝕而兼具有防銹的作用。The composite
再請參閱圖2所示,本創作亦可於上述複合材毛細層2上,設有複數對應各第一支撐部102的定位孔20,以供該複合材毛細層2可被固定於該第一板件10的第一凹入空間101內,並貼緊於該第一板件10的內面處。Referring again to FIG. 2, the creation can also be provided on the composite
是以,藉由上述之構造組成,即可得到本創作均溫板結構改良。Therefore, by the composition of the above-mentioned structure, we can get the improvement of the temperature distribution structure of this creation.
再者,如圖3及圖4所示,在本創作所與之第二實施例中,該薄板殼體1之第二板件11上亦可具有形成於其周緣且連續構成的第二密封緣110,並由該第二板件11與第二密封緣110包圍而形成的第二凹入空間111,且在與該第一板件10相蓋合時,透過第一、二板件10、11之第一、二密封緣100、110相對密接而封閉所述第一、二凹入空間101、111,藉以作為所述薄板殼體1的其它可行實施態樣。此外,所述第二凹入空間111也可透過如蝕刻等方式,將該第二板件11一表面向內凹入而蝕刻形成所述第二凹入空間111,並可於該第二凹入空間111內預留未蝕刻的部分而形成複數第二支撐部112,以供該第一板件10相蓋合時,可透過該等第一支撐部102與第二支撐部112相互抵頂而彼此皆可作為支撐結構。Furthermore, as shown in FIGS. 3 and 4, in the second embodiment of the present invention, the
綜上所述,本創作確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合新型專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障創作人之權利。In summary, this creation can indeed achieve the intended use purpose, and solve the lack of knowledge, and because it is extremely novel and progressive, it fully meets the requirements of the new patent application. The application is made in accordance with the Patent Law, please check and Grant the patent in this case to protect the creator's rights.
惟以上所述僅為本創作之較佳可行實施例,非因此即拘限本創作之專利範圍,故舉凡運用本創作說明書及圖式內容所為之等效技術、手段等變化,均同理皆包含於本創作之範圍內,合予陳明。However, the above is only the preferred and feasible embodiment of this creation, and the patent scope of this creation is not limited by this, so any changes in the equivalent technology and means of the use of this creation description and graphic content are the same. It is included in the scope of this creation, and is conjoined with Chen Ming.
1:薄板殼體 10:第一板件 100:第一密封緣 101:第一凹入空間 102:第一支撐部 11:第二板件 110:第二密封緣 111:第二凹入空間 112:第二支撐部 2:複合材毛細層 20:定位孔 21:披覆層 1: thin plate shell 10: The first board 100: first sealing edge 101: first recessed space 102: First support 11: Second board 110: second sealing edge 111: Second recessed space 112: Second support 2: Capillary layer of composite material 20: positioning hole 21: cladding
圖1係本創作第一實施例之立體分解示意圖。FIG. 1 is a three-dimensional exploded schematic diagram of the first embodiment of the present creation.
圖2係本創作第一實施例之局部剖面組合示意圖。FIG. 2 is a schematic diagram of partial cross-sectional assembly of the first embodiment of the present creation.
圖3係本創作第二實施例之局部剖面分解示意圖。FIG. 3 is a partial cross-sectional exploded view of the second embodiment of the present creation.
圖4係本創作第二實施例之局部剖面組合示意圖。FIG. 4 is a schematic diagram of partial cross-sectional assembly of the second embodiment of the present creation.
1:薄板殼體 1: thin plate shell
10:第一板件 10: The first board
100:第一密封緣 100: first sealing edge
101:第一凹入空間 101: first recessed space
102:第一支撐部 102: First support
11:第二板件 11: Second board
2:複合材毛細層 2: Capillary layer of composite material
20:定位孔 20: positioning hole
21:披覆層 21: cladding
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113916033A (en) * | 2020-07-09 | 2022-01-11 | 煌傑金属复合材料科技股份有限公司 | Temperature equalizing plate |
TWI793843B (en) * | 2021-07-08 | 2023-02-21 | 大陸商東莞立訊技術有限公司 | Thermal conductive device and manufacturing method thereof, electrical connector, and electronic device |
-
2020
- 2020-02-20 TW TW109201866U patent/TWM597381U/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113916033A (en) * | 2020-07-09 | 2022-01-11 | 煌傑金属复合材料科技股份有限公司 | Temperature equalizing plate |
TWI793843B (en) * | 2021-07-08 | 2023-02-21 | 大陸商東莞立訊技術有限公司 | Thermal conductive device and manufacturing method thereof, electrical connector, and electronic device |
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