TWM473041U - Heat transfer structure for housing of electronic device - Google Patents

Description

Electronic device housing heat transfer structure

The present invention relates to a heat transfer structure, and more particularly to an electronic device housing heat transfer structure applied to an electronic device and composed of a temperature equalizing plate or a loop heat pipe to form a housing portion of the electronic device.

According to the rapid development of the 3C industry, today's electronic devices such as mobile phones, display screens, and tablet computers often have problems in heat generation due to the continuous improvement of the operational capabilities of electronic components, resulting in heat dissipation requirements.

However, at present, the above-mentioned electronic devices are becoming thinner and thinner, and the heat dissipation problem is becoming more serious. In particular, due to the need for a thinner design, the overall internal space is relatively small, making it difficult to match the existing heat dissipation structure to achieve heat dissipation requirements. Generally, electronic devices such as mobile phones, display screens, and tablet computers usually adopt a nearly closed housing structure design, and it is difficult to provide a structure such as a vent hole between the inside and the outside to release the internal heat. Therefore, its heat dissipation problem is still difficult to obtain an effective solution.

In view of this, the creator is trying to improve and solve the above-mentioned shortcomings, and he has devoted himself to researching and cooperating with the application of theory, and finally proposed a creation that is reasonable in design and effective in improving the above-mentioned defects.

The main purpose of the present invention is to provide an electronic device housing heat transfer structure, Mainly through the design of a Vapor chamber or a loop heat pipe to make the housing part of the electronic device, so that the temperature equalizing plate or the loop heat pipe with heat transfer or even heat dissipation effect can be transmitted. It directly contacts the electronic heating element in the electronic device to provide the effect of heat transfer and heat dissipation.

In order to achieve the above object, the present invention provides an electronic device housing heat transfer structure for use as a housing portion of an electronic device, including a first shell layer and a second shell layer, the first shell layer having an inner side surface. a recessed space is formed on one side of the second shell layer, and the recessed space is formed in a loop shape, and a shell edge is formed outside the recessed space forming a loop-shaped peripheral edge, and a shell plate portion is formed in a loop-shaped surrounding portion of the recessed space; wherein, the shell The edge is in contact with the inner side surface of the first shell layer, and the shell plate portion is in contact with the inner side surface of the first shell layer to form a loop-like chamber between the first shell layer and the recessed space, and the chamber is on the inner wall thereof There is capillary structure on it and a working fluid is sealed.

10‧‧‧ first shell

100‧‧‧ inside

11‧‧‧Second shell

110‧‧‧ recessed space

111‧‧‧ Shell

112‧‧‧Shell Department

113‧‧‧ chamber

114‧‧‧ recessed area

12‧‧‧Muscle tissue

2‧‧‧Electronic heating element

The first picture is a three-dimensional appearance of the creation.

The second picture is a schematic cross-section of the creation.

The third picture is a three-dimensional diagram of the state of use of the present creation.

The fourth picture is a schematic cross-sectional view of the state of use of the present creation.

The fifth figure is a three-dimensional diagram of another use state of the present creation.

The sixth figure is a schematic cross-sectional view of another use state of the present creation.

The seventh drawing is a schematic perspective view of another embodiment of the present creation.

The eighth figure is a schematic perspective view of another embodiment of the present creation.

In order to further disclose the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and description, and are not intended to limit the creation.

Please refer to the first figure and the second figure, which are respectively a schematic view of the three-dimensional appearance and a schematic cross-section. The present invention provides an electronic device housing heat transfer structure, which is used as a housing of an electronic device, such as a mobile phone, a display screen or a tablet computer, etc., in the embodiment of the present invention. Take the back cover of a mobile phone as an example. Therefore, the heat transfer structure 1 of the casing can be directly attached to the electronic heating element 2 (shown in FIG. 4) inside the electronic device, thereby providing heat transfer or heat dissipation. The housing heat transfer structure 1 includes a first shell layer 10 and a second shell layer 11 covering the first shell layer 10; wherein: the first shell layer 10 has an inner side surface 100 (eg, As shown in the second figure, the inner side surface 100 is in contact with the side of the second shell layer 11.

One side of the second shell layer 11 may have a recessed space 110 by means of stamping or the like, and the recessed space 110 is formed in a loop shape (as shown in the first figure), and the recessed space 110 forms a loop-like peripheral edge. A shell edge 111 is formed to be in contact with the inner side surface 100 of the first shell layer 10, and at least one shell portion 112 is formed inside the first shell layer 10 in a portion surrounded by the recessed space 110. The side surface 100 is fitted to form a chamber 113 (ie, as shown in the second figure) through the first shell layer 10 and the recessed space 110. The chamber 113 is provided with a capillary structure 12 on the inner wall thereof. And a proper amount of working fluid (not shown) is sealed, and the shell edge 111 can be formed into a curved concave arc shape in accordance with the shape of the applicable casing to facilitate the cover or design of the assembled structure and the like.

As described above, the other side of the second shell layer 11 surrounds the shell portion 112 by the recessed space 110, so as to form a recessed portion 114 on the opposite shell portion 112, and the recessed space thus formed 110 can be configured as a loop as described above, and further provides a support effect required for the chamber 113 through the loop-like structure, thereby constituting the housing heat transfer structure 1.

Accordingly, as shown in the third and fourth figures, in the state of use of the present invention, the heat transfer structure 1 of the casing is in contact with the electronic heating element 2 by the portion protruding through the recessed space 110; In other words, the second shell layer 11 serves as an inner portion of the shell heat transfer structure 1, and the first shell layer 10 serves as an outer portion of the shell heat transfer structure 1. Or, as shown in the fifth and sixth figures, in another use state of the present invention, the case heat transfer structure 1 can also pass through the portion of the first shell layer 10 relative to the recessed space 110 to the electronic heating element 2. The first shell layer 10 serves as an inner portion of the heat transfer structure 1 of the casing, and the second shell layer 11 serves as an outer portion of the heat transfer structure 1 of the casing.

Furthermore, as shown in the seventh figure, in another embodiment of the present creation, the recessed space 110 may also form a plurality of loop-like structures in which the chamber 113 communicates; or as shown in the eighth figure, In an embodiment, the recessed space 110 may form a plurality of phase-divided loop-like structures to each have a separate chamber 113. Therefore, the heat transfer structure 1 of the casing is substantially a temperature equalizing plate or a loop heat pipe, and is designed as a casing part of the electronic device through the first and second shell layers 10 and 11 to achieve an anatomical shell of the electronic device. Directly in contact with the electronic heating elements within it, thereby providing a heat dissipation effect.

Therefore, the heat transfer structure of the electronic device housing of the present invention can be obtained by the above-mentioned structural composition.

Therefore, the heat transfer structure 1 of the electronic device housing is designed to pass through a Vapor chamber or a loop heat pipe to form any part of the housing of the electronic device, which may be partial or It is all. In this way, the temperature-sensing plate or the loop-type heat pipe having heat transfer or even heat-dissipating effect can directly contact the electronic heating element 2 in the electronic device, thereby eliminating the need to provide other heat-dissipating structures in the electronic device and avoid increasing the thickness thereof. Or the overall volume and the like affecting the thinned design, and can directly contact the electronic heating element 2 through the heat transfer structure of the housing, thereby providing the heat transfer and heat dissipation effects required by the electronic heating element 2 to obtain an effective effect. solve.

In summary, this creation is a rare new creative product, which can achieve the intended use, but solve the lack of knowledge, and because of its novelty and progress, it fully meets the requirements of new patent applications. To file an application in accordance with the Patent Law, please check and grant the patent in this case to protect the rights of the creator.

However, the above description is only a preferred and feasible embodiment of the present invention, and thus the scope of the patent of the present invention is not limited thereby, and therefore equivalent structural changes made by using the present specification and the contents of the drawings are equally included in the present invention. Within the scope of creation, he is given to Chen Ming.

1‧‧‧Shell heat transfer structure

10‧‧‧ first shell

100‧‧‧ inside

11‧‧‧Second shell

110‧‧‧ recessed space

111‧‧‧ Shell

112‧‧‧Shell Department

113‧‧‧ chamber

114‧‧‧ recessed area

12‧‧‧Muscle tissue

2‧‧‧Electronic heating element

Claims (10)

An electronic device housing heat transfer structure for use as a housing portion of an electronic device, comprising: a first shell layer having an inner side surface; and a second shell layer having a recessed space on one side thereof, the recessed space Forming a loop shape, forming a shell edge outside the recessed space forming the loop-shaped periphery, and forming at least one shell portion in the loop-shaped surrounding portion of the recessed space; wherein the shell edge is The inner side surface of the first shell layer is in contact with each other, and the shell plate portion is in contact with the inner side surface of the first shell layer, so as to form a loop-like chamber between the first shell layer and the recessed space, the cavity The chamber is provided with capillary structure on its inner wall and stores a working fluid. The electronic device housing heat transfer structure according to claim 1, wherein the heat transfer structure of the housing is a casing portion of a mobile phone, a display screen or a tablet computer. The electronic device housing heat transfer structure of claim 2, wherein the heat transfer structure of the housing is part or all of a casing of a mobile phone, a display screen or a tablet computer. The electronic device housing heat transfer structure according to claim 1, wherein the first shell layer serves as an inner portion of the shell heat transfer structure, and the second shell layer serves as the shell heat transfer structure. The outer part. The electronic device housing heat transfer structure according to claim 1, wherein the second shell layer serves as an inner portion of the shell heat transfer structure, and the first shell layer serves as the shell heat transfer structure. The outer part. The electronic device housing heat transfer structure according to claim 1, wherein the first The other side of the second shell surrounds the shell portion by the recessed space to form a recessed portion with respect to the shell portion. The electronic device housing heat transfer structure according to claim 1, wherein the shell edge has a curved concave shape. The electronic device housing heat transfer structure according to any one of claims 1 to 7, wherein the recessed space is further formed into a plurality of loop-like structures. The electronic device housing heat transfer structure of claim 8, wherein the plurality of loop-like structures of the recessed spaces are in communication. The electronic device housing heat transfer structure of claim 8, wherein the plurality of loop-like structures of the recessed spaces are separated by phases and each has an independent chamber.