TWI529363B - Wearable carrier with heat dissipation structure - Google Patents
Wearable carrier with heat dissipation structure Download PDFInfo
- Publication number
- TWI529363B TWI529363B TW103138955A TW103138955A TWI529363B TW I529363 B TWI529363 B TW I529363B TW 103138955 A TW103138955 A TW 103138955A TW 103138955 A TW103138955 A TW 103138955A TW I529363 B TWI529363 B TW I529363B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- heat dissipation
- dissipation structure
- wearable carrier
- structure according
- Prior art date
Links
Description
一種具散熱結構之穿戴式載體,尤指一種應用於穿戴式智慧型行動裝置內部進行解熱的具散熱結構之穿戴式載體。 A wearable carrier having a heat dissipation structure, in particular, a wearable carrier having a heat dissipation structure applied to the inside of a wearable smart mobile device for deheating.
現行行動裝置係除了手機、平板外亦擴及至手錶、項鍊、戒子亦成為具有多功能之智慧型行動穿戴裝置,隨著功能日漸增加亦加入觸控螢幕及衛星定位晶片等元件,使智慧型手錶除了可與其他行動裝置透過藍牙或網路連線使用外,亦可插入SIN卡進行3G或4G網路使用以及通話等功能,但當智慧型手錶進行執行運作時會產生熱量,此外智慧型手錶為達到防水之效果,必須將整體緊密封閉,內部之電子元件所產生之熱量無法向外進行散熱則產生積熱於該手錶內部。 In addition to mobile phones and tablets, the current mobile device has also expanded into watches, necklaces and rings. It has become a multi-functional smart mobile wear device. With the increasing functions, it has also added components such as touch screens and satellite positioning chips to make smart devices. In addition to being connected to other mobile devices via Bluetooth or the Internet, the watch can also be plugged into a SIN card for 3G or 4G network use and calls, but when the smart watch performs its operation, it generates heat. In addition, it is smart. In order to achieve the waterproof effect, the watch must be tightly closed as a whole, and the heat generated by the internal electronic components cannot be radiated to the outside to generate heat accumulated inside the watch.
傳統配置於智慧型手錶上便於使用者穿戴之錶帶具有各種材質如金屬、皮革、橡膠、塑膠等皆無法將智慧型手錶所產生之熱量有效的導出進行解熱,又因錶帶需具有可撓性,便於使用者穿戴,故無法將無法彎折或不具可撓性之散熱元件(如熱管、均溫板等)與其結合進行解熱。 Traditionally placed on smart watches, the watch straps that are easy for the user to wear have various materials such as metal, leather, rubber, plastic, etc., and the heat generated by the smart watch cannot be effectively deferred, and the strap needs to be flexible. It is easy for the user to wear, so it is impossible to combine heat-dissipating components (such as heat pipes, temperature equalizing plates, etc.) that cannot be bent or not flexible.
故習知技術仍然造成該智慧型手錶因溫度過高產生作業延遲或嚴重者當機等缺失,故如何對該智慧型手錶及各項穿戴式的型動裝置進行解熱為現行最優先解決之課題。 Therefore, the conventional technology still causes the smart watch to be delayed due to excessive temperature or serious crashes, so how to deheat the smart watch and various wearable devices is the current priority. .
爰此,為有效解決上述之問題,本發明之主要目的,係提供一種有效解決智慧型行動裝置內部積熱問題的具散熱結構之穿戴式載體。 Accordingly, in order to effectively solve the above problems, the main object of the present invention is to provide a wearable carrier having a heat dissipation structure that effectively solves the problem of heat accumulation inside a smart mobile device.
為達上述目的本發明係提供一種具散熱結構之穿戴式載體,係包含:一錶帶本體;該錶帶本體係為矽膠或橡膠其中任一材質所製成,其中該錶帶本體具有一腔室,該腔室係具有至少一毛細結構及一工作液體,且其腔室壁面凸伸一支撐部,並於該錶帶本體定義至少一吸熱部及一散熱部,該散熱部係由該吸熱部至少一端或兩端延伸所構形,本發明係提供一種具可撓特性且內部形成具有汽液循環熱交換腔室結構之載具,係可大幅提升對應組設之智慧型行動裝置4散熱效率者。 In order to achieve the above object, the present invention provides a wearable carrier having a heat dissipating structure, comprising: a strap body; the strap is made of any material of silicone or rubber, wherein the strap body has a cavity The chamber has at least one capillary structure and a working liquid, and a wall portion of the chamber protrudes from a support portion, and at least one heat absorption portion and a heat dissipation portion are defined in the surface of the watch body, and the heat dissipation portion is formed by the heat absorption portion The invention is characterized in that at least one end or both ends are extended, and the present invention provides a vehicle having flexible characteristics and internally forming a vapor-liquid circulating heat exchange chamber structure, which can greatly improve the heat dissipation efficiency of the corresponding intelligent mobile device 4. By.
11‧‧‧錶帶本體 11‧‧‧Band body
111‧‧‧腔室 111‧‧‧ chamber
111a‧‧‧支撐部 111a‧‧‧Support
1111‧‧‧凸肋 1111‧‧‧ rib
1112‧‧‧通道 1112‧‧‧ channel
112‧‧‧吸熱部 112‧‧‧Heat Absorption Department
113‧‧‧毛細結構 113‧‧‧Capillary structure
114‧‧‧散熱部 114‧‧‧ Department of heat dissipation
2‧‧‧工作液體 2‧‧‧Working liquid
3‧‧‧導熱體 3‧‧‧ Thermal Conductor
31‧‧‧第一側 31‧‧‧ first side
32‧‧‧第二側 32‧‧‧ second side
4‧‧‧智慧型行動裝置 4‧‧‧Smart mobile device
5‧‧‧鍍層 5‧‧‧ plating
第1圖係為本發明之具散熱結構之穿戴式載體之第一實施例之立體圖;第2圖係為本發明之具散熱結構之穿戴式載體之第一實施例之剖視圖;第3圖係為本發明之具散熱結構之穿戴式載體之第二實施例之立體剖視圖;第4圖係為本發明之具散熱結構之穿戴式載體之第三實施例之立體分解圖;第5圖係為本發明之具散熱結構之穿戴式載體之第四實施例之剖視圖;第6圖係為本發明之具散熱結構之穿戴式載體之第五實施例之立體分解圖; 1 is a perspective view of a first embodiment of a wearable carrier having a heat dissipation structure according to the present invention; and FIG. 2 is a cross-sectional view showing a first embodiment of a wearable carrier having a heat dissipation structure according to the present invention; FIG. 4 is a perspective exploded view of a wearable carrier having a heat dissipation structure according to a second embodiment of the present invention; FIG. 4 is a perspective exploded view of a wearable carrier having a heat dissipation structure according to the present invention; A cross-sectional view of a fourth embodiment of a wearable carrier having a heat dissipation structure according to the present invention; and a sixth perspective view of a wearable carrier having a heat dissipation structure according to a fifth embodiment of the present invention;
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
請參閱第1、2圖,係為本發明之具散熱結構之穿戴式載體之第一實施例之立體分解及組合圖剖視圖,如圖所示,本發明具散熱結構之穿戴式載體,係包含:一錶帶本體11: 該錶帶本體11係為矽膠或橡膠其中任一材質所製成,該錶帶本體11具有一腔室111,該腔室111具有一毛細結構113及一工作液體2,且腔室111之壁面凸伸一支撐部111a。 1 and 2 are a perspective exploded view and a combined cross-sectional view of a first embodiment of a wearable carrier having a heat dissipation structure according to the present invention. As shown, the wearable carrier having the heat dissipation structure of the present invention includes : A strap body 11: The watch body 11 is made of any material such as silicone or rubber. The watch body 11 has a chamber 111 having a capillary structure 113 and a working liquid 2, and the wall of the chamber 111 A support portion 111a is projected.
該錶帶本體11定義至少一吸熱部112及一散熱部114,該散熱部114係由該吸熱部112至少一端延伸所構形。 The strap body 11 defines at least one heat absorbing portion 112 and a heat dissipating portion 114, and the heat dissipating portion 114 is configured by extending at least one end of the heat absorbing portion 112.
所述毛細結構113係為網格體或纖維體或金屬線材編織體其中任一。 The capillary structure 113 is any one of a mesh body or a fiber body or a metal wire braid.
所述支撐部111a係為複數凸肋(柱、點、塊)1111呈間隔排列所組成,並該等凸肋1111間型成至少一通道1112,該等通道1112係可作為工作液體2汽液循環時之蒸汽通道使用。 The support portion 111a is composed of a plurality of ribs (columns, dots, blocks) 1111 arranged at intervals, and the ribs 1111 are formed into at least one channel 1112. The channels 1112 can be used as working fluid 2 vapor. The steam channel is used during the cycle.
所述錶帶本體11係可透過射出成型(模內射出)或其他方法成型,該錶帶本體11內部之腔室111、支撐部111a以及將毛細結構113係完全密封真空地包覆於其腔室111內,進而形成可提供工作液體2汽液循環使用之空間及結構。 The watch body 11 can be formed by injection molding (in-mold injection) or other methods. The chamber 111 inside the watch body 11 and the support portion 111a and the capillary structure 113 are completely sealed and vacuum-covered in the cavity. In the chamber 111, a space and structure for providing a vapor-liquid circulation of the working liquid 2 are formed.
本發明之具散熱結構之穿戴式載體主要係用於與至少一智慧型行動裝置結合,當智慧型行動裝置產生熱量時係可透過與其搭配組合之穿戴式穿戴式載體之錶帶本體11的吸熱部112吸取熱量,並透過該吸熱部112處內部腔室111的工作流體2加熱產生汽化成汽態,並於該吸熱部112處內之腔室111中進行擴散,並將熱量傳遞至該散熱部114處內之腔室111時產生冷卻冷凝成液態,並藉由毛細結構113將液態的工作流體2吸附回流至該吸熱部112附近再次進行汽液循環熱交換,則本發明之具散熱結構之穿戴式載體除可令智慧型行動裝置裝配或穿戴於使用者身上外,另外係提供智慧型行動裝置散熱之效果,防止產生內部積熱進而提升智慧型行動裝置散熱效果。 The wearable carrier with the heat dissipation structure of the present invention is mainly used for combining with at least one smart mobile device, and when the smart mobile device generates heat, the heat absorption of the watch body 11 through the wearable wearable carrier combined with the combination is adopted. The portion 112 absorbs heat and is heated to be vaporized into a vapor state through the working fluid 2 of the internal chamber 111 at the heat absorbing portion 112, and diffuses in the chamber 111 in the heat absorbing portion 112, and transfers heat to the heat dissipation. The chamber 111 in the portion 114 is cooled and condensed into a liquid state, and the liquid working fluid 2 is adsorbed and returned to the vicinity of the heat absorbing portion 112 by the capillary structure 113 to perform vapor-liquid circulation heat exchange again, and the heat dissipation structure of the present invention is provided. In addition to the smart mobile device being assembled or worn on the user's body, the wearable carrier provides the cooling effect of the smart mobile device to prevent internal heat build-up and enhance the heat dissipation effect of the smart mobile device.
請參閱第3圖,係為本發明之具散熱結構之穿戴式載體之第二實施例之立體剖視圖,如圖所示,本實施例部分結構技術特徵係與前述第一實施 例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於,本實施例中所述支撐部111a係為複數凸體1113呈間隔排列所組成,並於該等凸體1113橫向及縱向形成有至少一通道1112,該等通道1112係可作為工作液體2(如第2圖所示)汽液循環時之蒸汽通道使用。 FIG. 3 is a perspective cross-sectional view showing a second embodiment of a wearable carrier having a heat dissipation structure according to the present invention. As shown in the figure, a part of the structural technical features of the embodiment and the foregoing first embodiment are shown. The example is the same, so it will not be described here, but the difference between the embodiment and the first embodiment is that the support portion 111a is composed of a plurality of protrusions 1113 arranged at intervals, and The protrusion 1113 is formed with at least one passage 1112 in the lateral direction and the longitudinal direction, and the passages 1112 can be used as a steam passage in the vapor-liquid circulation of the working liquid 2 (as shown in FIG. 2).
請參閱第4圖,係為本發明之具散熱結構之穿戴式載體之第三實施例立體分解圖,如圖所示,本實施例部分結構技術特徵係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於,本實施例錶帶本體11更具有一承載部12,該承載部12可對應設置或圍繞四周側以構置有一容置空間121,該吸熱部112設置於該容置空間121內,並該容置空間121係可提供至少一智慧型行動裝置4對應結合組設。 4 is a perspective exploded view of a wearable carrier having a heat dissipation structure according to the present invention. As shown in the figure, some of the structural features of the embodiment are the same as those of the first embodiment. The difference between the present embodiment and the foregoing first embodiment is that the strap body 11 of the present embodiment further has a carrying portion 12, and the carrying portion 12 can be disposed correspondingly or around the surrounding side to configure a capacity. The space 121 is disposed in the accommodating space 121, and the accommodating space 121 is configured to provide at least one smart mobile device 4 correspondingly combined.
本實施例中之智慧型行動裝置4係以智慧型手錶作為說明實施例,但並不引以為限,所述智慧型行動裝置4係容設於該承載部12之容置空間121內與該錶帶本體11之吸熱部112貼設,令該智慧型行動裝置4所產生之熱量得以透過該錶帶本體11之吸熱部112及散熱部114進行散熱,進而解決智慧行動裝置4之積熱等散熱問題。 The intelligent mobile device 4 in the present embodiment is an intelligent wristwatch as an illustrative embodiment, but is not limited thereto. The smart mobile device 4 is accommodated in the accommodating space 121 of the carrying portion 12 and The heat absorbing portion 112 of the strap body 11 is attached, so that the heat generated by the smart mobile device 4 can be dissipated through the heat absorbing portion 112 and the heat dissipating portion 114 of the strap body 11 to solve the heat accumulation of the smart mobile device 4. Waiting for heat issues.
請參閱第5圖,係為本發明之具散熱結構之穿戴式載體之第四實施例之剖視圖,如圖所示,本實施例部分結構技術特徵係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於,本實施例所述錶帶本體11之腔室111內更具有一鍍層5,所述鍍層5係設於該腔室111之表面,所數鍍層5係可增加該腔室111內工作流體2(如第2圖所示)之冷凝效率,以及有助於該工作流體2冷凝後匯集之效果。 FIG. 5 is a cross-sectional view showing a fourth embodiment of the wearable carrier having the heat dissipation structure of the present invention. As shown in the figure, the structural features of the embodiment are the same as those of the first embodiment, and thus The difference between the embodiment and the first embodiment is that the chamber 111 of the strap body 11 of the embodiment further has a plating layer 5, and the plating layer 5 is disposed in the chamber 111. On the surface, the number of plating layers 5 increases the condensation efficiency of the working fluid 2 (as shown in Fig. 2) in the chamber 111, and the effect of facilitating the collection of the working fluid 2 after condensation.
請參閱第6圖,係為本發明之具散熱結構之穿戴式載體之第五實施例之立體分解,如圖所示,本實施例部分結構技術特徵係與前述第一實施例 相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於本實施例更具有一導熱體3,所述導熱體3係嵌設於前述錶帶本體11之吸熱部112,所述導熱體3具有一第一側31及一第二側32,所述導熱體3之第一側31裸露於該錶帶本體11之外部,該第二側32係相對該錶帶本體11之腔室111,並所述毛細結構113延伸相鄰該導熱體3,所述導熱體3係為熱管或均溫板或石墨片其中任一,本實施例係以石墨片作為說明實施例但並不引以為限。 Please refer to FIG. 6 , which is a perspective exploded view of a fifth embodiment of a wearable carrier having a heat dissipation structure according to the present invention. As shown in the figure, some structural technical features of the embodiment are compared with the foregoing first embodiment. The same is true, and the difference between the present embodiment and the foregoing first embodiment is that the present embodiment further has a heat conductor 3 embedded in the heat absorbing portion of the strap body 11 . 112. The heat conductor 3 has a first side 31 and a second side 32. The first side 31 of the heat conductor 3 is exposed outside the strap body 11. The second side 32 is opposite to the strap. a chamber 111 of the body 11 and the capillary structure 113 extending adjacent to the heat conductor 3, wherein the heat conductor 3 is a heat pipe or a temperature equalizing plate or a graphite sheet, and the embodiment is implemented by using a graphite sheet as a description. However, it is not limited.
本實施例主要透過該錶帶本體11之吸熱部112所嵌設之導熱體3直接與一智慧型行動裝置4進一步貼設組合時,該導熱體3之第一側31可直接將智慧型行動裝置4所產生之熱量直接吸附傳導至該錶帶本體11,並由該導熱體3之第二側32將熱量導入腔室111內,令錶帶本體11之吸熱部112處之腔室111內之工作液體2產生蒸發汽化擴散,其後該工作液體2擴散至該散熱部114處之腔室111時冷卻冷凝後再由毛細結構113吸附回流至該導熱體3周圍再次進行汽液循環,進而達到對該智慧型裝置4解熱之目的。 In this embodiment, when the heat conductor 3 embedded in the heat absorbing portion 112 of the watch body 11 is directly combined with a smart mobile device 4, the first side 31 of the heat conductor 3 can directly act as a smart action. The heat generated by the device 4 is directly adsorbed and conducted to the strap body 11, and the heat is introduced into the chamber 111 from the second side 32 of the heat conductor 3, so that the heat sink portion 112 of the watch body 11 is in the chamber 111. The working liquid 2 is vaporized and vaporized, and then the working liquid 2 is diffused to the chamber 111 at the heat radiating portion 114, and then cooled and condensed, and then adsorbed and returned by the capillary structure 113 to the periphery of the heat conducting body 3 to perform vapor-liquid circulation again. The purpose of deheating the smart device 4 is achieved.
11‧‧‧錶帶本體 11‧‧‧Band body
111‧‧‧腔室 111‧‧‧ chamber
111a‧‧‧支撐部 111a‧‧‧Support
1111‧‧‧凸肋 1111‧‧‧ rib
1112‧‧‧通道 1112‧‧‧ channel
112‧‧‧吸熱部 112‧‧‧Heat Absorption Department
113‧‧‧毛細結構 113‧‧‧Capillary structure
114‧‧‧散熱部 114‧‧‧ Department of heat dissipation
2‧‧‧工作液體 2‧‧‧Working liquid
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103138955A TWI529363B (en) | 2014-11-10 | 2014-11-10 | Wearable carrier with heat dissipation structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103138955A TWI529363B (en) | 2014-11-10 | 2014-11-10 | Wearable carrier with heat dissipation structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI529363B true TWI529363B (en) | 2016-04-11 |
TW201617577A TW201617577A (en) | 2016-05-16 |
Family
ID=56361429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103138955A TWI529363B (en) | 2014-11-10 | 2014-11-10 | Wearable carrier with heat dissipation structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI529363B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11946699B2 (en) | 2020-03-19 | 2024-04-02 | Asia Vital Components (Shen Zhen) Co., Ltd. | Bendable vapor chamber structure |
-
2014
- 2014-11-10 TW TW103138955A patent/TWI529363B/en active
Also Published As
Publication number | Publication date |
---|---|
TW201617577A (en) | 2016-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI537693B (en) | Wearable strap heat dissipation structure | |
TWI584110B (en) | Heat dissipation structure of wearable electronic device | |
CN106550583B (en) | Heat radiation module | |
US10077945B2 (en) | Heat dissipation device | |
US20140071614A1 (en) | Heat dissipation device | |
TWI461648B (en) | Heat-dissipating device | |
US9074824B2 (en) | Low-profile heat transfer device | |
US20090151906A1 (en) | Heat sink with vapor chamber | |
JP6527879B2 (en) | mobile computer | |
TW201528927A (en) | New heat spreading packaging design | |
CN112804851A (en) | Electronic equipment | |
US9367105B1 (en) | Heat dissipation structure for wearable mobile device | |
TWI529363B (en) | Wearable carrier with heat dissipation structure | |
WO2016095507A1 (en) | Heat dissipation device, circuit board, and terminal | |
JP3195692U (en) | Mobile device carrier with heat dissipation structure | |
US20160201994A1 (en) | Carrier with heat dissipation structure | |
TWM498454U (en) | Carrier with heat dissipation structure | |
TW201723408A (en) | Heat dissipation structure | |
TWM486933U (en) | Electric substrate heat dissipation structure | |
JP3195723U (en) | Heat dissipation structure for wearable mobile devices | |
KR20190032976A (en) | Heat cooler | |
TWI534596B (en) | Wearable mobile device heat dissipation structure | |
TWI529520B (en) | Heat dissipation structure of intelligent wearable device | |
TWM460507U (en) | Housing structure of handheld devices | |
TWM504437U (en) | Wearing type watchband heat dissipation structure |