CN217686784U - Assembling structure of uniform temperature plate and heat pipe - Google Patents
Assembling structure of uniform temperature plate and heat pipe Download PDFInfo
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- CN217686784U CN217686784U CN202221062526.9U CN202221062526U CN217686784U CN 217686784 U CN217686784 U CN 217686784U CN 202221062526 U CN202221062526 U CN 202221062526U CN 217686784 U CN217686784 U CN 217686784U
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Abstract
The utility model relates to a combination structure of a vapor chamber and a heat pipe, which comprises a vapor chamber half shell seat, a heat pipe half shell seat, a half shell cover component, a capillary structure and a working fluid, wherein the vapor chamber half shell seat comprises a bottom plate and a lower bounding wall, a vapor chamber cavity is enclosed between the bottom plate and the lower bounding wall, and a lower receiving semi-ring is arranged on the lower bounding wall; the heat pipe half shell seat is connected corresponding to the lower adapting semi-ring, and is provided with a heat pipe containing cavity which is communicated with the temperature-equalizing plate containing cavity; the half shell cover component is connected with the half shell seat of the heat pipe in a sealing way corresponding to the half shell seat of the temperature-uniforming plate; the capillary tissue is continuously laid on the temperature-equalizing plate half-shell seat and the heat pipe half-shell seat and is formed in the temperature-equalizing plate accommodating cavity and the heat pipe accommodating cavity; the working fluid is arranged in the temperature-equalizing plate containing cavity. Therefore, the manufacturing is easy, and the capillary tissue is uniformly distributed, so that the capillary adsorption force is strong.
Description
Technical Field
The present invention relates to a heat sink, and more particularly to a structure for connecting a vapor chamber and a heat pipe.
Background
With the increase of the computer boot speed and the software reading speed, the heat productivity and temperature of the electronic components used therein are also increasing, and the high temperature not only makes most of the electronic components easily and quickly aged, but also reduces the reading and writing speed of the electronic components such as the solid state disk, so how to maintain the working temperature becomes the research subject of the scheme.
In order to solve the Heat dissipation problem of the electronic components, efficient Heat conducting and dissipating members such as Heat pipes (Heat pipes) and Vapor chambers (Vapor chambers) have been developed, and the efficient Heat conducting and dissipating members have become the mainstream members for Heat dissipation of the electronic components due to their light weight and efficient Heat conducting capability.
However, in the manufacturing process, in addition to the need of forming a large number of dies for punching, blanking, folding, and the like, the arrangement of the capillary structure is an important factor related to the good capillary adsorption capacity of the capillary structure, most of the capillary structures of the existing temperature-uniforming plate and the existing heat pipe structure are manufactured separately, and then the capillary structures in the temperature-uniforming plate and the capillary structures in the heat pipes are connected with each other through a secondary processing method, and the capillary structure manufactured by the method is a discontinuous structure, so that the capillary adsorption capacity of the existing temperature-uniforming plate and the existing heat pipe structure is poor.
In view of the above, the present inventor has made extensive research and application of the theory to solve the above problems, and thus the present invention is an improved object.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to provide a connection structure of a vapor chamber and a heat pipe, which is easy to manufacture and has a uniform distribution of capillary structure to enhance the capillary adsorption force.
In order to achieve the above object, the present invention provides a structure for assembling a vapor chamber and heat pipes, comprising a vapor chamber half-shell, a plurality of heat pipe half-shell, a half-shell cover member, a capillary structure and a working fluid, wherein the vapor chamber half-shell comprises a bottom plate and a lower surrounding plate extending upward from the bottom plate, a vapor chamber is enclosed between the bottom plate and the lower surrounding plate, and the lower surrounding plate is provided with a plurality of lower receiving semi-rings; each heat pipe half shell seat is connected corresponding to each lower adapting semi-ring, each heat pipe half shell seat is provided with a heat pipe containing cavity, and each heat pipe containing cavity is communicated with the temperature equalizing plate containing cavity; the half-shell cover component corresponds to the half-shell seat of the vapor chamber and is connected with the half-shell seats of the heat pipes in a sealing way; the capillary tissue is continuously laid on the temperature-uniforming plate half-shell seat and each heat pipe half-shell seat and is formed in the temperature-uniforming plate accommodating cavity and each heat pipe accommodating cavity; the working fluid is arranged in the temperature-equalizing plate containing cavity.
As another implementation of the present invention, the half shell cover member includes a half shell cover of a uniform temperature plate and a half shell cover of several heat pipes, the half shell cover of the uniform temperature plate includes a top plate and an upper surrounding plate extending downward from the top plate, an another uniform temperature plate accommodating chamber is enclosed between the top plate and the upper surrounding plate, the upper surrounding plate is provided with a plurality of upper receiving semi-rings, each half shell cover of the heat pipes is connected with each upper receiving semi-ring, each half shell cover of the heat pipes has another heat pipe accommodating chamber, each another heat pipe accommodating chamber is communicated with the another uniform temperature plate accommodating chamber.
As another embodiment of the present invention, the half-shell seat of the vapor chamber has a first folding edge, each half-shell seat of the heat pipe has a second folding edge, the half-shell cover of the vapor chamber has a third folding edge, each half-shell cover of the heat pipe has a fourth folding edge, the first folding edge is corresponding to the sealing of the third folding edge, and each second folding edge is corresponding to the sealing of each fourth folding edge.
As another embodiment of the present invention, the half-shell seat of the vapor chamber and the half-shell cover of the vapor chamber are combined to form a rectangular vapor chamber, and each half-shell seat of the heat pipe and each half-shell cover of the heat pipe are combined to form a circular heat pipe.
The heat pipe comprises a first heat pipe and a second heat pipe, wherein the first heat pipe and the second heat pipe are respectively arranged on the first heat pipe and the second heat pipe, and the first heat pipe and the second heat pipe are respectively arranged on the first heat pipe and the second heat pipe.
As another embodiment of the present invention, the other capillary structure is integrally formed.
As another implementation of the utility model, the utility model also comprises a plurality of supporting columns, and each supporting column is vertically arranged between the half shell seat of the uniform temperature plate and the half shell cover of the uniform temperature plate.
In another embodiment of the present invention, the thickness of each of the half shell covers of the heat pipe is smaller than the thickness of the half shell cover of the uniform temperature plate.
In another embodiment of the present invention, the capillary structure is integrally formed.
In another embodiment of the present invention, the thickness of each of the heat pipe half shell seats is smaller than the thickness of the uniform temperature plate half shell seat.
As another implementation of the present invention, the half-shell cover member is a flat plate.
As another implementation of the present invention, the heat exchanger further comprises a plurality of supporting columns, each of the supporting columns is vertically disposed between the half shell seat of the vapor chamber and the half shell cover member.
The utility model discloses still have following efficiency, borrow by the interchange or the sharing of half cap of samming board and half shell seat of samming board, half cap of each heat pipe and half shell seat of each heat pipe exchange or share, can save the expense that the mould was seted up by a wide margin, and can reduce the administrative cost of stock. By means of the fact that the plate thickness of each heat pipe half shell seat is smaller than that of the uniform temperature plate half shell seat, a large heat pipe containing cavity is formed in each heat pipe half shell seat, and therefore heat conduction and dissipation efficiency is improved.
Drawings
Fig. 1 is a perspective view of the connection structure of the vapor chamber and the heat pipe according to the present invention.
Fig. 2 is an exploded view of the vapor chamber half shell seat, each heat pipe half shell seat and half shell cover member of the present invention.
Fig. 3 is a schematic view of the combination of the half-shell seat of the vapor chamber and the half-shell seats of the heat pipes according to the present invention.
Fig. 4 is an exploded cross-sectional view of the vapor chamber half shell holder, each heat pipe half shell holder, and half shell cover member of the present invention.
Fig. 5 is a combined cross-sectional view of the connection structure of the vapor chamber and the heat pipe according to the present invention.
Fig. 6 is an enlarged view of a partial region of fig. 5.
Fig. 7 is a cross-sectional view of another embodiment of the present invention.
Symbolic illustration in the drawings:
10, a half shell seat of the vapor chamber;
11, a bottom plate;
12, a lower coaming;
13, a temperature-equalizing plate cavity;
14, lower adapting semi-rings;
15, first folding edge;
20, a heat pipe half shell seat;
21, a heat pipe accommodating cavity;
22, a second folded edge;
30. 30A half-shell cover member;
31, half shell covers of the temperature-equalizing plates;
311, a top plate;
312, an upper coaming plate;
313, another uniform temperature plate cavity;
314, an upper adapting semi-ring;
315 third fold edge;
40, half shell covers of the heat pipes;
41, another heat pipe accommodating cavity;
42, a fourth folded edge;
50, capillary tissue;
60 working fluid;
70, a support column;
80: another capillary tissue;
t1 to t4 are the plate thickness.
Detailed Description
The following detailed description and technical contents of the present invention are described with reference to the drawings, but the drawings are only for reference and illustration and are not intended to limit the present invention.
Referring to fig. 1 to 6, the present invention provides a structure for assembling a vapor chamber and a heat pipe, which mainly comprises a vapor chamber half-shell base 10, a plurality of heat pipe half-shell bases 20, a half-shell cover member 30, a capillary structure 50 and a working fluid 60.
The temperature-equalizing plate half-shell seat 10 is made of copper, aluminum, magnesium or alloy thereof and other materials with good heat conductivity, is approximately rectangular, and mainly comprises a bottom plate 11 and a lower enclosing plate 12 which is formed by extending upwards from the periphery of the bottom plate 11, and a temperature-equalizing plate accommodating cavity 13 is enclosed between the bottom plate 11 and the lower enclosing plate 12; at the end of the lower enclosing plate 12 away from the bottom plate 11, a plurality of lower receiving half rings 14 and a first folding edge 15 extend.
Each heat pipe half shell seat 20 is connected corresponding to each lower adapting semi-ring 14, the cross section of each heat pipe half shell seat is roughly semicircular, a heat pipe containing cavity 21 is formed inside each heat pipe half shell seat 20, and each heat pipe containing cavity 21 is communicated with the temperature equalizing plate containing cavity 13. A second flange 22 extends outwardly from the open end of each heat pipe half shell 20.
The half-shell cover member 30 is sealed and connected with the half-shell seats 10 of the temperature-uniforming plate and the half-shell seats 20 of the heat pipes correspondingly, and is also made of materials with good heat conductivity such as copper, aluminum, magnesium or alloy thereof, the half-shell cover member 30 mainly comprises a half-shell cover 31 of the temperature-uniforming plate and a plurality of half-shell covers 40 of the heat pipes, the half-shell cover 31 of the temperature-uniforming plate is approximately rectangular, and is mainly composed of a top plate 311 and an upper enclosing plate 312 which extends upwards from the periphery of the top plate 311, and another temperature-uniforming plate containing cavity 313 is enclosed between the top plate 311 and the upper enclosing plate 312; in addition, a plurality of upper receiving half rings 314 and a third flange 315 are provided at one end of the upper enclosing plate 312 away from the top plate 311.
The cross section of each heat pipe half shell cover 40 is roughly semicircular, another heat pipe accommodating cavity 41 is arranged in each heat pipe half shell cover 40, and each other heat pipe accommodating cavity 41 is communicated with another temperature-equalizing plate accommodating cavity 313. A fourth flange 42 extends outwardly from the open end of each heat pipe half cover 40.
Wherein the half shell cover 31 of the temperature-equalizing plate has the characteristic of being used or shared with the half shell seat 10 of the temperature-equalizing plate, and each half shell cover 40 of the heat pipe also has the characteristic of being used or shared with each half shell seat 20 of the heat pipe.
In one embodiment, the vapor chamber half shell seat 10 has a plate thickness t1, and each heat pipe half shell seat 20 has a plate thickness t2, and since the vapor chamber half shell seat 10 and each heat pipe half shell seat 20 are formed by different stamping processes, the plate thickness t2 of each heat pipe half shell seat 20 is smaller than the plate thickness t1 of the vapor chamber half shell seat 10, so that each heat pipe half shell seat 20 has a larger heat pipe cavity 21 for providing gas and liquid circulation.
In one embodiment, the vapor plate half case cover 31 has a plate thickness t3, and each heat pipe half case cover 40 has a plate thickness t4, because the vapor plate half case covers are formed by different stamping processes, the plate thickness t4 of each heat pipe half case cover 40 is smaller than the plate thickness t3 of the vapor plate half case cover 31, so that each heat pipe half case cover 40 has a larger heat pipe cavity 41 for providing gas and liquid flow.
The capillary tissue 50 is continuously laid on the temperature-uniforming plate half-shell seat 10 and each heat pipe half-shell seat 20, and is formed in the temperature-uniforming plate accommodating cavity 13 and each heat pipe accommodating cavity 21. The "continuous laying" herein is to uniformly cover the base material of the capillary structure 50 on the inner surfaces of the bottom plate 11 and the lower enclosing plate 12, and to fix the capillary structure 50 to the inner surfaces of the bottom plate 11 and the lower enclosing plate 12 by a sintering process or a thermal diffusion welding process, that is, the capillary structure 50 is integrally formed.
In one embodiment, the capillary structure 50 can be made of a material with good capillary adsorption force, such as a metal mesh, porous sintered powder, or fiber bundle.
The working fluid 60 may be pure water, which is filled in the temperature-uniforming plate accommodating chamber 13 and is subjected to a degassing sealing process, so that the temperature-uniforming plate accommodating chamber 13 and each heat pipe accommodating chamber 21 form a vacuum chamber.
In an embodiment, the assembly structure of the vapor chamber and the heat pipe of the present invention further includes a plurality of supporting pillars 70, and the supporting pillars 70 may be made of copper, aluminum, magnesium or alloys thereof with good thermal conductivity. In one embodiment, the supporting pillars 70 are solid cylinders, and two end surfaces of each supporting pillar 70 respectively abut against the bottom plate 11 and the top plate 311.
In one embodiment, the combination structure of the vapor chamber and the heat pipe of the present invention further comprises another capillary structure 80, wherein the another capillary structure 80 is continuously laid on the vapor chamber half cover 31 and each heat pipe half cover 40, and is formed in the another vapor chamber cavity 313 and each another heat pipe cavity 41.
During the combination, the first folding edge 15 of the half-shell seat 10 of the vapor chamber is attached corresponding to the third folding edge 315 of the half-shell cover 31 of the vapor chamber, the second folding edge 22 of each half-shell seat 20 of the heat pipe is attached corresponding to the fourth folding edge 42 of each half-shell cover 40 of the heat pipe, and a welding process is performed, so that the half-shell cover member 30, the half-shell seat 10 of the vapor chamber and each half-shell seat 20 of the heat pipe are sealed and sealed. The half vapor chamber holder 10 and the half vapor chamber cover 31 are combined to form a rectangular vapor chamber, and each half vapor chamber holder 20 and each half vapor chamber cover 40 are combined to form a circular vapor chamber.
Referring to fig. 7, in addition to the above-mentioned embodiments, the half-shell cover member 30A of the present invention can be a flat plate, which is sealed and sealed corresponding to the half-shell seat 10 of the temperature-uniforming plate and the half-shell seats 20 of the heat pipes. Wherein each support post 70 is vertically disposed between the vapor plate housing half 10 and the housing half cover member 30A.
To sum up, the assembly structure of the vapor chamber and the heat pipe of the present invention can achieve the expected purpose of use, and solve the drawbacks of the prior art.
The above description is only a preferred and practical embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structural changes made by applying the contents of the specification and drawings of the present invention are reasonably included in the scope of the present invention.
Claims (12)
1. An assembling structure of a vapor chamber and a heat pipe is characterized by comprising:
the temperature-equalizing plate half-shell seat comprises a bottom plate and a lower enclosing plate extending upwards from the bottom plate, wherein a temperature-equalizing plate accommodating cavity is arranged between the bottom plate and the lower enclosing plate in an enclosing manner, and a plurality of lower bearing half-rings are arranged on the lower enclosing plate;
the heat pipe half shell seats are respectively connected corresponding to the lower adapting semi-rings, each heat pipe half shell seat is provided with a heat pipe containing cavity, and the heat pipe containing cavities are communicated with the temperature equalizing plate containing cavity;
a half shell cover component which is corresponding to the half shell seat of the temperature-uniforming plate and is connected with the half shell seats of the heat pipes in a sealing way;
the capillary tissue is continuously laid on the temperature-equalizing plate half-shell seat and each heat pipe half-shell seat and is formed in the temperature-equalizing plate accommodating cavity and each heat pipe accommodating cavity; and
a working fluid arranged in the temperature-equalizing plate containing cavity.
2. A vapor-panel and heat-pipe assembly as defined in claim 1, wherein said half-shell cover member comprises a vapor-panel half-shell cover and a plurality of heat-pipe half-shell covers, said vapor-panel half-shell cover comprises a top plate and an upper wall plate extending downward from said top plate, a further vapor-panel cavity is defined between said top plate and said upper wall plate, a plurality of upper receiving half-rings are provided on said upper wall plate, each of said heat-pipe half-shell covers is connected to each of said upper receiving half-rings, each of said heat-pipe half-shell covers has a further heat-pipe cavity, and each of said further heat-pipe cavities is connected to said further vapor-panel cavity.
3. A structure for assembling a vapor chamber and a heat pipe as defined in claim 2, wherein said vapor chamber half-shell base has a first flange, each of said heat pipe half-shell bases has a second flange, said vapor chamber half-shell cover has a third flange, each of said heat pipe half-shell covers has a fourth flange, said first flange is sealed with said third flange, and each of said second flanges is sealed with said fourth flange.
4. A structure for assembling a heat pipe and a heat spreader as defined in claim 3, wherein the half heat spreader housing and the half heat spreader housing cover are assembled to form a rectangular heat spreader, and each of the half heat pipe housing and the half heat pipe housing cover is assembled to form a circular heat pipe.
5. The structure as claimed in claim 2, further comprising another capillary structure, wherein the another capillary structure is continuously laid on the cover of the half-shell of the temperature-uniforming plate and the cover of each heat pipe, and is formed in the cavity of the temperature-uniforming plate and the cavity of each heat pipe.
6. A combination of a vapor-permeable plate and a heat pipe as defined in claim 5, wherein the other capillary structure is integrally formed.
7. A structure for assembling a vapor chamber and a heat pipe as defined in claim 2, further comprising a plurality of support posts, each support post being vertically disposed between the half-shell holder and the half-shell cover.
8. A structure for assembling a vapor chamber and a heat pipe as defined in claim 2, wherein the thickness of each half case cover of the heat pipe is smaller than the thickness of the half case cover of the vapor chamber.
9. A structure for assembling a vapor-temperature plate and a heat pipe according to claim 1, wherein said wick is integrally formed.
10. A structure for assembling a vapor plate and a heat pipe as recited in claim 1, wherein a thickness of each half shell of the heat pipe is smaller than a thickness of the half shell of the vapor plate.
11. A combination of a vapor-temperature plate and a heat pipe as defined in claim 1, wherein the half-shell cover member is a flat plate.
12. A structure for assembling a vapor plate and a heat pipe as recited in claim 11, further comprising a plurality of support posts, each of said support posts being vertically disposed between said vapor plate half shell holder and said half shell cover member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221062526.9U CN217686784U (en) | 2022-05-06 | 2022-05-06 | Assembling structure of uniform temperature plate and heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221062526.9U CN217686784U (en) | 2022-05-06 | 2022-05-06 | Assembling structure of uniform temperature plate and heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217686784U true CN217686784U (en) | 2022-10-28 |
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ID=83736510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221062526.9U Active CN217686784U (en) | 2022-05-06 | 2022-05-06 | Assembling structure of uniform temperature plate and heat pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217686784U (en) |
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2022
- 2022-05-06 CN CN202221062526.9U patent/CN217686784U/en active Active
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