CN110213947A - Housing unit and preparation method thereof and electronic equipment - Google Patents
Housing unit and preparation method thereof and electronic equipment Download PDFInfo
- Publication number
- CN110213947A CN110213947A CN201910578557.6A CN201910578557A CN110213947A CN 110213947 A CN110213947 A CN 110213947A CN 201910578557 A CN201910578557 A CN 201910578557A CN 110213947 A CN110213947 A CN 110213947A
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- China
- Prior art keywords
- metal layer
- housing unit
- middle plate
- heat
- inlet
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
Abstract
The embodiment of the present application provides a kind of housing unit and preparation method thereof and electronic equipment, wherein housing unit may include include center, the first metal layer, second metal layer and heat-conducting medium, middle plate includes mounting surface, mounting surface opens up fluted, middle plate further includes the bottom wall and side wall in groove, the first metal layer and bottom wall injection molding are simultaneously layed in bottom wall, second metal layer is oppositely arranged with the first metal layer, and the end of second metal layer and side wall injection molding, middle plate, the first metal layer and second metal layer surround dielectric cavity.Heat-conducting medium is set in dielectric cavity.Due in plate, will not additionally increase the thickness of housing unit or electronic equipment in the first metal layer or second metal layer insertion.In use, heat is conducted in the first metal layer fitting corresponding with heater element, heat is carried out by soaking on entire housing unit by heat-conducting medium, heat is avoided to concentrate in the local excessive of electronic equipment.
Description
Technical field
This application involves electronic equipment dissipating heat technical fields, and in particular to a kind of housing unit and preparation method thereof and electricity
Sub- equipment.
Background technique
The power supply of electronic equipment or other electronic devices can generate a large amount of heat at work, bring electronic equipment
Bulk temperature increases, and when temperature sharply increases, there are spontaneous combustion risks.Present some electronic equipments all can after temperature raising
Take part to reduce the measure of power consumption, this causes the operational efficiency of electronic equipment to decline, electronic equipment is caused to become Caton automatically；
Hot situation is had when user holds electronic equipment simultaneously.
Summary of the invention
The application's is designed to provide a kind of housing unit and preparation method thereof and electronic equipment, and electricity can be improved
The radiating efficiency of sub- equipment.
In a first aspect, the embodiment of the present application provides a kind of housing unit, including center, the first metal layer, the second metal
Layer and heat-conducting medium, center include middle plate and frame, and frame encloses the edge set on middle plate and connect with middle plate, and middle plate includes peace
Fill surface, mounting surface opens up fluted, and middle plate further includes bottom wall and side wall in the groove, and side wall surrounds bottom wall and company
It is connected to bottom wall.The first metal layer and bottom wall injection molding are simultaneously layed in bottom wall, and second metal layer is oppositely arranged with the first metal layer,
And the end of second metal layer and side wall injection molding, middle plate, the first metal layer and second metal layer surround dielectric cavity.It is thermally conductive
Medium is set in dielectric cavity.
Second aspect, the embodiment of the present application provide the preparation method of above-mentioned housing unit, comprising: by the first metal layer with
And second metal layer is oppositely arranged basis of formation structure, injection molding forms center in foundation structure.Inlet is formed, inlet connects
The logical dielectric cavity by being surrounded between the first metal layer, second metal layer and middle plate.Dielectric cavity is vacuumized from inlet, Xiang Jie
The intracavitary filling heat-conductive medium of matter closes inlet.
The third aspect, the embodiment of the present application provide a kind of electronic equipment, including above-mentioned housing unit and fever member
Part, heater element is set to middle plate, and is bonded with second metal layer.
Housing unit provided by the present application and preparation method thereof and electronic equipment, the first metal layer or second metal layer are embedding
Enter in plate, will not additionally increase the thickness of housing unit or electronic equipment.In use, the first metal layer and heater element pair
It answers, alternatively, second metal layer can directly be bonded conduction heat with heater element, by heat-conducting medium by heat in entire shell
Soaking is carried out on component, avoids heat from concentrating in the local excessive of electronic equipment, while can also increase the heat dissipation of electronic equipment
Heat transfer area as early as possible scatters and disappears away heat outward.
These aspects or other aspects of the application can more straightforward in the following description.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for
For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is a kind of structural schematic diagram of housing unit provided by the embodiments of the present application；
Fig. 2 is cross-sectional view of the Fig. 1 along line A-A；
Fig. 3 be III in Fig. 2 at enlarged drawing；
Fig. 4 be IV in Fig. 3 at enlarged drawing；
Fig. 5 is the cross-sectional view in Fig. 1 along line B-B；
Fig. 6 be VI in Fig. 5 at enlarged drawing；
Fig. 7 is the structural schematic diagram of another housing unit provided by the embodiments of the present application；
Fig. 8 is the structural schematic diagram of a kind of electronic equipment provided by the embodiments of the present application；
Fig. 9 is the cross-sectional view in Fig. 8 along line C-C.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of embodiments of the present application, instead of all the embodiments.It is based on
Embodiment in the application, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall in the protection scope of this application.
With the fast development of electronic equipment (such as mobile terminal), the power consumption of electronic equipment is also gradually increased, therewith,
The heat that electronic equipment generates during the work time is also larger.By taking power supply as an example, existing housing unit, fixed by viscose glue
Mode is fixed on the center on piece of power supply, and in radiation processes, the heat that power supply generates is transferred to shell after center piece, viscose glue
Component, radiating efficiency is low, while the thickness of whole assembly back casing component is larger, and electronic equipment is needed to reserve in a thickness direction
Biggish space causes the thickness of electronic equipment bigger than normal.Therefore, inventors herein propose housing unit in the embodiment of the present application and
Preparation method and electronic equipment.Present embodiments are specifically described below in conjunction with attached drawing.
Refering to fig. 1, the present embodiment provides a kind of housing units 100, including center 30, the first metal layer 41, the second metal
Layer 42 and the heat-conducting medium (not shown) between 41 (not shown in figure 1) of second metal layer 42 and the first metal layer.Its
Middle the first metal layer 41 is oppositely arranged with second metal layer 42, and the first metal layer 41 and second metal layer 42 with 30 note of center
It is moulded into type.
Also referring to Fig. 1 and Fig. 2, center 30 includes middle plate 32 and frame 31, and the frame 31 is enclosed set on the middle plate
32 edge is simultaneously connect with the middle plate 32, and the middle plate 32 includes mounting surface 322, and mounting surface 322 is all kinds of for being arranged
The element of type.The mounting surface 322 opens up fluted 321, and groove 321 can be recessed by mounting surface 322 and be formed, Ke Yili
Solution groove 321 in a strip shape can extend, and can also be extended along any direction, specifically can setting according to second metal layer 42
It counts and changes.
Also referring to Fig. 3 and Fig. 4, the middle plate 32 further includes the bottom wall 323 and side wall in the groove 321
324, the side wall 324 is around the bottom wall 323 and is connected to the bottom wall 323.It is appreciated that bottom wall 323 refers to positioned at recessed
The wall of 321 bottom of slot, side wall 324 refer to that the wall positioned at the side surface of groove 321, bottom wall 323 and side wall 324 limit described recessed
Slot 321.In some embodiments, bottom wall 323 is in rough plane configuration, and substantially parallel with mounting surface 322.Side wall
324 is substantially vertical with bottom wall 323 and mounting surface 322, and the region that side wall 324 surrounds can be arbitrary shape, as rectangle,
Circle etc..
The range for the mounting surface 322 that groove 321 occupies can according to need is designed, such as groove 321 occupies
The range of mounting surface 322 can be 10%, 20%, 50% etc..It specifically can according to need the region of setting heater element
It is determined, so that the position of the first metal layer 41 and second metal layer 42 can be corresponded to each other with heater element, convenient for conduction
The heat that heater element generates.
Referring to Fig. 4, the second patch that the first metal layer 41 has the first binding face and mutually deviates from the first binding face
Conjunction face, wherein the first binding face is layed in bottom wall 323 and is paved with bottom wall 323, the first metal layer 41 and bottom wall 323 pass through injection molding
Mode is integrally formed, and this mode can be firmly fixed the first metal layer 41, and in the first metal layer 41 and bottom wall 323 and
Gap will not be generated between side wall 324, improve the airtightness of finally formed dielectric cavity 45.
First binding face can be smooth plane or the form for the surface engagement with bottom wall 323.Such as some
It is curved surface in embodiment, in this way, the first binding face is bonded completely with bottom wall 323, simultaneously because the first binding face and bottom wall 323
Between contact area increase, the bonding strength between bottom wall 323 and the first binding face and thermally conductive transfer performance can be improved.The
Two binding faces are towards second metal layer 42 and opposite with second metal layer 42.
Wherein, the first metal layer 41 can be made of the metal material of sheet, for example, the first metal layer 41 can be steel disc,
The high sheet metal of the heat conduction efficiencies such as copper sheet, aluminium flake is made, and can also be prepared by other metal or alloys.
Refering to Fig. 3 and Fig. 4, second metal layer 42 is oppositely arranged with the first metal layer 41, and the substantially position of second metal layer 42
In in groove 321, it will be understood that be located substantially at and refer to that at least part of second metal layer 42 is located at groove 321 in groove 321
It is interior.Interval is formed between the first metal layer 41 and second metal layer 42, for for forming dielectric cavity 45 and filling heat-conducting medium
140.Wherein, second metal layer 42 can be made of the metal material of sheet, such as second metal layer 42 can be steel disc, copper
The high sheet metal of the heat conduction efficiencies such as piece, aluminium flake is made, and can also be prepared by other metal or alloys.
In some embodiments, second metal layer 42 can be made of material identical with the first metal layer 41, this
Sample is conducive to be welded to connect between the first metal layer 41.And it can be to avoid between the first metal layer 41 and second metal layer 42
Galvanic interaction is formed after being packed into heat-conducting medium, and the first metal layer 41 or second metal layer 42 is caused to be corroded.Such as: the
One metal layer 41 and second metal layer 42 all can be layers of copper, copper has good thermal conductivity, while activity is not high, be not easy by
Corrosion, and it is relatively inexpensive.
The end of second metal layer 42 and 324 integrated injection molding of side wall, it will be understood that the end of second metal layer 42 is
Refer to the end of the length direction of second metal layer 42 and the end of width direction.That is: the end of second metal layer 42 and side wall
324 connections, and closed pockets 321.Wherein, the surface of the separate the first metal layer 41 of second metal layer 42 can be all kinds of for being arranged
Component, especially heater element, so that the heat that heater element generates is conducted to second metal layer 42.Certainly, in others
In some embodiments, the surface of the separate the first metal layer 41 of second metal layer 42 also be can be set into and each heater element phase
The form of cooperation.
In some embodiments, the surface of the separate the first metal layer 41 of second metal layer 42 can be with mounting surface
322 flush with each other can be in this way, when heater element fits in the surface of separate the first metal layer 41 of second metal layer 42
It is more smooth, the setting of the various components of electronic equipment is not influenced.And in other some embodiments, second metal layer
The surface of 42 separate the first metal layer 41 can also partly or entirely protrude from outside groove 321.
It should be noted that heater element refers to all types of heater elements in electronic equipment, such as power supply, mainboard, place
Manage device, memory etc..
Also referring to Fig. 5 and Fig. 6, the middle plate 32, the first metal layer 41 and the second metal layer 42 are enclosed
At dielectric cavity 45, dielectric cavity 45 is for filling heat-conducting medium.Heat-conducting medium is room temperature liquid medium, for example, water, ethyl alcohol etc..For
Convenient for into dielectric cavity 45 filling heat-conductive medium, dielectric cavity 45 be provided with inlet 47, inlet 47 is connected to dielectric cavity 45.
Housing unit 100 further includes sealing 48, and sealing 48 is for closing inlet 47, it is to be understood that sealing 48 is sealing
During closing inlet 47, it can be connected with the first metal layer 41, second metal layer 42 and middle plate 32 by modes such as welding
Connect the sealing realized to dielectric cavity 45.
In some embodiments, inlet 47 can be opened in the first metal layer 41 or second metal layer 42, exist at this time
Inlet 47 can be formed when being pre-formed the first metal layer 41 or second metal layer 42 together.Thermally conductive Jie to be implanted of sealing 48
It connect formation sealing after matter with the first metal layer 41 or second metal layer 42 again.
In some embodiments, middle plate 32 offers channel 325, and the middle plate 32 is run through in the one end in the channel 325,
The other end extends to the inlet 47, and inlet 47 is located at the edge of the first metal layer 41 and the edge of second metal layer 42
Between.Channel 325 can be integrally formed during plate 32 in injection molding is formed, wherein leading to shorten the path in channel 325
Road 325 can open up and run through middle plate 32 close to the position of the first metal layer 41 and second metal layer 42, inject in this way
When heat-conducting medium, the path of heat-conducting medium or the length for being inserted into pipeline can be shorter, more convenient, also avoid heat-conducting medium
Remain in channel 325.
The advantages of this embodiment, is: not needing to reserve inlet on the first metal layer 41 or second metal layer 42
47, it avoids during injection molding, fluid enters from inlet 47 forms residual in dielectric cavity 45.Meanwhile channel 325
Aperture can open bigger, be vacuumized through channel 325 from inlet 47 and implant operation conducive to subsequent.
Spacing between second metal layer 42 and the first metal layer 41 determines the volume of entire dielectric cavity 45, that is, determines
The volume of heat-conducting medium, when the spacing between second metal layer 42 and the first metal layer 41 is thicker, the volume of heat-conducting medium is more
Greatly, heat dissipation effect is more preferable, but will increase the thickness of entire housing unit 100 accordingly.In some embodiments, the second metal
Spacing between layer 42 and the first metal layer 41 can be set to 0.5mm-5mm.In the spacing, heat dissipation effect is preferable and will not
Cause thickness excessive, and easy to process.It is appreciated that the spacing between second metal layer 42 and the first metal layer 41 can also be small
In 0.5mm or it is greater than 5mm.
In some embodiments, housing unit 100 can also include support column 44, and support column 44 is set to second metal layer
Between 42 and the first metal layer 41, support column 44 is connected to second metal layer 42 and the first metal layer 41, can be to the second gold medal
Belong to layer 42 and the first metal layer 41 is played a supporting role, prevents dielectric cavity 45 from deforming.Support column 44 can use and the second gold medal
Belong to the identical material of layer 42 to be made, and can link together in advance with second metal layer 42 or the first metal layer 41, such as
It is connected to a side surface towards the first metal layer 41 and the first metal layer 41 of second metal layer 42 by welding
The side surface towards second metal layer 42.In some embodiments, support column 44 can also be by second metal layer
42 or the first metal layer 41 on be etched, the modes such as laser carving are formed.It is appreciated that support column 44 can be one or more,
When support column 44 is multiple, multiple support columns 44, which can be spaced, to be uniformly distributed.
In some embodiments, capillary structure layer can also be set between second metal layer 42 and the first metal layer 41
43, the setting of capillary structure layer 43 can condense liquefaction again for the heated heat-conducting medium for gasification phenomenon occur, and by heat from height
Temperature area is conducted to low-temperature region.The form of metal mesh can be set into capillary structure layer 43, for example, by using metal mesh made of copper.
In some embodiments, capillary structure layer 43 can be formed on support column 44, be then only connected to support column 44, in this way,
Convenient for fixing capillary structure layer 43 in advance.In addition, capillary structure layer 43 can also be supported in the first metal layer 41 or the second gold medal
Belong on layer 42, while capillary structure layer 43 also can connect to be formed in middle plate 32 and fix.
Working principle using the housing unit 100 of liquid heat-conducting medium is: the first metal layer 41 or second metal layer 42
Heat is absorbed from heater element in heating region and is transferred to heat-conducting medium, and the heat-conducting medium 140 in dielectric cavity 45 is by hot gas
Change, the heat-conducting medium of gasification is mobile to low-temperature region, encounters the hair in the second metal layer 42 or dielectric cavity 45 of relative low temperature
It is condensed when fine texture layer 43, heat is passed to the second metal layer 42 and the first metal layer 41 of low-temperature region, final heat
It is uniformly scattered on entire housing unit 100.
Since the specific heat capacity of heat-conducting medium is larger, the heat that heater element generates will not make the temperature of entire housing unit 100
Degree sharply increases, and since the area of the first metal layer of housing unit 100 41 and second metal layer 42 is larger, heat is uniform
Dispersion, thus user using when do not felt as scald, also avoid electronic equipment actively consumption reduction cause operational efficiency to decline.
In some embodiments, the surface far from the first metal layer 41 of the second metal layer 42 is located at described
In groove 321, i.e., second metal layer 42 is integrally located in groove 321, and the separate the first metal layer 41 of second metal layer 42
Surface is lower than mounting surface 322.The housing unit 100 further includes covering part, and the covering part is set to second metal
The surface far from the first metal layer 41 of layer 42.This setup, the first metal layer 41 and second metal layer 42 are complete
In full insertion in plate 32, it will not influence all kinds of components in the setting of mounting surface 322.In order to improve heat-conducting effect, covering part
Thickness can be small as far as possible.Also, surface and the mounting surface 322 of the separate second metal layer 42 of covering part
Concordantly, so that entire mounting surface 322 is smooth plane.
In some embodiments, refering to Fig. 7, housing unit 100 can also include front housing 70 and rear cover 80, wherein front housing
70 and rear cover 80 can be assemblied in center 30, and front housing 70 and rear cover 80 can be located at the two sides of middle plate 32 being away from each other.
Above-mentioned housing unit 100 can be prepared as follows:
S10: the first metal layer 41 and the second metal layer 42 are oppositely arranged basis of formation structure, described
Injection molding forms the center 30 in foundation structure.Wherein, when injection molding, the first metal layer 41 and bottom wall 323 are connected, second metal layer
42 end is connect with side wall 324.
The first metal layer 41 and the material of second metal layer 42 can be copper, and the material of middle plate 32 can be aluminium, due to copper
Fusing point be much larger than aluminium, therefore in injection moulding process, the first metal layer 41 and second metal layer 42 are not in melting phenomenon.Injection molding
Before, it can be supported, be formed for setting heat-conducting medium by support column 44 between the first metal layer 41 and second metal layer 42
Space.And support column 44 can weld together with the first metal layer 41 and second metal layer 42 simultaneously, such injection moulding process
In, it will not distending deformation between the first metal layer 41 and second metal layer 42.
S20: forming inlet 47, the inlet 47 connection by the first metal layer 41, second metal layer 42 and
The dielectric cavity 45 surrounded between the middle plate 32.
It should be noted that step S10 synchronous can be carried out with step S20, i.e., injection is directly formed in injection moulding process
Mouth 47.And step S20 can also be carried out before step S10, such as in advance on the first metal layer 41 or second metal layer 42
Inlet 47 is formed, then carries out step S10 again.Certainly, step S10 carries out being also feasible before step S20.
In some embodiments, forming inlet 47 can carry out in the following manner: be located at institute in the middle plate 32
The edge for stating groove 321 forms the channel 325 for running through the middle plate 32, and the channel 325 is connected to the first metal layer
The inlet 47 is formed between 41 and the second metal layer 42.The inlet 47 formed in this way is conducive to subsequent vacuumized
And the operation of filling heat-conductive medium, and the channel 325 can both retain or seal together after filling heat-conductive medium.?
Vacuumize and filling heat-conductive medium during, can directly be carried out from channel 325, or conduit is inserted into from channel 325
Inlet carries out.
S30: vacuumizing the dielectric cavity 45 from the inlet 47, filling heat-conductive medium in Xiang Suoshu dielectric cavity 45,
Close the inlet 47.In vacuum, it can be repeated as many times and carry out, to improve the vacuum degree in dielectric cavity 45.Closing
Inlet 47 can be carried out by modes such as welding.
Also referring to Fig. 8 and Fig. 9, the present embodiment also provides a kind of electronic equipment 10, and electronic equipment 10 includes center 30,
One or more heater elements 50 and above-mentioned housing unit 100, wherein heater element 50 is set to center 30, heater element
50 be, for example, power supply 51, is also possible to euthermic chip 52 etc..
Referring to Fig. 9, heater element 50 includes power supply 51 and euthermic chip 52, power supply 51 and fever in the present embodiment
Chip 52 is the biggish element of calorific value in electronic equipment.Center 30 includes frame 31 and middle plate 32, and the frame 31, which encloses, to be set
In the middle plate 32.Power supply 51 and euthermic chip 52 are all set on the surface of middle plate 32 being away from each other with mounting surface 322.
Electronic equipment 10 further includes front housing 70 and display screen 60, wherein front housing is assemblied in center 30 and is located at installation table
The side in face 322, display screen 60 are assemblied in center 30 and are surrounded by front housing 70, and mounting surface 322 is oppositely arranged with display screen 60.
Power supply 51 and euthermic chip 52 be all set in middle plate 32 and with where second metal layer 42 and the first metal layer 41
Region is corresponding.Specific second metal layer 42 is opposite with display screen 60.Since the first metal layer 41 and second metal layer 42 are logical
It crosses injection molding manner and is set to middle plate 32, thus, the heat that power supply 51 and euthermic chip 52 generate can be carried out through housing unit 100
Conduction, achievees the purpose that mutual soaking.In some embodiments, when the table of the separate the first metal layer 41 of second metal layer 42
When face is concordant with mounting surface, a part of component (such as display screen 60) can be directly arranged at the separate of second metal layer 42
On the surface of the first metal layer 41.
Electronic equipment 10 provided in this embodiment, the radiator structure formed by the first metal layer 41 and second metal layer 42
Be completely embedded within plate 32, will not additionally increase in 32 position of plate thickness, avoid increase electronic equipment 10 thickness, simultaneously
The setting for not influencing euthermic chip 52 and power supply 51 reaches fabulous equal thermal effect.
Using the electronic equipment 10 of above-mentioned housing unit 100, due to the first metal layer 41 and the formation of second metal layer 42
Radiator structure be completely embedded into middle plate 32, do not need the thickness for additionally increasing electronic equipment 10, therefore be not necessarily to inside center 30
The reserved space on thickness, electronic equipment 10 can be more frivolous.Simultaneously because in housing unit 100 the first metal layer 41 with
And second metal layer 42 does not need to reduce the thermal resistance in heat transfer process using viscose glue in setting, so that heat transfer
It is more efficient, it can preferably carry out soaking.In addition, housing unit 100 can be directly by power supply 51 and the thermally conductive company of euthermic chip 52
It is connected together, more can quickly realize soaking.
Electronic equipment 10 in the application (for example, being based on iPhone TM, can be based on for mobile phone or smart phone
The phone of Android TM), portable gaming device (such as Nintendo DS TM, PlayStation Portable TM,
Gameboy Advance TM, iPhone TM), laptop computer, PDA, portable Internet appliance, music player and
Data storage device, other handheld devices and wrist-watch, earphone, pendant, earphone etc., electronic equipment 10 can also be other
Wearable device (for example, such as electronic glasses, electronics clothes, electronics bracelet, electronics necklace, electronics are tatooed, electronic equipment 10
Or the headset equipment (HMD) of smartwatch).
Electronic equipment 10 can also be any one of multiple electronic equipments 10, and multiple electronic equipments 10 include but unlimited
In cellular phone, smart phone, other wireless telecom equipments, personal digital assistant, audio player, other media players,
Music recorder, video recorder, camera, other medium recorders, radio, Medical Devices, vehicle transport instrument, calculator,
Programmable remote control, pager, laptop computer, desktop computer, printer, netbook computer, personal digital assistant
(PDA), portable media player (PMP), Motion Picture Experts Group's (MPEG-1 or MPEG-2) audio layer 3 (MP3) play
Device, portable medical device and digital camera and combinations thereof.
The foregoing is merely preferred embodiment of the present application, are not intended to limit this application, for the skill of this field
For art personnel, various changes and changes are possible in this application.Within the spirit and principles of this application, made any to repair
Change, equivalent replacement, improvement etc., should be included within the scope of protection of this application.
Claims (11)
1. a kind of housing unit characterized by comprising
Center, the center include middle plate and frame, and the frame encloses the edge set on the middle plate and connect with the middle plate,
The middle plate includes mounting surface, and the mounting surface opens up fluted, and the middle plate further includes the bottom in the groove
Wall and side wall, the side wall is around the bottom wall and is connected to the bottom wall；
The first metal layer, the first metal layer and the bottom wall injection molding are simultaneously layed in the bottom wall；
Second metal layer, the second metal layer are oppositely arranged with the first metal layer, and the end of the second metal layer
With the side wall injection molding, the middle plate, the first metal layer and the second metal layer surround dielectric cavity；And
Heat-conducting medium, the heat-conducting medium are set in the dielectric cavity.
2. housing unit according to claim 1, which is characterized in that separate first metal of the second metal layer
The surface of layer is concordant with the mounting surface.
3. housing unit according to claim 1, which is characterized in that separate first metal of the second metal layer
The surface of layer is located in the groove, and the housing unit further includes covering part, and the covering part is set to second metal
The surface far from the first metal layer of layer.
4. housing unit according to claim 3, which is characterized in that the separate second metal layer of the covering part
Surface is concordant with the mounting surface.
5. housing unit according to claim 1, which is characterized in that the dielectric cavity has inlet, the shell group
Part further includes sealing, and the middle plate offers channel, and the middle plate is run through in the one end in the channel, and the other end extends to described
Inlet, inlet described in the both seals.
6. housing unit according to claim 1, which is characterized in that the first metal layer and the second metal layer are equal
For layers of copper.
7. housing unit according to claim 1-6, which is characterized in that the housing unit further includes support
Column, the support column are set in the dielectric cavity, and the support column is connected to the first metal layer and described second
Between metal layer.
8. housing unit according to claim 1-6, which is characterized in that the housing unit further includes capillary knot
Structure layer, the capillary structure layer are set between the first metal layer and the second metal layer.
9. a kind of production method of such as described in any item housing units of claim 1-8 characterized by comprising
The first metal layer and the second metal layer are oppositely arranged basis of formation structure, infused in the foundation structure
Moulding is at the center；
Inlet is formed, the inlet connection between the first metal layer, second metal layer and the middle plate by surrounding
Dielectric cavity；
The dielectric cavity is vacuumized from the inlet, filling heat-conductive medium in Xiang Suoshu dielectric cavity closes the inlet.
10. according to the method described in claim 9, it is characterized in that, the formation inlet, comprising:
The channel for running through the middle plate is formed in the edge positioned at the groove of the middle plate, the channel is connected to described
The inlet is formed between the first metal layer and the second metal layer.
11. a kind of electronic equipment characterized by comprising
Such as the described in any item housing units of claim 1-8,
Heater element, the heater element are set to the middle plate, and fitting corresponding with the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910578557.6A CN110213947B (en) | 2019-06-28 | 2019-06-28 | Shell assembly, preparation method thereof and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910578557.6A CN110213947B (en) | 2019-06-28 | 2019-06-28 | Shell assembly, preparation method thereof and electronic equipment |
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| CN110213947A true CN110213947A (en) | 2019-09-06 |
| CN110213947B CN110213947B (en) | 2020-11-27 |
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| CN201910578557.6A Active CN110213947B (en) | 2019-06-28 | 2019-06-28 | Shell assembly, preparation method thereof and electronic equipment |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110730600A (en) * | 2019-10-29 | 2020-01-24 | 维沃移动通信有限公司 | Electronic equipment's casing and electronic equipment |
| CN111770222A (en) * | 2020-07-10 | 2020-10-13 | 北京字节跳动网络技术有限公司 | Terminal medium plate, middle frame and terminal |
| CN113543574A (en) * | 2020-04-18 | 2021-10-22 | 华为技术有限公司 | Vapor chamber and manufacturing method thereof, middle frame assembly and manufacturing method thereof, and electronic equipment |
| CN114093252A (en) * | 2020-08-24 | 2022-02-25 | 乐金显示有限公司 | Display device |
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| CN104902727A (en) * | 2015-05-26 | 2015-09-09 | 华为技术有限公司 | Middle frame of mobile terminal and mobile terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110730600A (en) * | 2019-10-29 | 2020-01-24 | 维沃移动通信有限公司 | Electronic equipment's casing and electronic equipment |
| CN113543574A (en) * | 2020-04-18 | 2021-10-22 | 华为技术有限公司 | Vapor chamber and manufacturing method thereof, middle frame assembly and manufacturing method thereof, and electronic equipment |
| EP4123252A4 (en) * | 2020-04-18 | 2024-03-13 | Huawei Tech Co Ltd | Vapor chamber and manufacturing method therefor, middle frame assembly and manufacturing method therefor, and electronic device |
| CN111770222A (en) * | 2020-07-10 | 2020-10-13 | 北京字节跳动网络技术有限公司 | Terminal medium plate, middle frame and terminal |
| CN114093252A (en) * | 2020-08-24 | 2022-02-25 | 乐金显示有限公司 | Display device |
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