CN104349651A - Handheld communication device and thinned heat dissipation structure thereof - Google Patents
Handheld communication device and thinned heat dissipation structure thereof Download PDFInfo
- Publication number
- CN104349651A CN104349651A CN201310378592.6A CN201310378592A CN104349651A CN 104349651 A CN104349651 A CN 104349651A CN 201310378592 A CN201310378592 A CN 201310378592A CN 104349651 A CN104349651 A CN 104349651A
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- CN
- China
- Prior art keywords
- heat
- heat pipe
- slimming
- protrusion tab
- radiator structure
- Prior art date
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- Pending
Links
- 238000004891 communication Methods 0.000 title claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 title abstract 4
- 238000007493 shaping process Methods 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 6
- 238000012856 packing Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract 2
- 230000005855 radiation Effects 0.000 description 7
- 239000004519 grease Substances 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a handheld communication device and a thinned heat dissipation structure thereof, wherein the thinned heat dissipation structure comprises a heat conduction plate and a heat pipe, the heat conduction plate is provided with a through groove and an inner annular wall is formed on the inner periphery of the through groove, and at least one protruding piece extends from the inner annular wall; the heat pipe is arranged in the through groove and is mutually clamped with the protruding sheet. Therefore, the heat generated by the heating element is uniformly conducted to the heat pipe and the heat conducting plate, and the heat is prevented from being accumulated around the heating element, so that the effect of improving the heat dissipation efficiency is achieved.
Description
Technical field
The present invention relates to a kind of radiator structure, espespecially a kind of hand-hold communication device and slimming radiator structure thereof.
Background technology
Hand-hold communication device, as mobile phone, flat computer, PDA, GPS etc., along with scientific and technological progress, its calculation function and efficiency are also powerful gradually, cause the inner member of hand-hold communication device, such as the element such as central processing unit and integrated circuit, during running, all can produce high heat, therefore first the heat of element must be left, operational paradigm and the useful life of element could be maintained.
At present for the radiator structure of hand-hold communication device, it mainly comprises the heat-conducting plate that metal material is formed, and utilize the direct heat posted of heat-conducting plate to connect the heater element such as central processing unit and integrated circuit, make the heat conduction of heater element on heat-conducting plate, to reach effect of heat radiation.
Summary of the invention
An object of the present invention is to provide a kind of hand-hold communication device and slimming radiator structure thereof, and the even heat that heater element produces is directed on heat pipe and heat-conducting plate by it, avoids accumulation of heat around heater element, to reach effect of improving heat radiation efficiency.
In order to reach above-mentioned object, the invention provides a kind of slimming radiator structure, comprising:
One heat-conducting plate, be provided with one and wear groove and wear groove inner peripheral form an internal ring wall in this, this internal ring wall is extended with at least one protrusion tab; And
One heat pipe, be arranged at this to wear in groove and and this protrusion tab mutually engage.
Wherein, the thickness of this heat pipe equals the thickness of this heat-conducting plate.
Wherein, this heat pipe is shaping with impact style, and makes this heat pipe be provided with a depression section, and this depression section is to being fitted together to by protrusion tab.
Wherein, this heat pipe and this protrusion tab have a coplanar structure.
Wherein, this heat pipe is connected with this protrusion tab with welding manner or packing mode.
Wherein, the quantity of protrusion tab is one, and this internal ring wall has a sidewall, and this sidewall has a root edge, and this protrusion tab is along this root edge elongation moulding.
Wherein, the quantity of protrusion tab is two, and this internal ring wall has two relative sidewalls, and respectively this sidewall has a root edge, and respectively this protrusion tab is along each this root edge elongation moulding.
Wherein, this heat pipe is an in-line body, a L-shaped body or a U-shaped body, and the matching form of this shape and this heat pipe of wearing groove closes.
In order to reach above-mentioned object, the invention provides a kind of hand-hold communication device, comprising:
One housing, inside is provided with a cavity volume;
One heater element, is contained in this cavity volume; And
Slimming radiator structure described above, is contained in this cavity volume, and this heat pipe heat posted is connected to this heater element.
Wherein, this heat-conducting plate and this protrusion tab heat posted are connected to this heater element.
The present invention also has following effect:
The first, heat pipe be arranged at wear in groove and and protrusion tab mutually engage, heat pipe is worn in groove to be firmly positioned at by the supporting of protrusion tab, and then promotes the structural stability of slimming radiator structure.
The second, heat pipe is shaping and be embedded in and wear in groove with impact style, the thickness of heat pipe is made to equal in fact the thickness of heat-conducting plate, with the advantage making slimming radiator structure reach slimming, allow slimming radiator structure have volume frivolous, do not take up space, effect of ease of assembly.
Three, heat pipe is shaping with impact style, and makes heat pipe and protrusion tab jointly form coplanar structure, and the surface of heater element is more easily closely amplexiformed in coplanar structure, and then promotes the radiating efficiency of slimming radiator structure.
Four, heat pipe is provided with depression section, and the corresponding protrusion tab of depression section is fitted together to, and enable protrusion tab provide area to paste heat pipe, the heat allowing heater element produce conducts on heat-conducting plate rapidly, reaches the advantage of temperature uniforming heat radiation in the short time.
Five, heat pipe can be L-shaped body or U-shaped body, makes heat pipe can utilize shape in limited space, amplexiforms heat-conducting plate in large area, amasss with the heat posted junction promoted between heat pipe and heat-conducting plate, and then increases the heat radiation function of slimming radiator structure.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 is the three-dimensional exploded view of hand-hold communication device of the present invention.
Fig. 2 is the perspective exploded view of slimming radiator structure first embodiment of the present invention.。
Fig. 3 is the assembled sectional view of slimming radiator structure first embodiment of the present invention.
Fig. 4 is the assembled sectional view of slimming radiator structure second embodiment of the present invention.
Fig. 5 is the three-dimensional combination figure of hand-hold communication device of the present invention.
Fig. 6 is the assembled sectional view of hand-hold communication device of the present invention.
Fig. 7 is the using state schematic diagram of hand-hold communication device of the present invention.
Fig. 8 is the combination schematic diagram of slimming radiator structure the 3rd embodiment of the present invention.
Fig. 9 is the combination schematic diagram of slimming radiator structure the 4th embodiment of the present invention.
Wherein, Reference numeral:
100 hand-hold communication devices
10 slimming radiator structures
1 heat-conducting plate
11 wear groove
12 internal ring walls
121 sidewalls
122 root edges
121 ' sidewall
122 ' root edge
13 protrusion tabs
131 surfaces
2 heat pipes
21 depression sections
22 surfaces
3 thermal greases
20 housings
201 cavity volumes
30 heater elements
40 circuit boards
H1, h2 thickness
S coplanar structure
Embodiment
Detailed description for the present invention and technology contents, be described as follows graphic for cooperation, but institute's accompanying drawings is only as illustrative purposes, not for limiting to the present invention.
Please refer to shown in Fig. 1 to Fig. 7, the invention provides a kind of hand-hold communication device and slimming radiator structure thereof, this slimming radiator structure 10 mainly comprises a heat-conducting plate 1 and a heat pipe (Heat Pipe) 2; Hand-hold communication device 100 comprises housing 20, heater element 30 and a slimming radiator structure 10.
Heat-conducting plate 1 is a flat metal plate, and its most preferred embodiment is copper coin or aluminium sheet, and heat-conducting plate 1 is provided with one and wears groove 11 and form an internal ring wall 12 in wearing groove 11 inner peripheral, and internal ring wall 12 is extended with one or more protrusion tab 13, and heat-conducting plate 1 has a thickness h 1.Wherein, the shape of wearing groove 11 can be the geometries such as in-line, a L-shaped or a U-shaped, is not restriction with the present embodiment.
In addition, as shown in Figure 3, be slimming radiator structure first embodiment of the present invention, the quantity of protrusion tab 13 is one, and internal ring wall 12 has a sidewall 121, and the bottom ora terminalis of sidewall 121 has a root edge 122, and protrusion tab 13 is along root edge 122 elongation moulding.
Moreover as shown in Figure 4, be slimming radiator structure second embodiment of the present invention, the second embodiment and the first embodiment difference are, the quantity of protrusion tab 13 is different, further illustrates as follows.
The quantity of protrusion tab 13 is two, and internal ring wall 12 has two relative sidewalls 121 ', and the bottom ora terminalis of each sidewall 121 ' has a root edge 122 ', and each protrusion tab 13 is along each root edge 122 ' elongation moulding.
Heat pipe (Heat Pipe) 2 be arranged at wear in groove 11 and and protrusion tab 13 mutually engage; Be described in detail as follows, heat pipe (Heat Pipe) 2 can first be placed in wear in groove 11 shaping with impact style again, or heat pipe (Heat Pipe) 2 can first be worn in groove 11 with shaping being placed in again of impact style, and making heat pipe (Heat Pipe) 2 be provided with a depression section 21, the corresponding protrusion tab 13 of depression section 21 is fitted together to.
Again, the thickness h 2 of heat pipe (Heat Pipe) 2 equals in fact the thickness h 1 of heat-conducting plate 1, namely the thickness h 2 of heat pipe (Heat Pipe) 2 equal, slightly larger than or be slightly less than the thickness h 1 of heat-conducting plate 1, and the surface 131 of the surface 22 of heat pipe (Heat Pipe) 2 and protrusion tab 13 jointly forms a coplanar structure S, namely the surface 131 of the surface 22 of heat pipe (Heat Pipe) 2 and protrusion tab 13 at grade.
Wherein, heat pipe (Heat Pipe) 2 and protrusion tab 13 are interconnected with welding manner or in packing mode; Be described in detail as follows, when heat pipe (Heat Pipe) 2 is first placed in and wears in groove 11 more shaping with impact style, then heat pipe (Heat Pipe) 2 can urgently to be orientated as in wearing in groove 11, and heat pipe (Heat Pipe) 2 can and internal ring wall 12 and protrusion tab 13 mutually amplexiform in packing mode.
Slimming radiator structure 10 of the present invention more comprises a thermal grease 3, thermal grease 3 is filled between heat pipe (Heat Pipe) 2, internal ring wall 12 and protrusion tab 13, to improve the heat transfer area between heat pipe (Heat Pipe) 2, internal ring wall 12 and protrusion tab 13, but thermal grease 3 is not the necessary assembly of this slimming radiator structure 10, therefore thermal grease 3 can optionally increase or delete.
In addition, heat pipe (Heat Pipe) 2 can be an in-line body, a L-shaped body or a U-shaped body, and the shape of the shape meeting and heat pipe (Heat Pipe) 2 of wearing groove 11 cooperatively interacts.
Housing 20 inside is provided with a cavity volume 201; Be described in detail as follows, housing 20 assembled by a upper casing and a lower casing, and cavity volume 201 is formed in the inside of upper casing and lower casing.
Heater element 30 can be the element such as central processing unit and integrated circuit, but not as limit, heater element 30 is contained in cavity volume 201.
Above-mentioned slimming radiator structure 10 is also contained in cavity volume 201, and heat pipe (Heat Pipe) 2 heat posteds are connected to heater element 30.Wherein, heat-conducting plate 1 and protrusion tab 13 can heat posted to connect or heat posted is not connected to heater element 30, i.e. the size of heat-conducting plate 1 and the visual heater element 30 of protrusion tab 13, to connect size from the heat posted between Row sum-equal matrix and heater element 30.
Hand-hold communication device 100 of the present invention more comprises a circuit board 40, and heater element 30 fills admittedly at circuit board 40, and heater element 30 and circuit board 40 are contained in cavity volume 201 jointly, and the arrangement in storehouse shape of circuit board 40 and heat-conducting plate 1.
The combination of slimming radiator structure 10 of the present invention, as shown in Figures 1 to 4, it utilizes heat-conducting plate 1 to be provided with and wears groove 11 and form internal ring wall 12 in wearing groove 11 inner peripheral, and internal ring wall 12 is extended with protrusion tab 13; Heat pipe (Heat Pipe) 2 be arranged at wear in groove 11 and and protrusion tab 13 mutually engage.
The combination of hand-hold communication device 100 of the present invention, as shown in Figure 5 to Figure 6, it utilizes housing 20 inside to be provided with cavity volume 201; Heater element 30 is contained in cavity volume 201; Slimming radiator structure 10 described above is contained in cavity volume 201, and heat pipe (Heat Pipe) 2 heat posteds are connected to heater element 30.Whereby, the even heat that heater element 30 produces is directed on heat-conducting plate 1 by heat pipe (Heat Pipe) 2, avoids accumulation of heat in heater element 30 around, to reach the radiating efficiency of heat radiation device 10.
Compare the radiator of existing hand-hold communication device, it only utilizes heat-conducting plate direct heat posted sending and receiving thermal element, and make heat easily be accumulated in the local of the contiguous heater element of heat-conducting plate, namely heat is easily accumulated in around heater element.
The using state of slimming radiator structure 10 of the present invention and hand-hold communication device 100, as shown in Figure 7, wherein the heat transfer of heat pipe (Heat Pipe) 2 and radiating effect good compared with heat-conducting plate 1, therefore when heat pipe (Heat Pipe) 2 heat posteds are connected to heater element 30, conduct on heat-conducting plate 1 with can utilizing heat pipe (Heat Pipe) 2 even heat produced by heater element 30, and then avoid accumulation of heat in heater element 30 around, and play effect of heat-conducting plate 1, by heat-conducting plate 1, even heat is dispensed on hand-hold communication device 100, slimming radiator structure 10 is made to have radiating efficiency well.
In addition, heat pipe (Heat Pipe) 2 be arranged at wear in groove 11 and and protrusion tab 13 mutually engage, heat pipe (Heat Pipe) 2 is worn in groove 11 to be firmly positioned at by the supporting of protrusion tab 13, and then promotes the structural stability of slimming radiator structure 10.
Moreover, heat pipe (Heat Pipe) 2 is shaping and be embedded in and wear in groove 11 with impact style, the thickness h 2 of heat pipe (Heat Pipe) 2 is made to equal in fact the thickness h 1 of heat-conducting plate 1, with the advantage making slimming radiator structure 10 reach slimming, allow slimming radiator structure 10 have volume frivolous, do not take up space, effect of ease of assembly.
Again, (Heat Pipe) 2 is shaping with impact style for heat pipe, and make heat pipe (Heat Pipe) 2 and protrusion tab 13 jointly form coplanar structure S, the surface of heater element 30 is more easily closely amplexiformed in coplanar structure S, and then promotes the radiating efficiency of slimming radiator structure 10.
In addition, heat pipe (Heat Pipe) 2 is provided with depression section 21, the corresponding protrusion tab 13 of depression section 21 is fitted together to, make protrusion tab 13 that area can be provided to paste heat pipe (Heat Pipe) 2, the heat allowing heater element 30 produce conducts on heat-conducting plate 1 rapidly, reaches the advantage of temperature uniforming heat radiation in the short time.
Please refer to shown in Fig. 8 to Fig. 9, for slimming radiator structure the 3rd embodiment of the present invention, the 4th embodiment, 3rd embodiment, the 4th embodiment and the first embodiment difference are, heat pipe (Heat Pipe) 2 is except for except in-line body, it also can be L-shaped body or U-shaped body, the shape of the shape meeting and heat pipe (Heat Pipe) 2 of wearing groove 11 cooperatively interacts, and further illustrates as follows.
Heat pipe (Heat Pipe) 2 can be L-shaped body or U-shaped body, make heat pipe (Heat Pipe) 2 can utilize shape in limited space, amplexiform heat-conducting plate 1 in large area, amass to promote heat pipe (Heat Pipe) the heat posted junction between 2 and heat-conducting plate 1, and then increase the heat radiation function of slimming radiator structure 10.
Certainly; the present invention also can have other various embodiments; when not deviating from the present invention's spirit and essence thereof; those of ordinary skill in the art can make various corresponding change and distortion according to the present invention, but these change accordingly and are out of shape the protection range that all should belong to the claims in the present invention.
Claims (10)
1. a slimming radiator structure, is characterized in that, comprising:
One heat-conducting plate, be provided with one and wear groove and wear groove inner peripheral form an internal ring wall in this, this internal ring wall is extended with at least one protrusion tab; And
One heat pipe, be arranged at this to wear in groove and and this protrusion tab mutually engage.
2. slimming radiator structure according to claim 1, is characterized in that, the thickness of this heat pipe equals the thickness of this heat-conducting plate.
3. slimming radiator structure according to claim 1, is characterized in that, this heat pipe is shaping with impact style, and makes this heat pipe be provided with a depression section, and this depression section is to being fitted together to by protrusion tab.
4. slimming radiator structure according to claim 1, is characterized in that, this heat pipe and this protrusion tab have a coplanar structure.
5. slimming radiator structure according to claim 1, is characterized in that, this heat pipe is connected with this protrusion tab with welding manner or packing mode.
6. slimming radiator structure according to claim 1, is characterized in that, the quantity of protrusion tab is one, and this internal ring wall has a sidewall, and this sidewall has a root edge, and this protrusion tab is along this root edge elongation moulding.
7. slimming radiator structure according to claim 1, is characterized in that, the quantity of protrusion tab is two, and this internal ring wall has two relative sidewalls, and respectively this sidewall has a root edge, and respectively this protrusion tab is along each this root edge elongation moulding.
8. slimming radiator structure according to claim 1, is characterized in that, this heat pipe is an in-line body, a L-shaped body or a U-shaped body, and the matching form of this shape and this heat pipe of wearing groove closes.
9. a hand-hold communication device, is characterized in that, comprising:
One housing, inside is provided with a cavity volume;
One heater element, is contained in this cavity volume; And
Slimming radiator structure described in any one of claim 1 to 8, is contained in this cavity volume, and this heat pipe heat posted is connected to this heater element.
10. hand-hold communication device according to claim 9, is characterized in that, this heat-conducting plate and this protrusion tab heat posted are connected to this heater element.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102127000A TWI533791B (en) | 2013-07-26 | 2013-07-26 | Handheld communication apparatus and thin heat-dissipating structure thereof |
| TW102127000 | 2013-07-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104349651A true CN104349651A (en) | 2015-02-11 |
Family
ID=52504138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310378592.6A Pending CN104349651A (en) | 2013-07-26 | 2013-08-22 | Handheld communication device and thinned heat dissipation structure thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104349651A (en) |
| TW (1) | TWI533791B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109327997A (en) * | 2017-08-01 | 2019-02-12 | 东莞市普威玛精密工业有限公司 | The connection of the heat pipe and metal shell of electronic apparatus constructs |
| US20190254190A1 (en) * | 2018-02-13 | 2019-08-15 | Sy-Thermal Inc. | Handheld communication device and thin heat dissipating structure thereof |
| CN110740611A (en) * | 2018-07-20 | 2020-01-31 | 深圳富泰宏精密工业有限公司 | Radiator and electronic device with same |
| CN113811135A (en) * | 2020-06-12 | 2021-12-17 | 维峰科技股份有限公司 | Heat radiation module and manufacturing method thereof |
-
2013
- 2013-07-26 TW TW102127000A patent/TWI533791B/en active
- 2013-08-22 CN CN201310378592.6A patent/CN104349651A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109327997A (en) * | 2017-08-01 | 2019-02-12 | 东莞市普威玛精密工业有限公司 | The connection of the heat pipe and metal shell of electronic apparatus constructs |
| US20190254190A1 (en) * | 2018-02-13 | 2019-08-15 | Sy-Thermal Inc. | Handheld communication device and thin heat dissipating structure thereof |
| CN110740611A (en) * | 2018-07-20 | 2020-01-31 | 深圳富泰宏精密工业有限公司 | Radiator and electronic device with same |
| CN113811135A (en) * | 2020-06-12 | 2021-12-17 | 维峰科技股份有限公司 | Heat radiation module and manufacturing method thereof |
| CN113811135B (en) * | 2020-06-12 | 2024-08-02 | 杜春林 | Heat dissipation module and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201505533A (en) | 2015-02-01 |
| TWI533791B (en) | 2016-05-11 |
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Application publication date: 20150211 |